Copper plating auxiliary tool for thin film copper electrode of semiconductor electrostatic chuck

Abstract

The utility model relates to the technical field of semiconductor devices, in particular to a copper plating auxiliary tool for a thin film copper electrode of a semiconductor electrostatic chuck, which comprises a bottom plate, a shielding plate, a copper plating through hole, a copper plating pattern and a plurality of positioning pieces, a PI film is attached to the top of the bottom plate, the shielding plate covers the PI film, the center of the shielding plate is provided with the copper plating through hole, and the positioning pieces are arranged in the copper plating through hole. The shielding plate is arranged on the bottom plate and the copper plating pattern, the shielding plate and the copper plating pattern are pressed on the PI film through the effect of a positioning piece, a plurality of positioning holes are formed in the bottom plate, the PI film and the shielding plate in a penetrating mode so that the bottom plate, the PI film and the shielding plate can be accurately overlapped, the shielding plate is used for shielding, and the surface of the obtained copper electrode is cleaner; and the copper plating pattern is positioned by using the positioning piece, so that the accuracy of the shape is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, in particular to a copper plating auxiliary tool for a semiconductor electrostatic chuck thin film copper electrode. Background Art

[0002] The thin-film copper electrode for semiconductor electrostatic chucks is produced by PVD copper plating on a PI film (polyimide film). Conventional PVD copper plating cannot accurately produce the shape of the thin-film copper electrode, and the resulting thin-film copper electrode has surface defects. Utility Model Content

[0003] In view of this, the purpose of the present invention is to provide a copper plating auxiliary tool for a semiconductor electrostatic chuck thin film copper electrode to solve the problem of defects on the film surface after copper plating.

[0004] Based on the above purpose, the utility model provides a copper plating auxiliary tool for a semiconductor electrostatic chuck thin film copper electrode, comprising:

[0005] a base plate with a PI film placed on top;

[0006] A shielding plate is attached to the top of the PI film, and a copper-plated through hole is provided at the center of the shielding plate;

[0007] a copper-plated pattern, disposed in the copper-plated through-hole;

[0008] A plurality of positioning members are provided on the bottom plate and the copper-plated pattern, and the shielding plate and the copper-plated pattern are pressed against the PI film by the positioning members;

[0009] Among them, multiple positioning holes are provided on the bottom plate, PI film and shielding plate to ensure that the bottom plate, PI film and shielding plate are accurately overlapped.

[0010] Preferably, the shielding plate and the copper-plated pattern are both made of stainless steel.

[0011] Preferably, the positioning member includes a magnetic patch, and a plurality of magnetic patches are welded on the copper-plated pattern and the base plate, and the copper-plated pattern and the base plate are positioned at the center of the copper-plated through-hole through the corresponding magnetic patches, so that the PI film can obtain a precise thin film copper electrode shape after copper plating.

[0012] Beneficial effects of the utility model:

[0013] (1) By using a stainless steel shielding plate for shielding, the surface of the copper electrode obtained is cleaner.

[0014] (2) Use magnetic patches for positioning to ensure the accuracy of the shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 This is a schematic diagram of the shielding plate and the PI film after being laminated to each other according to an embodiment of the present invention;

[0017] Figure 2 This is a side view schematic diagram of the shielding plate and PI film after being laminated to each other according to an embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the entire tool after copper plating according to an embodiment of the present invention.

