Novel press unit for packaging chip substrate

Abstract

The utility model belongs to the technical field of semiconductor packaging, and provides a novel press unit for packaging a chip substrate and a control method. The plurality of mold closing guide columns are arranged on the base in parallel; the upper die is arranged on the multiple die assembly guide columns in a penetrating mode, the lower die is arranged on the multiple die assembly guide columns in a penetrating mode, and the upper die and the lower die can move relatively; the adjusting assembly is provided with movable lifting adjusting blocks, the number of the lifting adjusting blocks is matched with that of the mold closing guide columns, and the adjusting assembly is connected with the upper mold or the lower mold; the pressure sensor is arranged on the mold closing guide column and is used for detecting the pressure borne by the mold closing guide column during mold closing; the controller is in communication connection with the adjusting assembly and the pressure sensor and used for receiving the pressure electric signal of the pressure sensor and sending out an adjusting instruction so as to conduct lifting adjustment on the lifting adjusting block. By the adoption of the structure, the pressure borne by the mold closing guide column can be adjusted in real time, the balance of the mold closing pressure is guaranteed, and therefore the packaging thickness is uniform, and the packaging quality is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip substrate packaging, in particular to a new press unit for chip substrate packaging. Background Art

[0002] Over time, semiconductor technology has continued to advance, gradually developing more complex semiconductor devices such as integrated circuits and large-scale integrated circuits. These technological developments have greatly promoted progress in fields such as computers, communications, and medicine, making our lives more convenient and efficient.

[0003] Compression packaging of chip substrates is an essential step. Since the packaging size and volume of chip substrates are different, uneven mold pressure is likely to occur during mold compression packaging, resulting in uneven packaging thickness of the chip substrate, and thus the packaging quality cannot be guaranteed. Utility Model Content

[0004] The utility model provides a new press unit for chip substrate packaging, which solves the problem of uneven packaging thickness caused by uneven chip substrate size and packaging volume in traditional packaging equipment in the above technical background, thereby improving packaging quality.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A novel press unit for chip substrate packaging, characterized by comprising:

[0007] base;

[0008] A plurality of mold closing guide pillars, one end of which is fixedly mounted on the base, and the plurality of mold closing guide pillars are arranged parallel to each other;

[0009] The upper mold is provided on the plurality of mold guide pillars.

[0010] A lower mold is provided on the plurality of mold closing guide pillars, the lower mold is provided below the upper mold, and the upper mold and the upper mold can move relative to each other and close the mold;

[0011] An adjustment assembly, which is provided with a lifting adjustment block. The number of the adjustment assemblies matches the number of the mold clamping guide columns. The lifting adjustment block is provided on the mold clamping guide columns and is connected to the upper mold or the lower mold. The lifting adjustment block can be raised and lowered along the mold clamping guide columns.

[0012] A pressure sensor is provided on each mold clamping guide column, and is used to detect the pressure borne by the mold clamping guide column during mold clamping.

[0013] In some embodiments, the lower mold can be lifted and moved along the axis of the mold closing guide column and moved closer to the upper mold for mold closing, and the lifting adjustment block of the adjustment assembly is connected to the upper mold.

[0014] In some embodiments, the adjustment assembly further includes an adjustment motor, a reduction gear assembly, and a flange assembly. The adjustment motor is fixed to the upper mold through a mounting bracket. The reduction gear assembly includes an active reduction gear, a plurality of driven reduction gears, and an annular rack. The number of teeth of the active reduction gear is smaller than the number of teeth of the driven reduction gear. The active reduction gear is connected to the output shaft of the adjustment motor. The plurality of driven reduction gears are respectively meshed with the active reduction gear and the annular rack. The annular rack is fixed to the mounting bracket.

[0015] The flange assembly includes an upper flange and a lower flange, the upper flange is connected to the output shaft of the driven reduction gear, and the lower flange is fixedly connected to the upper flange;

[0016] The lifting adjustment block is a correction nut, and the mold closing guide column is provided with a corresponding correction thread. The correction nut is rotatably connected to the upper mold, and the correction nut is fixedly connected to the lower flange.

[0017] In some embodiments, the annular rack, the active reduction gear, the upper flange, the lower flange, the correction nut, and the mold clamping guide column are coaxially arranged.

