Multifunctional adsorption jig and vacuum machine table

Abstract

The utility model provides a multifunctional adsorption jig and a vacuum machine table, and relates to the technical field of semiconductor equipment. The multifunctional adsorption jig comprises a carrying table and a cushion block, wherein a first adsorption hole and a mounting groove are formed in the carrying table; and the cushion block is detachably arranged in the mounting groove. A second adsorption hole is formed in the bottom of the mounting groove, a third adsorption hole is formed in the cushion block, and the second adsorption hole and the third adsorption hole are selectively aligned. According to the multifunctional adsorption jig, by arranging the cushion blocks, the supporting performance of the carrying table can be improved, and warping of a base plate or a substrate is relieved. And the second adsorption holes and the third adsorption holes are selectively aligned, so that different types of substrates or base plates can be adapted, and the universality is good.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a multifunctional adsorption fixture and a vacuum machine. Background Art

[0002] With the rapid development of the semiconductor industry, electronic products have diversified to meet the needs of users and the need for product performance iteration. The packaging substrates of electronic products are diverse. For example, the forms of substrates include lead frames, core-less substrates, glass fiber-based copper foil substrates, ceramic substrates or grooved substrates. Usually, when the machine mounts the chip, a dedicated vacuum machine is used to vacuum adsorb the substrate to improve the mounting accuracy of the machine. However, due to the diversity of substrates, it is necessary to equip corresponding vacuum platforms for adsorption to deal with the warping caused by the substrate and the warping caused by vacuum adsorption, and the versatility needs to be improved. Utility Model Content

[0003] The purpose of the utility model is to provide a multifunctional adsorption fixture and a vacuum machine, which are helpful to alleviate the technical problem of substrate warping existing in the prior art and to improve the versatility and adaptability of the vacuum machine to different types of substrates.

[0004] In a first aspect, the present invention provides a multifunctional adsorption fixture, comprising:

[0005] A carrier, wherein the carrier is provided with a first adsorption hole and a mounting groove;

[0006] a cushion block, the cushion block being detachably disposed in the mounting groove;

[0007] The bottom of the mounting groove is provided with a second adsorption hole, the pad is provided with a third adsorption hole, and the second adsorption hole and the third adsorption hole are selectively aligned.

[0008] In an optional embodiment, the corners of the carrier are chamfered.

[0009] In an optional embodiment, the third adsorption holes are arranged along the diagonal line of the pad.

[0010] In an optional embodiment, the first adsorption holes are provided on the outer periphery of the mounting groove.

[0011] In an optional embodiment, the carrier includes at least two adjacent first side surfaces, and each of the two first side surfaces is provided with a chamfer.

[0012] In an optional embodiment, the pad includes at least two adjacent second side surfaces, and each of the two second side surfaces is provided with a chamfer.

[0013] In an optional embodiment, a pressure strip is further included, and the pressure strip is detachably mounted on the carrier.

[0014] In an optional embodiment, one of the pressure strip and the carrier is provided with a mounting hole, and the other is provided with a protrusion, and the protrusion is plug-fitted into the mounting hole.

[0015] In an optional embodiment, the pad is arranged in the middle of the carrier.

[0016] In a second aspect, the present invention provides a vacuum machine, comprising an air pump and a multifunctional adsorption fixture as described in any one of the aforementioned embodiments, wherein the air pump is connected to the first adsorption hole of the carrier.

[0017] The multifunctional adsorption fixture provided by the present invention has a removable pad disposed within the mounting groove. This improves the support performance of the carrier and mitigates warping of the substrate. The removable pad facilitates adaptation to different types of substrates, providing greater versatility and adaptability. The selective alignment of the second and third adsorption holes facilitates adaptation to different types of substrates, providing greater versatility. This helps improve the adsorption force applied to the substrate and mitigates warping.

[0018] The vacuum machine provided by the embodiment of the present invention includes the above-mentioned multifunctional adsorption fixture, which is used to achieve adsorption and fixation of the substrate or base, alleviate the warping deformation of the substrate or base and reduce the warping deformation caused by vacuum adsorption. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of the overall structure of the multifunctional adsorption fixture provided by an embodiment of the present utility model;

[0021] Figure 2 for Figure 1 Schematic diagram of the structural decomposition;

[0022] Figure 3 A schematic structural diagram of a carrier of a multifunctional adsorption fixture provided in an embodiment of the present utility model;

[0023] Figure 4 A schematic structural diagram of the alignment of the second adsorption hole and the third adsorption hole of the multifunctional adsorption fixture provided by an embodiment of the present utility model;

[0024] Figure 5 This is a schematic structural diagram of the multifunctional adsorption fixture provided by an embodiment of the present invention in which the second adsorption hole and the third adsorption hole are not aligned.

