Compressor heat dissipation device based on bionics
Through the combined structure of the cylinder radiator and air radiator and the bionic heat dissipation design, the problem of enlarged packaging volume caused by the large size of the compressor radiator is solved, and efficient heat dissipation and space utilization are improved, reducing the manufacturing cost of the oxygen generator.
Patent Information
- Application Number
- CN202422793338.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-11-15
AI Technical Summary
The radiator size of the existing compressor is relatively large, resulting in an increase in the packaging volume, increasing the overall structure of the oxygen generator and increasing manufacturing costs.
The combined structure of the cylinder radiator and the air radiator is adopted. The cylinder radiator sleeve is located on the outer periphery of the compressor cylinder, and the air radiator is arranged between the cylinders. Combined with the bionic radiator plate and the heat dissipation fin set, the cooling runner design is optimized, the bionic radiator branches are used to improve the heat dissipation efficiency, and the heat dissipation is assisted by the heat dissipation fan.
It effectively realizes the heat dissipation of the compressor and compressed air, rationally utilizes space, reduces packaging volume, improves space utilization, and reduces manufacturing costs.
Smart Images

Figure CN223270133U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of oxygen concentrators, in particular to a compressor heat dissipation device based on bionics. Background Art
[0002] Because internal compressors generate noise during operation, some oxygen concentrator designs often include encapsulation to reduce noise. However, during operation, the internal energy generated by the compressed air causes the compressor and the compressed air to continuously heat up. This excessive temperature not only shortens the compressor's lifespan but also causes a decrease in oxygen concentration. Therefore, a heat dissipation structure is needed to overcome this problem.
[0003] The heat dissipation structure used in existing compressors generally adds a radiator to the compressor's air outlet and installs a fan on the package to achieve the heat dissipation effect. Due to the large size of the radiator, the package volume increases accordingly, which not only makes the overall structure of the oxygen concentrator bloated, but also increases the manufacturing cost. Summary of the Invention
[0004] The utility model provides a compressor heat dissipation device based on bionics, aiming to solve the problem of excessively large packaging volume caused by oversized radiators.
[0005] In order to achieve the above purpose, the technical solution of the utility model is:
[0006] A compressor heat dissipation device based on bionics, comprising: a cylinder radiator and an air radiator;
[0007] The cylinder radiator is sleeved on the periphery of the cylinder body of the compressor, the air radiator is arranged between two adjacent cylinder radiators, the air inlet end of the air radiator is connected to the air outlet of the compressor, and the air outlet end of the air radiator can be connected to the air inlet of the oxygen concentrator.
[0008] Furthermore, the air radiator comprises an air path base plate, a bionic heat sink and a heat dissipation fin group which are fixedly connected in sequence from bottom to top;
[0009] The gas path bottom plate is provided with a cooling channel, and the two ends of the cooling channel are respectively connected to the air inlet joint and the air outlet joint fixed on the gas path bottom plate;
[0010] A bionic heat dissipation branch is provided on one side of the bionic heat dissipation plate close to the gas path bottom plate, and the bionic heat dissipation branch extends into the cooling flow channel;
[0011] The heat dissipation fin group is arranged on a side of the bionic heat dissipation plate away from the air path bottom plate, and the heat dissipation fin group consists of a plurality of heat dissipation fins.
[0012] Furthermore, the air inlet connector and the air outlet connector are located at the same end of the air path base plate, and the cooling channel includes a first heat dissipation path and a second heat dissipation path that are connected in sequence;
[0013] The first heat dissipation path is a straight flow path extending from the proximal end to the distal end of the air outlet joint, and the second heat dissipation path is a serpentine flow path formed by alternatingly connecting multiple straight flow paths and multiple semicircular flow paths;
[0014] Two ends of the first heat dissipation path are respectively communicated with the air outlet connector and the second heat dissipation path, and two ends of the second heat dissipation path are respectively communicated with the first heat dissipation path and the air inlet connector.
[0015] Furthermore, the shape of the bionic heat dissipation branch is selected from the group consisting of fin-shaped, tooth-shaped, cylindrical, hemispherical and rectangular.
[0016] Furthermore, it also includes a first connecting pipeline and a second connecting pipeline;
[0017] The compressor outlet pipeline of the compressor is connected to the air inlet joint through a first connecting pipeline, and the air outlet joint is connected to the air inlet of the oxygen concentrator through a second connecting pipeline.
