Cooling device for plastic particle production
By using cooling devices in the plastic particle production process and using components such as semiconductor refrigeration sheets and fans for circulating cooling, the adhesion and deformation of high-temperature plastic particles is solved, and the rapid cooling effect is achieved.
Patent Information
- Application Number
- CN202422540082.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-21
AI Technical Summary
During the plastic particle production process, high-temperature plastic particles are prone to stick and deform, affecting product quality and performance.
A cooling device for plastic particles production is adopted, including a main body and a cooling mechanism, and the plastic particles are rapidly cooled by circulating cooling medium and wind power using components such as semiconductor refrigeration sheets, fans and stirring rods.
It achieves rapid cooling of plastic particles, avoids adhesion and deformation, and improves product quality and performance.
Smart Images
Figure CN223266037U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of plastic pellet production equipment, in particular to a cooling device for plastic pellet production. Background Art
[0002] The production of plastic pellets is a complex process, typically involving multiple steps, including raw material mixing, heating and plasticizing, and extrusion and pelletizing. During the heating and plasticizing stage, the raw materials are melted and thoroughly mixed at high temperatures, leaving the plastic in a hot, viscous state.
[0003] Based on the above, the inventors have discovered the following problem: During the production of plastic pellets, the plastic raw materials are heated, mixed, extruded, and otherwise exposed to high temperatures. If they are not cooled promptly and effectively, the pellets may become stuck together, deform, or otherwise deform, affecting the quality and performance of the product.
[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a cooling device for plastic pellet production is provided to achieve the purpose of having greater practical value. Utility Model Content
[0005] The purpose of the present invention is to provide a cooling device for producing plastic pellets to solve the problems raised in the above-mentioned background technology.
[0006] By adopting the above technical solution, the rapid cooling of plastic pellets during the production process is achieved.
[0007] In view of the above problems, the technical solution proposed by the present invention is:
[0008] A cooling device for producing plastic pellets includes a main body and a cooling mechanism, wherein the main body includes a box body, a plurality of through holes are opened at the inner bottom end of the box body, and a breathable net is installed inside the through holes. A stirring rod is rotatably connected to the center of the inner bottom end of the box body, and the cooling mechanism includes a cooling box, which is arranged at the bottom end of the box body. A first semiconductor refrigeration plate is installed inside the cooling box, and a first brushless fan is installed on both sides of the upper end of the first semiconductor refrigeration plate. The bottom end of the first semiconductor refrigeration plate is provided with a heat dissipation pipe, and a water tank is installed at the bottom end of the heat dissipation pipe inside the cooling box, and a second semiconductor refrigeration plate is fixedly installed at the inner bottom end of the water tank.
[0009] Furthermore, the heat dissipation pipes are distributed in a spiral shape, and both ends of the heat dissipation pipes are connected to the water tank.
[0010] The beneficial effect of adopting the above further solution is that by installing a heat dissipation pipe to connect it with the water tank, and cooperating with a micro pump, the internal medium of the two can circulate, thereby promoting the cooling effect on the hot end of the first semiconductor refrigeration plate.
[0011] Furthermore, a micro pump is installed inside the water tank, and the input of the micro pump is connected to one end of the heat dissipation pipe.
[0012] The beneficial effect of adopting the above further solution is that by installing the micro pump, the medium in the water tank can be injected into the heat dissipation pipe when the micro pump is working.
[0013] Furthermore, a plurality of heat dissipation fins are installed at the bottom end of the second semiconductor refrigeration plate, and the plurality of heat dissipation fins all pass through the water tank and extend to the outside.
[0014] The beneficial effect of adopting the above further solution is that by installing heat dissipation fins, the hot end of the second semiconductor refrigeration plate can be cooled conveniently.
[0015] Furthermore, an exhaust slot is inserted into the bottom side of the cooling box, and a plurality of second brushless fans are provided inside the exhaust slot.
[0016] The beneficial effect of adopting the above further solution is that by installing a plurality of second brushless fans inside the exhaust slot, the temperature of the heat sink fins can be reduced when the fans are in operation, thereby cooling the hot end of the second semiconductor refrigeration plate.
[0017] Furthermore, the upper end of the box body is threadedly connected to a box cover, and a plurality of third brushless fans are inserted into the upper end surface of the box cover.
[0018] The beneficial effect of adopting the above further solution is that by installing the third brushless fan, when it is working, the hot air inside the box can be extracted, thereby improving the cooling efficiency of the plastic particles inside the box.
