Cutting device for silica gel plate processing

Abstract

The cutting device comprises a cutting frame and a laser cutting head, placing plates are arranged on the two sides in the cutting frame, a through groove is formed in the bottom of the inner side of the cutting frame, a collecting box is arranged at the bottom of the through groove, electric guide rails are arranged on the two sides of the rear portion of the cutting frame, and the laser cutting head is arranged on the electric guide rails. An installation piece is arranged above the electric guide rail, an installation groove is formed in the inner side of the installation piece, an installation block is arranged in the installation groove, an electric telescopic rod is arranged at the bottom of the installation block, and the electric telescopic rod is connected with a laser cutting head. The silica gel plate is moved out of the bottom of the laser cutting head, the silica gel plate which is completely cut is conveniently collected, a containing plate is moved to the position above a through groove, waste left after cutting can be manually pushed into a collecting box, and then the next silica gel plate can be rapidly cut.

Description

Technical Field

[0001] The utility model relates to the technical field of silica gel plate processing, in particular to a cutting device for silica gel plate processing. Background Art

[0002] Silicone sheet is an industrial rubber sheet made primarily from silicone. It can be punched into gaskets, washers, and seals, primarily for use in the food industry, machinery, electronics, automotive, chemical and light industries, metalworking, and paint. During processing, silicone sheet often needs to be cut into various shapes based on specific needs. Currently, silicone sheet is typically cut using laser cutting, which is suitable for silicone sheets with thicknesses between 5.0mm and 10.0mm. Laser cutting utilizes a high-energy laser beam to cut materials, offering advantages such as high precision and high speed.

[0003] When existing laser cutting devices cut silicone plates into specific shapes, they usually cut out a certain amount of waste. After the cutting is completed and the cut silicone plate is taken out, the cut waste needs to be cleaned up, which means that the next silicone plate cannot be cut immediately, which affects the efficiency of silicone plate cutting. Utility Model Content

[0004] The purpose of the present invention is to provide a cutting device for processing silicone plates to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A cutting device for processing silicone plates, comprising a cutting frame and a laser cutting head, wherein placing plates are provided on both sides of the cutting frame, limiting strips are provided on both sides of the placing plates, limiting rails are provided on both sides of the cutting frame, the limiting strips are slidably connected to the limiting rails, a through groove is provided at the bottom of the inner side of the cutting frame, a collection box is provided at the bottom of the through groove, electric guide rails are provided on both sides of the rear of the cutting frame, a mounting piece is provided above the electric guide rail, electric sliders are provided on both sides of the bottom of the mounting piece, the electric slider slides in the electric guide rails, a mounting groove is provided on the inner side of the mounting piece, a mounting block is provided inside the mounting groove, the mounting block is slidably connected to the mounting groove, an electric telescopic rod is provided at the bottom of the mounting block, and the electric telescopic rod is connected to the laser cutting head.

[0007] In a preferred embodiment of the present invention, a first threaded rod is provided on the inner side of the cutting frame, a threaded tube is provided on the bottom of the placement plate, and the first threaded rod is threadedly connected to the threaded tube.

[0008] In a preferred embodiment of the present invention, a first motor is provided at the rear side of the cutting frame, and the first motor is connected to a first threaded rod.

[0009] In a preferred embodiment of the present invention, support plates are provided on the front and rear sides of the bottom of the cutting frame, and a blocking bar is provided on the rear side of the placement plate.

[0010] In a preferred embodiment of the present invention, a mounting rail is provided on the inner side of the front support plate, and mounting bars are provided on both sides of the collection box, and the mounting bars are slidably connected to the mounting rail.

[0011] In a preferred embodiment of the present invention, a second threaded rod is provided on the inner side of the installation groove, a screw opening is provided on the inner side of the installation block, and the second threaded rod is threadedly connected to the screw opening.

[0012] In a preferred embodiment of the present invention, a second motor is provided on one side of the mounting member, and the second motor is connected to the second threaded rod.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention.

[0014] Beneficial effect: When the device is in use, the silicone plate is placed on the placement plate, the first threaded rod is driven to rotate by the first motor, and the limit bar is limited by the limit rail, so that the placement plate slides in the cutting frame and drives the silicone plate to slide to the bottom of the laser cutting head for cutting. When the cutting is completed, the placement plate is moved to move the silicone plate out of the bottom of the laser cutting head, so that the complete cut silicone plate can be collected conveniently, and by moving the placement plate above the through slot, the waste left by the cutting can be manually pushed into the collection box, so that the next silicone plate can be quickly cut.

