Semiconductor electrostatic chuck structure

Abstract

The utility model discloses a semiconductor electrostatic chuck structure, which comprises a vacuum chuck, a bottom end electrostatic generation block arranged at the middle section of the vacuum chuck, a rotary cleaning ring rotatably connected to the outer end of the bottom end electrostatic generation block, a dust cleaning plate fixedly connected to the upper end of the rotary cleaning ring, and the dust cleaning plate is clamped with the vacuum chuck. The outer ends of the vacuum chucks are fixedly connected with edge sealing tapes; and the connecting and fixing rings are of two-section structures, sealing connecting blocks are arranged between the connecting and fixing rings, second fixing bolts are connected between the sealing connecting blocks in a threaded mode, and anti-skid tongs are fixedly connected between the connecting and fixing rings. And the outer end of the fixed connection protection column is provided with a connection fixing ring of a double-layer structure and an anti-skid gripper, so that the suction cup structure is convenient to grab and replace, and the use efficiency of the vacuum suction cup structure is improved. And a rotary sweeping ring structure is arranged at the outer end of the bottom end electrostatic generation block to drive a dust sweeping plate to rotate, dust is concentrated at the corresponding position, and the vacuum suction cup is convenient to clean.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor dust cleaning, in particular to a semiconductor electrostatic chuck structure. Background Art

[0002] During semiconductor production and packaging, static electricity can cause dust accumulation, impacting semiconductor quality, lifespan, and efficiency. To clean dust from semiconductor surfaces, a semiconductor electrostatic chuck is typically used.

[0003] The general semiconductor electrostatic chuck structure is to set an electrostatic accretion block inside the chuck, cover the outer end of the semiconductor with the chuck structure, vacuum the semiconductor, and set an electrostatic accretion device inside to achieve adsorption of dust inside the semiconductor and improve the quality of the semiconductor. However, this structure is not convenient for grabbing the chuck structure during use, and it is not convenient to clean the internal structure of the chuck. The Chinese patent application number is " CN201910863533.5 "An electrostatic chuck and a method for manufacturing a semiconductor structure are described. By providing an ejector pin with a damper in the electrostatic chuck, damage to the wafer caused by the electrostatic chuck during wafer adsorption can be reduced. The damping coefficient of the damper can be adjusted according to the value of the electrostatic force. However, this structure does not solve the problem of difficult gripping of the electrostatic chuck structure, and it is difficult to clean the chuck. Utility Model Content

[0004] The present utility model aims to solve at least one of the technical problems existing in the prior art by providing a semiconductor electrostatic chuck structure. By providing a double-layered connecting and fixing ring and a non-slip gripper at the outer end of a fixed connection protective column, the chuck structure is facilitated for handling and replacement, thereby improving the efficiency of the vacuum chuck structure. A rotating cleaning ring structure is provided at the outer end of the bottom static electricity generating block to drive the dust cleaning plate to rotate, thereby concentrating dust accumulated on the outer end of the vacuum chuck at the corresponding location, thereby facilitating cleaning of the vacuum chuck.

[0005] The present invention also provides a semiconductor electrostatic suction cup structure as described above, comprising: a vacuum suction cup, wherein the middle section of the vacuum suction cup is provided with a bottom electrostatic generating block, the outer end of the bottom electrostatic generating block is rotatably connected to a rotating cleaning ring, the upper end of the rotating cleaning ring is fixedly connected to a dust cleaning plate, the dust cleaning plate is engaged with the vacuum suction cup, and the outer end of the vacuum suction cup is fixedly connected to an edge sealing belt; a connecting fixing ring, wherein the connecting fixing ring is a two-section structure, a sealing connection block is provided between the connecting fixing rings, a second fixing bolt is threadedly connected between the sealing connection blocks, and an anti-slip gripper is fixedly connected between the connecting fixing rings. By providing a double-layer connecting fixing ring and an anti-slip gripper at the outer end of the fixed connection protective column, the grasping and replacement of the suction cup structure is facilitated, thereby improving the efficiency of the use of the vacuum suction cup structure. By providing a rotating cleaning ring structure at the outer end of the bottom electrostatic generating block, the dust cleaning plate is driven to rotate, and the dust accumulated on the outer end of the vacuum suction cup is concentrated at the corresponding position, making it convenient to clean the vacuum suction cup.

[0006] According to the semiconductor electrostatic chuck structure of the present invention, a fixed connection ring is fixedly connected to the upper end of the vacuum chuck, and a fixed connection protection column is provided between the fixed connection rings to achieve connection and grasping of the vacuum chuck and extend the vacuum chuck to the corresponding position.