[0018] Furthermore, the cylinder radiator includes a plurality of heat dissipation blocks connected end to end in sequence, and the heat dissipation blocks are provided with heat dissipation fins.
[0019] Furthermore, a heat-conducting gasket is provided between the cylinder radiator and the cylinder.
[0020] Furthermore, it also includes a cooling fan, which is located above or to the side of the compressor;
[0021] The heat dissipation fins of the heat dissipation fin group extend along the air flow direction of the heat dissipation fan.
[0022] Furthermore, it also includes a packaging shell, which can accommodate the compressor, and the cooling fan is fixed on the packaging shell.
[0023] Beneficial effect: The utility model provides a compressor heat dissipation device based on bionics. By arranging a cylinder radiator on the cylinder body of the compressor and arranging an air radiator between the cylinder radiators, it not only effectively realizes the heat dissipation of the compressor and its compressed air, but also places the air radiator in the gap between the two cylinder bodies of the compressor to reasonably utilize the space, thereby improving the space utilization rate inside the package, and thus achieving the goal of reducing the package volume. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0025] Figure 1 This is a schematic diagram of the coordination between a compressor heat dissipation device based on bionics and a compressor disclosed in the utility model;
[0026] Figure 2 for Figure 1 A magnified view of point A;
[0027] Figure 3 This is a schematic structural diagram of an air radiator of a compressor heat dissipation device based on bionics disclosed in the utility model;
[0028] Figure 4 This is an exploded view of an air radiator of a compressor heat dissipation device based on bionics disclosed in the utility model;
[0029] Figure 5 This is a partial cross-sectional view of an air radiator of a compressor heat dissipation device based on bionics disclosed in the utility model. Figure 1 ;
[0030] Figure 6 This is a schematic structural diagram of a bionic heat sink plate of a compressor heat sink device based on bionics disclosed in the utility model;
[0031] Figure 7 This is a partial cross-sectional view of an air radiator of a compressor heat dissipation device based on bionics disclosed in the utility model. Figure 2 ;
[0032] Figure 8 This is a partial cross-sectional view of an air radiator of a compressor heat dissipation device based on bionics disclosed in the utility model. Figure 3 ;
[0033] Figure 9 This is a schematic diagram of a compressor heat dissipation device based on bionics disclosed in the present invention, in which a cooling fan is located above the compressor;
[0034] Figure 10 This is a schematic diagram of a compressor heat dissipation device based on bionics disclosed in the present utility model, in which a cooling fan is located on the side of the compressor.
[0035] In the picture:
[0036] 1. Compressor; 11. Compressor air inlet pipe; 12. Cylinder block; 13. Compressor air outlet pipe;
[0037] 2. Cylinder radiator; 21. Heat sink;
[0038] 3. Air radiator; 31. Air inlet connector; 32. Air outlet connector; 33. Air path base plate; 331. First heat dissipation path; 332. Second heat dissipation path; 34. Bionic heat sink; 341. Bionic heat dissipation branch; 341a. Fin-shaped heat dissipation branch; 341b. Tooth-shaped heat dissipation branch; 341c. Rectangular heat dissipation branch; 341d. Cylindrical heat dissipation branch; 341e. Hemispherical heat dissipation branch; 35. Heat dissipation fin assembly;
[0039] 4. First connecting pipeline;
[0040] 5. Second connecting pipeline;
[0041] 6. Fan;
[0042] 7. Encapsulation shell;
[0043] 8. Thermal pad. DETAILED DESCRIPTION
[0044] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0045] This embodiment provides a compressor heat dissipation device based on bionics, such as Figure 1 As shown, it includes: a cylinder radiator 2 and an air radiator 3;
[0046] The cylinder radiator 2 is sleeved on the outer periphery of the cylinder 12 of the compressor 1, and the air radiator 3 is arranged between two adjacent cylinder radiators 2. The air inlet end of the air radiator 3 is connected to the air outlet of the compressor 1, and the air outlet end of the air radiator 3 can be connected to the air inlet of the oxygen concentrator;
[0047] This embodiment provides a compressor heat dissipation device based on bionics. By arranging a cylinder radiator 2 on the cylinder 12 of the compressor 1 and arranging an air radiator 3 between the cylinder radiators 2, it not only effectively realizes the heat dissipation of the compressor and its compressed air, but also places the air radiator 3 in the gap between the two cylinders 12 of the compressor 1, so as to reasonably utilize the space, improve the space utilization rate inside the package, and thus achieve the goal of reducing the package volume.