[0018] In some embodiments, an annular clearance groove is provided on the upper mold, and the correction nut is rotatably set in the annular clearance groove. An annular limiting groove is provided on the correction nut, and the lower end surface of the annular limiting groove is coplanar with the upper end surface of the upper mold. A detachable limiting block is provided on the upper mold, and the limiting block is partially located in the annular limiting groove, and the limiting block abuts against the lower end surface of the annular limiting groove.

[0019] In some embodiments, a spring bracket is provided on the mold closing guide column, and a return spring is provided on the spring bracket. The return spring is sleeved on the mold closing guide column, one end of the return spring abuts against the spring bracket, and the other end of the return spring abuts against the lower end surface of the upper mold.

[0020] In some embodiments, it also includes a first driving component arranged on the base, the first driving component includes a mold closing motor, a mold closing screw, a mold closing nut and a nut guide shaft, the mold closing motor is arranged on the base, the mold closing screw is rotatably arranged on the base and is connected to the output end of the mold closing electrode, the mold closing nut is movably arranged on the mold closing screw, the nut guide shaft is arranged on the base, the mold closing nut is sleeved on the nut guide shaft, and the mold closing screw, mold closing guide column and nut guide shaft are arranged parallel to each other.

[0021] In some embodiments, a mold closing link assembly is further included, which includes a first link, a second link and a third link, one end of the first link is hinged to the lower mold, one end of the second link is hinged to the base, the other end of the first link is hinged to the other end of the second link, one end of the third link is hinged to the mold closing nut, the other end of the third link is hinged to the first link, and the intersection of the first link and the second link is close to one side of the mold closing screw.

[0022] In some embodiments, a pressure amplifier is further included, which is used to amplify the micro-deformation pressure value measured by the pressure sensor and convert it into electrical signal data; and

[0023] The controller includes a storage unit, an operation unit, a comparison unit and a control instruction unit. The storage unit is used to receive the electrical signal data converted by the pressure amplifier. The operation unit calculates the electrical signal data converted by the storage unit and transmits the calculation result to the comparison unit. The comparison unit is provided with a standard value.

[0024] Compared with the prior art, the beneficial effects brought by the present invention are:

[0025] This application arranges pressure sensors on multiple mold closing guide pillars to detect the micro-deformation variable pressure values ​​borne by the mold closing guide pillars during mold closing. According to the different pressure values, the lifting and lowering adjustment blocks of the adjustment assembly are driven to move up or down slightly along the mold closing guide pillars, so that the pressure borne by the multiple mold closing guide pillars is within the standard value range, thereby ensuring that the pressure borne by the chip substrate is balanced during mold closing, making the package thickness uniform, and improving the package quality.

[0026] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a first perspective view of the press unit of the present invention;

[0028] Figure 2 A top view of the press unit of the present invention;

[0029] Figure 3 for Figure 2 Cross-sectional view at LL;

[0030] Figure 4 for Figure 3 Enlarged view of T in the middle;

[0031] Figure 5 for Figure 2 Cross-sectional view at KK in the middle;

[0032] Figure 6 for Figure 2 Cross-sectional view at NN in the middle;

[0033] Figure 7 This is a control flow chart of the adjustment component of the press unit of the present invention;

[0034] Figure 8 The figure is a schematic diagram of the assembly structure between the correction nut, the mold closing guide column and the upper mold of the press unit of the present invention. DETAILED DESCRIPTION

[0035] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.

[0036] In one embodiment, Figure 1 and Figure 2 As shown, the press unit 500 provided by the present invention includes an upper mold 503 and a lower mold 502, wherein the upper mold 503 is fixedly arranged, and the lower mold 502 can be raised and lowered to form a closed mold.

[0037] Specifically, the press unit 500 includes a base 501, on which a plurality of mold closing guide columns 504 are provided, one end of the mold closing guide column 504 is fixedly connected to the base 501, and the mold closing guide columns 504 are arranged parallel to each other, wherein the lower mold 502 is movably mounted on the mold closing guide column 504, and the upper mold 503 is fixedly arranged on the upper end of the mold closing guide column 504, and a first negative pressure mechanism is provided on the upper mold 503 to adsorb and fix the chip substrate, and a second negative pressure mechanism is provided on the lower mold 502 to adsorb and fix the film carrying the resin.

