Material frame lifting mechanism and semiconductor processing equipment

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to a material frame lifting mechanism and semiconductor processing equipment, and the material frame lifting mechanism comprises a bearing plate; each clamping set comprises two oppositely-arranged clamping modules, each clamping module comprises a fixing block and a clamping strip, the fixing blocks are arranged on the bottom face of the bearing plate, one end of each clamping strip is connected with the corresponding fixing block, and the other end of each clamping strip extends to the position above the top face of the bearing plate. The bearing plate is provided with a first side and a second side which are arranged in the width direction of the bearing plate, for each clamping set, the two clamping strips are located on the first side and the second side correspondingly, and the distance between the two oppositely-arranged clamping strips is adjustable; the driving assembly is connected with the connecting plate, the bearing plate is arranged on the connecting plate, and the driving assembly is used for driving the connecting plate to move in the thickness direction of the bearing plate. The material frame lifting mechanism is at least beneficial to improving the structural stability of the material frame lifting mechanism.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing equipment, and in particular relates to a material frame lifting mechanism and semiconductor processing equipment. Background Art

[0002] A wafer is a chip used to make silicon semiconductor circuits. The starting material can be silicon. The main wafer processing methods are sheet processing and batch processing, which involves processing a single wafer or multiple wafers simultaneously.

[0003] In the case of mass production of wafers, the wafers need to be moved multiple times. If it relies entirely on manual labor, on the one hand, it is time-consuming, labor-intensive and inefficient; on the other hand, manual operation also has a certain error rate. Now, a more automated mechanical handling method is usually adopted, and some wafer material frames provided by the existing technology have complex structures and poor stability. Utility Model Content

[0004] In view of this, the present invention aims to provide a material frame lifting mechanism and semiconductor processing equipment, which are at least beneficial to improving the structural stability of the material frame lifting mechanism.

[0005] In order to achieve the above-mentioned purpose, the technical solution of the utility model is achieved as follows:

[0006] On the one hand, the utility model provides a material frame lifting mechanism, comprising: a carrying plate, the carrying plate having a relative top surface and a bottom surface, the top surface being used to carry the material frame; two clamping groups arranged at intervals along the length direction of the carrying plate, each clamping group comprising two relatively arranged clamping modules, the clamping module comprising a fixed block and a snap strip, the fixed block being arranged on the bottom surface of the carrying plate, one end of the snap strip being connected to the fixed block, and the other end of the snap strip extending to above the top surface of the carrying plate, the carrying plate having a first side and a second side arranged along the width direction of the carrying plate, for each clamping group, the two snap strips being respectively located on the first side and the second side, and the distance between the two relatively arranged snap strips is adjustable, and the snap strip is used to clamp and fix the material frame; a driving assembly and a connecting plate, the driving assembly and the connecting plate being connected, the carrying plate being arranged on the connecting plate, and the driving assembly being used to drive the connecting plate to move along the thickness direction of the carrying plate.

[0007] Furthermore, the fixed block has a limiting hole that passes through the fixed block along the width direction of the supporting plate; one end of the locking strip has a connecting piece extending along the width direction of the supporting plate, the connecting piece is arranged in the limiting hole, and the connecting piece is movable relative to the fixed block along the width direction of the supporting plate; the clamping module also includes a cylinder, the cylinder is fixed to the bottom surface of the supporting plate, the free end of the cylinder is fixed to the locking strip, and the cylinder is used to drive the locking strip to move along the width direction of the supporting plate, thereby adjusting the distance between the two relatively arranged locking strips.

[0008] Furthermore, the fixing block includes a main body and an extension part, the main body is fixed to the bottom surface of the supporting plate, the extension part is fixed to the surface of the main body away from the supporting plate, and the limiting hole passes through the extension part along the width direction of the supporting plate.

[0009] Furthermore, the connecting plate has a first surface and a second surface opposite to each other, the first surface is connected to the driving assembly, the supporting plate is fixed on the second surface, and the side surface of the supporting plate is opposite to the second surface.

[0010] Furthermore, the material frame lifting mechanism also includes at least two trapezoidal reinforcement plates, which are arranged at intervals along the length direction of the supporting plate, and the two trapezoidal reinforcement plates are arranged parallel to the angle area formed by the supporting plate and the connecting plate. One side surface of the trapezoidal reinforcement plate is fixed to the bottom surface of the supporting plate, and the other side surface of the trapezoidal reinforcement plate is fixed to the second surface.

