Heat dissipation structure of operation board card

Abstract

The utility model discloses an operation board card heat dissipation structure which comprises an operation force board and an operation unit arranged on one side of the operation force board, a plurality of heat dissipation strips are evenly embedded in the operation force board, a radiator is arranged on the side, opposite to the operation unit, of the operation force board, and a plurality of positioning pins are fixedly connected to the side, close to the radiator, of the outer side of the operation force board. A plurality of positioning holes matched with the positioning pins in an inserted mode are formed in the radiator, a mounting plate is arranged at the position, close to the middle, of the top side of the radiator, a cooling fan is mounted on the side, away from the radiator, of the mounting plate, and two cooling plates arranged on the outer side of the radiator are symmetrically and fixedly connected to the outer side of the mounting plate. And a plurality of connecting assemblies for fixing the mounting plate are uniformly arranged between the mounting plate and the computing force plate. By means of the structure, the radiator, the radiating plate, the mounting plate, the radiating fan and other radiating components are arranged, the overall radiating efficiency can be improved, the radiating effect is good, mounting is conducted in a movable connection mode, the dismounting and mounting efficiency is high, and meanwhile convenience is provided for follow-up maintenance work.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board heat dissipation, in particular to a heat dissipation structure of a computing board. Background Art

[0002] As core components of high-performance computing systems, computing boards carry complex data processing and computational tasks. During their efficient operation, the high-frequency operation of numerous electronic components inevitably generates significant heat. If this accumulated heat is not dissipated promptly and effectively, it will cause the computing board's operating temperature to rise, affecting its performance stability and lifespan.

[0003] Currently, most heat dissipation structures use a small heat sink directly bonded to the computing board. This results in poor heat dissipation and requires the bonded heat sink to be removed during maintenance and disassembly, which can easily damage the computing board and reduces replacement efficiency. Therefore, the present invention provides a heat dissipation structure for a computing board to address the problems raised in the above-mentioned background technology. Utility Model Content

[0004] The purpose of the utility model is to provide a heat dissipation structure for a computing board, which is provided with heat dissipation components such as a radiator, a heat dissipation plate, a mounting plate and a heat dissipation fan, which can improve the overall heat dissipation efficiency and have a good heat dissipation effect. It is installed in a movable connection manner, which has high disassembly and assembly efficiency and provides convenience for subsequent maintenance work.

[0005] To achieve the above-mentioned object, a computing board heat dissipation structure is provided, comprising a computing board and a computing unit provided on one side of the computing board, wherein a plurality of heat dissipation strips are evenly embedded in the computing board, a heat sink is provided on the side of the computing board opposite to the computing unit, a plurality of positioning pins are fixedly connected to the outside of the computing board and on the side close to the heat sink, a plurality of positioning holes are provided inside the heat sink for mating with the positioning pins, a mounting plate is provided on the top side of the heat sink and near the middle, a cooling fan is installed on the side of the mounting plate away from the heat sink, two heat dissipation plates provided on the outside of the heat sink are symmetrically fixedly connected to the outside of the mounting plate, and a plurality of connection components for fixing the mounting plate are evenly provided between the mounting plate and the computing board;

[0006] The connection assembly includes a stud provided between the mounting plate and the computing board, a screw fixedly connected to the bottom of the stud, and a bolt inserted into the mounting plate. The stud is a hexagonal structure, the bottom end of the bolt is threadedly connected to the top side of the stud, and a threaded hole is opened inside the computing board, and the screw is matched with the threaded hole.

[0007] According to the heat dissipation structure of a computing board, a plurality of heat dissipation fins are evenly formed on the top of the heat dissipation plate.

[0008] According to the heat dissipation structure of a computing board, the heat dissipation strips are configured as a serpentine structure, and the surfaces of the heat dissipation fins of the radiator are configured as a wave structure.

[0009] According to the heat dissipation structure of a computing board, the heat dissipation bar is made of copper, and the heat sink, heat dissipation plate and heat sink are all made of aluminum.

[0010] According to the heat dissipation structure of a computing board, a plurality of through-going mounting holes are evenly provided inside the computing board.

[0011] According to the heat dissipation structure of a computing board, thermal grease is provided on the side of the radiator close to the computing board and on the side of the heat dissipation plate close to the radiator.

[0012] The utility model has the following beneficial effects:

[0013] 1. Compared with the existing technology, this computing board heat dissipation structure is a kind of heat dissipation structure. The heat generated by the computing board during high-load computing is transferred to the radiator through the heat dissipation strips for dissipation. The operation of the cooling fan accelerates the flow of air, thereby improving the heat dissipation efficiency. In addition, the heat dissipation plate and heat sink are arranged on the top of the radiator to increase the heat dissipation area. At the same time, the arrangement of the heat sink and the heat sink cooperate with the heat dissipation fins of the radiator to form an air circulation channel. The flowing air flows through the channel between the heat dissipation fins and the heat dissipation plate, which can effectively take away the heat absorbed by the heat dissipation fins and the heat dissipation plate surface, reducing their temperature, thereby improving the overall heat dissipation efficiency and achieving good heat dissipation effect.