[0019] Furthermore, a servo motor is fixedly mounted at the center of the upper end surface of the box cover, and the output end of the servo motor extends through the box cover to the bottom end and is sleeved with a connector.
[0020] The beneficial effect of adopting the above further solution is that by installing a servo motor, the connecting head can be driven to rotate when the servo motor is working.
[0021] Furthermore, a slot is provided at the top end of the stirring rod, and the connector is engaged with the slot.
[0022] The beneficial effect of adopting the above further solution is that, by engaging the card slot with the connector, the box cover and the box body are fixed, and the stirring rod can be driven to rotate by the servo motor.
[0023] Furthermore, a touch panel is installed on one side of the cooling box, and the input and output ends of the touch panel are communicatively connected with the input and output ends of the servo motor, micro pump, first brushless fan, second brushless fan, third brushless fan, first semiconductor refrigeration plate and second semiconductor refrigeration plate.
[0024] The beneficial effect of adopting the above further solution is that, by installing a touch panel, it is convenient for the user to control the operation of the device and adjust the temperature of the first semiconductor refrigeration plate and the second semiconductor refrigeration plate.
[0025] The beneficial effects of the present invention are as follows: the present invention provides a cooling device for the production of plastic pellets through the above-mentioned design. The cooling device for the production of plastic pellets opens a plurality of through holes at the inner bottom end of the box body and installs an air-permeable net therein, so as to facilitate the cooling of the plastic pellets poured into the box body. By installing a stirring rod and making it rotate slowly, the plastic pellets can be dispersed and the cooling effect can be improved. A first semiconductor refrigeration plate is installed inside the cooling box, and a pair of first brushless fans are installed thereon. When the first semiconductor refrigeration plate is working, its cold end is cooled, and the first brushless fan is used to blow cold air into the interior of the box body through the air-permeable net to stir and disperse the plastic pellets. By installing a heat dissipation pipe, the heat of the hot end of the first semiconductor refrigeration plate can be transferred. By installing a water tank, the internal medium thereof is exchanged with the internal medium of the heat dissipation pipe, which can play a role of circulating cooling. And by installing a second semiconductor refrigeration plate, the internal medium of the water tank can be cooled. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 Schematic diagram of the three-dimensional structure of the cooling device for plastic pellet production disclosed in the embodiment of the utility model Figure 1 ;
[0027] Figure 2 Schematic diagram of the three-dimensional structure of the cooling device for plastic pellet production disclosed in the embodiment of the utility model Figure 2 ;
[0028] Figure 3 Schematic diagram of the expanded three-dimensional structure of the cooling device for plastic pellet production disclosed in the embodiment of the utility model Figure 1 ;
[0029] Figure 4 Schematic diagram of the expanded three-dimensional structure of the cooling device for plastic pellet production disclosed in the embodiment of the utility model Figure 2 ;
[0030] Figure 5 This is a front cross-sectional schematic diagram of a cooling device for producing plastic pellets disclosed in an embodiment of the present utility model.
[0031] In the figure: 100, main body; 1001, box body; 1002, box cover; 1003, third brushless fan; 1004, servo motor; 1005, stirring rod; 1006, slot; 1007, connector; 1008, through hole; 1009, breathable mesh; 200, cooling mechanism; 2001, cooling box; 2002, exhaust slot; 2003, touch panel; 2004, water tank; 2005, second semiconductor refrigeration plate; 2006, heat dissipation fins; 2007, second brushless fan; 2008, first brushless fan; 2009, first semiconductor refrigeration plate; 2010, micro pump; 2011, heat pipe. DETAILED DESCRIPTION
[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0033] See also Figure 1 - Figure 5The utility model provides a technical solution: a cooling device for producing plastic pellets, comprising a main body 100 and a cooling mechanism 200, wherein the main body 100 comprises a box body 1001, a plurality of through holes 1008 are opened at the bottom end of the box body 1001, and a breathable net 1009 is installed inside the through holes 1008, a stirring rod 1005 is rotatably connected to the center of the bottom end of the box body 1001, and the cooling mechanism 200 comprises a cooling box 2001, which is arranged on the bottom end of the box body 1001. 01, the interior of the cooling box 2001 is equipped with a first semiconductor refrigeration sheet 2009, and the upper ends of the first semiconductor refrigeration sheet 2009 are both equipped with first brushless fans 2008. The bottom end of the first semiconductor refrigeration sheet 2009 is provided with a heat pipe 2011. The interior of the cooling box 2001 is equipped with a water tank 2004 at the bottom end of the heat pipe 2011. The bottom end of the water tank 2004 is fixedly equipped with a second semiconductor refrigeration sheet 2005. A plurality of through holes 1008 are provided at the bottom end thereof, and an air-permeable net 1009 is installed inside the inside thereof, so as to facilitate the cooling of the plastic pellets poured into the inside of the box body 1001. By installing a stirring rod 1005 and making it rotate slowly, the plastic pellets can be dispersed and the cooling effect can be improved. A first semiconductor refrigeration plate 2009 is installed inside the cooling box 2001, and a pair of first brushless fans 2008 are installed thereon. When the first semiconductor refrigeration plate 2009 is working, its cold end is cooled, and the first brushless fan 2008 blows cold air into the inside of the box body 1001 through the air-permeable net 1009 to stir and disperse the plastic pellets. By installing a heat dissipation pipe 2011, the heat of the hot end of the first semiconductor refrigeration plate 2009 can be transferred. By installing a water tank 2004, the internal medium thereof is exchanged with the internal medium of the heat dissipation pipe 2011, which can play a role of circulating cooling. And by installing a second semiconductor refrigeration plate 2005, the internal medium of the water tank 2004 can be cooled.
