Refrigeration camera mounting structure and refrigeration camera
By designing a variety of radiator-adapted installation structures in the refrigeration camera, the problem of single cooling method of the refrigeration camera is solved, and the heat dissipation effect of changing the radiator according to the scene is achieved to meet different needs.
Patent Information
- Application Number
- CN202422812498.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-11-18
AI Technical Summary
The existing cooling cameras have a single cooling method and cannot meet the needs of different scenarios.
A refrigeration camera installation structure is provided, including a camera housing, a centralized heat conduction plate, an electronic control assembly and an imaging assembly. It is adapted through a variety of radiators of the centralized heat conduction plate and is selectively connected to a fin radiator, an air-cooled radiator or a liquid-cooled radiator to realize a variety of heat dissipation methods.
Replace different radiators according to the specific usage scenario to meet the heat dissipation needs of different scenarios, improve heat dissipation efficiency and stability, and avoid the impact of vibration.
Smart Images

Figure CN223272767U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cameras, and in particular to a refrigerated camera installation structure and a refrigerated camera. Background Art
[0002] Cooled cameras typically consist of an image sensor, a cooler, and hardware circuitry. The cooler cools the sensor to below ambient temperature, reducing thermal noise and increasing sensitivity. This allows cooled cameras to operate at very low temperatures, providing a higher signal-to-noise ratio and finer temperature resolution. Uncooled cameras, on the other hand, do not require a cooler to operate, and their sensor temperature is generally equal to or higher than ambient temperature, resulting in poor image quality.
[0003] During operation, components such as the cooler and hardware circuits of a cooled camera generate considerable heat. To ensure proper operation, conventional cooling systems typically incorporate a heat sink. However, existing cooling methods for cooled cameras employ a single approach and fail to meet the needs of diverse scenarios. Utility Model Content
[0004] The purpose of the utility model is to provide a cooling camera installation structure and a cooling camera, which have multiple heat dissipation methods and can replace different radiators according to specific usage scenarios to meet usage requirements.
[0005] The embodiment of the present utility model is achieved as follows:
[0006] In a first aspect, the utility model provides a cooling camera mounting structure, comprising:
[0007] Camera housing;
[0008] A centralized heat conducting plate, the centralized heat conducting plate is connected to the camera housing and forms an accommodating space;
[0009] an electric control component, the electric control component being arranged in the accommodation space;
[0010] an imaging assembly, the imaging assembly being disposed in the accommodating space; and
[0011] a refrigerator, the refrigerator being disposed in the accommodating space and in contact with the imaging assembly, the refrigerator being used to cool the imaging assembly;
[0012] The first heat conducting surface of the concentrated heat conducting plate contacts the electronic control component and the refrigerator to conduct heat generated by the electronic control component and the refrigerator, and the second heat conducting surface of the concentrated heat conducting plate is exposed outside the accommodation space.
[0013] In an optional embodiment, the refrigerator is an active refrigerator.
[0014] In an optional embodiment, the imaging assembly includes an image sensor and a heat-conducting block that are stacked, and one side of the refrigerator contacts the heat-conducting block, and the other side contacts the first heat-conducting surface.
[0015] In an optional embodiment, the electronic control component includes an electronic control mainboard and a mainboard bracket, the electronic control mainboard is arranged on the mainboard bracket, and the mainboard bracket is in contact with the first heat conducting surface.
[0016] In an optional embodiment, a heat-conducting extension portion is provided at one end of the mainboard bracket, the heat-conducting extension portion passes through the camera housing, and a portion of the heat-conducting extension portion is exposed outside the accommodating space.
[0017] In an optional embodiment, the camera housing includes a first housing and a second housing, the first housing is connected to the centralized heat conducting plate and forms an imaging cavity, and the second housing is connected to the centralized heat conducting plate and forms an electric control space; the electric control component is arranged in the electric control space, and the imaging component and the refrigerator are arranged in the imaging cavity; and / or,
[0018] The first heat conducting surface includes an electrically controlled heat conducting surface and an imaging heat conducting surface. The electrically controlled heat conducting surface and the second heat conducting surface are both located on the first side of the concentrated heat conducting plate, and the imaging heat conducting surface is located on the second side of the concentrated heat conducting plate.
[0019] In a second aspect, the utility model provides a refrigerated camera, comprising a heat dissipation component and a refrigerated camera mounting structure as described in any one of the aforementioned embodiments, wherein the heat dissipation component is selected from any one of a fin radiator, an air-cooled radiator, and a liquid-cooled radiator, and the heat dissipation component is detachably connected to the centralized heat conduction plate.