[0038] In this embodiment, the number of the mold closing guide pillars is 4. Optionally, the number of the mold closing guide pillars may be 3 or 5.

[0039] Furthermore, a first driving assembly is arranged on the base 501, and the first driving assembly includes a mold closing motor 5011, a mold closing screw 5015, a mold closing nut 5016 and a mold closing connecting rod assembly 506, wherein both ends of the mold closing screw 5015 are rotatably arranged on the base 501 through bearings, and the mold closing nut 5016 is sleeved on the mold closing screw 5015 through threaded fitting, and the axis of the mold closing screw 5015 is parallel to the axis of the mold closing guide column 504, a mold closing active pulley 5012 is arranged at the output end of the mold closing motor 5011, and a mold closing driven pulley 5014 is arranged at the end of the mold closing screw 5015 close to the base 501, and a mold closing driven belt 5013 is wound around the mold closing active pulley 5012 and the mold closing driven pulley 5014 for power transmission, and the lower mold 502 is driven to perform the mold closing action through the forward and reverse rotation of the mold closing motor 5011.

[0040] Further, if Figure 5 As shown, to ensure the stability of the mold clamping structure during the mold clamping process, the press unit 500 is further provided with a mold clamping link assembly 506, which includes a first link 5063, a second link 5062, and a third link 5061. One end of the first link 5063 is hinged to the lower mold 502, one end of the second link 5062 is hinged to the base 501, the other end of the first link 5063 is hinged to the other end of the second link 5062, one end of the third link 5061 is hinged to the mold clamping nut 5016, and the other end of the third link 5061 is hinged to the first link 5063. In this embodiment, the first link 5063, the second link 5062, and the third link 5061 are symmetrically arranged about the mold clamping screw 5015. In the initial state, the hinge point of the first connecting rod 5063 and the second connecting rod 5062 is set close to one side of the mold clamping screw 5015. When the lower mold 502 rises, the hinge point of the first connecting rod 5063 and the second connecting rod 5062 begins to slowly move away from the mold clamping screw 5015.

[0041] Further, if Figure 6 As shown, a nut guide shaft 5017 is also provided on the base 501. The nut guide shaft 5017 is arranged parallel to the mold screw 5015. The nut guide shaft 5017 is passed through the mold nut 5016. In this embodiment, there are two nut guide shafts 5017, and they are symmetrically arranged with respect to the mold screw 5015. The axis of the mold screw 5015 and the axes of the two mold guide columns 5017 are on the same plane.

[0042] like Figure 3 and Figure 4As shown, multiple groups of adjustment assemblies 505 are provided on the upper mold 503, and the number of adjustment assemblies 505 matches the number of mold clamping guide pillars 504. Specifically, the adjustment assembly 505 includes an adjustment motor 5051, a reduction gear assembly, and a flange assembly. The adjustment motor 5051 is fixedly mounted on the upper mold 503 via a mounting bracket. A reduction gear assembly 5052 is provided at the output end of the adjustment motor 5051. The reduction gear assembly 5052 includes a driving reduction gear, a driven reduction gear, and an annular rack. The number of teeth on the driving reduction gear is much smaller than that on the driven reduction gear, thereby achieving a deceleration effect. The driven reduction gear meshes with the driving reduction gear and the annular rack, respectively. The annular rack is fixedly mounted on the mounting bracket, and the driving reduction gear is mounted on the output shaft of the adjustment motor 5051. To facilitate assembly, the flange assembly includes an upper flange and a lower flange. The output end of the driven reduction gear is connected to the upper flange 5053. A fixed lower flange 5054 is provided below the upper flange 5053. The lower flange 5054 is fixedly connected to the correction nut 5056. A corresponding correction thread is provided on the upper end of the mold clamping guide column 504. The correction nut 5056 is sleeved on the mold clamping guide column 5054 through the correction thread. Figure 8 As shown, an annular clearance groove is provided on the upper mold 503, and the size of the annular clearance groove 5031 is adapted to the outer diameter of the correction nut 5056, and the correction nut 5056 can rotate relative to the upper mold 503 in the annular clearance groove 5031; further, a detachable limit block 5055 is also provided on the upper mold 503 to limit the axial direction of the correction nut 5056 in the mold closing guide column 504, so as to facilitate the correction nut 5056 to be movably installed in the annular clearance groove 6031 of the upper mold 503. Specifically, an annular limit groove 50561 is provided on the correction nut 5056. When the correction nut 5056 is installed in the annular stop groove 5031, the lower end surface of the annular limit groove 50561 is coplanar with the upper end surface of the upper mold 503. A detachable limit block 5055 is provided on the upper mold 503. The limit block 5055 is partially located in the annular limit groove 50561, and the limit block 5055 abuts against the lower end surface of the annular limit groove 50561.