[0025] Icon: 100-multi-function adsorption fixture; 110-carrier; 111-first adsorption hole; 112-mounting slot; 113-second adsorption hole; 114-first side; 120-pad; 121-third adsorption hole; 122-second side; 130-chamfer; 140-pressing strip; 141-bump; 143-mounting hole. DETAILED DESCRIPTION

[0026] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0031] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0032] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0033] The multifunctional adsorption fixture provided in the embodiments of the present invention is used on a vacuum machine to adsorb and fix a substrate or baseplate. For example, it can be used on a chip placement machine, a chip coating machine, or other process equipment. The multifunctional adsorption fixture can adapt to different types of substrates or baseplates, and can help mitigate warping deformation of the substrate or baseplate, thereby improving the positioning accuracy of the substrate or baseplate.

[0034] Combine Figures 1 to 3 The multifunctional adsorption fixture 100 includes a carrier 110 and a pad 120. The carrier 110 is provided with a first adsorption hole 111 and a mounting groove 112. The pad 120 is detachably mounted within the mounting groove 112. By providing the pad 120, the multifunctional adsorption fixture 100 can improve the support performance of the carrier 110 and alleviate the warping of the substrate or base. The detachable pad 120 facilitates adaptation to different types of substrates or bases, providing greater versatility and adaptability.

[0035] Optionally, the corners of the carrier 110 are provided with chamfers 130. This is beneficial to improving positioning performance, reducing mechanical shaking, and improving the positioning accuracy of the substrate or substrate. A second adsorption hole 113 is provided at the bottom of the mounting groove 112, and the pad 120 is provided with a third adsorption hole 121, and the second adsorption hole 113 and the third adsorption hole 121 are selectively aligned. It can be understood that for different adsorption objects, that is, when the structural shape of the substrate or substrate is different, the third adsorption hole 121 on the pad 120 and the second adsorption hole 113 in the mounting groove 112 can be aligned according to actual conditions. When the third adsorption hole 121 and the second adsorption hole 113 are aligned, the pad 120 can also exert a certain adsorption force on the substrate or substrate. When the third adsorption hole 121 and the second adsorption hole 113 are not aligned, the pad 120 has no adsorption force on the substrate or substrate, that is, the substrate or substrate is not subject to adsorption force in the pad 120 area.

[0036] It should be understood that the second adsorption hole 113 and the third adsorption hole 121 are selectively aligned or misaligned according to actual conditions to change the force conditions of the substrate or baseboard in the corresponding area of ​​the pad 120, thereby adjusting the optimal force of the substrate or baseboard and reducing warping deformation, thereby improving the positioning accuracy of the substrate or baseboard.

[0037] Combine Figure 4 and Figure 5 Optionally, the third adsorption holes 121 are arranged along the diagonal lines of the pad 120. This arrangement can reduce the number of third adsorption holes 121 under the same force, and the force is evenly distributed. In addition, the alignment or misalignment of the second adsorption holes 113 and the third adsorption holes 121 can be adjusted by the installation direction of the pad 120, which is convenient for operation. For example, the second adsorption holes 113 and the third adsorption holes 121 can be aligned or misaligned by rotating the pad 120 left and right, or by turning it upside down and installing it.

[0038] Of course, in other embodiments, the third adsorption holes 121 may also be distributed in a matrix, an annular array, or other manner. For example, if the pad 120 is circular, the third adsorption holes 121 may be located at the edges and center of the pad 120. If the pad 120 is square or rectangular, the third adsorption holes 121 may be located at the corners and center of the pad 120.

[0039] Accordingly, the size and shape of the mounting groove 112 are adapted to the size and shape of the pad 120. The distribution of the second adsorption holes 113 corresponds to the distribution of the third adsorption holes 121.

[0040] Optionally, the first adsorption hole 111 is provided on the periphery of the mounting groove 112. That is, the first adsorption hole 111 and the mounting groove 112 are spaced apart. In this embodiment, the carrier 110 is a rectangular parallelepiped, the pad 120 is a rectangular parallelepiped, and the cross-section of the mounting groove 112 is rectangular. And the thickness of the pad 120 is equal to the depth of the mounting groove 112. When the pad 120 is installed in the mounting groove 112, the upper surface of the pad 120 is flush with the upper surface of the carrier 110. The first adsorption holes 111 are provided along the edge of the carrier 110 and are distributed in a rectangular shape.

