Recyclable packaging structure of nude MCU (Microprogrammed Control Unit)

Abstract

The utility model discloses a recyclable packaging structure of a bare MCU, relates to the technical field of logistics packaging, solves the problem that the surface of the MCU is prone to being scratched and abraded in the transportation process, and comprises a lower shell, the lower shell is provided with an upper protective cover used for packaging the MCU, and a locking piece is arranged between the upper protective cover and the lower shell. A connecting piece is arranged between the upper protective cover and the lower shell; the locking piece and the connecting piece are located on different sides of the upper protective cover respectively, and the upper protective cover is detachably connected with the lower shell through the locking piece and the connecting piece. According to the invention, dustproof and protection effects on the MCU are realized.

Description

Technical Field

[0001] The present application relates to the field of logistics packaging technology, and in particular to a recyclable packaging structure for a bare MCU. Background Art

[0002] In recent years, with the influx of new energy vehicle companies into the automotive market and the application of high-end AI control systems in intelligent driving, a key control system has emerged in the automotive field: the MCU (motor controller: used for energy conversion). With the emergence of new components, corresponding logistics and transportation configurations will also change.

[0003] New energy vehicles currently contain numerous electronic components, requiring assembly at a rate several times greater than that of conventional vehicles. Consequently, MCUs are being designed with a focus on size and protection, minimizing their size and accommodating a greater number of components per unit volume. However, the packaging of these semi-exposed MCUs has become extremely complex. They are no longer packaged individually, but are integrated with other components. Reusable components are not removed until the powertrain is assembled on the production line.

[0004] In existing packaging methods, in order to adapt to the integration space of new energy powertrains and facilitate assembly, the MCU is generally packaged only in the lower shell. However, this packaging method is prone to scratches and wear on the surface of the MCU during transportation. Therefore, a recyclable packaging structure for naked MCUs is urgently needed to improve the above-mentioned problems. Utility Model Content

[0005] In order to improve the problem of scratches and wear on the surface of the MCU during transportation, the present application provides a recyclable packaging structure for a bare MCU.

[0006] This application provides a recyclable packaging structure for a bare MCU, which adopts the following technical solutions:

[0007] A recyclable packaging structure for a bare microcontroller (MCU), comprising a lower shell, wherein the lower shell is provided with an upper protective cover for packaging the MCU, a locking piece is provided between the upper protective cover and the lower shell, and a connecting piece is provided between the upper protective cover and the lower shell; the locking piece and the connecting piece are respectively located on different sides of the upper protective cover, and the upper protective cover is detachably connected to the lower shell via the locking piece and the connecting piece.

[0008] Preferably, the connecting piece includes an inverted block arranged on the upper protective cover, the lower shell is provided with a plug-in slot for the inverted block to be plugged in, and the inverted block is provided with a guiding slope; when the inverted block is located in the plug-in slot, the top of the inverted block is located directly below the top wall of the plug-in slot.

[0009] Preferably, there are at least two locking members, which are spaced apart and arranged on the same side of the upper protective cover.

[0010] Preferably, the locking member includes a locking plate arranged on the upper protective cover, a buckle slot opened on the locking plate, a locking slot opened on the lower shell, and a buckle block arranged in the locking slot; the locking plate is elastic, and the top and bottom of the buckle block are respectively provided with a first guide inclined surface, and the bottom end of the locking plate is provided with a second guide inclined surface; when the upper protective cover and the lower shell are locked, the locking plate is inserted into the locking slot vertically, and the buckle block is inserted into the buckle slot horizontally.

[0011] Preferably, the upper protective cover is provided with a flip block located at the locking plate for separating the buckle block from the buckle slot, and the flip block is fixedly connected to the locking plate.

[0012] Preferably, there are at least two inverted blocks which are spaced apart from each other, and the number of the insertion slots is the same as the number of the inverted blocks.

[0013] Preferably, a stabilizing plate is provided between the handle block and the upper protective cover.

[0014] Preferably, the upper protective cover is provided with a reinforcement grid, and the upper protective cover has an anti-static effect.