[0007] According to the semiconductor electrostatic chuck structure of the present invention, a limiting hole is provided in the middle section of the fixed connection protection column, and the fixed connection protection column is threadedly connected to the fixed connection ring via a first fixing bolt. This connects the fixed connection protection column structure to the vacuum chuck, facilitating replacement of the vacuum chuck.

[0008] According to the semiconductor electrostatic chuck structure of the present invention, a connection fixing ring is engaged with the outer end of the fixed connection protection column, and an electrostatic generator is fixedly connected to the top of the fixed connection protection column, so that the electrostatic structure generates static electricity and transmits it to the corresponding position.

[0009] According to the semiconductor electrostatic chuck structure of the present invention, the side end of the electrostatic generator is connected to a power transmission line, and the output end of the power transmission line is connected to a power socket, thereby providing power to the electrostatic generator.

[0010] According to the semiconductor electrostatic chuck structure of the present invention, the front end of the power socket is connected to a power connector, and the power connector is connected to a power supply device to provide power to the power socket.

[0011] According to the semiconductor electrostatic chuck structure of the present invention, the electrostatic generator is connected to the bottom electrostatic generating block, and dust is accumulated inside the vacuum chuck, so that the dust is removed through the electrostatic and vacuum structure to clean the semiconductor structure.

[0012] According to the semiconductor electrostatic chuck structure of the present invention, the outer end of the anti-slip gripper is provided with anti-slip grooves, and the anti-slip grooves of the anti-slip gripper are threaded structures, thereby increasing the friction of the anti-slip gripper and preventing the electrostatic chuck from falling off.

[0013] Beneficial effects:

[0014] 1. Compared with the existing technology, this semiconductor electrostatic chuck structure is convenient for grabbing and replacing the chuck structure by setting a double-layer connecting fixing ring and an anti-slip gripper at the outer end of the fixed connecting protection column, thereby improving the use efficiency of the vacuum chuck structure.

[0015] 2. Compared with the existing technology, this semiconductor electrostatic suction cup structure sets a rotating cleaning ring structure at the outer end of the bottom electrostatic generating block to drive the dust cleaning plate to rotate, and concentrate the dust accumulated on the outer end of the vacuum suction cup at the corresponding position, making it easier to clean the vacuum suction cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 It is a structural diagram of the entire utility model;

[0018] Figure 2 This is a structural diagram of the utility model from an upward perspective;

[0019] Figure 3 This is a structural diagram of the utility model from a side perspective;

[0020] Figure 4 This is a structural diagram of the utility model from a top view.

[0021] Legend:

[0022] 1. Vacuum suction cup; 2. Edge sealing tape; 3. Fixed connecting ring; 4. First fixing bolt; 5. Connecting fixing ring; 6. Anti-slip gripper; 7. Static generator; 8. Power transmission line; 9. Power socket; 10. Fixed connecting protection column; 11. Power connector; 12. Sealing connection block; 13. Second fixing bolt; 14. Bottom static generating block; 15. Rotating cleaning ring; 16. Dust cleaning plate. DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0024] refer to Figure 1-4The semiconductor electrostatic suction cup structure of this embodiment includes: a vacuum suction cup 1, which provides a vacuum environment; a bottom electrostatic generating block 14 is provided in the middle section of the vacuum suction cup 1, which provides an electrostatic environment inside the vacuum suction cup 1. The outer end of the bottom electrostatic generating block 14 is rotatably connected to a rotating cleaning ring 15, which drives the dust cleaning plate 16 to rotate; the upper end of the rotating cleaning ring 15 is fixedly connected to the dust cleaning plate 16, and the dust cleaning plate 16 is engaged with the vacuum suction cup 1 to transfer the dust accumulated inside the vacuum suction cup 1 to the corresponding position. The outer end of the vacuum suction cup 1 is fixedly connected to an edge sealing belt 2; the upper end of the vacuum suction cup 1 is fixedly connected to a fixed connection ring 3, and a fixed connection protective column 10 is provided between the fixed connection rings 3. The fixed connection ring 3 is engaged with the fixed connection protective column 10 to prevent the anti-slip gripper 6 from falling off. A limiting hole is provided in the middle section of the fixed connection protective column 10, and the fixed connection protective column 10 is threadedly connected to the fixed connection ring 3 through a first fixing bolt 4. The fixed connection protective column 10 is connected to the vacuum suction cup 1, which is convenient for removal and replacement. The outer end of the fixed connection protective column 10 is engaged with a connecting fixing ring 5, and the top of the fixed connection protective column 10 is fixedly connected to an electrostatic generator 7. The side end of the electrostatic generator 7 is connected to a power transmission line 8, and the output end of the power transmission line 8 is connected to a power socket 9. The front end of the power socket 9 is connected to a power connector 11, and the power connector 11 is connected to the power supply device. The electrostatic generator 7 is connected to the bottom electrostatic generating block 14 to provide power for the operation of the bottom electrostatic block 14. Dust accumulates inside the vacuum suction cup 1. It is convenient for dust to be absorbed.