[0041] Optionally, the platform 110 includes at least two adjacent first side surfaces 114, each of which is provided with a chamfer 130. In this embodiment, the platform 110 has four corners, each of which is provided with two chamfers 130, meaning that each corner forms three or four edges perpendicular to the upper surface of the platform 110. This arrangement improves the stability of the platform 110 and reduces mechanical vibration.

[0042] Optionally, the pad 120 includes at least two adjacent second side surfaces 122, and chamfers 130 are respectively provided on the two second side surfaces 122. In this embodiment, the pad 120 has four corners, and each corner is respectively provided with two chamfers 130, that is, each corner is formed with three or four edges perpendicular to the upper surface of the pad 120. This arrangement can improve the stability of the placement of the pad 120 and reduce the mechanical shaking of the pad 120. This is conducive to improving the positioning accuracy of the substrate or baseboard. Of course, each corner of the pad 120 and the carrier 110 can also be provided with one, three, four or more chamfers 130, which is not specifically limited here.

[0043] It should be noted that one or more chamfers 130 are provided at the corners of the pad 120 and the carrier 110, which can effectively play a positioning role without the need for additional parts such as positioning pins for fixation, making installation more convenient.

[0044] Of course, in some other embodiments, the cross-sectional shapes of the carrier 110 , the pad 120 and the mounting groove 112 are not limited and may be triangle, diamond, circle, ellipse, sector or any other shape.

[0045] Optionally, the pad 120 is disposed in the middle of the stage 110. In this embodiment, the pad 120 is disposed in the exact center of the stage 110. This helps to improve the support of the stage 110 and effectively prevent the substrate or baseboard from warping.

[0046] Optionally, the multifunctional adsorption fixture 100 further includes a pressure bar 140, which is detachably mounted on the carrier 110. The detachable configuration of the pressure bar 140 allows for selective use in different scenarios. For example, if a substrate or backing with excessive warping is placed on the carrier 110, the pressure bar 140 can be used to hold the substrate or backing to mitigate the warping.

[0047] It should be noted that if the substrate or base plate is a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate, the holding strip 140 may be pressed against the substrate or base plate. Such substrates or base plates are relatively thick and are prone to warping.

[0048] Optionally, one of the beading strip 140 and the carrier 110 may be provided with a mounting hole 143, and the other with a protrusion 141, with the protrusion 141 being pluggable with the mounting hole 143. In this embodiment, the beading strip 140 is provided with the protrusion 141, and the carrier 110 is provided with the mounting hole 143. The protrusion 141 can be inserted into the mounting hole 143, thereby connecting the beading strip 140 and the carrier 110.

[0049] In other embodiments, a protrusion 141 may be provided on the carrier 110, and a mounting hole 143 may be provided on the pressure strip 140, with the pressure strip 140 and the carrier 110 connected by plugging and fitting the protrusion 141 and the mounting hole 143. Alternatively, a protrusion 141 and a mounting hole 143 may be provided on the carrier 110, and the mounting hole 143 and a protrusion may be provided on the pressure strip 140, with the pressure strip 140 and the carrier 110 connected by plugging and fitting the protrusion 141 and the mounting hole 143. The number of protrusions 141 and the mounting holes 143 are equal, and their positions correspond one to one. The shape and size of the protrusion 141 are compatible with the shape and size of the mounting holes 143.

[0050] Of course, it is not limited to this. The pressure strip 140 and the carrier 110 can also be fixed by means of clamping, riveting or bolting, etc., which are not specifically limited here.

[0051] The multifunctional adsorption fixture 100 provided in the embodiment of the present invention has the following operating principles:

[0052] In the first usage scenario, the pad 120 is not installed on the carrier 110. The substrate or baseplate is attached to the carrier 110 through the first attachment holes 111. This is suitable for lead frame products (QFNs), substrates with films attached to the backside, or substrates with grooves. The mounting grooves 112 on the carrier 110 can be used to avoid structures on the backside of the substrate, preventing the backside of the substrate from being delaminated due to attachment.

[0053] In the second usage scenario, a pad 120 is mounted on the carrier 110. The third suction hole 121 on the pad 120 is misaligned with the second suction hole 113 on the carrier 110. This means that the pad 120 area does not generate suction force. The pad 120 only serves a supporting function. This is applicable to leadframe products (QFN), products with films attached to the back, or coreless substrates. It is understood that if the target is a leadframe, the pad 120 area does not generate suction force, and the pad 120 only serves as support, preventing deformation of the leadframe. If the target is a coreless substrate, this substrate has no copper layer and is relatively thin. The center area is less susceptible to suction force and is not suitable for this. Vacuum suction in this area can easily lead to flip-chip soldering failure. By not generating suction force in the pad 120 area and using it only for support, vacuum suction in the center area of ​​the coreless substrate can be avoided, preventing the substrate or substrate from warping and forming grooves due to vacuum suction, which can lead to soldering failure.