[0015] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the description, the following is a detailed description of the preferred embodiments of the present invention with the accompanying drawings. The specific implementation methods of the present invention are given in detail in the following embodiments and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the main structure of a cutting device for processing silicone plates;

[0018] Figure 2 This is a schematic diagram of the inner structure of a cutting frame in a cutting device for processing silicone plates;

[0019] Figure 3 This is a schematic diagram of the plate structure placed in a cutting device for processing silicone plates;

[0020] Figure 4 This is a schematic diagram of the installation structure of a laser cutting head in a cutting device for silicone plate processing.

[0021] In the figure: 1. Cutting frame; 11. Placement plate; 12. First threaded rod; 13. First motor; 14. Threaded tube; 2. Through slot; 21. Support plate; 22. Collection box; 23. Mounting rail; 24. Mounting bar; 3. Stop bar; 31. Limiting bar; 32. Limiting rail; 33. Mounting part; 34. Electric guide rail; 35. Electric slider; 4. Laser cutting head; 41. Electric telescopic rod; 42. Mounting block; 43. Screw mouth; 44. Mounting slot; 45. Second threaded rod; 5. Second motor. DETAILED DESCRIPTION

[0022] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0023] Please refer to Figure 1-4 The utility model discloses a cutting device for processing silicone plates, comprising a cutting frame 1 and a laser cutting head 4. The cutting frame 1 serves as the mounting structure of the device and is used to mount other structures. The laser cutting head 4 serves as the main structure of the device, i.e., it cuts the silicone plate by laser. Placement plates 11 are provided on both sides of the interior of the cutting frame 1, and a baffle 3 is provided on the rear side of the placement plate 11. The placement plate 11 is used to place the silicone plate and block and limit the silicone plate through the baffle 3 on the rear side. Support plates 21 are provided on the front and rear sides of the bottom of the cutting frame 1, and the support plate 21 serves as the bottom structure of the device. It is used to support the overall structure. A through slot 2 is provided at the bottom inner side of the cutting frame 1, a collecting box 22 is provided at the bottom of the through slot 2, a mounting rail 23 is provided on the inner side of the front support plate 21, and mounting bars 24 are provided on both sides of the collecting box 22. The mounting bars 24 are slidably connected to the mounting rails 23, that is, the mounting rails 23 are connected through the mounting bars 24, so that the collecting box 22 is installed at the bottom of the through slot 2. When the cutting of the silicone plate is completed, by moving the placing plate 11 above the through slot 2, the waste left by the cutting can be manually pushed into the collecting box 22, so that the next silicone plate can be quickly cut.

[0024] Limiting bars 31 are set on both sides of the placing plate 11, and limiting rails 32 are set on both sides of the inside of the cutting frame 1. The limiting bars 31 are slidably connected to the limiting rails 32. A first threaded rod 12 is set on the inside of the cutting frame 1, and a threaded tube 14 is set at the bottom of the placing plate 11. The first threaded rod 12 is threadedly connected to the threaded tube 14. A first motor 13 is set on the rear side of the cutting frame 1. The first motor 13 is connected to the first threaded rod 12, that is, the first threaded rod 12 is driven to rotate by the first motor 13, and the limiting bars 31 are limited by the limiting rails 32, so that the placing plate 11 slides in the cutting frame 1, and drives the silicone plate to slide to the bottom of the laser cutting head 4 for cutting.

[0025] Electric guide rails 34 are provided on both sides of the rear of the cutting frame 1, and mounting parts 33 are provided above the electric guide rails 34. Electric sliders 35 are provided on both sides of the bottom of the mounting parts 33. The electric sliders 35 slide in the electric guide rails 34. A mounting groove 44 is provided on the inner side of the mounting parts 33. A mounting block 42 is provided inside the mounting groove 44. The mounting block 42 is slidably connected to the mounting groove 44. An electric telescopic rod 41 is provided at the bottom of the mounting block 42. The electric telescopic rod 41 is connected to the laser cutting head 4. A second threaded rod 45 is provided inside the mounting groove 44. A mounting block 42 is provided inside the mounting block 42. There is a screw hole 43, and the second threaded rod 45 is threadedly connected to the screw hole 43. A second motor 5 is provided on one side of the mounting part 33, and the second motor 5 is connected to the second threaded rod 45, that is, the second motor 5 drives the second threaded rod 45 to rotate, so that the mounting block 42 slides in the mounting groove 44, so that the laser cutting head 4 moves left and right, and the electric slider 35 slides in the electric guide rail 34, so that the laser cutting head 4 moves forward and backward, and the electric telescopic rod 41 drives the laser cutting head 4 to extend and retract, so as to facilitate the cutting of the silicone plate.

