Electrostatic adsorption device

Abstract

The utility model provides an electrostatic adsorption device which comprises an insulating medium layer and a concentric circular ring electrode subareas, and a spacing ring area exists between every two adjacent circular ring electrode subareas. And the spacing ring area and the circular ring electrode subarea are respectively provided with a first clearance area and a second clearance area in the radial direction of the circular plane. According to the utility model, the spacing ring areas are arranged among the ring electrode subareas, so that to-be-adsorbed substrates with different sizes can be adsorbed, the application flexibility is improved, and the production cost is reduced; meanwhile, the distribution of the first clearance area and the second clearance area is used for adapting to space application requirements such as ejector pin movement clearance and fixed part through hole; in addition, the minimum distance between the adjacent circular ring electrode subareas ensures that no electric leakage exists between the two circular ring electrode subareas and the space utilization rate is maximized; and finally, two electrode distribution modes are matched, so that only two electrode connection points are needed in each circular ring electrode subarea, the wiring space needed by the back is reduced, integration and debugging of the electrostatic adsorption device are facilitated, and the electrostatic adsorption adaptability to different materials is improved.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment, in particular to an electrostatic adsorption device. Background Art

[0002] In the semiconductor industry, electrostatic chucks (ESCs) are commonly used to secure wafers using Coulomb or Johnson-Rahbek forces (JR) generated between the wafer and an electrode. Compared to traditional mechanical chucks, ESCs do not require large moving parts, reduce the risk of particle contamination, and offer high reliability.

[0003] Electrostatic adsorption devices can be divided into unipolar and bipolar types. Unipolar devices have only one electrode and require a plasma environment to ensure that the wafer carries a charge opposite to that of the device's electrode layer. While their structure is simple and their adsorption force is stronger, they require a grounded cavity or substrate to complete the circuit. Bipolar devices apply high voltages of opposite polarity to two electrodes, forming a complete circuit between the two electrodes and the wafer, thus eliminating the need for a plasma environment. Therefore, bipolar electrostatic chucks are widely used in non-plasma environments.

[0004] With the rapid development of the process technology of third-generation and fourth-generation semiconductors, the display industry is also making continuous technological breakthroughs. For traditional semiconductor manufacturing processes, simple wafer processing is far from meeting customer needs. High-resistivity substrates such as sapphire and glass substrates can better meet the needs of emerging semiconductor application fields such as the display industry. However, the adsorption and fixation of high-resistivity substrates require higher electrostatic adsorption force. The general bipolar electrostatic chucks in the existing technology can only be used to adsorb silicon wafers, but cannot meet the electrostatic adsorption requirements of high-resistivity substrates such as sapphire and glass substrates. In some solutions that can achieve adsorption of high-resistivity substrates, the adsorption force is insufficient due to the small electrode area, and it is impossible to achieve adsorption of substrates of various specifications. As a result, the flexibility and adaptability of adsorption of substrates of different sizes and materials is poor, the cost of use is high, and it is difficult to apply to actual production.

[0005] Therefore, there is an urgent need for a bipolar electrostatic chuck that can achieve reliable electrostatic adsorption of substrates of different sizes and materials.

[0006] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of this application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are explained in the background technology part of this application. Utility Model Content

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an electrostatic adsorption device for solving the problem of poor adsorption reliability and compatibility of bipolar electrostatic chucks in the prior art for substrates of different materials and sizes.

[0008] To achieve the above-mentioned and other related purposes, the present invention provides the following technical solutions:

[0009] The utility model provides an electrostatic adsorption device, comprising: an insulating dielectric layer and a concentric annular electrode partitions, where a is an integer greater than or equal to 2; a spacer ring region exists between two adjacent annular electrode partitions, each of the annular electrode partitions includes a first electrode region and a second electrode region, and the first electrode region and the second electrode region in each annular electrode partition have opposite electrical polarities; a cross-section of the insulating dielectric layer at a preset height is a circular plane, and the center of the circular plane coincides with the central axis of each annular electrode partition;

[0010] There is a first air avoidance area in the radial direction of the circular plane within e spacing ring areas, where e is an integer greater than or equal to 0 and less than a; there is a second air avoidance area in the radial direction of the circular plane within d circular ring electrode partitions, where d is an integer greater than or equal to 0 and less than or equal to a; e and d are not 0 at the same time.