[0011] Furthermore, the top surface of the carrying plate has a groove, and the outer surface of the material frame has a protrusion. When the material frame is set on the carrying plate, the protrusion cooperates with the groove to limit the material frame on the carrying plate.

[0012] Furthermore, the material frame lifting mechanism also includes a mounting plate, a slider and a guide rail. The mounting plate has a mounting surface, and the side of the driving component away from the connecting plate is fixed to the mounting surface; the side of the connecting plate away from the supporting plate is fixed to the slider, and the slider is arranged on the guide rail, and the slider is movable along the thickness of the supporting plate relative to the guide rail, and the side of the guide rail away from the slider is fixed to the mounting surface.

[0013] Furthermore, the material frame lifting mechanism also includes: a second mounting plate, and a side of the mounting plate away from the connecting plate is arranged on the second mounting plate.

[0014] On the other hand, the present invention further provides a semiconductor processing device, which includes: the above-mentioned material frame lifting mechanism.

[0015] Compared with the prior art, the present invention can achieve the following beneficial effects: when the material frame is placed on the top surface of the supporting plate, the material frame is clamped and fixed by adjusting the distance between the two sets of relatively arranged snap bars. In this way, when the driving assembly drives the material frame to move, the material frame is fixed more stably, which is beneficial to ensuring the operating stability of the material frame lifting mechanism. Moreover, while simplifying the structure of the material frame lifting mechanism, the overall rigidity is improved, which is beneficial to reducing assembly costs and improving maintenance convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0017] Figure 1 This is a structural diagram of a material frame lifting mechanism according to an embodiment of the present utility model;

[0018] Figure 2 This is a structural schematic diagram of a material frame lifting mechanism carrying a material frame according to an embodiment of the present utility model;

[0019] Figure 3 This is a schematic structural diagram of the load-bearing plate, cylinder, and clamping group according to an embodiment of the present utility model;

[0020] Figure 4 This is a structural schematic diagram of another material frame lifting mechanism described in an embodiment of the present utility model.

[0021] Explanation of the accompanying drawings: 10, supporting plate; 101, top surface; 102, bottom surface; 11, groove; Y, length direction; 30, clamping module; 31, fixing block; 32, snap bar; X, width direction; 40, driving assembly; 50, connecting plate; 322, connecting piece; 90, cylinder; 91, free end; 311, main body; 312, extension portion; 52, first surface; 51, second surface; 103, trapezoidal reinforcement plate; 80, mounting plate; 60, slider; 70, guide rail; 81, second mounting plate; 61, connecting block; 20, material frame. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention.

[0023] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0025] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0026] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0027] refer to Figures 1 to 4, On the one hand, the utility model provides a material frame lifting mechanism, comprising: a carrier plate 10, the carrier plate 10 has a relative top surface 101 and a bottom surface 102, the top surface 101 is used to carry the material frame 20, the material frame 20 is a material frame 20 for carrying wafers, usually a material frame 20 has a plurality of slots, each slot can hold a wafer, and a material frame 20 can hold multiple wafers; two clamping groups are arranged at intervals along the length direction Y of the carrier plate 10, each clamping group includes two clamping modules 30 arranged oppositely, the clamping module 30 includes a fixing block 31 and a locking strip 32, the fixing block 31 is arranged on the bottom surface 102 of the carrier plate 10, one end of the locking strip 32 is connected to the fixing block 31, and the other end of the locking strip 32 extends above the top surface 101 of the carrier plate 10, the carrier plate 1 0 has a first side and a second side arranged along the width direction X of the carrying plate 10. For each clamping group, two snap bars 32 are respectively located on the first side and the second side, and the distance between the two oppositely arranged snap bars 32 is adjustable. The snap bars 32 are used to clamp and fix the material frame 20. Specifically, when the material frame 20 is placed on the carrying plate 10, the four snap bars 32 of the two clamping groups are located around the material frame 20, and the distance between the two opposite snap bars 32 in each group is reduced. The four snap bars 32 stably fix the material frame 20 on the top surface 101 of the carrying plate 10; the driving assembly 40 and the connecting plate 50, the driving assembly 40 and the connecting plate 50 are connected, the carrying plate 10 is arranged on the connecting plate 50, and the driving assembly 40 is used to drive the connecting plate 50 to move along the thickness direction of the carrying plate 10.

[0028] The driving assembly 40 is driven by a servo motor to drive the carrying plate 10 to move, thereby driving the material frame 20 to rise, fall or move.