[0014] 2. Compared with the existing technology, this computing board heat dissipation structure uses a movable connection method to install heat dissipation components such as the radiator, heat dissipation plate, mounting plate and heat dissipation fan. The radiator and heat dissipation fan can be disassembled and assembled by removing and assembling bolts. The disassembly and assembly efficiency is high and it provides convenience for subsequent maintenance work and is highly practical.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a first overall structural diagram of a heat dissipation structure of a computing board according to the present invention;

[0018] Figure 2 This is a second overall structural diagram of a heat dissipation structure of a computing board according to the present invention;

[0019] Figure 3This is a schematic diagram of the split structure of the heat sink and computing board of a computing board heat dissipation structure of the utility model;

[0020] Figure 4 The utility model is a schematic diagram of the mounting plate, cooling fan, cooling plate and heat sink structure of a computing board heat dissipation structure.

[0021] Legend:

[0022] 1. Hash board; 2. Computing unit; 3. Radiator; 4. Positioning pin; 5. Positioning hole; 6. Mounting plate; 7. Cooling fan; 8. Heat sink; 9. Heat sink; 10. Stud; 11. Bolt; 12. Heat dissipation strip; 13. Screw; 14. Threaded hole. DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0024] Reference Figure 1-4 The embodiment of the present invention provides a heat dissipation structure for a computing board, which includes a computing board 1 and a computing unit 2 arranged on one side of the computing board 1. A plurality of heat dissipation strips 12 are evenly embedded in the computing board 1. A radiator 3 is provided on the side of the computing board 1 opposite to the computing unit 2. A plurality of positioning pins 4 are fixedly connected to the outside of the computing board 1 and close to the side of the radiator 3. A plurality of positioning holes 5 for plugging with the positioning pins 4 are opened inside the radiator 3. A mounting plate 6 is provided on the top side of the radiator 3 and near the middle. A cooling fan 7 is installed on the side of the mounting plate 6 away from the radiator 3. Two heat dissipation plates 8 arranged on the outside of the radiator 3 are symmetrically fixedly connected to the outside of the mounting plate 6. A plurality of heat dissipation fins 9 are evenly formed on the top of the heat dissipation plate 8.

[0025] The radiator 3 can be positioned on the computing board 1 by fitting the positioning holes 5 with the positioning pins 4. The cooling fan 7 is mounted on the top of the radiator 3 via the mounting plate 6. The cooling fan 7 facilitates air circulation. The heat generated by the computing board 1 during high-load operations is transferred to the radiator 3 via the heat dissipation bars 12 for dissipation. The operation of the cooling fan 7 accelerates the flow of air, thereby improving heat dissipation efficiency. In addition, the installation of a heat sink 8 and heat sink 9 on the top of the radiator 3 increases the heat dissipation area. At the same time, the installation of the heat sink 8 cooperates with the heat dissipation fins of the radiator 3 to form an air circulation channel. The flowing air flows through the channel between the heat dissipation fins and the heat sink 8, effectively removing the heat absorbed by the heat dissipation fins and the surface of the heat sink 8, reducing their temperature, thereby improving the overall heat dissipation efficiency and achieving good heat dissipation effect.

[0026] A plurality of connection components for fixing the mounting plate 6 are evenly provided between the mounting plate 6 and the computing board 1. The connection components include studs 10 provided between the mounting plate 6 and the computing board 1, screws 13 fixedly connected to the bottom of the studs 10, and bolts 11 inserted into the interior of the mounting plate 6. The studs 10 are hexagonal in structure, and the bottom end of the bolts 11 are threadedly connected to the top side of the studs 10. A threaded hole 14 is provided inside the computing board 1, and the screws 13 are matched with the threaded holes 14.

[0027] By fitting the screw 13 of the stud 10 into the threaded hole 14, the stud 10 can be installed on the hash board 1. The mounting plate 6 is placed on the stud 10 and secured to it with bolts 11. This better secures the cooling fan 7 while also ensuring the stability of the radiator 3, allowing the radiator 3 and cooling fan 7 to be tightly fixed to the hash board 1. The installation is done in a flexible connection, and the radiator 3 and cooling fan 7 can be removed and assembled by simply removing the bolts 11. This improves efficiency while facilitating subsequent maintenance work, making it highly practical.