[0025] The connecting fixing ring 5 has a two-section structure, with a sealing connection block 12 provided between the connecting fixing rings 5. A second fixing bolt 13 is threadedly connected between the sealing connection blocks 12 to secure the double-layer structure of the fixed connecting ring 3 in the corresponding position. An anti-slip gripper 6 is fixedly connected between the connecting fixing rings 5 ​​to secure the anti-slip gripper 6. The outer end of the anti-slip gripper 6 is provided with an anti-slip groove, and the anti-slip groove of the anti-slip gripper 6 is a threaded structure. This improves the friction of the anti-slip gripper 6 to prevent the entire device from falling off when the suction cup structure is used.

[0026] Working principle: When using the device, the power socket 9 and the power connector 8 are engaged with the power device to provide power for the electrostatic generator 7.

[0027] The vacuum chuck 1 is then placed over the outer edge of the semiconductor, with edge sealing tape 2 securing the chuck 1 to improve the seal. Simultaneously, the static electricity generator 14 at the bottom operates, attracting dust from the semiconductor to the outer edge of the vacuum chuck 1, thus completing the dust removal process.

[0028] After cleaning is completed, grab the dust cleaning plate 16 and rotate the cleaning ring 15 to complete the cleaning of the inside of the vacuum suction cup 1, collect the dust at the corresponding position, and complete the cleaning of the vacuum suction cup 1.

[0029] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor electrostatic chuck structure, characterized in that: include: A vacuum suction cup (1), wherein a bottom static electricity generating block (14) is provided in the middle section of the vacuum suction cup (1), an outer end of the bottom static electricity generating block (14) is rotatably connected to a rotating cleaning ring (15), an upper end of the rotating cleaning ring (15) is fixedly connected to a dust cleaning plate (16), the dust cleaning plate (16) is engaged with the vacuum suction cup (1), and an outer end of the vacuum suction cup (1) is fixedly connected to an edge sealing belt (2); A connecting fixing ring (5) is provided, wherein the connecting fixing ring (5) is a two-section structure, a sealing connection block (12) is provided between the connecting fixing rings (5), a second fixing bolt (13) is threadedly connected between the sealing connection blocks (12), and an anti-slip gripper (6) is fixedly connected between the connecting fixing rings (5).

2. A semiconductor electrostatic chuck structure according to claim 1, characterized in that: A fixed connection ring (3) is fixedly connected to the upper end of the vacuum suction cup (1), and a fixed connection protection column (10) is provided between the fixed connection rings (3).

3. A semiconductor electrostatic chuck structure according to claim 2, characterized in that: A limiting hole is provided in the middle section of the fixed connection protection column (10), and the fixed connection protection column (10) is threadedly connected to the fixed connection ring (3) via a first fixing bolt (4).

4. A semiconductor electrostatic chuck structure according to claim 2, characterized in that: A connection fixing ring (5) is engaged at the outer end of the fixed connection protection column (10), and an electrostatic generator (7) is fixedly connected to the top end of the fixed connection protection column (10).

5. A semiconductor electrostatic chuck structure according to claim 4, characterized in that: The side end of the electrostatic generator (7) is connected to a power supply line (8), and the output end of the power supply line (8) is connected to a power socket (9).

6. A semiconductor electrostatic chuck structure according to claim 5, characterized in that: The front end of the power socket (9) is connected to a power connector (11), and the power connector (11) is connected to a power supply device.

7. The semiconductor electrostatic chuck structure according to claim 5, characterized in that: The electrostatic generator (7) is connected to the bottom electrostatic generating block (14), and dust is accumulated inside the vacuum suction cup (1).

8. The semiconductor electrostatic chuck structure according to claim 1, wherein: The outer end of the anti-slip grip (6) is provided with an anti-slip groove, and the anti-slip groove of the anti-slip grip (6) is a threaded structure.

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