[0029] For further reference, Figure 3 The fixing block 31 has a limiting hole that passes through the fixing block 31 along the width direction X of the carrier plate 10; one end of the locking bar 32 has a connecting piece 322 that extends along the width direction X of the carrier plate 10. The connecting piece 322 is disposed in the limiting hole and is movable relative to the fixing block 31 along the width direction X of the carrier plate 10; the clamping module 30 also includes a cylinder 90. The cylinder 90 is fixed to the bottom surface 102 of the carrier plate 10, and the free end 91 of the cylinder 90 is fixed to the locking bar 32. The cylinder 90 is used to drive the locking bar 32 to move along the width direction X of the carrier plate 10, thereby adjusting the distance between the two oppositely arranged locking bars 32. The locking bar 32 is driven by the cylinder 90, thereby adjusting the distance between the two oppositely arranged locking bars 32, and the connecting piece 322 slides in the limiting hole. The limiting hole limits the movement direction of the locking bar 32, which is conducive to improving the stability of the movement of the locking bar 32, thereby facilitating stable clamping of the material frame 20.

[0030] Furthermore, the fixing block 31 includes a main body 311 and an extension 312. The main body 311 is fixed to the bottom surface 102 of the supporting plate 10, and the extension 312 is fixed to the surface of the main body 311 away from the supporting plate 10. The limiting hole passes through the extension 312 along the width direction X of the supporting plate 10.

[0031] In some embodiments of the present invention, the locking strip has a bent portion bent toward the material frame 20 . The bent portion cooperates with the side surface of the material frame 20 , so that the material frame 20 can be more stably placed on the supporting plate.

[0032] Furthermore, the connecting plate 50 has a first surface 52 and a second surface 51 opposite to each other. The first surface 52 is connected to the driving assembly 40 . The supporting plate 10 is fixed on the second surface 51 , and the side surface of the supporting plate 10 faces the second surface 51 .

[0033] In some embodiments of the present invention, the thickness direction of the supporting plate 10 is the vertical direction, and the driving assembly 40 drives the connecting plate 50 , thereby driving the supporting plate 10 to move up and down in the vertical direction.

[0034] Furthermore, the material frame lifting mechanism includes at least two trapezoidal reinforcement plates 103, which are spaced apart along the length direction Y of the carrier plate 10 and arranged parallel to the angle formed by the carrier plate 10 and the connecting plate 50. One side of the trapezoidal reinforcement plate 103 is fixed to the bottom surface 102 of the carrier plate 10, and the other side of the trapezoidal reinforcement plate 103 is fixed to the second surface 51. In other words, the carrier plate 10 is connected to the connecting plate 50 via the trapezoidal reinforcement plates 103, and the arrangement of the trapezoidal reinforcement plates 103 provides a certain amount of support for the carrier plate 10 at the bottom surface 102 of the carrier plate 10, which helps to improve the structural stability of the carrier plate 10.

[0035] Furthermore, the top surface 101 of the carrier plate 10 has a groove 11, and the outer surface of the material frame 20 has a protrusion. When the material frame 20 is placed on the carrier plate 10, the protrusion cooperates with the groove 11 to retain the material frame 20 on the carrier plate 10. The cooperation between the groove 11 and the protrusion helps further improve the stability of the material frame 20 when it is fixed to the carrier plate 10.

[0036] Furthermore, the material frame lifting mechanism also includes a mounting plate 80, a slider 60 and a guide rail 70. The mounting plate 80 has a mounting surface, and the side of the drive component 40 away from the connecting plate 50 is fixed to the mounting surface; the side of the connecting plate 50 away from the supporting plate 10 is fixed to the slider 60, and the slider 60 is arranged on the guide rail 70, and the slider 60 is movable relative to the guide rail 70 along the thickness of the supporting plate 10, and the side of the guide rail 70 away from the slider 60 is fixed to the mounting surface.

[0037] In some embodiments of the present invention, a side of the connecting plate 50 away from the carrying plate 10 is fixedly connected to the slider 60 via a connecting block 61 .

[0038] In some embodiments of the present invention, the material frame lifting mechanism further includes: a second mounting plate 81, on which the side of the mounting plate 80 away from the connecting plate 50 is arranged, and the second mounting plate 81 is used to fix the material frame lifting mechanism in the desired installation position.