[0048] In a specific embodiment, Figure 3 and Figure 4 As shown, the air radiator 3 includes an air path base plate 33, a bionic heat sink 34, and a heat sink fin group 35 that are fixedly connected in sequence from bottom to top. In this embodiment, the air path base plate 33 and the bionic heat sink 34 are connected and sealed together by high-temperature brazing, and the heat sink fin group 35 is welded to the bionic heat sink 34;
[0049] The gas path bottom plate 33 is provided with a cooling channel, and the two ends of the cooling channel are respectively connected to the air inlet joint 31 (air inlet end) and the air outlet joint 32 (air outlet end) fixed on the gas path bottom plate 33;
[0050] like Figure 5 、 Figure 7 and Figure 8 As shown, a bionic heat dissipation branch 341 is provided on one side of the bionic heat dissipation plate 34 close to the gas path bottom plate 33 , and the bionic heat dissipation branch 341 extends into the cooling flow channel to quickly transfer heat through the bionic heat dissipation branch 341 ;
[0051] The heat dissipation fin group 35 is arranged on a side of the bionic heat dissipation plate 34 away from the gas path bottom plate 33 , and the heat dissipation fin group 35 is composed of a plurality of heat dissipation fins.
[0052] In a specific embodiment, Figure 4 As shown, the air inlet connector 31 and the air outlet connector 32 are located at the same end of the air path base plate 33, and the cooling channel includes a first heat dissipation path 331 and a second heat dissipation path 332 that are connected in sequence;
[0053] The first heat dissipation path 331 is a straight flow path extending from the proximal end to the distal end of the air outlet connector 32, and the second heat dissipation path 332 is a serpentine flow path formed by alternating a plurality of straight flow paths and a plurality of semicircular flow paths;
[0054] The first heat dissipation path 331 and the second heat dissipation path 332 prolong the retention time of air in the air radiator 3 to improve the heat dissipation effect of the air radiator 3;
[0055] The two ends of the first heat dissipation path 331 are respectively connected to the air outlet connector 32 and the second heat dissipation path 332, and the two ends of the second heat dissipation path 332 are respectively connected to the first heat dissipation path 331 and the air inlet connector 31;
[0056] In this embodiment, the bionic heat dissipation branch 341 is located in the direct flow path between the first heat dissipation path 331 and the second heat dissipation path 332 .
[0057] In a specific embodiment, the shape of the bionic heat dissipation branch 341 is selected from the group consisting of fin, tooth, cylinder, hemisphere and rectangular;
[0058] Figure 6 The bionic heat dissipation plate 34 shown is provided with five types of bionic heat dissipation branches 341, including fin-shaped heat dissipation branches 341a (continuous long strips), tooth-shaped heat dissipation branches 341b (intermittent long strips), rectangular heat dissipation branches 341c, cylindrical heat dissipation branches 341d and hemispherical heat dissipation branches 341e. In actual applications, the above five shapes are included but not limited to (in actual applications, bionic heat dissipation branches 341 of different shapes are generally selected for use).
[0059] In a specific embodiment, Figure 1 As shown, it also includes a first connecting pipeline 4 and a second connecting pipeline 5;
[0060] The compressor 1 is provided with a compressor air inlet pipeline 11, a cylinder body 12 and a compressor air outlet pipeline 13. Air is sucked in by the compressor air inlet pipeline 11, compressed by the cylinder body 12, and then discharged from the compressor air outlet pipeline 13. The compressor air outlet pipeline 13 of the compressor 1 is connected to the air inlet joint 31 through a first connecting pipeline 4, and the air outlet joint 32 is connected to the air inlet of the oxygen concentrator through a second connecting pipeline 5.
[0061] In a specific embodiment, Figure 2 As shown, the cylinder radiator 2 includes a plurality of heat dissipation blocks 21 connected end to end by bolts, and the plurality of heat dissipation blocks 21 connected end to end by bolts can hug the cylinder 12. The heat dissipation blocks 21 are provided with heat dissipation fins. In this embodiment, the air radiator 3 and the cylinder radiator 2 can be fixed by welding, or fixed together by fasteners (bolt holes are provided on the heat dissipation fins adjacent to the air radiator 3 and the cylinder radiator 2).
[0062] In a specific embodiment, Figure 2 As shown, a heat-conducting gasket 8 is provided between the cylinder radiator 2 and the cylinder 12 to improve heat transfer efficiency.