[0043] Furthermore, a return spring 5041 is provided below the upper die 503 to assist in resetting the upper die 503. Specifically, a spring bracket 5042 is provided on the mold closing guide column 504. One end of the return spring 5041 abuts against the spring bracket 5042, and the other end of the return spring 5041 abuts against the lower wall of the upper die 503. When the upper die 503 moves downward under the action of the adjustment motor 5051, the return spring 5041 is squeezed. When the upper die 503 moves upward under the action of the adjustment motor 5051, the return spring 5041 returns to its initial state.

[0044] In one embodiment, Figure 7As shown, the press unit 500 also includes a pressure sensor 5043, a pressure amplifier, and a controller. The controller includes a storage unit, an operation unit, a comparison unit, and a control instruction unit. The pressure sensor 5043 is provided on the mold clamping guide column 504 and is used to detect the pressure of each mold clamping guide column 5043 during mold clamping, thereby confirming whether there is a pressure difference. The pressure amplifier is used to perform analog-to-digital conversion on the pressure value of the micro-deformation variable and transmit the converted electrical signal data to the storage unit of the controller. The operation unit calculates and processes the converted data in the storage unit and compares the calculation result with the standard value set by the comparison unit. Based on the comparison result, the control instruction unit issues an adjustment instruction to fine-tune the correction nut 5056 of one or more adjustment components 505 to adjust the mold clamping pressure, thereby ensuring uniform force on the multiple mold clamping guide columns 5056 and ensuring a uniform thickness of the package body. For example, when the calculation result is less than the standard value, the adjustment motor rotates forward, and when the calculation result is greater than the standard value, the adjustment motor rotates reversely.

[0045] Furthermore, the controller is also used to detect the size of the upper and lower mold clamping pressures, confirm whether the clamping pressures meet the set values, and issue adjustment instructions to the clamping motor through the controller to adjust the total clamping pressure.

[0046] In one embodiment, the present invention further provides a method for adjusting the mold clamping of a press unit 500:

[0047] S1; the mold closing motor 5051 rotates, driving the lower mold 502 to move upward for mold closing;

[0048] S2: When the mold is closed, the pressure sensor 5043 detects the pressure values ​​of the multiple mold closing guide pillars 504 in real time, converts the deformation value into analog-to-digital value through the pressure amplifier, and stores the detection data in the storage unit of the controller;

[0049] S3: The controller's calculation unit calculates and processes the detection data in the storage unit, compares the calculated data with the standard value of the comparison unit, obtains a deviation value, and feeds the deviation value back to the controller's control instruction unit;

[0050] S4: The control command unit issues a command based on the deviation value, and issues an adjustment command to one or more adjustment motors 5051 to drive the correction nut 5056 to perform fine adjustment so that the force applied to the multiple mold clamping guide columns 504 is within the range of the specified standard value.

[0051] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A new press unit for chip substrate packaging, characterized in that: include: base; A plurality of mold closing guide pillars, one end of which is fixedly mounted on the base, and the plurality of mold closing guide pillars are arranged parallel to each other; The upper mold is provided on the plurality of mold guide pillars. A lower mold is provided on the plurality of mold closing guide pillars, the lower mold is provided below the upper mold, and the upper mold and the upper mold can move relative to each other and close the mold; An adjustment assembly, which is provided with a lifting adjustment block. The number of the adjustment assemblies matches the number of the mold clamping guide columns. The lifting adjustment block is provided on the mold clamping guide columns and is connected to the upper mold or the lower mold. The lifting adjustment block can be raised and lowered along the mold clamping guide columns. A pressure sensor is provided on each mold clamping guide column, and is used to detect the pressure borne by the mold clamping guide column during mold clamping.