[0039] The material frame lifting mechanism provided by the present invention places the material frame 20 on the top surface 101 of the carrier plate 10, and adjusts the distance between the two pairs of oppositely arranged snap bars 32 through the cylinder, and uses the snap bars 32 to clamp and fix the material frame 20. In this way, when the driving component drives the material frame 20 to move, the material frame 20 is fixed more stably, which is conducive to ensuring the operational stability of the material frame lifting mechanism.

[0040] On the other hand, the present invention further provides a semiconductor processing device, which includes: the above-mentioned material frame lifting mechanism.

[0041] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution disclosed in this disclosure can be achieved. This is not a limitation herein.

[0042] The above specific embodiments do not limit the scope of protection of this utility model. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model shall be included within the scope of protection of this utility model.

Claims

1. A material frame lifting mechanism, characterized in that: include: A carrying plate, the carrying plate having a top surface and a bottom surface opposite to each other, the top surface being used for carrying the material frame; Two clamping groups are arranged at intervals along the length direction of the carrier plate, each of the clamping groups includes two clamping modules arranged opposite to each other, the clamping modules include a fixing block and a locking strip, the fixing block is arranged on the bottom surface of the carrier plate, one end of the locking strip is connected to the fixing block, and the other end of the locking strip extends above the top surface of the carrier plate, the carrier plate has a first side and a second side arranged along the width direction of the carrier plate, for each of the clamping groups, the two locking strips are respectively located on the first side and the second side, and the distance between the two oppositely arranged locking strips is adjustable, and the locking strips are used to clamp and fix the material frame; A driving assembly and a connecting plate, wherein the driving assembly and the connecting plate are connected, the bearing plate is arranged on the connecting plate, and the driving assembly is used to drive the connecting plate to move along the thickness direction of the bearing plate.

2. The material frame lifting mechanism according to claim 1, characterized in that: The fixing block has a limiting hole that passes through the fixing block along the width direction of the carrying plate; One end of the locking strip has a connecting piece extending along the width direction of the supporting plate, the connecting piece is arranged in the limiting hole, and the connecting piece is movable relative to the fixing block along the width direction of the supporting plate; The clamping module also includes a cylinder, which is fixed to the bottom surface of the supporting plate. The free end of the cylinder is fixed to the locking strip. The cylinder is used to drive the locking strip to move along the width direction of the supporting plate, thereby adjusting the distance between the two relatively arranged locking strips.

3. The material frame lifting mechanism according to claim 2, characterized in that: The fixing block includes a main body and an extension part, the main body is fixed to the bottom surface of the supporting plate, the extension part is fixed to the surface of the main body away from the supporting plate, and the limiting hole passes through the extension part along the width direction of the supporting plate.

4. The material frame lifting mechanism according to claim 1, characterized in that: The connecting plate has a first surface and a second surface opposite to each other. The first surface is connected to the driving assembly. The supporting plate is fixed on the second surface, and a side surface of the supporting plate faces the second surface.

5. The material frame lifting mechanism according to claim 4, characterized in that: The material frame lifting mechanism also includes at least two trapezoidal reinforcement plates, which are arranged at intervals along the length direction of the supporting plate, and the two trapezoidal reinforcement plates are arranged parallel to the angle area formed by the supporting plate and the connecting plate. One side surface of the trapezoidal reinforcement plate is fixed to the bottom surface of the supporting plate, and the other side surface of the trapezoidal reinforcement plate is fixed to the second surface.

6. The material frame lifting mechanism according to claim 1, characterized in that: The top surface of the carrying plate has a groove, and the outer surface of the material frame has a protrusion. When the material frame is set on the carrying plate, the protrusion cooperates with the groove to limit the material frame on the carrying plate.

7. The material frame lifting mechanism according to claim 1, characterized in that: The material frame lifting mechanism further comprises a mounting plate, a slider and a guide rail, wherein the mounting plate has a mounting surface, and the driving assembly is fixed to the mounting surface on a side away from the connecting plate; The side of the connecting plate away from the supporting plate is fixed to the slider, the slider is arranged on the guide rail, and the slider is movable along the thickness of the supporting plate relative to the guide rail, and the side of the guide rail away from the slider is fixed to the mounting surface.

8. The material frame lifting mechanism according to claim 7, characterized in that: The material frame lifting mechanism further includes: a second mounting plate, on which a side of the mounting plate away from the connecting plate is arranged.

9. A semiconductor processing equipment, characterized in that: include: The material frame lifting mechanism according to any one of claims 1 to 8.

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