[0011] Optionally, the minimum distance between two adjacent circular electrode partitions is 1 mm to 10 mm.

[0012] Optionally, any one or more of the spacer ring regions include p first air-avoidance areas, and any one or more of the circular electrode regions include q second air-avoidance areas; each of the first air-avoidance areas and the closest second air-avoidance area correspond to each other in the same radial direction of the circular plane;

[0013] Alternatively, any one or more of the spacer ring regions include p first air-avoidance regions, and any one or more of the circular electrode regions include q second air-avoidance regions; and the closest first air-avoidance regions and the closest second air-avoidance regions are not on the same radial direction of the circular plane;

[0014] Both p and q are integers greater than or equal to 0, and p and q cannot be 0 at the same time.

[0015] Optionally, the first electrode area within each of the circular electrode partitions includes a central electrode portion, m first branch portions, and m groups of first arc portions, and each group of first arc portions includes n first arc electrodes; the central electrode portion is a first arc coinciding with the center of the circular plane, and the m first branch portions extending radially along the circular plane are all connected to the outer circumference of the central electrode portion; each group of the first arc portions is connected to the first branch portions in pairs, and the n first arc electrodes in the same group of the first arc portions are arcs corresponding to n concentric circles with different radii that are larger than the first arc shape and at the same central angle;

[0016] The second electrode area within each of the circular electrode partitions includes an edge electrode portion, m second branch portions, and m groups of second arc portions, each group of second arc portions includes n second arc electrodes; the edge electrode portion is a second arc coinciding with the center of the circular plane, and the m second branch portions extending radially along the circular plane are all connected to the inner circumference of the edge electrode portion; each group of second arc portions is connected to the second branch portions in pairs, and the n second arc electrodes in the same group of the second arc portions are arcs corresponding to n concentric circles with different radii that are smaller than the second arc shape and located at the same central angle;

[0017] m is an integer greater than or equal to 1, and n is an integer greater than 2; the first arc electrodes and the second arc electrodes radially adjacent to each other along the circular plane are distributed in an interdigitated manner, and the insulating dielectric layer covers the exposed surfaces of the first arc electrodes and the second arc electrodes in each of the circular electrode partitions and fills the gaps between their surfaces; the radius of the central electrode portion in each of the circular electrode partitions is smaller than the radius of the second circular electrode in the corresponding circular electrode partition, and the radius of the edge electrode portion in each of the circular electrode partitions is larger than the radius of the first circular electrode in the corresponding circular electrode partition;

[0018] The a circular electrode partitions include b first circular electrode partitions and c second circular electrode partitions, and any one of the circular electrode partitions is the first circular electrode partition or the second circular electrode partition; b is an integer greater than or equal to 0 and less than or equal to a, and c is an integer greater than or equal to 0 and less than or equal to a;

[0019] Each group of the first arc portions within each first circular electrode partition is distributed on the same side of the first branch portion connected thereto along the first circumferential direction of the circular plane, and each group of the second arc portions within each first circular electrode partition is distributed on the same side of the second branch portion connected thereto along the second circumferential direction of the circular plane; the closest first branch portion and second branch portion within each first circular electrode partition are back-to-back located in the same radial direction of the circular plane; one of the first circumferential direction and the second circumferential direction is clockwise, and the other is counterclockwise;

[0020] Each group of the first arc portions within each second circular electrode partition is distributed on one side of the first branch portion connected to it along the first circumferential direction of the circular plane and on one side of the second circumferential direction of the circular plane, and each group of the second arc portions within each second circular electrode partition is distributed on one side of the second branch portion connected to it along the first circumferential direction of the circular plane and on one side of the second circumferential direction of the circular plane; there is an angle between the closest first branch portion and second branch portion within each second circular electrode partition, and they are not located on the same radial direction of the circular plane; one of the first circumferential direction and the second circumferential direction is clockwise, and the other is counterclockwise.

