Bearing device and production equipment
By designing a bearing device with support structure and limit structure, the problem of decreasing limit effect of the load-bearing structure is solved, and the stable load bearing of the silicon wafer is achieved and the production efficiency is improved.
Patent Information
- Application Number
- CN202422555588.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-22
AI Technical Summary
During semiconductor production, the reduction in the limit effect of the load-bearing structure causes the silicon wafer to shake, affecting the load-bearing of the silicon wafer and subsequent production and manufacturing processes.
A load bearing device is designed, including a support structure and a removable limit structure. The support structure provides stable support through the load groove and the support groove. The limit structure limits the position of the silicon wafer through the limit groove to ensure the stability of the silicon wafer in the load bearing device.
It improves the position stability of the silicon wafer in the carrier device, reduces the probability of silicon wafer shaking, avoids damage and mutual influence of silicon wafers, and improves production efficiency.
Smart Images
Figure CN223273233U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of semiconductor production equipment, and in particular to a carrier device and production equipment. Background Art
[0002] With the development of society, semiconductor devices play a core role in modern electronic technology and information technology. As the basic material for manufacturing most semiconductor devices and integrated circuits, the production and manufacturing of silicon wafers is particularly important.
[0003] In the actual production process, large quantities of silicon wafers are usually supported by a specific supporting structure. However, with the long-term use of the supporting structure, the limiting effect of the supporting structure on the silicon wafers gradually decreases, and the silicon wafers are prone to shaking in the supporting structure, which has a certain impact on the support of the silicon wafers and the subsequent production and manufacturing process. Utility Model Content
[0004] The carrying device provided in the embodiment of the present application can improve the position stability of the component to be carried in the carrying device and reduce the probability of the component to be carried shaking in the carrying device.
[0005] In a first aspect, an embodiment of the present application provides a carrying device, comprising:
[0006] A support structure having an accommodating space and a bearing surface, wherein the accommodating space includes a bearing groove formed by the bearing surface being recessed along a first direction and a plurality of first supporting grooves, wherein the plurality of first supporting grooves are connected and arranged on both sides of the bearing groove along a second direction, and a dimension of the first supporting groove in a third direction is smaller than a dimension of the bearing groove in the third direction, and the first direction, the second direction, and the third direction intersect with each other;
[0007] a limiting structure located in the accommodating space, the limiting structure comprising a first surface and a second surface opposite to each other, the first surface being detachably connected to the supporting structure, and the second surface being inwardly recessed to form a limiting groove;
[0008] The dimension of the limiting groove in the third direction does not exceed the dimension of the first supporting groove in the third direction, and the projection of the limiting groove in the first direction is flush with the projection of the first supporting groove in the first direction in the third direction.
[0009] In some embodiments, a first connecting portion is provided on the supporting structure, and a second connecting portion connected to and cooperating with the first connecting portion is provided on the limiting structure. The first connecting portion and the second connecting portion connect the limiting structure and the supporting structure at least in the third direction.
[0010] In some embodiments, the first connecting portion is configured as two side walls of the supporting structure along the third direction, and the second connecting portion is configured as a connecting groove, wherein the connecting groove is formed by the limiting structure being recessed inwardly on one side of the first surface, and the supporting structure is clamped between the side walls of the connecting groove in the third direction;
[0011] The bottom wall of the connecting groove is connected to the bottom wall of the bearing groove, and the limiting groove is recessed inwardly along the first direction from the second surface.
[0012] In some embodiments, the support structure has a first through hole penetrating the bottom wall of the supporting groove along the first direction, and the projection of the first through hole in the first direction and the projection of the first supporting groove in the first direction at least partially overlap in the third direction.
[0013] In some embodiments, the first through hole forms the first connecting portion, and the second connecting portion is configured as a convex portion, and the convex portion is protruded from the first surface by the limiting structure, and the convex portion is clamped between the two side walls of the first through hole along the third direction, and the side of the convex portion away from the first surface does not exceed the side of the support structure away from the bearing surface.