[0015] In summary, the beneficial effects of this application are:

[0016] An upper protective cover is set on the lower shell to prevent dust and protect the MCU during transportation, thereby improving the problem of scratches and wear on the surface of the MCU. The upper protective cover and the lower shell are connected in a detachable manner. The upper protective cover can be retained until the MCU is assembled and can be reused after being removed during assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of the MCU packaged in this embodiment of the present application;

[0018] Figure 2 is a cross-sectional schematic diagram of the embodiment of the present application highlighting the positions of the connecting member and the locking member;

[0019] Figure 3 yes Figure 2 A magnified schematic diagram of point A in the middle;

[0020] Figure 4 yes Figure 2 A magnified schematic diagram of point B in the middle;

[0021] Figure 5 It is a schematic structural diagram of the protective cover in this embodiment of the present application;

[0022] Figure 6It is a side view of the protective cover of this embodiment of the present application.

[0023] Explanation of the accompanying drawings: 1. Lower shell; 11. Plug-in slot; 2. Upper protective cover; 3. Reinforcement grid; 4. Connecting piece; 41. Inverted buckle block; 411. Guide slope; 412. Guide deformation groove; 42. Connecting plate; 5. Locking piece; 51. Locking plate; 511. Second guide slope; 52. Buckle slot; 53. Locking slot; 54. Buckle block; 541. First guide slope; 6. Mounting plate; 7. Flip block; 71. Stabilizing plate. DETAILED DESCRIPTION

[0024] The present application is further described in detail below with reference to the accompanying drawings.

[0025] Reference Figure 1 The embodiment of the present application discloses a recyclable packaging structure for a bare MCU, including a lower shell 1 and an upper protective cover 2 detachably connected to the lower shell 1. The upper protective cover 2 and the lower shell 1 are used together to achieve fully enclosed protection for the MCU to avoid scratches and wear during transportation.

[0026] Reference Figure 1 and Figure 2 In addition, the upper protective cover 2 is made of PP (polypropylene), which has a certain anti-static effect and deformation capacity. When the upper protective cover 2 is used to package the MCU, it can provide an anti-static effect. The top and sides of the upper protective cover 2 are respectively equipped with reinforcement grids 3 to provide a certain degree of protection against downward pressure.

[0027] Reference Figure 2 and Figure 3 as well as Figure 4 Furthermore, a connecting piece 4 and a locking piece 5 are provided between the upper protective cover 2 and the lower shell 1. The locking piece 5 and the connecting piece 4 are respectively located on different sides of the upper protective cover 2. The upper protective cover 2 is detachably connected to the lower shell 1 through the locking piece 5 and the connecting piece 4.

[0028] Reference Figure 2 and Figure 3 as well as Figure 6Specifically, the upper protective cover 2 is generally a rectangular parallelepiped structure. The connecting part 4 includes two inverted blocks 41 installed on the upper protective cover 2, and the two inverted blocks 41 are spaced apart at one long side of the upper protective cover 2. In addition, the inverted block is also made of polypropylene material and has a certain deformation ability; a connecting plate 42 is integrally formed between the two inverted blocks 41. A guide slope 411 is inclined on the inner side of the bottom end of the inverted block 41, and a plug-in slot 11 for the inverted block 41 to be plugged in is provided on one side of the lower shell 1; during installation, the guide slope 411 is used to insert the inverted block 41 into the plug-in slot 11 from top to bottom. A guide deformation groove 412 is provided on the outer side of the bottom end of the inverted block 41, and the guide deformation groove 412 and the guide slope 411 are respectively located on one side of the inverted block 41. The purpose of designing the guiding deformation groove 412 is to facilitate the deformation of the bottom end of the inverted block 41 first during the process of inserting the inverted block 41 into the plug-in slot 11 from top to bottom, thereby inserting the inverted block 41 into the plug-in slot 11; at this time, the top of the inverted block 41 is located directly below the top wall of the plug-in slot 11.

[0029] Reference Figure 4 and Figure 5 as well as Figure 6 There are at least two locking members 5, which are spaced apart and arranged on the same long side of the upper protective cover 2. The locking member 5 includes a locking plate 51 fixed to the upper protective cover 2, a buckle slot 52 provided on the locking plate 51, a locking slot 53 provided on the lower shell 1, and a buckle block 54 fixed to the inner wall of one side of the locking slot 53. Among them, the locking plate 51 is generally a rectangular parallelepiped structure, and the length direction of the locking plate 51 is arranged vertically; the top of the locking plate 51 is fixedly connected to the upper protective cover 2. The locking plate 51 and the upper protective cover 2 are both made of PP (polypropylene) material, which has elasticity and a certain degree of deformation ability. The buckle slot 52 is located near the bottom of the locking plate 51, and the two ends of the buckle slot 52 respectively penetrate the side walls of the locking plate 51.

