Semiconductor module testing device

Abstract

The utility model discloses a semiconductor module testing device which comprises a testing module and a device tool module. The test module comprises a test board assembly, a probe and a guide shaft, the probe is arranged on the test board assembly, the guide shaft penetrating through the test board assembly is arranged on the test board assembly, and a first positioning hole is formed in the bottom of the guide shaft; the device tool module comprises a heat conduction cushion block, a container cushion block and an insulation cushion block, the container cushion block is arranged on the heat conduction cushion block, a solution groove capable of containing the insulation cushion block is formed in the container cushion block, and a first positioning shaft capable of being matched with the first positioning hole is arranged on the heat conduction cushion block. The testing device has the advantages that the testing device can realize that the DBC device can obtain a good testing condition in a high-voltage testing environment in a semiconductor test, the electrical insulation requirement of the testing device meets the testing condition, and the probe and the DBC device are accurately aligned and contacted.

Description

Technical Field

[0001] The utility model relates to the technical field of power semiconductors, in particular to a semiconductor module testing device. Background Art

[0002] With the technological advancement of IGBT devices, the required chip integration level continues to increase, and circuit wiring is becoming increasingly fine. Directly bonded copper ceramic substrates (DBC) have become a key electronic packaging material due to their excellent thermal and electrical conductivity. DBC devices combine the unique high thermal conductivity, high electrical insulation, high mechanical strength, low expansion, and strong current-carrying capacity of ceramics with the high conductivity and excellent solderability of oxygen-free copper, allowing for etching of various patterns. This makes them widely used in power modules (IGBTs) and integrated power electronics modules. DBC device testing, as an essential step before IGBT packaging, significantly reduces the cost of defective packaging.

[0003] Prior art DBC device testing is difficult due to probe alignment issues. Inaccurate probe alignment can easily cause irreversible damage to the device. Furthermore, DBC devices rely solely on air insulation, making them inadequate for testing close to circuits or high voltages. Forced testing can also damage the device. Utility Model Content

[0004] The technical problem to be solved by the present invention is how to ensure that the probes are accurately aligned during DBC device testing and meet the testing requirements.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] A semiconductor module testing device comprises a testing module and a device tooling module;

[0007] The test module includes a test board assembly, a probe and a guide shaft. The test board assembly is provided with a probe, the test board assembly is provided with a guide shaft that passes through the test board assembly, and the bottom of the guide shaft is provided with a first positioning hole;

[0008] The device tooling module includes a thermal pad, a container pad, and an insulating pad. The container pad is arranged on the thermal pad. The container pad is provided with a solution tank for placing the insulating pad. The thermal pad is provided with a first positioning shaft that can cooperate with the first positioning hole.

[0009] The test device can achieve good test conditions for DBC devices in a high-voltage test environment during semiconductor testing, meet the test conditions for its own electrical insulation requirements, and ensure precise alignment and contact between the probe and the DBC device.

[0010] Preferably, the test board assembly includes a large board, a test PCB, and a fixed board. The test PCB is pressed onto one side of the large board through the fixed board. The probe passes through the fixed board and is fixed on the test PCB. The guide shaft passes through the large board and the test PCB.

[0011] Preferably, the large plate is an insulating large plate.

[0012] Preferably, a guide sleeve cooperating with the guide shaft is provided on the large plate.

[0013] Preferably, an isolation plate capable of isolating the probe electrodes is provided on the large plate.

[0014] Preferably, the thermally conductive pad is provided with at least two second positioning shafts, and the bottom of the container pad is correspondingly provided with second positioning holes that cooperate with the second positioning shafts.

[0015] Preferably, at least two third positioning shafts are provided at the bottom of the solution tank, and the bottom of the insulating spacer is correspondingly provided with third positioning holes that cooperate with the third positioning shafts.

[0016] Preferably, the container spacer is provided with an anti-overflow groove around the notch of the solution tank.

[0017] Preferably, the container pad is also provided with scale lines.