[0014] In some embodiments, a second through hole is provided through the protrusion along the first direction, and a projection of the second through hole in the first direction and a projection of the first supporting groove in the first direction at least partially overlap in the third direction.
[0015] In some embodiments, a protective structure is further included, which includes two protective parts spaced apart along the second direction, the two protective parts are connected to the bearing surface of the support structure, and the two protective structures form a protective cavity in the first direction, and the protective cavity is connected to the bearing groove and the first support groove.
[0016] In some embodiments, the sides of the two protection parts facing each other along the second direction are both recessed inward to form a second support groove, and the second support groove is connected to the protection cavity;
[0017] The dimension of the second supporting groove in the third direction is not smaller than the dimension of the limiting groove in the third direction, and the projection of the second supporting groove in the first direction is flush with the projection of the first supporting groove in the first direction in the third direction.
[0018] In some embodiments, the limiting structure includes two limiting parts fixedly connected to each other, the two limiting parts extend parallel to the third direction and are spaced apart in the second direction, and the limiting groove is provided on both of the limiting parts.
[0019] In a second aspect, an embodiment of the present application provides a production device, including the aforementioned carrying device, wherein the carrying device is used to carry a silicon wafer;
[0020] The silicon wafer abuts against the bottom wall of the first supporting groove in the first direction and is spaced apart from the bottom wall of the limiting groove.
[0021] The load-bearing device provided by the present application includes a support structure and a limiting structure detachably connected to the support structure. The support structure is primarily used to support a load-bearing member and to limit the position of the load-bearing member on the load-bearing device. The support groove is configured to allow the load-bearing member to avoid displacement in the first direction, allowing at least a portion of the load-bearing member to be positioned within the support groove, thereby improving the support stability of the support structure for the load-bearing member. Simultaneously, the load-bearing member is positioned within the first support groove, supported by the first support groove in the first direction. The dimensions of the support groove in the third direction are configured to be larger than the dimensions of the first support groove in the third direction, thereby preventing interference between the support groove and the sidewalls of the first support groove and reducing the probability of the load-bearing member being affected during placement into the load-bearing device. The limiting structure is configured to limit the position of the load-bearing member within the first support groove along the third direction. The dimensional relationship between the limiting groove and the first support groove in the third direction can reduce the impact on the load-bearing member caused by misalignment between the limiting groove and the first support groove, thereby improving the positional stability of the load-bearing member within the first support groove. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.
[0023] Figure 1 A schematic diagram of the overall structure of a carrying device provided in some embodiments of the present application;
[0024] Figure 2 A schematic structural diagram of a support structure and a protective structure in a load-bearing device provided in some embodiments of the present application;
[0025] Figure 3 A schematic structural diagram of a limiting structure in a carrying device provided in some embodiments of the present application;
[0026] Figure 4 A schematic structural diagram of a bearing device provided in some embodiments of the present application, showing a limit groove and a first support groove;
[0027] Figure 5 A schematic structural diagram of a support structure and a protective structure in a load-bearing device provided in some embodiments of the present application;
[0028] Figure 6 A schematic structural diagram of a limiting structure in a carrying device provided in some embodiments of the present application;
[0029] Figure 7 A schematic structural diagram of a limiting structure in a carrying device provided in some embodiments of the present application;
[0030] Figure 8 A schematic structural diagram of a limiting structure in a carrying device provided in some embodiments of the present application.
[0031] Marking Description:
[0032] 10. Support structure; 11. Bearing surface; 12. Accommodation space; 121. Bearing groove; 122. First supporting groove; 13. First connecting portion; 131. First through hole;
[0033] 20. Limiting structure; 21. First surface; 22. Second surface; 221. Limiting groove; 23. Second connecting portion; 231. Connecting groove; 232. Protrusion; 2321. Second through hole; 24. Limiting portion;
[0034] 30. Protective structure; 31. Protective portion; 311. Second supporting groove; 32. Protective cavity;
[0035] X, first direction; Y, second direction; Z, third direction.
[0036] In the drawings, like parts are given like reference numerals, but the drawings are not necessarily drawn to scale. DETAILED DESCRIPTION
[0037] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.