[0021] Optionally, the central electrode portion is a major arc with an opening; or the central electrode portion is a full circular ring;

[0022] The edge electrode portion is a major arc with an opening; or the edge electrode portion is a full circular ring.

[0023] Optionally, the angle between two adjacent first branch portions and the angle between two adjacent second branch portions in each first circular electrode partition are equal; the angle between adjacent first branch portions and second branch portions in each second circular electrode partition are equal.

[0024] Optionally, each first air avoidance region is located in the radial direction of the circular plane where the first branch portion and / or the second branch portion of the circular electrode partition closest to the inner side of the first air avoidance region are located in the spacing ring region, and the first electrode region and the second electrode region close to the first air avoidance region are deformed to avoid position so as to obtain a space for arranging the first air avoidance region;

[0025] The portion of the first electrode region of the circular electrode partition closest to the outside of the first avoidance area corresponding to the first avoidance area is a first avoidance arc surrounding the outside of the first avoidance area with the center point of the first avoidance area as the center;

[0026] The portion of the second electrode region of the annular electrode partition closest to the inside of the first clearance area corresponding to the first clearance area is a second avoidance arc surrounding the inside of the first clearance area with the center point of the first clearance area as the circle center.

[0027] Optionally, when the first avoidance area is outside the first circular electrode partition, the portion of the second electrode area within the first circular electrode partition closest to the first avoidance arc is a first avoidance secondary arc that surrounds the first avoidance arc with the center point of the first avoidance area as the center;

[0028] When the inside of the first avoidance area is the first circular electrode partition, the part of the first electrode area in the first circular electrode partition closest to the second avoidance arc is the second avoidance secondary arc surrounding the second avoidance arc with the center point of the first avoidance area as the center.

[0029] Optionally, a third avoidance arc is formed by surrounding the first avoidance arc with the center point of the first avoidance area as the center, and the second arc electrodes closest to both sides of the first avoidance arc are connected to the second branch portion closest to the first avoidance arc through the third avoidance arc; a fourth avoidance arc is formed by surrounding the second avoidance arc with the center point of the first avoidance area as the center, and the first arc electrodes closest to both sides of the second avoidance arc are connected to the first branch portion closest to the second avoidance arc through the fourth avoidance arc;

[0030] Alternatively, the second arc electrodes closest to both sides of the first avoidance arc are separated by the first avoidance arc, and the first arc electrodes closest to both sides of the second avoidance arc are separated by the second avoidance arc.

[0031] Optionally, the first electrode region and the second electrode region close to the second air avoidance region are arranged to be spaced apart and deformed to obtain space for arranging the second air avoidance region;

[0032] In the first circular electrode partition, one of the second avoidance regions is an empty area formed between a fifth avoidance arc on the first branch portion through which the second avoidance region passes and a sixth avoidance arc on the second branch portion through which the same second avoidance region passes;

[0033] The fifth avoidance arc is a semicircular arc portion surrounding one side of the second avoidance area with the center point of the second avoidance area through which the first branch portion of the same first circular electrode partition passes as the center;

[0034] The sixth avoidance arc is a semicircular arc portion that surrounds the other side of the second avoidance area with the center point of the second avoidance area through which the second branch portion of the same first circular electrode partition passes as the center;

[0035] The first arc electrodes located on both sides of the second avoidance area are separated by the fifth avoidance arc and the sixth avoidance arc at corresponding positions, and the second arc electrodes located on both sides of the second avoidance area are separated by the fifth avoidance arc and the sixth avoidance arc at corresponding positions.