[0020] In an optional embodiment, the fin heat sink includes a heat dissipation mounting plate and a plurality of first heat dissipation fins, the heat dissipation mounting plate is detachably connected to the concentrated heat conducting plate, and the plurality of first heat dissipation fins are all arranged on the heat dissipation mounting plate.
[0021] In an optional embodiment, the heat dissipation mounting plate includes a fixed portion and an extension portion connected to each other, the heat dissipation mounting plate is detachably connected to the concentrated heat conducting plate via the fixed portion, and the plurality of first heat dissipation fins are distributed on the same side of the fixed portion and the extension portion;
[0022] The fin heat sink further includes a plurality of second heat dissipation fins, and the plurality of second heat dissipation fins are arranged on a side of the extension portion away from the plurality of first heat dissipation fins.
[0023] In an optional embodiment, the air-cooled radiator includes a radiator housing, a fan, and a plurality of third heat dissipation fins, the radiator housing is detachably connected to the centralized heat conduction plate, and the fan and the plurality of third heat dissipation fins are both disposed in the radiator housing; and / or,
[0024] The liquid-cooled radiator includes a liquid cooling box, a liquid inlet joint, and a liquid outlet joint. The liquid cooling box is detachably connected to the centralized heat conduction plate. The liquid inlet joint and the liquid outlet joint are both in communication with the liquid cooling box.
[0025] The beneficial effects of the embodiments of the present utility model include:
[0026] The cooling camera mounting structure includes a camera housing, a centralized heat conduction plate, an electronic control component, an imaging component and a refrigerator. The centralized heat conduction plate is connected to the camera housing to form a storage space. The electronic control component, the imaging component and the refrigerator are all arranged in the storage space. The refrigerator is in contact with the imaging component and is used to cool the imaging component. The first heat conduction surface of the centralized heat conduction plate is in contact with the electronic control component and the refrigerator to conduct the heat generated by the electronic control component and the refrigerator. The second heat conduction surface of the centralized heat conduction plate is exposed outside the storage space.
[0027] It is easy to understand that the heat generated by the electronic control component can be transferred to the second heat-conducting surface through the first heat-conducting surface, and the refrigerator can cool the imaging component to keep the operating temperature of the imaging component at room temperature, and the heat generated by the refrigerator can also be transferred to the second heat-conducting surface through the first heat-conducting surface. In addition, the centralized heat-conducting plate can be adapted to different radiators in the heat dissipation component in different scenarios, so that the heat dissipation component contacts the second heat-conducting surface of the centralized heat-conducting plate, thereby performing centralized heat conduction and heat dissipation. Therefore, the refrigerated camera mounting structure can be adapted and installed with a variety of radiators, and different radiators can be replaced according to specific usage scenarios, thereby achieving a variety of heat dissipation methods to meet usage requirements.
[0028] The cooled camera includes a heat dissipation assembly and a cooled camera mounting structure. The heat dissipation assembly is selected from any one of a finned heat sink, an air-cooled heat sink, and a liquid-cooled heat sink. The heat dissipation assembly is detachably connected to a centralized heat transfer plate. As will be readily understood, the cooled camera mounting structure is selectively assembled with one of the finned heat sink, the air-cooled heat sink, and the liquid-cooled heat sink, depending on the different usage scenarios of the cooled camera. That is, the finned heat sink, the air-cooled heat sink, or the liquid-cooled heat sink is detachably connected to the centralized heat transfer plate, thereby enabling the heat sink to dissipate heat from the centralized heat transfer plate.
[0029] Specifically, in scenarios where space is limited or natural heat dissipation performance does not meet requirements, an air-cooled radiator or liquid-cooled radiator is selected for assembly with the refrigerated camera mounting structure. In scenarios where circulating coolant is inconvenient, a finned radiator or air-cooled radiator is selected for assembly with the refrigerated camera mounting structure. In scenarios where vibration requirements are high, a finned radiator is selected for assembly with the refrigerated camera mounting structure to prevent vibration generated by the air-cooled radiator or liquid-cooled radiator from affecting the camera. Therefore, this refrigerated camera has multiple heat dissipation methods, and different radiators can be replaced according to specific usage scenarios to meet usage needs. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.