[0054] In the third usage scenario, a pad 120 is mounted on the carrier 110. The third suction hole 121 on the pad 120 is aligned with the second suction hole 113 on the carrier 110. This creates an adsorption force around the pad 120. Pad 120 not only provides support but also allows for adsorption and fixation.

[0055] Optionally, a holding bar 140 can be installed on the carrier 110 to hold the substrate or underlay. This is suitable for adsorption of paper-based copper foil laminates, composite copper foil laminates, or polymer-impregnated fiberglass-based copper foil laminates. These substrates or underlays are thick and prone to warping. This warping can be mitigated by increasing the central adsorption force and applying pressure with the holding bar 140.

[0056] The embodiment of the present invention further provides a vacuum machine, comprising an air pump and the aforementioned multifunctional adsorption fixture 100 , wherein the air pump is connected to the first adsorption hole 111 of the carrier 110 .

[0057] As will be understood, the air pump is used to provide negative pressure or vacuum gas. The air pump is connected to the first suction hole 111 on the carrier 110 via a pipe, which provides a vacuum suction force on the carrier 110 to secure the substrate or substrate on the carrier 110. Depending on the actual situation, the air pump is connected to the second suction hole 113 in the mounting groove 112 to provide a certain vacuum suction force in the middle of the carrier 110.

[0058] In summary, the multifunctional adsorption fixture 100 and vacuum machine provided by the embodiment of the present invention have the following beneficial effects, including:

[0059] The multifunctional adsorption jig 100 provided by the embodiment of the present invention has a pad 120 which is detachably arranged in the mounting groove 112. The supporting performance of the carrier 110 can be improved, and the warping of the substrate or substrate can be alleviated. The pad 120 is detachable, which is convenient for adapting to different types of substrates or substrates, and has better versatility and adaptability. The corners of the carrier 110 are provided with chamfers 130, which are beneficial to improving the positioning performance, reducing mechanical shaking, and improving the positioning accuracy of the substrate or substrate. The carrier 110 is detachably provided with a pressure strip 140, which can be suitable for substrates or substrates with larger warping deformation. The multifunctional adsorption jig 100 can adapt to various types of substrates or substrates, has good versatility, simple structure, strong adaptability, and strong practicality.

[0060] The vacuum machine provided by the embodiment of the present invention includes the above-mentioned multifunctional adsorption fixture 100, which is used to achieve adsorption and fixation of the substrate or substrate, alleviate the warping deformation of the substrate or substrate and reduce the warping deformation caused by vacuum adsorption, thereby improving the positioning accuracy of the substrate or substrate.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some or all of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made should be included in the scope of protection of the present invention.

Claims

1. A multifunctional adsorption fixture, characterized in that: include: A carrier, wherein the carrier is provided with a first adsorption hole and a mounting groove; a cushion block, the cushion block being detachably disposed in the mounting groove; The bottom of the mounting groove is provided with a second adsorption hole, the pad is provided with a third adsorption hole, and the second adsorption hole and the third adsorption hole are selectively aligned.

2. The multifunctional adsorption fixture according to claim 1, characterized in that: The corners of the carrier are chamfered.

3. The multifunctional adsorption fixture according to claim 2, characterized in that: The third adsorption holes are arranged along the diagonal line of the pad.

4. The multifunctional adsorption fixture according to claim 1, characterized in that: The first adsorption holes are arranged on the outer periphery of the installation groove.

5. The multifunctional adsorption fixture according to claim 2, characterized in that: The carrier includes at least two adjacent first side surfaces, and the two first side surfaces are respectively provided with chamfers.

6. The multifunctional adsorption fixture according to claim 1, characterized in that: The pad includes at least two adjacent second side surfaces, and the two second side surfaces are respectively provided with chamfers.

7. The multifunctional adsorption fixture according to claim 1, characterized in that: It also includes a pressure strip, which is detachably mounted on the carrier.

8. The multifunctional adsorption fixture according to claim 7, characterized in that: One of the pressure strip and the carrier is provided with a mounting hole, and the other is provided with a convex block, and the convex block is plug-fitted into the mounting hole.

9. The multifunctional adsorption fixture according to any one of claims 1 to 8, characterized in that: The pad is arranged at the middle part of the carrier.

10. A vacuum machine, characterized in that: It comprises an air pump and the multifunctional adsorption fixture according to any one of claims 1 to 9, wherein the air pump is connected to the first adsorption hole of the carrier.

Images