[0026] The working principle of the present invention is as follows: when the device is used, the silicone plate is placed on the placement plate 11, and the silicone plate is blocked and limited by the blocking bar 3 on the rear side, the first motor 13 drives the first threaded rod 12 to rotate, and the limiting rail 32 limits the limiting bar 31, so that the placement plate 11 slides in the cutting frame 1 and drives the silicone plate to slide to the bottom of the laser cutting head 4, and the second motor 5 drives the second threaded rod 45 to rotate, so that the mounting block 42 slides in the mounting groove 44, so that the laser cutting head 4 moves left and right. The electric slider 35 slides in the electric guide rail 34, so that the laser cutting head 4 moves back and forth, and the electric telescopic rod 41 drives the laser cutting head 4 to extend and retract, so as to facilitate the cutting of the silicone plate. When the cutting is completed, the placement plate 11 is moved to move the silicone plate out of the bottom of the laser cutting head 4, so as to facilitate the collection of the complete cut silicone plate, and by moving the placement plate 11 above the through groove 2, the waste left by the cutting can be manually pushed into the collection box 22, so that the next silicone plate can be quickly cut.

[0027] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A cutting device for processing silicone plates, comprising a cutting frame (1) and a laser cutting head (4), characterized in that: The cutting frame (1) is provided with placement plates (11) on both sides, and limit bars (31) are provided on both sides of the placement plates (11). The cutting frame (1) is provided with limit rails (32) on both sides, and the limit bars (31) are connected to the limit rails (32) in a sliding manner. A through groove (2) is provided at the bottom of the inner side of the cutting frame (1), and a collection box (22) is provided at the bottom of the through groove (2). Electric guide rails (34) are provided on both sides of the rear of the cutting frame (1), and a motorized guide rail (34) is provided above the motorized guide rail (34). A mounting member (33) is provided, electric sliders (35) are provided on both sides of the bottom of the mounting member (33), the electric sliders (35) slide in the electric guide rails (34), a mounting groove (44) is provided on the inner side of the mounting member (33), a mounting block (42) is provided inside the mounting groove (44), the mounting block (42) is slidably connected to the mounting groove (44), an electric telescopic rod (41) is provided at the bottom of the mounting block (42), and the electric telescopic rod (41) is connected to the laser cutting head (4).

2. A cutting device for processing a silicone plate according to claim 1, characterized in that: A first threaded rod (12) is provided inside the cutting frame (1), a threaded tube (14) is provided at the bottom of the placement plate (11), and the first threaded rod (12) and the threaded tube (14) are threadedly connected.

3. A cutting device for processing a silicone plate according to claim 2, characterized in that: A first motor (13) is provided on the rear side of the cutting frame (1), and the first motor (13) is connected to the first threaded rod (12).

4. A cutting device for processing a silicone plate according to claim 1, characterized in that: Support plates (21) are provided at the front and rear sides of the bottom of the cutting frame (1), and a blocking bar (3) is provided at the rear side of the placement plate (11).

5. A cutting device for processing a silicone plate according to claim 4, characterized in that: A mounting rail (23) is provided on the inner side of the front support plate (21), and mounting bars (24) are provided on both sides of the collection box (22), wherein the mounting bars (24) are slidably connected to the mounting rail (23).

6. A cutting device for processing a silicone plate according to claim 1, characterized in that: A second threaded rod (45) is provided inside the installation groove (44), a screw opening (43) is provided inside the installation block (42), and the second threaded rod (45) is threadedly connected to the screw opening (43).

7. A cutting device for processing silicone plates according to claim 1, characterized in that: A second motor (5) is provided on one side of the mounting member (33), and the second motor (5) is connected to a second threaded rod (45).

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