[0031] Figure 1 A schematic structural diagram of a cooling camera provided by an embodiment of the present utility model;
[0032] Figure 2 A schematic diagram of a cooling camera installation structure provided by an embodiment of the present utility model;
[0033] Figure 3 A cross-sectional view of a cooling camera installation structure provided by an embodiment of the present utility model;
[0034] Figure 4 A schematic diagram of the assembly of the cooling camera mounting structure and the finned heat sink provided in an embodiment of the present utility model;
[0035] Figure 5 A schematic diagram of the assembly of the cooling camera mounting structure and the air-cooling radiator provided in an embodiment of the present utility model;
[0036] Figure 6 A schematic diagram of the assembly of the cooling camera mounting structure and the liquid cooling radiator provided in an embodiment of the present utility model;
[0037] Figure 7 A schematic structural diagram of a finned heat sink provided in an embodiment of the present utility model;
[0038] Figure 8 A schematic structural diagram of an air-cooled radiator provided in an embodiment of the present utility model;
[0039] Figure 9 This is a schematic structural diagram of a liquid cooling radiator provided in an embodiment of the present utility model.
[0040] Icons: 100 - refrigerated camera; 10 - refrigerated camera mounting structure; 11 - camera housing; 111 - first housing; 112 - second housing; 1121 - first mounting slot; 1122 - second mounting slot; 1123 - third mounting slot; 12 - concentrated heat conduction plate; 121 - first heat conduction surface; 1211 - electric control heat conduction surface; 1212 - imaging heat conduction surface; 122 - second heat conduction surface; 123 - threaded hole; 13 - electric control assembly; 131 - electric control mainboard; 132 - mainboard bracket; 1321 - heat conduction extension; 14 - imaging assembly; 141 - image sensor; 142 - heat conduction block; 15 - refrigerator; 16 -trigger connector; 17-power connector; 18-GigE connector; 20-heat dissipation assembly; 21-finned heat sink; 211-heat dissipation mounting plate; 2111-fixing portion; 2112-extension portion; 212-first heat dissipation fin; 213-second heat dissipation fin; 214-first screw; 22-air-cooled radiator; 221-radiator housing; 222-fan; 223-third heat dissipation fin; 224-second screw; 23-liquid-cooled radiator; 231-liquid cooling box; 2311-first avoidance groove; 2312-second avoidance groove; 232-liquid inlet connector; 233-liquid outlet connector; 234-third screw. DETAILED DESCRIPTION
[0041] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.
[0042] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.
[0043] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.
[0044] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0045] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.
[0046] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0047] As described in the background, during operation, components such as the cooler and hardware circuits within a cooled camera generate considerable heat. To ensure proper operation, conventional cooling systems typically incorporate a heat sink. However, existing cooling systems employ a single heat dissipation method that cannot meet the needs of diverse scenarios.
[0048] Based on this, please refer to Figures 1-9 The present invention provides a cooling camera mounting structure 10 and a cooling camera 100 that effectively address the aforementioned technical issues. Specifically, the cooling camera mounting structure 10 and the cooling camera 100 have multiple heat dissipation methods, allowing for replacement of different heat sinks to meet specific usage scenarios. The cooling camera mounting structure 10 and the cooling camera 100 are described in detail below.
[0049] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of the cooling camera 100 provided in this embodiment, combined with Figure 1The refrigerated camera 100 includes a heat dissipation component 20 and a refrigerated camera mounting structure 10. The heat dissipation component 20 is selected from any one of a fin radiator 21, an air-cooled radiator 22, and a liquid-cooled radiator 23. The refrigerated camera mounting structure 10 is used to be selectively assembled with the fin radiator 21, the air-cooled radiator 22, or the liquid-cooled radiator 23. That is, according to different usage scenarios, one of the radiators is selected for assembly and use to meet the needs of multiple heat dissipation methods.
[0050] Specifically, please refer to Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the cooling camera installation structure 10 provided in this embodiment. Figure 3 This is a cross-sectional view of the cooling camera mounting structure 10 provided in this embodiment, combined with Figure 2 and Figure 3 The cooling camera mounting structure 10 includes a camera housing 11, a centralized heat conducting plate 12, an electronic control component 13, an imaging component 14 and a refrigerator 15. The centralized heat conducting plate 12 is connected to the camera housing 11 to form a storage space. The electronic control component 13, the imaging component 14 and the refrigerator 15 are all arranged in the storage space. The refrigerator 15 is in contact with the imaging component 14 and is used to cool the imaging component 14. Among them, the first heat conducting surface 121 of the centralized heat conducting plate 12 is in contact with the electronic control component 13 and the refrigerator 15 and is used to conduct the heat generated by the electronic control component 13 and the refrigerator 15. The second heat conducting surface 122 of the centralized heat conducting plate 12 is exposed outside the storage space.