[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0035] See also Figure 1 - Figure 5, the heat dissipation pipe 2011 is distributed in a spiral shape, and both ends of the heat dissipation pipe 2011 are communicated with the water tank 2004, a micro pump 2010 is installed on the inside of the water tank 2004, and the input of the micro pump 2010 is connected to one end of the heat dissipation pipe 2011, and a plurality of heat dissipation fins 2006 are installed at the bottom end of the second semiconductor refrigeration plate 2005, and the plurality of heat dissipation fins 2006 all pass through the water tank 2004 and extend to the outside, an exhaust slot 2002 is inserted at the bottom side of the cooling box 2001, and a plurality of second brushless fans 2007 are provided inside the exhaust slot 2002, and the upper end of the box body 1001 is threadedly connected to the box cover 1002, and the upper end surface of the box cover 1002 is inserted with a plurality of third brushless fans 1003. By installing the heat dissipation pipe 2011, it is communicated with the water tank 2004, and cooperates with the micro The type pump 2010 can make the internal medium of the two circulate, thereby promoting the cooling effect on the hot end of the first semiconductor refrigeration plate 2009. By installing the micro pump 2010, when it is working, the internal medium of the water tank 2004 can be injected into the heat dissipation pipe 2011. By installing the heat dissipation fins 2006, it is convenient to cool the hot end of the second semiconductor refrigeration plate 2005. By installing a plurality of second brushless fans 2007 inside the exhaust slot 2002, when it is working, the temperature of the heat dissipation fins 2006 can be reduced, thereby cooling the hot end of the second semiconductor refrigeration plate 2005. By installing the third brushless fan 1003, when it is working, the hot air inside the box body 1001 can be extracted, thereby improving the cooling efficiency of the plastic particles inside the box body 1001.
[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0037] See also Figure 1 - Figure 5A servo motor 1004 is fixedly installed at the center of the upper end surface of the box cover 1002. The output end of the servo motor 1004 extends through the box cover 1002 to the bottom end and is covered with a connector 1007. A slot 1006 is provided at the top of the stirring rod 1005. The connector 1007 is engaged with the slot 1006. A touch panel 2003 is installed on one side of the cooling box 2001. The input and output ends of the touch panel 2003 are connected to the servo motor 1004, the micro pump 2010, the first brushless fan 2008, the second brushless fan 2007, the third brushless fan 1003, The input and output ends of the first semiconductor refrigeration chip 2009 and the second semiconductor refrigeration chip 2005 are communicated with each other. By installing a servo motor 1004, the connector 1007 can be driven to rotate when the refrigeration chip is working. By engaging the card slot 1006 with the connector 1007, the box cover 1002 and the box body 1001 are fixed. The stirring rod 1005 can be driven to rotate by the servo motor 1004. By installing a touch panel 2003, the user can conveniently control the operation of the device and adjust the temperature of the first semiconductor refrigeration chip 2009 and the second semiconductor refrigeration chip 2005. Specifically, the working principle of the cooling device for the production of plastic pellets is as follows: when in use, the plastic pellets to be cooled are poured into the interior of the box 1001 and the box cover 1002 is closed. Then, the user starts the servo motor 1004, and the connector 1007 provided on the output end of the servo motor 1004 engages with the slot 1006 provided on the top of the stirring rod 1005, thereby causing the stirring rod 1005 to rotate slowly to stir and disperse the plastic pellets. At this time, the user starts the third brushless fan 1003 to discharge the hot air inside the box 1001. At the same time, the first brushless fan 2008 cooperates with the first semiconductor refrigeration plate 2009 to blow cold air into the interior of the box 1001 through the through hole 1008 to cool the plastic pellets inside. When the cold end of the first semiconductor refrigeration plate 2009 is working, the heat generated at its hot end is dissipated by the heat dissipation pipe 2 011 The medium circulating inside is transferred to the inside of the water tank 2004. A second semiconductor