[0036] Optionally, the first electrode region and the second electrode region close to the second air avoidance region are arranged to be spaced apart and deformed to obtain space for arranging the second air avoidance region;

[0037] In the second circular electrode partition, the second avoidance area passing through the first branch portion is an empty area formed within the seventh avoidance arc on the first branch portion through which the second avoidance area passes, and the second avoidance area passing through the second branch portion is an empty area formed within the eighth avoidance arc on the second branch portion through which the second avoidance area passes;

[0038] The seventh avoidance arc is a full arc portion that surrounds the second avoidance area with the center point of the second avoidance area through which the first branch portion passes as the center; the first arc electrodes located on both sides of the seventh avoidance arc are separated by the seventh avoidance arc;

[0039] The eighth avoidance arc is a full arc portion surrounding the second avoidance area with the center point of the second avoidance area through which the second branch portion passes as the center; the second arc electrodes located on both sides of the eighth avoidance arc are separated by the eighth avoidance arc.

[0040] Optionally, each of the first air-avoidance areas within each of the spacing ring areas is uniformly distributed along the first circumferential direction or the second circumferential direction of the circular plane; and / or, each of the second air-avoidance areas within each of the circular electrode partitions is uniformly distributed along the first circumferential direction or the second circumferential direction of the circular plane.

[0041] Optionally, the area ratio of the first electrode region to the second electrode region in each of the circular electrode partitions is equal to 1; the electrostatic adsorption device further comprises a protective layer, the protective layer covering the insulating dielectric layer, the protective layer being used to contact the substrate to be adsorbed by the electrostatic adsorption device, and the volume resistivity of the protective layer being greater than or equal to 10 14 Ω·cm; or the volume resistivity of the insulating dielectric layer is greater than or equal to 10 14 Ω·cm.

[0042] As described above, the electrostatic adsorption device of the present invention has the following beneficial effects:

[0043] The utility model provides a spacer ring area between the circular electrode partitions, which can be used to adsorb substrates of different sizes to be adsorbed, thereby improving the application flexibility of the electrostatic adsorption device. As a result, it is no longer necessary to specially customize the electrostatic adsorption device for each size of the substrate to be adsorbed, thereby ensuring a wider range of applications while reducing production costs.

[0044] The utility model arranges the distribution of the first and second air-avoidance areas to meet the spatial application requirements such as the air-avoidance area for ejector movement required by the substrate to be adsorbed and the through-hole area for insert fixation, thereby improving the universal application of the electrostatic adsorption device.

[0045] The utility model sets a minimum distance between adjacent circular electrode partitions to ensure that no leakage occurs between the two circular electrode partitions while maximizing space utilization.

[0046] The utility model arranges the two electrode distribution modes of the first circular electrode partition and the second circular electrode partition so that only two electrode connection points are needed in each circular electrode partition to realize the electrode lead-out, which is beneficial to reducing the wiring space required on the back of the electrostatic adsorption device and reducing the spacing between the electrode connection points between different circular electrode partitions, facilitating the integration and debugging of the electrostatic adsorption device, and increasing the arc density that the electrostatic adsorption device can accommodate, thereby improving the electrostatic adsorption adaptability of the electrostatic adsorption device to the substrates to be adsorbed of different materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 Shown is a schematic side cross-sectional view of half of the electrostatic adsorption device in Example 1 of the present invention.

[0048] Figure 2 Shown is a partially enlarged detail view of the side sectional view of the electrostatic adsorption device in Example 1 of the present invention.

[0049] Figure 3 Shown is a schematic diagram of an overall top view of the electrostatic adsorption device in Example 1 of the present utility model.

[0050] Figure 4 Shown is a detailed enlarged view of part A of the electrostatic adsorption device in Example 1 of the present invention.

[0051] Figure 5 Shown is a detailed enlarged view of part B of the electrostatic adsorption device in Example 1 of the present invention.