[0051] It is easy to understand that the heat generated by the electronic control component 13 can be transferred to the second heat conducting surface 122 through the first heat conducting surface 121. The refrigerator 15 can cool the imaging component 14 to keep the operating temperature of the imaging component 14 at room temperature, and the heat generated by the refrigerator 15 can also be transferred to the second heat conducting surface 122 through the first heat conducting surface 121. In addition, the centralized heat conducting plate 12 can be adapted to different radiators in the heat dissipation component 20 in different scenarios, so that the heat dissipation component 20 contacts the second heat conducting surface 122 of the centralized heat conducting plate 12, thereby performing centralized heat conduction and heat dissipation. Therefore, the refrigerated camera mounting structure 10 can be adapted and installed with a variety of radiators. Different radiators can be replaced according to specific usage scenarios, thereby achieving a variety of heat dissipation methods to meet usage requirements.
[0052] Combine Figure 1-Figure 3 That is to say, according to different usage scenarios of the refrigerated camera 100, the refrigerated camera mounting structure 10 is selectively assembled with one of the fin radiator 21, the air-cooled radiator 22 and the liquid-cooled radiator 23, that is, the fin radiator 21, the air-cooled radiator 22 or the liquid-cooled radiator 23 is detachably connected to the centralized heat conducting plate 12, so that the radiator can dissipate heat from the centralized heat conducting plate 12.
[0053] For further information, please refer to Figure 4-Figure 6 , Figure 4 This is a schematic diagram of the assembly of the cooling camera mounting structure 10 and the finned heat sink 21 provided in this embodiment. Figure 5 This is a schematic diagram of the assembly of the cooling camera mounting structure 10 and the air-cooling radiator 22 provided in this embodiment. Figure 6 The schematic diagram of the assembly of the cooling camera mounting structure 10 and the liquid cooling radiator 23 provided in this embodiment is shown in FIG. Figure 2-Figure 6 Specifically, in scenarios where space is limited or natural heat dissipation performance does not meet requirements, an air-cooled radiator 22 or a liquid-cooled radiator 23 is selected for assembly with the refrigerated camera mounting structure 10. In scenarios where circulating coolant is inconvenient, a finned radiator 21 or an air-cooled radiator 22 is selected for assembly with the refrigerated camera mounting structure 10. In scenarios where vibration requirements are high, a finned radiator 21 is selected for assembly with the refrigerated camera mounting structure 10 to prevent vibrations generated by the air-cooled radiator 22 or the liquid-cooled radiator 23 from affecting the camera. Therefore, the refrigerated camera 100 has multiple heat dissipation methods, and different radiators can be replaced according to specific usage scenarios to meet usage requirements.
[0054] It should be noted that the refrigerated camera 100 provided in this embodiment selects one of the finned radiator 21, the air-cooled radiator 22 and the liquid-cooled radiator 23 for assembly and use with the refrigerated camera mounting structure 10 according to different usage scenarios. This can increase the camera's usable space and improve the heat dissipation performance of the radiator in such a larger installation space, thereby avoiding the problem in the prior art that multiple radiators are simultaneously installed on the refrigerated camera mounting structure 10, squeezing each other's space and affecting the heat dissipation performance.
[0055] In addition, it should be noted that in this embodiment, the refrigerator 15 is an active refrigerator. An active refrigerator is a device that uses energy consumption to achieve cooling. In contrast to a passive refrigerator, an active refrigerator consumes energy to reduce the temperature, while a passive refrigerator does not consume energy and relies solely on conduction or convection to transfer heat.
[0056] Specifically, active coolers typically use compressors or semiconductor coolers (TECs) to achieve cooling; for example, semiconductor coolers use the Peltier effect. When a direct current passes through a galvanic couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat, thereby achieving a cooling effect.
[0057] Please combine Figure 3Specifically, the imaging assembly 14 includes a stacked image sensor 141 and a heat-conducting block 142. One side of the cooler 15 contacts the heat-conducting block 142, and the other side contacts the first heat-conducting surface 121. It will be appreciated that the heat-conducting block 142 allows heat generated by the image sensor 141 to be transferred to the cooler 15 and, along with the heat generated by the cooler 15 itself, to be transferred to the first heat-conducting surface 121.
[0058] Furthermore, the electronic control assembly 13 includes an electronic control mainboard 131 and a mainboard bracket 132. The electronic control mainboard 131 is mounted on the mainboard bracket 132, which contacts the first heat conducting surface 121. The mainboard bracket 132 secures the electronic control mainboard 131, improving the stability of the cooled camera 100 during use. Heat generated by the electronic control mainboard 131 is also conducted through the mainboard bracket 132, improving heat dissipation.
