Jig for testing semiconductor power module

Abstract

The utility model discloses a jig for testing a semiconductor power module, which comprises a jig frame, conductive blocks, a PCB (printed circuit board) and probes, the jig frame is provided with a plurality of conductive blocks, the PCB is fixed on the jig frame, the PCB is correspondingly provided with through holes through which the conductive blocks can penetrate, and the PCB is at least provided with a set of probes penetrating through the PCB. The utility model has the advantages that through the arrangement of the conductive blocks on the jig, the conductivity under the condition of large current is improved, the pressure on the PCB is reduced, and the PCB is prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a fixture for testing semiconductor power modules. Background Art

[0002] With technological advancements, the use of power semiconductor IGBT and MOSFET modules is becoming increasingly widespread. Reliability assessments are necessary during device development, manufacturing, and before application. Before conducting electrical evaluations, the device under test (DUT) must be electrically connected to the test equipment using a quick, non-permanent connection.

[0003] Currently, test equipment for modules with multiple independent or semi-independent functional units within them typically utilizes a dedicated fixture system. This fixture system provides an electrical connection, connecting specific signals on the module to the relevant interfaces on the tester. This allows different test fixtures to be used for power modules of varying shapes and specifications, while maintaining the same tester interface.

[0004] In current fixture designs, a copper layer is often soldered on the back of the PCB as an electrical connection point. However, due to the small thickness of the copper layer, it is often prone to insufficient conductivity. In addition, during the inspection process, the electrical connection probes on the fixture base abut against the copper layer on the back of the PCB, and the PCB is subjected to greater pressure and is prone to breakage or damage. Utility Model Content

[0005] The technical problem to be solved by the utility model is how to improve the electrical conductivity and prevent the PCB from being damaged.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] A jig for testing semiconductor power modules includes a jig frame, conductive blocks, a PCB, and probes. The jig frame is provided with multiple conductive blocks, the PCB is fixed to the jig frame, the PCB is provided with corresponding through holes that allow the conductive blocks to pass through, and the PCB is provided with at least one set of probes that pass through the PCB.

[0008] By setting the conductive blocks on the fixture, small current signals and large current signals are respectively routed through the PCB and the conductive blocks, thereby improving the conductivity under high current conditions, reducing heat generation and loss, and improving power efficiency. In addition, the soldering of the copper layer on the PCB is eliminated, which can reduce the soldering workload and thus the requirements for the process. In addition, because the fixture base probes of the fixture base do not contact the PCB, the strength of their pressure is borne by the conductive blocks, reducing the pressure on the PCB and preventing damage to the PCB.

[0009] Preferably, the side of the fixture frame has at least one positioning groove.

[0010] Preferably, support frames are further provided on both sides of the bottom of the fixture frame.

[0011] Preferably, the fixture frame is further provided with a top column, and a top column is provided on both sides of each set of probes, and the top end of the top column is higher than the top end of the probe.

[0012] Preferably, the conductive block is fixed to the jig frame via a fixing bracket.

[0013] Preferably, a probe pad is fixed below the PCB, and the probe located below the PCB passes through the probe pad.

[0014] Preferably, the PCB and the probe pad are positioned by pins.

[0015] Preferably, the probe pad is made of non-metallic insulating material.

[0016] Preferably, at least one positioning hole is provided on the jig frame.

[0017] Preferably, the fixture frame and the PCB are fixed by pins.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] 1. By setting the conductive block on the fixture, the small current signal and the large current signal are respectively routed through the PCB and the conductive block, thereby improving the conductivity under high current conditions, reducing heat generation and loss, improving power efficiency, and eliminating the welding of the copper layer on the PCB, which can reduce the welding workload and thus reduce the requirements for the process.

[0020] 2. Since the fixture probe of the fixture seat does not contact the PCB, the strength of its pressure is borne by the conductive block, which reduces the pressure on the PCB and prevents the PCB from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0022] Figure 2 It is a schematic diagram of the local structure of an embodiment of the present utility model. DETAILED DESCRIPTION

[0023] In order to facilitate those skilled in the art to understand the technical solution of the present invention, the technical solution of the present invention is further described in conjunction with the accompanying drawings.

[0024] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0025] In this application, unless otherwise expressly specified or limited, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly indicate the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise expressly specified or limited.

[0026] See Figures 1 to 2 This embodiment discloses a fixture for testing a semiconductor power module, including a fixture frame 1, a fixing bracket 2, a conductive block 3, a PCB 4, a probe 5, a top column 6, a probe pad 7, and a support frame 8.

[0027] A fixing bracket 2 is fixed on the jig frame 1 , and a plurality of conductive blocks 3 are fixed on the fixing bracket 2 .

[0028] Positioning grooves 11 are provided on both sides of the fixture frame 1 , with two positioning grooves 11 on each side for engaging with the fixture seat.

[0029] The PCB4 is fixed to the jig frame 1 by pins to ensure relative position accuracy; the PCB4 is provided with corresponding through holes (not marked in the figure) that allow the conductive block 3 to pass through, and the number and position of the through holes correspond to the conductive block 4.