[0052] Figure 6 Shown is a schematic diagram of an overall top view of the electrostatic adsorption device in Example 2 of the present utility model.

[0053] Figure 7 Shown is a detailed enlarged view of part C of the electrostatic adsorption device in Example 2 of the present invention.

[0054] Figure 8 Shown is a detailed enlarged view of part D of the electrostatic adsorption device in Example 2 of the present invention.

[0055] Figure 9 Shown is a detailed enlarged view of part E of the electrostatic adsorption device in Example 2 of the present invention.

[0056] Figure 10 Shown is a schematic diagram of an overall top view of the electrostatic adsorption device in Example 3 of the present utility model.

[0057] Figure 11 Shown is a detailed enlarged view of part F of the electrostatic adsorption device in Example 3 of the present invention.

[0058] Figure 12 Shown is a detailed enlarged view of part G of the electrostatic adsorption device in Example 3 of the present invention.

[0059] Figure 13 Shown is a schematic diagram of an overall top view of the electrostatic adsorption device in Example 4 of the present utility model.

[0060] Figure 14 Shown is a detailed enlarged view of part H of the electrostatic adsorption device in Example 4 of the present invention.

[0061] Figure 15 Shown is an enlarged view of the details of the electrostatic adsorption device I in Example 4 of the present invention.

[0062] Figure 16 Shown is a schematic diagram of an overall top view of the electrostatic adsorption device in Example 6 of the present utility model.

[0063] Figure 17 Shown is a detailed enlarged view of part J of the electrostatic adsorption device in Example 6 of the present invention.

[0064] Figure 18 Shown is a detailed enlarged view of part K of the electrostatic adsorption device in Example 6 of the present invention.

[0065] Figure 19 Shown is a detailed enlarged view of the electrostatic adsorption device L in Example 6 of the present invention.

[0066] Figure 20 Shown is a schematic diagram of an overall top view of the electrostatic adsorption device in Example 7 of the present utility model.

[0067] Figure 21Shown is a detailed enlarged view of the electrostatic adsorption device M in Example 7 of the present invention.

[0068] Figure 22 Shown is a detailed enlarged view of part N of the electrostatic adsorption device in Example 7 of the present invention.

[0069] Figure 23 Shown is a detailed enlarged view of part O of the electrostatic adsorption device in Example 7 of the present invention.

[0070] Component number description

[0071] 10. Carrier layer; 12. Central axis; 13. First circumferential direction; 14. Second circumferential direction;

[0072] 20. Insulating dielectric layer; 22. First circular electrode partition; 23. Second circular electrode partition; 24. Spacer ring area;

[0073] 311. First arc electrode; 312. First branch portion; 321. Second arc electrode; 322. Second branch portion; 33. First avoidance area; 331. First avoidance arc; 332. Second avoidance arc; 3321. Second avoidance secondary arc; 333. Third avoidance arc; 334. Fourth avoidance arc; 34. Second avoidance area; 341. Fifth avoidance arc; 342. Sixth avoidance arc; 343. Seventh avoidance arc; 344. Eighth avoidance arc; 35. Center electrode; 361. First electrode connecting line; 362. Second electrode connecting line; 363. Power supply; 37. Edge electrode; 38. Hollow hole;

[0074] 40. Substrate to be adsorbed; 41. Bump layer. DETAILED DESCRIPTION

[0075] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0076] For example, when describing the embodiments of the present invention, schematic diagrams illustrating device structures may be partially enlarged for ease of explanation. These schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0077] For convenience of description, spatially relative terms such as "under," "below," "below," "below," "above," and "upper" may be used herein to describe the relationship of one element or feature to other elements or features shown in the drawings. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings.

[0078] In the context of the present application, a structure described as a first feature being "above" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where an additional feature is formed between the first and second features, such that the first and second features may not be in direct contact.