[0059] In order to further improve the heat dissipation effect of the electronic control motherboard 131, in this embodiment, a heat-conducting extension portion 1321 is provided at one end of the motherboard bracket 132. The heat-conducting extension portion 1321 is penetrated by the camera housing 11, and a portion of the heat-conducting extension portion 1321 is exposed outside the accommodating space.
[0060] It should be noted that since a portion of the thermally conductive extension portion 1321 is exposed outside the accommodating space, when the heat dissipation assembly 20 is assembled with the refrigerated camera mounting structure 10, the heat dissipation assembly 20 can also dissipate heat from the thermally conductive extension portion 1321, thereby further improving the heat dissipation efficiency.
[0061] Please combine Figure 2 and Figure 3 Specifically, the camera housing 11 includes a first housing 111 and a second housing 112. The first housing 111 is connected to the centralized heat conducting plate 12 to form an imaging cavity, while the second housing 112 is connected to the centralized heat conducting plate 12 to form an electrical control space. The electrical control assembly 13 is disposed within the electrical control space, while the imaging assembly 14 and the cooler 15 are disposed within the imaging cavity. It will be readily understood that the aforementioned accommodation space includes the electrical control space and the imaging cavity.
[0062] like Figure 2 and Figure 3As shown, in this embodiment, a radiator mounting space is formed between the top of the first housing 111 and the side of the second housing 112, which provides installation conditions for the radiator. Specifically, during conventional assembly of the finned radiator 21, air-cooled radiator 22, or liquid-cooled radiator 23 with the refrigerated camera mounting structure 10, the bottom of the finned radiator 21, air-cooled radiator 22, or liquid-cooled radiator 23 is mounted and fixed to the centralized heat conducting plate 12, while the side of the finned radiator 21, air-cooled radiator 22, or liquid-cooled radiator 23 can be abutted and fixed to the side of the second housing 112, thereby improving assembly stability and further ensuring the stability of the refrigerated camera 100 during use.
[0063] Please continue to combine Figure 3 Specifically, the first heat-conducting surface 121 includes an electrically controlled heat-conducting surface 1211 and an imaging heat-conducting surface 1212. Both the electrically controlled heat-conducting surface 1211 and the second heat-conducting surface 122 are located on the first side of the concentrated heat-conducting plate 12, while the imaging heat-conducting surface 1212 is located on the second side of the concentrated heat-conducting plate 12. In other words, the electrically controlled component 13 contacts the electrically controlled heat-conducting surface 1211 for heat transfer, while the imaging component 14 contacts the imaging heat-conducting surface 1212 for heat transfer.
[0064] It should be noted that, in this embodiment, the first side and the second side mentioned above are opposite sides of the concentrated heat conducting plate 12 ; of course, in other embodiments, the first side and the second side may also be adjacent sides of the concentrated heat conducting plate 12 .
[0065] Please continue to combine Figure 2 The cooling camera mounting structure 10 further includes a trigger connector 16, a power connector 17, and a GigE connector 18. The trigger connector 16, the power connector 17, and the GigE connector 18 are all disposed on a side of the second housing 112 away from the first housing 111 and are all connected to the electronic control motherboard 131. By disposing the trigger connector 16, the power connector 17, and the GigE connector 18 on the same side of the second housing 112, it is possible to facilitate connection of the connectors with other external adapter devices.
[0066] In order to better protect and fix the trigger connector 16, the power connector 17 and the GigE connector 18, in this embodiment, the second shell 112 is further provided with a first mounting groove 1121, a second mounting groove 1122 and a third mounting groove 1123 on the side away from the first shell 111. The trigger connector 16 is arranged in the first mounting groove 1121, the power connector 17 is arranged in the second mounting groove 1122, and the GigE connector 18 is arranged in the third mounting groove 1123.
[0067] Please refer to Figure 7 , Figure 7 The schematic diagram of the structure of the fin heat sink 21 provided in this embodiment is combined with Figure 4 and Figure 7 Specifically, the finned heat sink 21 includes a heat sink mounting plate 211 and a plurality of first heat sink fins 212. The heat sink mounting plate 211 is detachably connected to the centralized heat conducting plate 12, and the plurality of first heat sink fins 212 are disposed on the heat sink mounting plate 211. It should be noted that the finned heat sink 21 can be understood as a natural heat sink. The plurality of first heat sink fins 212 are arranged at intervals to form a heat dissipation channel, conduct heat to the centralized heat conducting plate 12, and then dissipate heat from the first heat sink fins 212 through natural wind.