[0063] In a specific embodiment, a heat dissipation fan 6 is also included. Figure 9 and Figure 10 As shown, the cooling fan 6 is located above or to the side of the compressor 1;
[0064] The heat dissipation fins of the heat dissipation fin group 35 extend along the airflow direction of the heat dissipation fan 6 , so that the airflow can flow through the gaps between adjacent heat dissipation fins to quickly remove heat.
[0065] In a specific embodiment, Figure 9 and Figure 10 As shown, it also includes a packaging shell 7, which is provided with a heat dissipation port. The packaging shell 7 can accommodate the compressor 1. The cooling fan 6 is fixed on the packaging shell 7. The air radiator 3 arranged between the two cylinders 12 of the compressor 1 not only reduces the waste of space, but also shortens the pipeline for connecting the compressor 1 and the radiator, reduces the problem of bloated volume, and improves the convenience of overall disassembly and assembly of the compressor.
[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A compressor heat dissipation device based on bionics, characterized in that: include: Cylinder radiator (2) and air radiator (3); The cylinder radiator (2) is sleeved on the outer periphery of the cylinder (12) of the compressor (1), and the air radiator (3) is arranged between two adjacent cylinder radiators (2). The air inlet end of the air radiator (3) is connected to the air outlet of the compressor (1), and the air outlet end of the air radiator (3) can be connected to the air inlet of the oxygen concentrator.
2. The bionics-based compressor heat dissipation device according to claim 1, characterized in that: The air radiator (3) comprises an air path base plate (33), a bionic heat sink (34) and a heat dissipation fin group (35) which are fixedly connected in sequence from bottom to top; A cooling channel is provided on the gas path bottom plate (33), and two ends of the cooling channel are respectively connected to an air inlet joint (31) and an air outlet joint (32) fixed on the gas path bottom plate (33); A bionic heat dissipation branch (341) is provided on one side of the bionic heat dissipation plate (34) close to the gas path bottom plate (33), and the bionic heat dissipation branch (341) extends into the cooling flow channel; The heat dissipation fin group (35) is arranged on a side of the bionic heat dissipation plate (34) away from the gas path bottom plate (33), and the heat dissipation fin group (35) is composed of a plurality of heat dissipation fins.
3. The bionics-based compressor heat dissipation device according to claim 2, characterized in that: The air inlet connector (31) and the air outlet connector (32) are located at the same end of the air path base plate (33), and the cooling channel includes a first heat dissipation path (331) and a second heat dissipation path (332) that are connected in sequence; The first heat dissipation passage (331) is a straight flow passage extending from the proximal end to the distal end of the air outlet joint (32), and the second heat dissipation passage (332) is a serpentine flow passage formed by alternatingly connecting a plurality of straight flow passages and a plurality of semicircular flow passages. The two ends of the first heat dissipation passage (331) are respectively in communication with the air outlet connector (32) and the second heat dissipation passage (332), and the two ends of the second heat dissipation passage (332) are respectively in communication with the first heat dissipation passage (331) and the air inlet connector (31).
4. The bionics-based compressor heat dissipation device according to claim 2, characterized in that: The shape of the bionic heat dissipation branch (341) is selected from the group consisting of fin-shaped, tooth-shaped, cylindrical, hemispherical and rectangular.
5. The bionics-based compressor heat dissipation device according to claim 2, characterized in that: It also includes a first connecting pipeline (4) and a second connecting pipeline (5); The compressor outlet pipe (13) of the compressor (1) is connected to the air inlet connector (31) via a first connecting pipe (4), and the air outlet connector (32) is connected to the air inlet of the oxygen concentrator via a second connecting pipe (5).
6. The bionics-based compressor heat dissipation device according to claim 1, characterized in that: The cylinder radiator (2) comprises a plurality of heat dissipation blocks (21) connected end to end in sequence, and heat dissipation fins are provided on the heat dissipation blocks (21).
7. The bionics-based compressor heat dissipation device according to claim 1, characterized in that: A heat-conducting gasket (8) is provided between the cylinder radiator (2) and the cylinder (12).
8. The bionics-based compressor heat dissipation device according to claim 2, characterized in that: It also includes a heat dissipation fan (6), which is located above or to the side of the compressor (1); The heat dissipation fins of the heat dissipation fin group (35) extend along the airflow direction of the heat dissipation fan (6).
9. The bionics-based compressor heat dissipation device according to claim 8, characterized in that: It also includes a packaging shell (7), which can accommodate the compressor (1), and the heat dissipation fan (6) is fixed on the packaging shell (7).