[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.
[0039] With the development of society, semiconductor devices play a core role in modern electronic technology and information technology. As the basic material for manufacturing most semiconductor devices and integrated circuits, the production and manufacturing of silicon wafers is particularly important.
[0040] In the actual production process, large quantities of silicon wafers are usually supported by a specific supporting structure. However, with the long-term use of the supporting structure, the limiting effect of the supporting structure on the silicon wafers gradually decreases, and the silicon wafers are prone to shaking in the supporting structure. On the one hand, they may come into contact with the side walls of the supporting structure and cause damage to the silicon wafers. On the other hand, when the supporting structure supports multiple silicon wafers, the multiple silicon wafers are prone to affect each other, which has a certain impact on the support of the silicon wafers and the subsequent production and manufacturing process.
[0041] In view of this, first of all, please refer to Figures 1 to 4 , an embodiment of the present application provides a bearing device. The bearing device includes a support structure 10 and a limiting structure 20. The support structure 10 has a accommodating space 12 and a bearing surface 11. The accommodating space 12 includes a bearing groove 121 formed by the bearing surface 11 being recessed along a first direction X and a plurality of first supporting grooves 122. The plurality of first supporting grooves 122 are connected and arranged on both sides of the bearing groove 121 along a second direction Y. The size of the first supporting groove 122 in the third direction Z is smaller than the size of the bearing groove 121 in the third direction Z. The first direction X, the second direction Y, and the third direction Z intersect with each other. The limiting structure 20 is located inside the accommodating space 12. The limiting structure 20 includes a first surface 21 and a second surface 22 arranged opposite to each other. The first surface 21 is detachably connected to the support structure 10, and the second surface 22 is recessed inward to form a limiting groove 221. The size of the limiting groove 221 in the third direction Z does not exceed the size of the first supporting groove 122 in the third direction Z, and the projection of the limiting groove 221 in the first direction X is flush with the projection of the first supporting groove 122 in the first direction X in the third direction Z.
[0042] The supporting device provided in the embodiments of the present application is used to support a component to be supported. The component to be supported is primarily a sheet-like structure. For example, the component to be supported may be a silicon wafer, or alternatively, a metal sheet. The supporting device provided in the embodiments of the present application can improve the positional stability of the component to be supported within the supporting device and reduce the probability of the component to be supported shaking within the supporting device.
[0043] Specifically, the load-bearing device includes a support structure 10 and a limiting structure 20 detachably connected to the support structure 10. The support structure 10 primarily supports the load-bearing component and limits its position on the load-bearing device. The limiting structure 20 is detachably connected to the support structure 10, making it easy to remove and replace the limiting structure 20.
[0044] In actual use, due to the detachable connection between the limiting structure 20 and the support structure 10, the support structure 10 can be manufactured using a more expensive material, while the limiting structure 20 can be manufactured using a less expensive material. The support structure 10 provides stable support for the supported component. When the limiting effect of the limiting structure 20 decreases, the limiting structure 20 can be replaced. This reduces costs and restores the good support effect for the supported component.
[0045] Taking the silicon wafer as an example, in actual application, the silicon wafer is supported by a support structure 10 made of silicon carbide and limited by a limiting structure 20 made of quartz, and the two cooperate with each other to achieve good support for the silicon wafer. At the same time, if the silicon wafer is subjected to a certain process and the silicon wafer and the supporting device need to be heated, the support structure 10 and the limiting structure 20 need to be produced using materials with the same or similar thermal expansion coefficients to ensure a good positional coordination relationship between the support structure 10 and the limiting structure 20. For ease of description, in this application, the supported component is taken as an example of a silicon wafer.