[0068] In order to further improve the heat dissipation effect, in this embodiment, the heat dissipation mounting plate 211 includes a fixed portion 2111 and an extension portion 2112 connected to each other. The heat dissipation mounting plate 211 is detachably connected to the centralized heat conducting plate 12 through the fixed portion 2111, and a plurality of first heat dissipating fins 212 are distributed on the same side of the fixed portion 2111 and the extension portion 2112; the fin heat sink 21 also includes a plurality of second heat dissipating fins 213, and the plurality of second heat dissipating fins 213 are arranged on the side of the extension portion 2112 away from the plurality of first heat dissipating fins 212.
[0069] It is easy to understand that the multiple second heat dissipation fins 213 are also arranged at intervals to form a heat dissipation channel. By arranging multiple first heat dissipation fins 212 and multiple second heat dissipation fins 213 on opposite sides of the extension portion 2112, the heat dissipation effect is improved.
[0070] Please combine Figure 7 It should be noted that the fixing portion 2111 includes a heat dissipation portion and a heat conduction portion connected thereto ( Figure 7 The first screw 214 is arranged in the heat conducting part), and multiple first heat dissipation fins 212 are arranged on the side of the heat dissipation part away from the heat conducting part. The heat conducting part is used to be detachably connected to the centralized heat conducting plate 12, that is, after the heat conducting part and the centralized heat conducting plate 12 are installed, the heat is transferred to the heat dissipation part, and can also be transferred to the extension part 2112 through the heat dissipation part, and then the heat is dissipated through the first heat dissipation fins 212 and the second heat dissipation fins 213.
[0071] It should be noted that the fixing portion 2111 and the extending portion 2112 can be connected in separate parts or in an integral molding manner; similarly, the heat dissipation portion and the heat conduction portion can be connected in separate parts or in an integral molding manner.
[0072] Please refer to Figure 8 , Figure 8 The structural diagram of the air-cooled radiator 22 provided in this embodiment is combined with Figure 8Specifically, the air-cooled radiator 22 includes a radiator housing 221, a fan 222, and a plurality of third heat dissipating fins 223. The radiator housing 221 is detachably connected to the centralized heat conducting plate 12, and the fan 222 and the plurality of third heat dissipating fins 223 are both disposed within the radiator housing 221. As will be readily understood, the plurality of third heat dissipating fins 223 can conduct heat to the centralized heat conducting plate 12, and the fan 222 then dissipates heat from the plurality of third heat dissipating fins 223.
[0073] Please combine Figure 1 and Figure 6 Specifically, the liquid-cooled radiator 23 includes a liquid cooling tank 231, a liquid inlet connector 232, and a liquid outlet connector 233. The liquid cooling tank 231 is detachably connected to the centralized heat conducting plate 12, and the liquid inlet connector 232 and the liquid outlet connector 233 are both in communication with the liquid cooling tank 231. As will be readily understood, the liquid cooling tank 231 is used to contain coolant. An external coolant supply device is connected via the liquid inlet connector 232 and the liquid outlet connector 233, thereby providing circulating coolant to the liquid cooling tank 231, thereby achieving heat dissipation for the centralized heat conducting plate 12.
[0074] It should be noted that the coolant can be water, ethylene glycol aqueous solution, propylene glycol aqueous solution, etc., as long as it can dissipate heat from the centralized heat conducting plate 12 .
[0075] Furthermore, in order to facilitate the installation of the cooling liquid supply device and the liquid inlet joint 232 and the liquid outlet joint 233, in this embodiment, the liquid cooling box 231 is also provided with a first avoidance groove 2311 and a second avoidance groove 2312, the liquid inlet joint 232 is arranged in the first avoidance groove 2311, and the liquid outlet joint 233 is arranged in the second avoidance groove 2312.
[0076] Please refer to Figure 9 , Figure 9 This is a schematic diagram of the structure of the liquid cooling radiator 23 provided in this embodiment, combined with Figure 2 、 Figure 7-Figure 9 In order to achieve the installation, fixation or removal of the fin radiator 21, the air-cooled radiator 22 or the liquid-cooled radiator 23 and the centralized heat conducting plate 12, in this embodiment, the centralized heat conducting plate 12 is provided with a plurality of threaded holes 123, the fin radiator 21 is provided with a plurality of first screws 214, and the plurality of first screws 214 are used to match the plurality of threaded holes 123 in a one-to-one correspondence; the air-cooled radiator 22 is provided with a plurality of second screws 224, and the plurality of second screws 224 are used to match the plurality of threaded holes 123 in a one-to-one correspondence; the liquid-cooled radiator 23 is provided with a plurality of third screws 234, and the plurality of third screws 234 are used to match the plurality of threaded holes 123 in a one-to-one correspondence.