[0019] The following are marked in the figure:

[0020] 1. Shielding plate; 2. PI film; 3. Bottom plate; 4. Magnetic patch; 5. Positioning hole. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0022] It should be noted that, unless otherwise defined, the technical or scientific terms used in this utility model should have the usual meanings understood by people with ordinary skills in the field to which this utility model belongs. The "first", "second" and similar words used in this utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0023] like Figure 1 and Figure 3 As shown, a copper plating auxiliary tool for a semiconductor electrostatic chuck thin film copper electrode comprises:

[0024] Base plate 3, with PI film 2 placed on top;

[0025] A shielding plate 1 is attached to the top of the PI film 2, and a copper-plated through hole is provided at the center of the shielding plate 1;

[0026] a copper-plated pattern, disposed in the copper-plated through-hole;

[0027] A plurality of positioning members are provided on the bottom plate 3 and the copper-plated pattern, and the shielding plate 1 and the copper-plated pattern are pressed against the PI film 2 by the positioning members;

[0028] A plurality of positioning holes 5 are provided through the bottom plate 3 , the PI film 2 and the shielding plate 1 so that the bottom plate 3 , the PI film 2 and the shielding plate 1 can be precisely overlapped.

[0029] As an optional embodiment, the shielding plate 1 and the copper-plated pattern are both made of stainless steel.

[0030] As an optional embodiment, the positioning member includes a magnetic patch 4, and multiple magnetic patches 4 are welded on the copper-plated pattern and the base plate 3, and the copper-plated pattern and the base plate 3 are positioned at the center of the copper-plated through-hole through the corresponding magnetic patches 4, so that the PI film 2 can obtain a precise thin film copper electrode shape after copper plating.

[0031] For example, after the cut PI film 2 is attached to the shielding plate 1, the PI film 2 is placed on the base plate 3; the shielding plate 1 is used to mask areas that do not require copper plating; the magnetic patch 4 is used to determine the position of the shielding plate 1; and the positioning holes 5 are used to locate the base plate 3, the PI film 2, and the shielding plate 1. After the base plate 3 and the shielding plate 1 are completed, the magnetic patch 4 is positioned and welded to the base plate 3 and the shaped copper-plated pattern. The PI film 2 is attached to the base plate 1 through the positioning holes 5, and the magnetic patch 4 on the shielding plate 3 is aligned with the patch on the base plate 1 to determine the position of the shielding plate 3. The PI film 2 attached to the stainless steel shielding plate 3 is PVD-coated with copper. Copper is deposited onto the substrate surface through physical vapor deposition technology. The thin film obtained in this way has a dense film layer and strong adhesion. The copper-plated film is removed from the shielding plate 3 to obtain a thin film copper electrode.

[0032] Those skilled in the art will understand that the discussion of any of the above embodiments is merely illustrative and is not intended to limit the scope of the present invention to these examples. Within the spirit and principles of the present invention, the technical features of the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and many other variations exist in the various aspects of the present invention described above, which are not provided in detail for the sake of clarity. Any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A copper plating auxiliary tool for a semiconductor electrostatic chuck thin film copper electrode, characterized in that: include: a bottom plate (3) with a PI film (2) placed on top; A shielding plate (1) is attached to the top of the PI film (2), and a copper-plated through hole is provided at the center of the shielding plate (1); a copper-plated pattern, disposed in the copper-plated through-hole; A plurality of positioning members are arranged on the bottom plate (3) and the copper-plated pattern, and the shielding plate (1) and the copper-plated pattern are pressed onto the PI film (2) by the positioning members; A plurality of positioning holes (5) are provided through the bottom plate (3), the PI film (2) and the shielding plate (1), so that the bottom plate (3), the PI film (2) and the shielding plate (1) are precisely aligned.

2. The copper plating auxiliary tool for a semiconductor electrostatic chuck thin film copper electrode according to claim 1, characterized in that: The shielding plate (1) and the copper-plated pattern are both made of stainless steel.

3. The copper plating auxiliary tool for a semiconductor electrostatic chuck thin film copper electrode according to claim 1, characterized in that: The positioning member includes a magnetic patch (4), and a plurality of magnetic patches (4) are welded on the copper-plated pattern and the base plate (3), and the copper-plated pattern and the base plate (3) are positioned at the center of the copper-plated through-hole through the corresponding magnetic patches (4), so that the PI film (2) obtains a precise thin-film copper electrode shape after copper plating.

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