[0046] The support structure 10 is provided with a cavity for accommodating a silicon wafer. The cavity includes a loading groove 121 and a first supporting groove 122 formed by a recess in the loading surface 11 along a first direction X. The first supporting groove 122 and the loading groove 121 are interconnected in a second direction Y. The loading surface 11 is the side of the support structure 10 that faces the silicon wafer. The loading groove 121 can avoid the silicon wafer in the first direction X, allowing at least a portion of the silicon wafer to be located within the loading groove 121, thereby improving the support structure 10's support stability for the silicon wafer. At the same time, the silicon wafer is located within the first supporting groove 122, and the first supporting groove 122 supports the silicon wafer in the first direction X. The dimension of the loading groove 121 in the third direction Z is larger than the dimension of the first supporting groove 122 in the third direction Z. This facilitates the loading of the silicon wafer and prevents interference between the sidewalls of the loading groove 121 and the first supporting groove 122, which would affect the silicon wafer during placement into the support device.
[0047] The limiting structure 20 is located in the accommodation space 12 to limit the position of the silicon wafer. The limiting structure 20 includes a first surface 21 and a second surface 22 arranged opposite each other. The first surface 21 is the surface that contacts the support structure 10 when the limiting structure 20 is connected to the support structure 10, and the second surface 22 is the surface facing away from the support structure 10 when the limiting structure 20 is connected to the support structure 10. The second surface 22 is recessed to form a limiting groove 221. The positioning of the limiting structure 20 within the accommodation space 12 enables the limiting groove 221 to form a good fit with the first supporting groove 122 within the accommodation space 12, thereby achieving the function of supporting and limiting the silicon wafer.
[0048] Specifically, the limiting structure 20 is used to limit the position of the silicon wafer within the first support groove 122 along the third direction Z. The size of the limiting groove 221 in the third direction Z does not exceed the size of the first support groove 122 in the third direction Z. The size of the limiting groove 221 in the third direction Z can be set to be smaller than the size of the first support groove 122 in the third direction Z, or the size of the limiting groove 221 in the third direction Z can be set to be equal to the size of the first support groove 122 in the third direction Z. At the same time, the projection of the limiting groove 221 in the first direction X is aligned with the projection of the first support groove 122 in the first direction X in the third direction Z. This can reduce the impact on the silicon wafer caused by the misalignment between the limiting groove 221 and the first support groove 122, thereby improving the positional stability of the silicon wafer within the first support groove 122.
[0049] In summary, in the embodiment of the present application, the carrying device includes a support structure 10 and a limiting structure 20 detachably connected to the support structure 10. The support structure 10 is mainly used to support the load-bearing member, and the support structure 10 is mainly used to limit the position of the load-bearing member on the carrying device. The setting of the load-bearing groove 121 can avoid the load-bearing member in the first direction X, so that at least part of the load-bearing member can be located inside the load-bearing groove 121, thereby improving the support stability of the support structure 10 for the load-bearing member. At the same time, the load-bearing member is located inside the first support groove 122, and the first support groove 122 supports the load-bearing member in the first direction X. The size of the load-bearing groove 121 in the third direction Z is set to be larger than the size of the first support groove 122 in the third direction Z, which can avoid interference between the load-bearing groove 121 and the sidewalls of the first support groove 122, thereby reducing the probability of the load-bearing member being affected during the placement of the load-bearing member into the carrying device. The limiting structure 20 is used to limit the position of the load-bearing member inside the first support groove 122 along the third direction Z. The dimensional relationship between the limiting groove 221 and the first supporting groove 122 in the third direction Z can reduce the impact on the supporting component caused by the misalignment between the limiting groove 221 and the first supporting groove 122, and improve the position stability of the supporting component inside the first supporting groove 122.
[0050] In one embodiment, see Figures 1 to 6 A first connecting portion 13 is provided on the supporting structure 10, and a second connecting portion 23 connected and coordinated with the first connecting portion 13 is provided on the limiting structure 20. The first connecting portion 13 and the second connecting portion 23 connect the limiting structure 20 and the supporting structure 10 at least in the third direction Z.
[0051] The detachable connection between the limiting structure 20 and the supporting structure 10 can be a snap connection or a threaded connection. In the embodiment of the present application, the limiting structure 20 and the supporting structure 10 are snap-connected.