[0077] It should be noted that, in some other embodiments, a slide groove can also be provided on the centralized heat conduction plate 12, corresponding to the way of providing a slide rail on the fin radiator 21, the air-cooled radiator 22 and the liquid-cooled radiator 23, so that the sliding fit is convenient for adaptation and installation; of course, the assembly or disassembly of the fin radiator 21, the air-cooled radiator 22 or the liquid-cooled radiator 23 and the centralized heat conduction plate 12 can also be achieved through detachable connection methods such as snap connection, pin connection, magnetic connection or setting a mortise and tenon structure.
[0078] In summary, an embodiment of the present invention provides a refrigerated camera mounting structure 10 and a refrigerated camera 100. The refrigerated camera mounting structure 10 includes a camera housing 11, a centralized heat conducting plate 12, an electronic control component 13, an imaging component 14 and a refrigerator 15. The centralized heat conducting plate 12 is connected to the camera housing 11 and forms a storage space. The electronic control component 13, the imaging component 14 and the refrigerator 15 are all arranged in the storage space. The refrigerator 15 is in contact with the imaging component 14 and is used to cool the imaging component 14. The first heat conducting surface 121 of the centralized heat conducting plate 12 is in contact with the electronic control component 13 and the refrigerator 15 and is used to conduct heat generated by the electronic control component 13 and the refrigerator 15. The second heat conducting surface 122 of the centralized heat conducting plate 12 is exposed outside the storage space. The heat generated by the electronic control component 13 can be transferred to the second heat conducting surface 122 via the first heat conducting surface 121. The refrigerator 15 can cool the imaging component 14, keeping the operating temperature of the imaging component 14 at room temperature. The heat generated by the refrigerator 15 can also be transferred to the second heat conducting surface 122 via the first heat conducting surface 121. Furthermore, the centralized heat conducting plate 12 can be adapted to different radiators in the heat dissipation assembly 20 in different scenarios, allowing the heat dissipation assembly 20 to contact the second heat conducting surface 122 of the centralized heat conducting plate 12, thereby achieving centralized heat dissipation.
[0079] Therefore, the cooling camera mounting structure 10 can be adapted and installed with a variety of radiators, and different radiators can be replaced according to specific usage scenarios, thereby achieving a variety of heat dissipation methods to meet usage requirements.
[0080] The cooled camera 100 includes a heat sink assembly 20 and a cooled camera mounting structure 10. The heat sink assembly 20 is selected from any one of a finned heat sink 21, an air-cooled heat sink 22, and a liquid-cooled heat sink 23. The heat sink assembly 20 is detachably connected to the centralized heat conducting plate 12. As will be readily understood, depending on the different usage scenarios of the cooled camera 100, the cooled camera mounting structure 10 is selectively assembled with one of the finned heat sink 21, the air-cooled heat sink 22, and the liquid-cooled heat sink 23. That is, the finned heat sink 21, the air-cooled heat sink 22, or the liquid-cooled heat sink 23 is detachably connected to the centralized heat conducting plate 12, thereby enabling the heat sink to dissipate heat from the centralized heat conducting plate 12. In scenarios where space is limited or the natural heat dissipation performance does not meet the requirements, an air-cooled radiator 22 or a liquid-cooled radiator 23 is selected to be assembled with the refrigerated camera mounting structure 10; in scenarios where it is inconvenient to provide circulating coolant, a fin radiator 21 or an air-cooled radiator 22 is selected to be assembled with the refrigerated camera mounting structure 10; in scenarios where there are high requirements for vibration, a fin radiator 21 is selected to be assembled with the refrigerated camera mounting structure 10 to avoid the vibration generated by the air-cooled radiator 22 or the liquid-cooled radiator 23 during operation affecting the camera.
[0081] Therefore, the refrigerated camera 100 has multiple heat dissipation methods, and different radiators can be replaced according to specific usage scenarios to meet usage requirements.