2. A novel press unit for chip substrate packaging according to claim 1, characterized in that: The lower mold can be lifted and moved along the axis of the mold closing guide column and moved closer to the upper mold for mold closing. The lifting adjustment block of the adjustment assembly is connected to the upper mold.

3. A novel press unit for chip substrate packaging according to claim 2, characterized in that: The adjustment assembly also includes an adjustment motor, a reduction gear assembly and a flange assembly. The adjustment motor is fixed to the upper mold through a mounting bracket. The reduction gear assembly includes an active reduction gear, a plurality of driven reduction gears and an annular rack. The number of teeth of the active reduction gear is smaller than the number of teeth of the driven reduction gear. The active reduction gear is connected to the output shaft of the adjustment motor. The plurality of driven reduction gears are respectively engaged with the active reduction gear and the annular rack. The annular rack is fixed to the mounting bracket. The flange assembly includes an upper flange and a lower flange, the upper flange is connected to the output shaft of the driven reduction gear, and the lower flange is fixedly connected to the upper flange; The lifting adjustment block is a correction nut, and the mold closing guide column is provided with a corresponding correction thread. The correction nut is rotatably connected to the upper mold, and the correction nut is fixedly connected to the lower flange.

4. A novel press unit for chip substrate packaging according to claim 3, characterized in that: The annular rack, active reduction gear, upper flange, lower flange, correction nut and mold clamping guide column are coaxially arranged.

5. A novel press unit for chip substrate packaging according to claim 3, characterized in that: The upper die is provided with an annular clearance groove, the correction nut is rotatably set in the annular clearance groove, the correction nut is provided with an annular limiting groove, the lower end surface of the annular limiting groove is coplanar with the upper end surface of the upper die, and a detachable limiting block is provided on the upper die, the limiting block is partially located in the annular limiting groove, and the limiting block abuts against the lower end surface of the annular limiting groove.

6. A novel press unit for chip substrate packaging according to claim 5, characterized in that: A spring bracket is provided on the mold closing guide column, and a return spring is provided on the spring bracket. The return spring is sleeved on the mold closing guide column, one end of the return spring abuts against the spring bracket, and the other end of the return spring abuts against the lower end surface of the upper mold.

7. A novel press unit for chip substrate packaging according to claim 2, characterized in that: It also includes a first drive assembly arranged on the base, the first drive assembly includes a mold clamping motor, a mold clamping screw, a mold clamping nut and a nut guide shaft, the mold clamping motor is arranged on the base, the mold clamping screw is rotatably arranged on the base and is connected to the output end of the mold clamping electrode, the mold clamping nut is movably arranged on the mold clamping screw, the nut guide shaft is arranged on the base, the mold clamping nut is sleeved on the nut guide shaft, and the mold clamping screw, mold clamping guide column and nut guide shaft are arranged parallel to each other.

8. A novel press unit for chip substrate packaging according to claim 7, characterized in that: It also includes a mold closing connecting rod assembly, which includes a first connecting rod, a second connecting rod and a third connecting rod. One end of the first connecting rod is hinged to the lower mold, one end of the second connecting rod is hinged to the base, the other end of the first connecting rod is hinged to the other end of the second connecting rod, one end of the third connecting rod is hinged to the mold closing nut, and the other end of the third connecting rod is hinged to the first connecting rod. The intersection point of the first connecting rod and the second connecting rod is close to one side of the mold closing screw.

9. A novel press unit for chip substrate packaging according to claim 1, characterized in that: It also includes a pressure amplifier, which is used to amplify the micro-deformation pressure value measured by the pressure sensor and convert it into electrical signal data; and The controller includes a storage unit, an operation unit, a comparison unit and a control instruction unit. The storage unit is used to receive the electrical signal data converted by the pressure amplifier. The operation unit calculates the electrical signal data converted by the storage unit and transmits the calculation result to the comparison unit. The comparison unit is provided with a standard value.

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