[0052] In order to reduce the limiting effect of the connection method between the limiting structure 20 and the supporting structure 10 on the silicon wafer and improve the position stability between the limiting structure 20 and the supporting structure 10 in the third direction Z, the first connecting part 13 on the supporting structure 10 and the second connecting part 23 on the limiting structure 20 are connected and matched with each other, and the limiting structure 20 and the support structure 10 are limited at least in the third direction Z to ensure the relative position between the limiting groove 221 and the first connecting groove 231 in the third direction Z.
[0053] In order to improve the utilization rate of the carrying device, multiple first support grooves 122 are arranged at intervals along the third direction Z. At the same time, multiple limiting grooves 221 are also arranged at intervals along the third direction Z. The multiple first support grooves 122 correspond one to one with the multiple limiting grooves 221. Through the mutual correspondence between the limiting grooves 221 and the first support grooves 122, contact or adhesion between multiple silicon wafers can be avoided.
[0054] In one embodiment, to enhance the limiting effect of the limiting structure 20, the limiting structure 20 includes two mutually fixedly connected limiting portions 24. The two limiting portions 24 extend parallel to each other along the third direction Z and are spaced apart in the second direction Y. Both limiting portions 24 are provided with limiting grooves 221. The simultaneous provision of the two limiting portions 24 forms two rows of limiting grooves 221, thereby enhancing the limiting effect of the limiting grooves 221 within the limiting structure 20 itself.
[0055] When two limiting portions 24 are provided, the two limiting portions 24 are symmetrically arranged in the second direction Y to symmetrically limit the silicon wafer. Alternatively, in some embodiments, a single limiting portion 24 may be provided. When a single limiting portion 24 is provided, the limiting portion 24 is positioned in the middle of the support structure 10 along the second direction Y.
[0056] In one embodiment, the first connecting portion 13 is configured as two side walls of the supporting structure 10 along the third direction Z, and the second connecting portion 23 is configured as a connecting groove 231. The connecting groove 231 is formed by the limiting structure 20 being recessed inward on one side of the first surface 21, and the supporting structure 10 is clamped between the groove side walls of the connecting groove 231 in the third direction Z.
[0057] Based on the support structure 10, its two side walls along the third direction Z are directly used as the first connecting part 13, and a connecting groove 231 is formed on the limiting structure 20. The support structure 10 is clipped into the connecting groove 231. The above-mentioned connection and positioning method can simply and efficiently connect the limiting structure 20 with the support structure 10, which is convenient for technical personnel to operate.
[0058] In one embodiment, connecting the bottom wall of the connecting groove 231 to the bottom wall of the supporting groove 121 is equivalent to connecting the limiting structure 20 to the interior of the supporting groove 121, and the limiting groove 221 is recessed inward from the second surface 22 along the first direction X. The limiting groove 221 is disposed on a side of the first supporting groove 122 facing away from the silicon wafer along the first direction X, and the limiting groove 221 limits the silicon wafer from the bottom of the silicon wafer.
[0059] In one embodiment, the bottom wall of the connecting groove 231 is connected to the supporting surface 11, which is equivalent to connecting the limiting structure 20 to the outside of the supporting groove 121. The limiting groove 221 is recessed inward from the second surface 22 along the second direction Y. The limiting groove 221 is arranged on the side of the first supporting groove 122 away from the silicon wafer along the second direction Y. The limiting groove 221 limits the silicon wafer from the side of the silicon wafer.
[0060] In one embodiment, see Figures 5 to 8 The supporting structure 10 has a first through hole 131 penetrating the bottom wall of the supporting groove 121 along the first direction X, and the projection of the first through hole 131 in the first direction X and the projection of the first supporting groove 122 in the first direction X at least partially overlap in the third direction Z.
[0061] In actual use, after the carrier device has loaded the silicon wafer, subsequent operations on the silicon wafer are required, and during these operations, the silicon wafer needs to be heated. To facilitate air circulation within the carrier device, first through-holes 131 are provided on the support structure 10, allowing heat to circulate through the first through-holes 131. Furthermore, the projection of the first through-holes 131 in the first direction X and the projection of the first support grooves 122 in the first direction X are arranged to at least partially overlap in the third direction Z. This allows heat to pass through the first through-holes 131 and directly reach the silicon wafer at the first support grooves 122.