[0030] At least one set of probes 5 passing through the PCB4 is provided on the PCB4; specifically, the PCB4 and the probes 5 are welded together, and at least one top post 6 is provided on the periphery of the probes 5 on the upper part of the PCB4, and the top of the top post 6 is higher than the top of the probes 5. In this embodiment, two sets of probes 5 are respectively arranged on the PCB4, and a top post 6 is provided on both sides of each set of probes 5. A probe pad 7 is fixed below the PCB4, and the probes 5 located below the PCB4 pass through the probe pad 7. The probes 5 and the probe pad 7 form a structural connection through a tight fit, and the PCB4 will bear the torsional force generated by the gravity of the probes 5 and the probe pad 7. In this embodiment, the PCB4 and the probe pad 7 are positioned by pins to ensure relative position. The probe pad 7 is made of non-metallic insulating material, including but not limited to epoxy resin board, polyformaldehyde resin, PEEK, etc.

[0031] As a further optimized technical solution, support frames 8 are further provided on both sides of the bottom of the jig frame 1. The support frames 8 form a space between the bottom of the jig frame 1 and the table of the jig seat where the jig is placed, thereby preventing the probe 5 from contacting the table of the jig seat when the jig is stored, thereby reducing the risk of damage to the probe 5.

[0032] At least one positioning hole 12 is provided on the jig frame 1. In this embodiment, one positioning hole 12 is provided on both sides of one side of the jig frame 1. The positioning hole 12 provides a high-precision positioning interface on the jig frame 1, which can avoid problems such as jig installation tilt during the jig installation process.

[0033] The working process of this embodiment is:

[0034] 1. First, install the probe 5, top pillar 6, and probe pad 7 on the PCB 4, then fix the PCB 4 on the fixture bracket 1, and ensure that each conductive block 3 can pass through the corresponding through hole on the PCB 4;

[0035] 2. Then, the fixture frame 1 is mounted on the fixture base through the positioning groove 11 and the positioning hole 12.

[0036] 3. Then, the electrical signal of the test machine is connected to the electrical interface of the fixture base through the cable, thereby connecting the fixture base probe. The fixture base probe of the fixture base contacts the surface of the conductive block 3 that passes through the through hole on the PCB 4 to form an electrical connection;

[0037] 4. The small current signal of the fixture base is connected to the probe 5 through the copper or flying wire on the PCB 4; the large current signal of the fixture base passes through the conductive block 3 and then connected to the probe 5 through the wire;

[0038] 5. The electrical signal on probe 5 is connected to the device under test to form a complete electrical connection.

[0039] By setting the conductive block 3 on the fixture, the small current signal and the large current signal are respectively passed through the PCB 4 and the conductive block 3, thereby improving the conductivity under high current conditions, reducing heat generation and loss, and improving power efficiency. In addition, the welding of the copper layer on the PCB 4 is eliminated, which can reduce the welding workload and thus reduce the requirements for the process. In addition, since the fixture base probe of the fixture base does not contact the PCB 4, the strength of its pressure is borne by the conductive block 3, reducing the pressure on the PCB 4 and preventing damage to the PCB 4.

[0040] The tester's electrical signals are connected via a cable to the fixture base electrical interface 4, which in turn connects to the fixture base probe 5. The fixture base probe 5 then connects the electrical signals to the probe 25, ultimately connecting to the device under test 6. The fixture 2 is pushed into the fixture compartment via the slide 12, where it is roughly positioned using the top bead 14 and the positioning groove 28. This is confirmed by the user's feedback during the sliding movement. The positioning post 16 and positioning hole 27 then establish a more precise positioning relationship between the fixture 2 and the fixture base 1, ensuring the reliability of the electrical connection.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description. It is intended that all variations within the meaning and range of equivalents of the claims be encompassed within the present invention, and any reference numerals in the claims should not be construed as limiting the claims to which they relate.

[0042] The above-mentioned embodiments only represent the implementation methods of the utility model. The protection scope of the utility model is not limited to the above-mentioned embodiments. For those skilled in the art, several modifications and improvements can be made without departing from the concept of the utility model, which all fall within the protection scope of the utility model.

Claims

1. A fixture for testing semiconductor power modules, characterized by: The jig frame includes a jig, a conductive block, a PCB, and a probe. The jig frame is provided with multiple conductive blocks, the PCB is fixed on the jig frame, the PCB is provided with corresponding through holes for the conductive blocks to pass through, and the PCB is provided with at least one set of probes that pass through the PCB.

2. The semiconductor power module testing fixture according to claim 1, characterized in that: The side of the fixture frame has at least one positioning groove.

3. The semiconductor power module testing fixture according to claim 1, wherein: Support frames are also provided on both sides of the bottom of the fixture frame.

4. The semiconductor power module testing fixture according to claim 1, wherein: The fixture frame is also provided with a top column, and a top column is respectively provided on both sides of each set of probes, and the top end of the top column is higher than the top end of the probe.

5. The semiconductor power module testing fixture according to claim 1, wherein: The conductive block is fixed on the fixture frame through a fixing bracket.

6. The semiconductor power module testing fixture according to claim 1, characterized in that: A probe pad is also fixed below the PCB, and the probe located below the PCB passes through the probe pad.

7. The semiconductor power module testing fixture according to claim 6, characterized in that: The PCB and the probe pad are positioned by pins.

8. The semiconductor power module testing fixture according to claim 6, characterized in that: The probe pad is made of non-metallic insulating material.

9. The semiconductor power module testing fixture according to claim 1, wherein: The fixture frame is also provided with at least one positioning hole.

10. The semiconductor power module testing fixture according to claim 1, characterized in that: The fixture frame and the PCB are fixed via pins.

Images