Semiconductor manufacturing device with pipeline heating function

Abstract

The utility model relates to the related field of semiconductor manufacturing, in particular to a semiconductor manufacturing device with a pipeline heating function, which comprises a device body, a semiconductor manufacturing machine, a heating assembly and an adjusting assembly are arranged in the device body, an exhaust pipe is arranged on one side of the semiconductor manufacturing machine, the heating assembly is sleeved on the outer side of the exhaust pipe, and the adjusting assembly is sleeved on the outer side of the exhaust pipe. The adjusting assembly is arranged at the lower end of the heating assembly, the heating assembly comprises an upper sleeve shell and a lower sleeve shell, inner grooves are formed in the upper sleeve shell and the lower sleeve shell correspondingly, the adjusting assembly comprises a fixing sleeve, and a nut is rotationally connected to the upper end of the fixing sleeve and can heat the exhaust pipe; the temperature of the inner wall of the preceding-stage pipeline is kept constant, the heating pipe is convenient to disassemble and assemble, later overhaul and maintenance are convenient, the supporting frame can be attached to the bottom of the sleeve shell, auxiliary supporting operation on the heating assembly is convenient to achieve, the stability of the heating assembly is convenient to keep, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the field related to semiconductor manufacturing, in particular to a semiconductor manufacturing device with a pipeline heating function. Background Art

[0002] Semiconductor manufacturing equipment is equipment used to manufacture semiconductors. It is primarily used to manufacture semiconductor components and devices such as transistors, diodes, and CMOS image sensors. 12 The specific components of a semiconductor manufacturing equipment include a stage, a bonding head, a profiling mechanism, and a controller. These components work together to manufacture semiconductor devices through a series of precise operations such as alignment, bonding, and etching.

[0003] The prior art utility model patent CN 208835029 U discloses a semiconductor manufacturing device with a pipe heating function. The device allows fluid to flow through a heat exchange tube onto the outer wall of a front-stage pipe, thereby transferring a predetermined temperature to the front-stage pipe. This maintains a constant temperature on the inner wall of the front-stage pipe, minimizes powder clogging on the inner wall of the front-stage pipe, and eliminates component failures and replacement costs associated with heating jackets.

[0004] However, it does not have the ability to conveniently disassemble and assemble the heating device. The heating device is installed as a whole on the outside of the front-stage tube. When a fault or damage is found, it is still inconvenient to disassemble and repair it, and the operation is relatively complicated. At the same time, it does not have the ability to assist in supporting and adjusting the heating component. The gravity of the heating component is applied to the pipeline, which can easily affect the stability. Therefore, we need to upgrade and transform the existing technology to overcome the existing problems and shortcomings. Utility Model Content

[0005] The purpose of the present invention is to provide a semiconductor manufacturing device with a pipeline heating function to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A semiconductor manufacturing device with a pipeline heating function is designed, including a device body, which contains a semiconductor manufacturing machine, a heating component and an adjustment component. An exhaust pipe is provided on one side of the semiconductor manufacturing machine, the heating component is sleeved on the outside of the exhaust pipe, and the adjustment component is provided at the lower end of the heating component.

[0008] Furthermore, the heating assembly includes an upper shell and a lower shell, and an inner groove is respectively opened in the upper shell and the lower shell. A connecting pipe is provided on the inner side of the inner groove and an external interface is provided at one end of the connecting pipe. A heating pipe is provided on the side of the connecting pipe.

[0009] Furthermore, the adjustment assembly includes a fixed sleeve, the upper end of the fixed sleeve is rotatably connected to a nut, a threaded rod is threaded through the nut, a connecting seat is fixed to the top of the threaded rod, and a support frame is fixed to the top of the connecting seat.

[0010] Furthermore, the upper shell and the lower shell are both configured as arc-shaped structures and are symmetrically sleeved on the outer wall of the exhaust pipe. Three groups of fixing holes are respectively opened on the sides of the upper shell and the lower shell, and fixing bolts are correspondingly connected in the fixing holes.

[0011] Furthermore, the connecting pipe is vertically arranged in the middle of the inner groove, the heating pipes are arranged in several groups and fixed at equal intervals on both sides of the connecting pipe, and the external interface penetrates to the outside of the inner groove.