[0062] In one embodiment, the first through hole 131 forms the first connecting portion 13, and the second connecting portion 23 is configured as a protrusion 232. The protrusion 232 is provided by the retaining structure 20 to protrude from the first surface 21. The protrusion 232 is engaged between the upper side walls of the first through hole 131 along the third direction Z. The side of the protrusion 232 away from the first surface 21 does not extend beyond the side of the support structure 10 away from the bearing surface 11.
[0063] Based on the first through hole 131, the first through hole 131 can be used as the first connecting part 13, and a protrusion 232 is set on the limiting structure 20 as the second connecting part 23. The connection between the limiting structure 20 and the supporting structure 10 is realized by the snap connection between the protrusion 232 and the first through hole 131.
[0064] At the same time, the side of the protrusion 232 away from the first surface 21 can be flush with the side of the support structure 10 away from the bearing surface 11. The setting of the protrusion 232 can provide a certain support effect on the part of the limiting structure 20 spanning the first through hole 131, so as to improve the strength of the limiting structure 20.
[0065] Taking the example of a limiting structure 20 including two limiting portions 24, the two limiting portions 24 can be connected to a single protrusion 232, and the relative position of the limiting grooves 221 on the two limiting portions 24 can be ensured by the single protrusion 232. Alternatively, two protrusions 232 can be provided, each of which is connected to the two limiting portions 24, and the two limiting portions 24 can be connected by providing another connecting structure to ensure the relative position of the limiting grooves 221 on the two limiting portions 24.
[0066] When one protrusion 232 is provided, the protrusion 232 is engaged with the interior of the first through hole 131. To ensure heat flow, the protrusion 232 is provided with a second through hole 2321 extending along the first direction X. The projection of the second through hole 2321 in the first direction X and the projection of the first support groove 122 in the first direction X at least partially overlap in the third direction Z.
[0067] In one embodiment, see Figures 1 to 4 The carrying device also includes a protective structure 30, which includes two protective parts 31 spaced apart along the second direction Y. The two protective parts 31 are connected to the carrying surface 11 of the support structure 10. The two protective parts 31 form a protective cavity 32 in the first direction X. The protective cavity 32 is connected to the carrying groove 121 and the first support groove 122.
[0068] After the support structure 10 supports the silicon wafer, the protective structure 30 can provide a certain degree of protection for the silicon wafer along both sides of the silicon wafer in the second direction Y. When the silicon wafer is within the first support groove 122, part of the silicon wafer is within the protective cavity 32. The provision of the two protective portions 31 can reduce the probability of external objects damaging the silicon wafer in the second direction Y.
[0069] In one embodiment, the sides of the two protective portions 31 facing each other along the second direction Y are both recessed inward to form a second support groove 311, which is in communication with the protective cavity 32. The dimension of the second support groove 311 in the third direction Z is no less than the dimension of the limiting groove 221 in the third direction Z, and the projection of the second support groove 311 in the first direction X is flush with the projection of the first support groove 122 in the first direction X in the third direction Z.
[0070] The second support groove 311 cooperates with the first support groove 122 to improve the support mechanism's ability to support the silicon wafer. To minimize interference with the silicon wafer caused by the second support groove 311, the dimensions of the second support groove 311 in the third direction Z are set to be no less than the dimensions of the retaining groove 221 in the third direction Z. To ensure effective coordination between the second support groove 311 and the first support groove 122, the projection of the second support groove 311 in the first direction X is aligned with the projection of the first support groove 122 in the first direction X.
[0071] In a second aspect, embodiments of the present application provide a production device comprising the aforementioned carrying device, which is configured to carry a silicon wafer. The silicon wafer abuts the bottom wall of the first support groove 122 in the first direction X and is spaced apart from the bottom wall of the limiting groove 221. Optionally, the silicon wafer abuts the bottom wall of the second support groove 311 in the first direction X. The production device provided by embodiments of the present application possesses all the technical features and effects of the aforementioned carrying device, and will not be further elaborated herein.