refrigeration plate 2005 is installed inside the water tank 2004 to cool the medium, thereby cooling the hot end of the first semiconductor refrigeration plate 2009 and promoting the cooling effect of its cold end. The hot end of the second semiconductor refrigeration plate 2005 is extended to the outside of the water tank 2004 by installing a plurality of heat dissipation fins 2006. By installing a second brushless fan 2007 inside the exhaust slot 2002, the heat dissipation fins 2006 can be cooled to achieve the cooling of the hot end of the second semiconductor refrigeration plate 2005, thereby promoting its cooling effect on the medium inside the water tank 2004. After the plastic pellets inside the box body 1001 are cooled, the user opens the box cover 1002 and inserts the negative pressure equipment pipe into the box body 1001, so that the cooled plastic pellets inside can be extracted for use.
Claims
1. A cooling device for producing plastic pellets, characterized in that: The invention comprises a main body (100) and a cooling mechanism (200), wherein the main body (100) comprises a box (1001), a plurality of through holes (1008) are provided at the inner bottom of the box (1001), a breathable net (1009) is installed inside the through holes (1008), a stirring rod (1005) is rotatably connected to the center of the inner bottom of the box (1001), and the cooling mechanism (200) comprises a cooling box (2001), and the cooling box (2001) is arranged at the bottom of the box (1001). A first semiconductor refrigeration plate (2009) is installed inside the cooling box (2001), first brushless fans (2008) are installed on both sides of the upper end of the first semiconductor refrigeration plate (2009), a heat dissipation pipe (2011) is sleeved on the bottom end of the first semiconductor refrigeration plate (2009), a water tank (2004) is installed inside the cooling box (2001) at the bottom end of the heat dissipation pipe (2011), and a second semiconductor refrigeration plate (2005) is fixedly installed at the bottom end of the water tank (2004).
2. A cooling device for producing plastic pellets according to claim 1, characterized in that: The heat dissipation pipes (2011) are distributed in a spiral shape, and both ends of the heat dissipation pipes (2011) are connected to the water tank (2004).
3. A cooling device for producing plastic pellets according to claim 1, characterized in that: A micro pump (2010) is installed inside the water tank (2004), and the input of the micro pump (2010) is connected to one end of the heat dissipation pipe (2011).
4. A cooling device for producing plastic pellets according to claim 1, characterized in that: A plurality of heat dissipation fins (2006) are installed at the bottom end of the second semiconductor refrigeration plate (2005), and the plurality of heat dissipation fins (2006) all pass through the water tank (2004) and extend to the outside.
5. A cooling device for producing plastic pellets according to claim 1, characterized in that: An exhaust slot (2002) is inserted into the bottom side of the cooling box (2001), and a plurality of second brushless fans (2007) are arranged inside the exhaust slot (2002).
6. A cooling device for producing plastic pellets according to claim 1, characterized in that: The upper end of the box body (1001) is threadedly connected to a box cover (1002), and a plurality of third brushless fans (1003) are inserted into the upper end surface of the box cover (1002).
7. A cooling device for producing plastic pellets according to claim 6, characterized in that: A servo motor (1004) is fixedly mounted at the center of the upper end surface of the box cover (1002), and the output end of the servo motor (1004) extends through the box cover (1002) to the bottom end and is sleeved with a connector (1007).
8. A cooling device for producing plastic pellets according to claim 7, characterized in that: A slot (1006) is provided at the top end of the stirring rod (1005), and the connector (1007) is engaged with the slot (1006).
9. A cooling device for producing plastic pellets according to claim 8, characterized in that: A touch panel (2003) is installed on one side of the cooling box (2001), and the input and output ends of the touch panel (2003) are communicatively connected to the input and output ends of the servo motor (1004), the micro pump (2010), the first semiconductor cooling plate (2009), the first brushless fan (2008), the second brushless fan (2007), the third brushless fan (1003) and the second semiconductor cooling plate (2005).