[0079] It should be noted that the illustrations provided in this application are only used to illustrate the basic concept of the present invention in a schematic manner. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0080] It should be noted that the circular electrode partition in this application is a general term for the first circular electrode partition and the second circular electrode partition. The circular electrode partition mentioned in this article is used to refer to the corresponding first circular electrode partition and / or second circular electrode partition respectively according to different embodiments.

[0081] The radial direction mentioned in this application does not specifically refer to the direction of any radius, and its specific reference direction is determined according to the application scenario and actual application requirements of the embodiment.

[0082] Example 1:

[0083] This embodiment provides an electrostatic adsorption device, such as Figure 1-Figure 5 As shown, Figure 1 is a side cross-sectional view of the electrostatic adsorption device along the right half of the central axis 12, Figure 2 for Figure 1 A partial enlarged detail of Figure 3 This is the overall top view of the electrostatic adsorption device. Figure 4 for Figure 3 A detailed enlarged view of part A. Figure 5 for Figure 3A detailed enlarged view of section B shows the electrostatic adsorption device comprising: an insulating dielectric layer 20 and a concentric annular electrode partitions, where a is an integer greater than or equal to 2; a spacer ring region 24 exists between adjacent annular electrode partitions, and each annular electrode partition includes a first electrode region and a second electrode region, with the first electrode region and the second electrode region in each annular electrode partition having opposite electrical polarities; a cross-section of the insulating dielectric layer 20 at a predetermined height is a circular plane, with the center of the circular plane coinciding with the central axis 12 of each annular electrode partition;

[0084] There is a first air avoidance area 33 in the radial direction of the circular plane within the e spacing ring areas 24, where e is an integer greater than 0 and less than a; there is a second air avoidance area 34 in the radial direction of the circular plane within the d circular ring electrode partitions, where d is an integer greater than 0 and less than or equal to a.

[0085] In the existing technology, general bipolar electrostatic chucks can only be used to adsorb silicon wafers, but cannot meet the requirements of electrostatic adsorption of high-resistivity substrates such as sapphire and glass substrates; and some solutions that can achieve adsorption of high-resistivity substrates have insufficient adsorption force due to the small electrode area and cannot achieve adsorption of substrates of various specifications, resulting in poor flexibility and adaptability for adsorption of substrates of different sizes and materials, high usage costs, and difficulty in actual production application.

[0086] The present invention can be used to adsorb substrates 40 to be adsorbed of different sizes by arranging a spacer ring area 24 between the circular electrode partitions, thereby improving the application flexibility of the electrostatic adsorption device, so that there is no need to specially customize the electrostatic adsorption device for each size of the substrate 40 to be adsorbed, thereby reducing the production cost while ensuring a wider range of applications; at the same time, by arranging the distribution of the first air avoidance area 33 and the second air avoidance area 34, it can adapt to spatial application requirements such as the air avoidance area for the movement of the ejector pin required by the substrate 40 to be adsorbed and the through-hole area for the fixation of the insert, thereby improving the universal application of the electrostatic adsorption device.

[0087] Specifically, the "cross-section of the insulating dielectric layer 20 at a preset height" is a plane passing through the first electrode region and the second electrode region, so that the circular plane can be used as a position reference plane for describing each part of the first electrode region and the second electrode region in each circular electrode partition.

[0088] In one embodiment, the first clearing area 33 serves as the mounting area for the electrostatic adsorption device's mechanical fixing insert or the active area for the interface device that interfaces with the electrostatic adsorption device for the substrate 40 to be adsorbed; the second clearing area 34 serves as the mounting area for the electrostatic adsorption device's mechanical fixing insert or the active area for the interface device that interfaces with the electrostatic adsorption device for the substrate 40 to be adsorbed. Specifically, the application functions of the first clearing area 33 and the second clearing area 34 can be determined based on the specific application scenario.

[0089] Specifically, the number of the first clearance areas 33 in each spacing ring area 24 and the number of the second clearance areas 34 in each circular electrode area can be equal or unequal, and are set according to specific application requirements.