[0018] Preferably, the insulating spacer is provided with a plurality of through holes and a guide groove along the length direction of the insulating spacer.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] The test device can achieve good test conditions for DBC devices in a high-voltage test environment during semiconductor testing, meet the test conditions for its own electrical insulation requirements, and ensure precise alignment and contact between the probe and the DBC device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the test module of the embodiment of the utility model;

[0023] Figure 3 This is a structural diagram of a device tooling module according to an embodiment of the present utility model;

[0024] Figure 4 This is another structural diagram of the device tooling module according to an embodiment of the present utility model;

[0025] Figure 5This is a structural diagram of a container spacer and an insulating spacer according to an embodiment of the present utility model;

[0026] Figure 6 This is a schematic structural diagram of the DBC device and the insulating spacer according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0027] In order to facilitate those skilled in the art to understand the technical solution of the present invention, the technical solution of the present invention is further described in conjunction with the accompanying drawings.

[0028] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0029] In this application, unless otherwise expressly specified or limited, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly indicate the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise expressly specified or limited.

[0030] See Figures 1 to 6 This embodiment discloses a semiconductor module testing device, including a testing module 1 and a device tooling module 2.

[0031] The test module 1 includes a test board assembly, a probe 14, a guide sleeve 15, and a guide shaft 16. The test board assembly includes a large board 11, a test PCB 12, and a fixed plate 13. The test PCB 12 is pressed onto one side of the large board 11 through the fixed plate 13. In this embodiment, the large board 11 is an insulating large board, and the test PCB 12 is pressed onto the back of the large board 11 and fixed by fasteners, which can be screws. The end of the probe 14 away from the detection end passes through the fixed plate 13 and is fixed to the test PCB 12. In this embodiment, two guide sleeves 15 are provided on the large board 11, and a guide shaft 16 is provided on the guide sleeve 15. A first positioning hole (not shown in the figure) is provided at the bottom of the guide shaft 16.

[0032] Furthermore, the large plate 11 is provided with an isolation plate 17 capable of isolating the electrodes of the probes 14, so as to separate the probes 14 according to different electrodes.

[0033] The device tooling module 2 includes a thermal pad 21, a container pad 22, and an insulating pad 23. A first positioning shaft 211 that can cooperate with the first positioning hole is fixed on the thermal pad 21. Specifically, when the first positioning shaft 211 is inserted into the first positioning hole, precise guiding work is completed, so that the probe 14 accurately contacts the corresponding contacts of the DBC device 3, thereby preventing damage to the DBC device 3.

[0034] The container pad 22 is arranged on the thermal pad 21 . In this embodiment, the thermal pad 21 is provided with two second positioning shafts 212 , and a second positioning hole cooperating with the second positioning shafts 212 is correspondingly provided at the bottom of the container pad 22 .

[0035] The container pad 22 is provided with a solution tank 221 capable of placing the insulating pad 23, and the solution tank 221 is filled with insulating solution; at least two third positioning shafts 222 are provided at the bottom of the solution tank 221, and the bottom of the insulating pad 23 is correspondingly provided with a third positioning hole that cooperates with the third positioning shaft 222.

[0036] Furthermore, the container spacer 22 is provided with an anti-overflow groove 223 at the notch surrounding the solution tank 221 to prevent the insulating solution in the solution tank 221 from overflowing the container spacer 22 .

[0037] Furthermore, the container spacer 22 is also provided with scale lines to facilitate observation of the amount of insulating solution injected into the solution tank 221 .

[0038] The insulating spacer 23 is provided with a plurality of through holes and a guide groove along the length direction of the insulating spacer 23 .