[0012] Furthermore, the support frame is configured as an arc-shaped structure and is correspondingly fitted to the lower end of the heating component. The bottom of the fixed sleeve is provided with a lower base plate, and the lower base plate is provided with a plurality of mounting holes.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] 1. The utility model is provided with a heating component, an upper shell, a lower shell, an inner groove, a connecting pipe, an external interface, a heating pipe, a fixing hole and a fixing bolt in the device. The heating pipe is installed through the upper shell and the lower shell, and the two sets of shells are connected through the fixing holes and the fixing bolts. The exhaust pipe can be heated to keep the temperature of the inner wall of the front-stage pipe constant, which is convenient for disassembly and assembly of the heating pipe and later inspection and maintenance, thereby improving the practicality of the device.

[0015] 2. The utility model is equipped with an adjustment component, a fixed sleeve, a nut, a threaded rod, a connecting seat, a support frame, a lower base plate and a mounting hole in the device. The threaded rod is controlled to rise and fall by the nut and the fixed sleeve, and the support frame is driven to rise and fall by the threaded rod and the connecting seat. The support frame can be attached to the bottom of the casing, which is convenient for auxiliary support operation of the heating component, easy to maintain the stability of the heating component, and prevent it from applying gravity to the pipeline.

[0016] With reference to the following description and accompanying drawings, specific embodiments of the present invention are disclosed in detail, indicating how the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope thereby. The embodiments of the present invention include numerous variations, modifications, and equivalents within the spirit and scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 This is a schematic diagram of the overall structure of a semiconductor manufacturing device with a pipeline heating function according to the present invention;

[0019] Figure 2 This is a partial structural diagram of a semiconductor manufacturing device with a pipeline heating function according to the present invention;

[0020] Figure 3 This is an exploded view of a heating assembly of a semiconductor manufacturing device with a pipeline heating function according to the utility model;

[0021] Figure 4 The present invention is an exploded view of an adjustment component of a semiconductor manufacturing device with a pipeline heating function.

[0022] In the figure: 1. Device body; 2. Semiconductor manufacturing machine; 3. Exhaust pipe; 4. Heating component; 41. Upper shell; 42. Lower shell; 43. Inner groove; 44. Connecting pipe; 45. External interface; 46. Heating pipe; 47. Fixing hole; 48. Fixing bolt; 5. Adjusting component; 51. Fixing sleeve; 52. Nut; 53. Threaded rod; 54. Connecting seat; 55. Support frame; 56. Lower base plate; 57. Mounting hole. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0024] like Figure 1 -4, this embodiment provides a semiconductor manufacturing device with a pipe heating function, including a device body 1, which contains a semiconductor manufacturing machine 2, a heating component 4 and an adjustment component 5. An exhaust pipe 3 is provided on one side of the semiconductor manufacturing machine 2, the heating component 4 is arranged on the outside of the exhaust pipe 3, and the adjustment component 5 is arranged at the lower end of the heating component 4.

[0025] Preferably, the heating assembly 4 includes an upper shell 41 and a lower shell 42, and an inner groove 43 is respectively opened in the upper shell 41 and the lower shell 42, a connecting pipe 44 is provided on the inner side of the inner groove 43, and an external interface 45 is provided at one end of the connecting pipe 44, and a heating pipe 46 is provided on the side of the connecting pipe 44. The upper shell 41 and the lower shell 42 are both configured as an arc structure and are symmetrically sleeved on the outer wall of the exhaust pipe 3. Three groups of fixing holes 47 are respectively opened on the side of the upper shell 41 and the lower shell 42, and fixing bolts 48 are correspondingly connected in the fixing holes 47. The connecting pipe 44 is vertically arranged in the middle of the inner groove 43, and the heating pipe 46 is provided in several groups and fixed at equal intervals on both sides of the connecting pipe 44, and the external interface 45 passes through the outside of the inner groove 43;

[0026] The two sets of connecting pipes 44 and the heating pipe 46 are respectively installed in the upper shell 41 and the lower shell 42 through the inner groove 43. The heating pipe 46 is sleeved on the outside of the exhaust pipe 3 through the upper shell 41 and the lower shell 42. The two sets of shells are fixedly connected through the fixing holes 47 and the fixing bolts 48. This can achieve heating of the exhaust pipe 3, keep the temperature of the inner wall of the front-stage pipe constant, and minimize the blockage of powder on the inner wall of the front-stage pipe, making it easy to disassemble and assemble the heating pipe 46, and to inspect and maintain it, thereby improving the practicality of the device.