[0090] In one embodiment, an insulating dielectric layer 20 is provided in the spacing ring region 24 to separate adjacent circular electrodes.

[0091] In one embodiment, the minimum distance between two adjacent circular electrode sections is 1 mm to 10 mm.

[0092] The utility model ensures that no leakage occurs between two circular electrode partitions while maximizing space utilization by setting a minimum distance between adjacent circular electrode partitions.

[0093] In this embodiment, Figure 3-Figure 5 As shown, the first electrode area within each circular electrode partition includes a central electrode portion 35, m first branches 312, and m groups of first arc portions. Each group of first arc portions includes n first arc electrodes 311. The central electrode portion 35 is a first arc coinciding with the center of the circular plane. The m first branches 312 extending radially along the circular plane are all connected to the outer circumference of the central electrode portion 35. Each group of first arc portions is connected to the first branches 312 in pairs. The n first arc electrodes 311 in the same group of first arc portions are arcs corresponding to n concentric circles with different radii that are larger than the first arc shape and located at the same central angle.

[0094] The second electrode area within each circular electrode partition includes an edge electrode portion 37, m second branch portions 322 and m groups of second arc portions, each group of second arc portions includes n second arc electrodes 321; the edge electrode portion 37 is a second arc shape that coincides with the center of the circular plane, and the m second branches 322 extending radially along the circular plane are all connected to the inner circumference of the edge electrode portion 37; each group of second arc portions is connected to the second branch portions 322 in pairs, and the n second arc electrodes 321 in the same group of second arc portions are arcs corresponding to n concentric circles with different radii and smaller than the second arc shape at the same central angle.

[0095] m is an integer greater than or equal to 1, and n is an integer greater than 2; the first arc electrodes 311 and the second arc electrodes 321 radially adjacent along the circular plane are distributed in an interdigitated manner, and the insulating dielectric layer 20 covers the exposed surfaces of the first arc electrodes 311 and the second arc electrodes 321 in each circular electrode partition and fills the gaps between their surfaces; the radius of the central electrode portion 35 in each circular electrode partition is smaller than the radius of the second circular electrode 321 in the corresponding circular electrode partition, and the radius of the edge electrode portion 37 in each circular electrode partition is larger than the radius of the first circular electrode 311 in the corresponding circular electrode partition.

[0096] Each of the a circular electrode partitions is the second circular electrode partition 23 .

[0097] Each group of first arc portions within each second circular electrode partition 23 is distributed on one side of the first branch portion 312 connected to it along the first circumferential direction 13 of the circular plane and on one side of the second circumferential direction 14 of the circular plane, and each group of second arc portions within each second circular electrode partition 23 is distributed on one side of the second branch portion 322 connected to it along the first circumferential direction 13 of the circular plane and on one side of the second circumferential direction 14 of the circular plane; there is an angle between the closest first branch portion 312 and the second branch portion 322 in each second circular electrode partition 23, and the two are not located in the same radial direction of the circular plane; one of the first circumferential direction 13 and the second circumferential direction 14 is clockwise, and the other is counterclockwise.

[0098] The present invention sets the electrode distribution mode of the second circular electrode partition 23 so that only two electrode connection points are needed in each circular electrode partition to realize the electrode lead-out, which is beneficial to reducing the wiring space required on the back of the electrostatic adsorption device and reducing the spacing between the electrode connection points between different circular electrode partitions, facilitating the integration and debugging of the electrostatic adsorption device, and increasing the arc density that the electrostatic adsorption device can accommodate, thereby improving the electrostatic adsorption force of the electrostatic adsorption device on the high-resistivity substrate 40 to be adsorbed such as sapphire and glass substrate, thereby improving the adsorption adaptability of the electrostatic adsorption device to different substrates 40 to be adsorbed, improving the flexibility and applicability of a single electrostatic adsorption device, and reducing the cost of adsorption equipment for different substrates 40 to be adsorbed.