[0028] The heat sink 12 is designed as a serpentine structure and is made of copper to maximize heat dissipation area and efficiency. The fin surface of the heat sink 3 is designed as a wave structure to help increase the heat dissipation area and improve heat exchange efficiency. The heat sink 12, heat sink 3, heat plate 8, and heat sink 9 are all made of aluminum, which can effectively absorb and dissipate heat.

[0029] The hash board 1 is evenly distributed with multiple mounting holes to facilitate its installation and fixation. Thermal grease is applied to both the side of the heat sink 3 closest to the hash board 1 and the side of the heat sink 8 closest to the heat sink 3, further enhancing heat conduction efficiency and ensuring rapid heat transfer from the hash board 1 to the heat sink 3 and heat sink 8.

[0030] Working Principle: The stud 10 can be installed on the hashboard 1 by fitting the screw 13 of the stud 10 with the threaded hole 14. The heat sink 3 is positioned on the hashboard 1 through the fitting of the positioning hole 5 and the positioning pin 4.

[0031] The mounting plate 6 is placed on the studs 10 and fixed to the studs 10 using bolts 11. This can better fix the cooling fan 7 and also ensure the stability of the radiator 3, so that the radiator 3 and the cooling fan 7 can be tightly fixed on the hash board 1.

[0032] The cooling fan 7 is installed on the top of the radiator 3 through the mounting plate 6, and the cooling fan 7 helps the air circulation. The heat generated by the computing board 1 during high-load operation is transferred to the radiator 3 through the heat dissipation bar 12 for dissipation. The operation of the cooling fan 7 accelerates the flow of air, which helps to improve the heat dissipation efficiency. In addition, the heat dissipation plate 8 and the heat sink 9 are arranged on the top of the radiator 3 to increase the heat dissipation area. At the same time, the setting of the heat sink 8 cooperates with the heat dissipation fins of the radiator 3 to form an air circulation channel. The flowing air flows through the channel between the heat dissipation fins and the heat dissipation plate 8, which can effectively take away the heat absorbed by the surface of the heat dissipation fins and the heat dissipation plate 8, reduce their temperature, thereby improving the overall heat dissipation efficiency and achieving good heat dissipation effect.

[0033] Moreover, the heat dissipation components such as the radiator 3, heat dissipation plate 8, mounting plate 6 and heat dissipation fan 7 are installed in a movable connection manner. The radiator 3 and the heat dissipation fan 7 can be disassembled and assembled by disassembling the bolts 11. The high disassembly and assembly efficiency provides convenience for subsequent maintenance work and is highly practical.

[0034] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A heat dissipation structure for a computing board, characterized in that: The invention comprises a computing board (1) and a computing unit (2) arranged on one side of the computing board (1), wherein a plurality of heat dissipation strips (12) are evenly embedded in the interior of the computing board (1), a heat sink (3) is provided on the side of the computing board (1) opposite to the computing unit (2), a plurality of positioning pins (4) are fixedly connected to the outside of the computing board (1) and close to the heat sink (3), a plurality of positioning holes (5) for plugging with the positioning pins (4) are provided inside the heat sink (3), a mounting plate (6) is provided on the top side of the heat sink (3) and close to the middle, a heat dissipation fan (7) is installed on the side of the mounting plate (6) away from the heat sink (3), two heat dissipation plates (8) arranged on the outside of the heat sink (3) are symmetrically fixedly connected to the outside of the mounting plate (6), and a plurality of connection components for fixing the mounting plate (6) are evenly provided between the mounting plate (6) and the computing board (1); The connection assembly comprises a stud (10) provided between the mounting plate (6) and the computing plate (1), a screw (13) fixedly connected to the bottom of the stud (10), and a bolt (11) inserted into the interior of the mounting plate (6); the stud (10) is a hexagonal structure; the bottom end of the bolt (11) is threadedly connected to the top side of the stud (10); a threaded hole (14) is provided inside the computing plate (1), and the screw (13) is cooperatively connected to the threaded hole (14).

2. The heat dissipation structure of a computing board according to claim 1, characterized in that: A plurality of heat sinks (9) are evenly formed on the top of the heat sink (8).

3. The heat dissipation structure of a computing board according to claim 2, characterized in that: The heat dissipation strip (12) is configured as a serpentine structure, and the surfaces of the heat dissipation fins of the radiator (3) are configured as a wave structure.

4. The heat dissipation structure of a computing board according to claim 3, characterized in that: The heat dissipation strip (12) is made of copper, and the heat sink (3), heat dissipation plate (8) and heat dissipation fin (9) are all made of aluminum.

5. The heat dissipation structure of a computing board according to claim 4, characterized in that: The computing board (1) is evenly provided with a plurality of through-going mounting holes.

6. The heat dissipation structure of a computing board according to claim 5, characterized in that The side of the radiator (3) close to the computing board (1) and the side of the heat dissipation plate (8) close to the radiator (3) are both provided with thermal conductive silicone grease.

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