[0030] Reference Figure 4 and Figure 5 During installation, the locking groove 53 is used for the locking plate 51 to be inserted from top to bottom (to achieve Y-axis limit), and the buckle block 54 is inserted into the buckle groove 52 along the horizontal direction (to achieve X-axis limit), thereby removing a long plate side shell of the upper protective cover 2 and connecting it to the lower shell 1.

[0031] Reference Figure 4 and Figure 5 Furthermore, to facilitate insertion of the buckle block 54 into the buckle slot 52, first guide slopes 541 are provided at the top and bottom of the buckle block 54, respectively. This makes the buckle block 54 have a substantially trapezoidal longitudinal cross-section, thereby guiding the buckle block 54 into the buckle slot 52. Furthermore, a second guide slope 511 is provided on the inner side of the bottom end of the locking plate 51 to guide the locking plate 51 into the locking slot 53.

[0032] Reference Figure 5 and Figure 6 In addition, the upper protective cover 2 includes a mounting plate 6 located at the locking plate 51. The top of the mounting plate 6 is connected to the upper protective cover 2, and the top of the locking plate 51 is connected to the mounting plate 6. During processing, the mounting plate 6, the locking plate 51 and the upper protective cover 2 are processed by integral injection molding. A flip block 7 is fixed to the outer wall of the mounting plate 6, which is used to swing the locking plate 51 outward so that the locking block disengages from the locking slot and removes the upper protective cover 2 and the lower shell 1. In order to ensure the reliability of the connection between the flip block 7 and the mounting plate 6, two stabilizing plates 71 are installed between the flip block 7 and the mounting plate 6. The two stabilizing plates 71 are respectively located on both sides of the flip block 7 to increase the folding resistance of this part.

[0033] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A recyclable packaging structure for a bare MCU, comprising a lower housing (1), characterized in that: The lower housing (1) is provided with an upper protective cover (2) for packaging the MCU; a locking piece (5) is provided between the upper protective cover (2) and the lower housing (1); and a connecting piece (4) is provided between the upper protective cover (2) and the lower housing (1); the locking piece (5) and the connecting piece (4) are respectively located on different sides of the upper protective cover (2); and the upper protective cover (2) is detachably connected to the lower housing (1) via the locking piece (5) and the connecting piece (4).

2. The recyclable packaging structure of a bare MCU according to claim 1, characterized in that: The connecting member (4) comprises an undercut block (41) arranged on the upper protective cover (2); the lower shell (1) is provided with a plug-in slot (11) for the undercut block (41) to be plugged in; the undercut block (41) is provided with a guiding inclined surface (411); when the undercut block is located in the plug-in slot (11), the top of the undercut block (41) is located directly below the top wall of the plug-in slot (11).

3. The recyclable packaging structure of a bare MCU according to claim 1, characterized in that: There are at least two locking members (5) which are spaced apart and arranged on the same side of the upper protective cover (2).

4. The recyclable packaging structure of a bare MCU according to claim 3, characterized in that: The locking member (5) comprises a locking plate (51) arranged on the upper protective cover (2), a buckle slot (52) provided on the locking plate (51), a locking slot (53) provided on the lower shell (1), and a buckle block (54) arranged in the locking slot (53); the locking plate (51) is elastic, the top and bottom of the buckle block (54) are respectively provided with a first guiding inclined surface (541), and the bottom end of the locking plate (51) is provided with a second guiding inclined surface (511); when the upper protective cover (2) and the lower shell (1) are locked, the locking plate (51) is vertically inserted into the locking slot (53), and the buckle block (54) is horizontally inserted into the buckle slot (52).

5. The recyclable packaging structure of a bare MCU according to claim 4, characterized in that: The upper protective cover (2) is provided with a flip block (7) located at the locking plate (51) for separating the buckle block (54) from the buckle slot (52), and the flip block (7) is fixedly connected to the locking plate (51).

6. The recyclable packaging structure of a bare MCU according to claim 2, characterized in that: There are at least two undercut blocks (41) arranged at intervals, and the number of the insertion slots (11) is the same as the number of the undercut blocks (41).

7. The recyclable packaging structure of a bare MCU according to claim 5, characterized in that: A stabilizing plate (71) is provided between the handle block (7) and the upper protective cover (2).

8. The recyclable packaging structure of a bare MCU according to claim 1, characterized in that: The upper protective cover (2) is provided with a reinforcement grid (3), and the upper protective cover (2) has an anti-static effect.

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