[0039] The working process of this embodiment is:

[0040] Working State 1: Place the DBC device 3 in the insulating spacer 23. Insulating solution is injected into the container spacer 22 up to the scale line, immersing the DBC device 3 in the insulating solution to meet the insulation distance requirements in a high-voltage test environment. Either the test module 1 or the device fixture module 2 can move up and down through a mechanism. For example, in one of these states, when the device fixture module 2 moves upward as a whole and the first positioning shaft 211 is inserted into the first positioning hole, precise guidance is completed, allowing the probe 14 to accurately contact the corresponding contacts of the DBC device 3 after passing through the insulating solution, preventing damage to the DBC device 3. Simultaneously, the thermal pad 21 conducts heat to the insulating solution, achieving a high-temperature test environment and completing the test.

[0041] Working state 2: The isolation plate 17 is inserted into the large plate 11, and the probes 14 are separated according to the different electrodes to meet the insulation distance requirements during high voltage testing.

[0042] Working state 3: When the insulating solution reaches a certain number of tests and needs to be replaced, the container spacer 22 can be directly picked up, and the insulating spacer 23 and the DBC device 3 can be taken out from the insulating solution to replace the insulating solution.

[0043] Working state 4: Different DBC devices 3 can be replaced as required, and an insulating spacer 23 needs to be designed to match. The insulating spacer 23 has several vias in the DBC device 3 area and the rest of the back has square grooves. A guide groove is also provided along the length of the insulating spacer 23 to reduce the contact pressure with the insulating solution during placement.

[0044] In this embodiment, the test device can achieve good test conditions for the DBC device 3 in a high voltage test environment during semiconductor testing, its own electrical insulation requirements meet the test conditions, and the probe 14 and the DBC device 3 are precisely aligned and contacted.

[0045] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description. It is intended that all variations within the meaning and range of equivalents of the claims be encompassed within the present invention, and any reference numerals in the claims should not be construed as limiting the claims to which they relate.

[0046] The above-mentioned embodiments only represent the implementation methods of the utility model. The protection scope of the utility model is not limited to the above-mentioned embodiments. For those skilled in the art, several modifications and improvements can be made without departing from the concept of the utility model, which all fall within the protection scope of the utility model.

Claims

1. A semiconductor module testing device, characterized in that: Including test module and device tooling module; The test module includes a test board assembly, a probe and a guide shaft. The test board assembly is provided with a probe, the test board assembly is provided with a guide shaft that passes through the test board assembly, and the bottom of the guide shaft is provided with a first positioning hole; The device tooling module includes a thermal pad, a container pad, and an insulating pad. The container pad is arranged on the thermal pad. The container pad is provided with a solution tank for placing the insulating pad. The thermal pad is provided with a first positioning shaft that can cooperate with the first positioning hole.

2. The semiconductor module testing device according to claim 1, wherein: The test board assembly includes a large board, a test PCB, and a fixed board. The test PCB is pressed onto one side of the large board through the fixed board. The probe passes through the fixed board and is fixed on the test PCB. The guide shaft passes through the large board and the test PCB.

3. The semiconductor module testing device according to claim 2, wherein: The large plate is an insulating large plate.

4. The semiconductor module testing device according to claim 2, wherein: The large plate is provided with a guide shaft sleeve that matches the guide shaft.

5. The semiconductor module testing device according to claim 2, wherein: The large plate is provided with an isolation plate capable of isolating the probe electrodes.

6. The semiconductor module testing device according to claim 1, wherein: The heat-conducting pad is provided with at least two second positioning shafts, and the bottom of the container pad is correspondingly provided with second positioning holes that match the second positioning shafts.

7. The semiconductor module testing device according to claim 1, wherein: At least two third positioning shafts are provided at the bottom of the solution tank, and a third positioning hole cooperating with the third positioning shafts is correspondingly provided at the bottom of the insulating spacer.

8. The semiconductor module testing device according to claim 1, wherein: The container pad is provided with an anti-overflow groove at the notch around the solution groove.

9. The semiconductor module testing device according to claim 1, wherein: The container pad is also provided with scale lines.

10. The semiconductor module testing device according to claim 1, wherein: The insulating spacer is provided with a plurality of through holes and a guide groove along the length direction of the insulating spacer.

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