[0027] Preferably, the adjustment assembly 5 includes a fixed sleeve 51, the upper end of the fixed sleeve 51 is rotatably connected to a nut 52, a threaded rod 53 is threaded through the nut 52, a connecting seat 54 is fixed to the top of the threaded rod 53, and a support frame 55 is fixed to the top of the connecting seat 54. The support frame 55 is configured as an arc structure and is correspondingly fitted to the lower end of the heating assembly 4. A lower base plate 56 is provided at the bottom of the fixed sleeve 51, and a plurality of mounting holes 57 are opened on the lower base plate 56;

[0028] By rotating the nut 52, the threaded rod 53 is driven to rise and fall on the fixed sleeve 51, and the threaded rod 53 drives the upper end connecting seat 54 and the support frame 55 to rise and fall. The support frame 55 is fitted with the bottom of the heating component 4, which can support the bottom of the heating component 4. The support height can be adjusted according to the position of the exhaust pipe 3. It has strong applicability, is convenient for maintaining the installation and working stability of the heating component 4, and improves the stability of the device.

[0029] The principle and process of use of the present invention are as follows: when in use, the upper shell 41 and the lower shell 42 can be correspondingly sleeved on the outside of the exhaust pipe 3, and the upper shell 41 and the lower shell 42 can be connected and fixed through the fixing hole 47 and the fixing bolt 48, and the connecting pipe 44 and the heating pipe 46 can be connected to the external power supply through the external interface 45. The outside of the exhaust pipe 3 can be evenly heated through the heating pipe 46, so that the temperature of the inner wall of the front-stage pipe is kept constant and the situation of powder clogging on the inner wall of the front-stage pipe is minimized. When the heating pipe 46 needs to be repaired and maintained When protecting, just remove the fixing bolt 48 and open the shell. The operation is simple and convenient. During use, the fixing sleeve 51 is installed at the lower end of the heating component 4 through the lower base plate 56 and the mounting hole 57. The height position of the threaded rod 53 is adjusted by the nut 52. The upper end connecting seat 54 and the support frame 55 are driven to rise and fall by the threaded rod 53. The support frame 55 is fitted with the bottom of the heating component 4 to support the bottom of the heating component 4, which is convenient for maintaining the installation and working stability of the heating component 4. The opposite operation can be performed when disassembling.

[0030] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0031] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

Claims

1. A semiconductor manufacturing device with a pipeline heating function, characterized in that: The invention comprises a device body (1), wherein the device body (1) contains a semiconductor manufacturing machine (2), a heating component (4) and an adjustment component (5); an exhaust pipe (3) is provided on one side of the semiconductor manufacturing machine (2); the heating component (4) is sleeved on the outside of the exhaust pipe (3); and the adjustment component (5) is provided at the lower end of the heating component (4).

2. The semiconductor manufacturing device with pipeline heating function according to claim 1, characterized in that: The heating assembly (4) comprises an upper shell (41) and a lower shell (42), wherein an inner groove (43) is respectively provided in the upper shell (41) and the lower shell (42), a connecting pipe (44) is provided inside the inner groove (43), and an external interface (45) is provided at one end of the connecting pipe (44), and a heating pipe (46) is provided on the side of the connecting pipe (44).

3. The semiconductor manufacturing device with pipeline heating function according to claim 1, characterized in that: The adjustment assembly (5) comprises a fixed sleeve (51), the upper end of the fixed sleeve (51) is rotatably connected to a nut (52), a threaded rod (53) is threadedly passed through the nut (52), a connecting seat (54) is fixed to the top of the threaded rod (53), and a supporting frame (55) is fixed to the top of the connecting seat (54).

4. The semiconductor manufacturing device with pipeline heating function according to claim 2, characterized in that: The upper shell (41) and the lower shell (42) are both configured as arc-shaped structures and are symmetrically sleeved on the outer wall of the exhaust pipe (3). Three groups of fixing holes (47) are respectively opened on the side surfaces of the upper shell (41) and the lower shell (42), and fixing bolts (48) are correspondingly connected in the fixing holes (47).

5. The semiconductor manufacturing device with pipeline heating function according to claim 2, characterized in that: The connecting pipe (44) is vertically arranged in the middle of the inner groove (43), the heating pipes (46) are arranged in a plurality of groups and fixed at equal intervals on both sides of the connecting pipe (44), and the external interface (45) penetrates to the outside of the inner groove (43).

6. The semiconductor manufacturing device with pipeline heating function according to claim 3, characterized in that: The support frame (55) is configured as an arc-shaped structure and is correspondingly fitted to the lower end of the heating component (4). A lower base plate (56) is provided at the bottom of the fixed sleeve (51), and a plurality of mounting holes (57) are provided on the lower base plate (56).

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