[0072] While the present invention has been described with reference to preferred embodiments, various modifications may be made and equivalent components may be substituted without departing from the scope of the present invention. In particular, the various technical features described in the various embodiments may be combined in any manner, provided no structural conflicts exist. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.
Claims
1. A carrying device, characterized in that: include: A support structure having an accommodating space and a bearing surface, wherein the accommodating space includes a bearing groove formed by the bearing surface being recessed along a first direction and a plurality of first supporting grooves, wherein the plurality of first supporting grooves are connected and arranged on both sides of the bearing groove along a second direction, and a dimension of the first supporting groove in a third direction is smaller than a dimension of the bearing groove in the third direction, and the first direction, the second direction, and the third direction intersect with each other; a limiting structure located in the accommodating space, the limiting structure comprising a first surface and a second surface opposite to each other, the first surface being detachably connected to the supporting structure, and the second surface being inwardly recessed to form a limiting groove; The dimension of the limiting groove in the third direction does not exceed the dimension of the first supporting groove in the third direction, and the projection of the limiting groove in the first direction is flush with the projection of the first supporting groove in the first direction in the third direction.
2. The carrying device according to claim 1, characterized in that: The supporting structure is provided with a first connecting portion, and the limiting structure is provided with a second connecting portion connected and matched with the first connecting portion. The first connecting portion and the second connecting portion connect the limiting structure and the supporting structure at least in the third direction.
3. The carrying device according to claim 2, characterized in that: The first connecting portion is configured as two side walls of the supporting structure along the third direction, and the second connecting portion is configured as a connecting groove, the connecting groove being formed by the limiting structure being recessed inwardly on one side of the first surface, and the supporting structure being clamped between the side walls of the connecting groove in the third direction; The bottom wall of the connecting groove is connected to the bottom wall of the bearing groove, and the limiting groove is recessed inwardly from the second surface along the first direction.
4. The carrying device according to claim 2, characterized in that: The supporting structure has a first through hole penetrating the bottom wall of the bearing groove along the first direction, and a projection of the first through hole in the first direction and a projection of the first supporting groove in the first direction at least partially overlap in the third direction.
5. The carrying device according to claim 4, characterized in that: The first through hole forms the first connecting portion, and the second connecting portion is configured as a convex portion, and the convex portion is protruded from the first surface by the limiting structure, and the convex portion is clamped between the two side walls of the first through hole along the third direction, and the side of the convex portion away from the first surface does not exceed the side of the support structure away from the bearing surface.
6. The carrying device according to claim 5, characterized in that: A second through hole is formed through the convex portion along the first direction, and a projection of the second through hole in the first direction and a projection of the first supporting groove in the first direction at least partially overlap in the third direction.
7. The carrying device according to claim 1, characterized in that: It also includes a protective structure, which includes two protective parts spaced apart along the second direction, the two protective parts are connected to the bearing surface of the support structure, and the two protective structures form a protective cavity in the first direction, and the protective cavity is connected to the bearing groove and the first support groove.
8. The carrying device according to claim 7, characterized in that: Side surfaces of the two protection parts facing each other along the second direction are both recessed inward to form a second support groove, and the second support groove is communicated with the protection cavity; The dimension of the second supporting groove in the third direction is not smaller than the dimension of the limiting groove in the third direction, and the projection of the second supporting groove in the first direction is flush with the projection of the first supporting groove in the first direction in the third direction.
9. The carrying device according to claim 1, characterized in that: The limiting structure includes two limiting parts fixedly connected to each other, the two limiting parts extend in parallel along the third direction and are spaced apart in the second direction, and the limiting grooves are both provided on the two limiting parts.
10. A production equipment, characterized in that, The carrier device comprises the carrier device according to any one of claims 1 to 9, wherein the carrier device is used to carry a silicon wafer; The silicon wafer abuts against the bottom wall of the first supporting groove in the first direction and is spaced apart from the bottom wall of the limiting groove.