[0082] The above description is merely a specific embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. A cooling camera mounting structure, characterized in that: include: Camera housing (11); a concentrated heat conducting plate (12), the concentrated heat conducting plate (12) being connected to the camera housing (11) to form an accommodating space; an electric control component (13), the electric control component (13) being arranged in the accommodation space; An imaging component (14), the imaging component (14) being disposed in the accommodation space; as well as a refrigerator (15), the refrigerator (15) being disposed in the accommodation space and in contact with the imaging component (14), the refrigerator (15) being used to cool the imaging component (14); The first heat-conducting surface (121) of the concentrated heat-conducting plate (12) contacts the electric control component (13) and the refrigerator (15) to conduct heat generated by the electric control component (13) and the refrigerator (15), and the second heat-conducting surface (122) of the concentrated heat-conducting plate (12) is exposed outside the accommodation space.
2. The cooling camera mounting structure according to claim 1, wherein: The refrigerator (15) is an active refrigerator.
3. The cooling camera mounting structure according to claim 1 or 2, wherein: The imaging assembly (14) comprises a stacked image sensor (141) and a heat-conducting block (142); one side of the refrigerator (15) contacts the heat-conducting block (142), and the other side contacts the first heat-conducting surface (121).
4. The cooling camera mounting structure according to claim 1 or 2, wherein: The electric control component (13) comprises an electric control mainboard (131) and a mainboard bracket (132); the electric control mainboard (131) is arranged on the mainboard bracket (132); and the mainboard bracket (132) contacts the first heat conducting surface (121).
5. The cooling camera mounting structure according to claim 4, wherein: A heat-conducting extension portion (1321) is provided at one end of the mainboard bracket (132), the heat-conducting extension portion (1321) is passed through the camera housing (11), and a portion of the heat-conducting extension portion (1321) is exposed outside the accommodating space.
6. The cooling camera mounting structure according to claim 1, wherein: The camera housing (11) comprises a first housing (111) and a second housing (112), wherein the first housing (111) is connected to the concentrated heat conducting plate (12) to form an imaging cavity, and the second housing (112) is connected to the concentrated heat conducting plate (12) to form an electric control space; the electric control component (13) is arranged in the electric control space, and the imaging component (14) and the refrigerator (15) are arranged in the imaging cavity; and / or, The first heat-conducting surface (121) comprises an electrically controlled heat-conducting surface (1211) and an imaging heat-conducting surface (1212); the electrically controlled heat-conducting surface (1211) and the second heat-conducting surface (122) are both located on a first side of the concentrated heat-conducting plate (12); and the imaging heat-conducting surface (1212) is located on a second side of the concentrated heat-conducting plate (12).
7. A cooling camera, characterized in that: The invention comprises a heat dissipation component (20) and a cooling camera mounting structure (10) according to any one of claims 1 to 6, wherein the heat dissipation component (20) is selected from any one of a fin heat sink (21), an air-cooled heat sink (22), and a liquid-cooled heat sink (23), and the heat dissipation component (20) is detachably connected to the centralized heat conducting plate (12).
8. The refrigerated camera according to claim 7, wherein: The fin heat sink (21) comprises a heat dissipation mounting plate (211) and a plurality of first heat dissipation fins (212); the heat dissipation mounting plate (211) is detachably connected to the concentrated heat conducting plate (12); and the plurality of first heat dissipation fins (212) are all arranged on the heat dissipation mounting plate (211).
9. The refrigerated camera according to claim 8, wherein: The heat dissipation mounting plate (211) comprises a fixed portion (2111) and an extension portion (2112) connected to each other; the heat dissipation mounting plate (211) is detachably connected to the concentrated heat conducting plate (12) via the fixed portion (2111); and the plurality of first heat dissipation fins (212) are distributed and arranged on the same side of the fixed portion (2111) and the extension portion (2112); The fin heat sink (21) further comprises a plurality of second heat dissipation fins (213), wherein the plurality of second heat dissipation fins (213) are arranged on a side of the extension portion (2112) away from the plurality of first heat dissipation fins (212).
10. The refrigerated camera according to claim 7, wherein: The air-cooled radiator (22) comprises a radiator housing (221), a fan (222), and a plurality of third heat dissipation fins (223); the radiator housing (221) is detachably connected to the concentrated heat conduction plate (12); the fan (222) and the plurality of third heat dissipation fins (223) are both arranged in the radiator housing (221); and / or, The liquid-cooled radiator (23) comprises a liquid cooling box (231), a liquid inlet joint (232) and a liquid outlet joint (233); the liquid cooling box (231) is detachably connected to the concentrated heat conducting plate (12); and the liquid inlet joint (232) and the liquid outlet joint (233) are both in communication with the liquid cooling box (231).