[0099] In one embodiment, the interior of the central electrode portion 35 of the innermost annular electrode partition is a hollow hole 38 or is filled with an insulating medium layer 20 .

[0100] In one embodiment, the first electrode region and the second electrode region are made of a material with a high melting point and high conductivity, such as tungsten, silver, platinum, copper, etc.

[0101] In one embodiment, Figure 2 As shown, the spacing distance D1 between the first arc electrodes 311 and the second arc electrodes 321 adjacent to each other along the radial direction of the circular plane in each circular electrode partition is equal.

[0102] The present invention sets the spacing distance between the first arc electrode 311 and the second arc electrode 321 radially adjacent to each other along the circular plane in each circular electrode partition to be equal, so that the electrostatic adsorption device can generate a higher non-uniform electric field intensity, make the gradient force greater, and improve the adsorption reliability of the high resistivity substrate 40 to be adsorbed.

[0103] In one embodiment, the spacing distance D1 between the first arc electrodes 311 and the second arc electrodes 321 adjacent to each other along the radial direction of the circular plane in each circular electrode partition is greater than or equal to 0.5 mm and less than or equal to 10 mm.

[0104] The present invention sets a spacing distance range between the radially adjacent first arc electrodes 311 and the second arc electrodes 321 so that the spacing distance is not too large, resulting in a significant reduction in the area of ​​the first electrode area and the second electrode area, thereby avoiding affecting the strength of the electrostatic adsorption force; at the same time, the spacing distance is not too small, resulting in poor insulation isolation between the first arc electrode 311 and the second arc electrode 321, thereby avoiding causing adverse phenomena such as high-voltage breakdown.

[0105] Preferably, the spacing distance between the first arc electrodes 311 and the second arc electrodes 321 adjacent to each other along the radial direction of the circular plane in each circular electrode partition is 3 mm.

[0106] In one embodiment, Figure 1-Figure 2 As shown, the spacing distance D1 between the first arc electrodes 311 and the second arc electrodes 321 adjacent to each other along the radial direction of the circular plane in each circular electrode partition is equal, so that the first arc electrodes 311 and the second arc electrodes 321 in each circular electrode partition are evenly distributed, which can further maximize the electrostatic adsorption force; at this time, R 1(s+1) =R 1s +2*D1+L1+L2, where R 1(s+1) R is the radius of the first arc electrode 311 of the s+1th layer radially outward from the central electrode portion 35 along the circular plane in a circular electrode partition, 1s is the radius corresponding to the first arc electrode 311 of the sth layer; R 2(s+1) =R 2s +2*D1+L1+L2, where R 2(s+1) R is the radius of the second arc electrode 321 of the s+1th layer radially outward from the central electrode portion 35 along the circular plane, 2s is the radius corresponding to the second arc electrode 321 of the sth layer.

[0107] In this embodiment, any one or more spacing ring areas 24 include p first space-avoiding areas 33, and any one or more circular electrode areas include q second space-avoiding areas 34; Figure 3 As shown, each first air avoidance area 33 and the closest second air avoidance area 34 correspond to each other in the same radial direction of the circular plane; p and q are both integers greater than or equal to 0, and p and q are not 0 at the same time.

[0108] In one embodiment, Figure 3As shown, it includes two second circular electrode partitions 23 and a spacer ring area 24, the spacer ring area 24 includes three first air avoidance areas 33, and the inner second circular electrode partition 23 includes three second air avoidance areas 34. Each first air avoidance area 33 and the closest second air avoidance area 34 correspond to each other in the same radial direction of the circular plane.

[0109] In one embodiment, two second annular electrode partitions 23 and one spacer ring region 24 are included. The spacer ring region 24 includes four first air-avoidance areas 33 , and the inner second annular electrode partition 23 includes four second air-avoidance areas 34 .

[0110] Specifically, the positional relationship and quantity distribution between the first space avoidance area 33 and the second space avoidance area 34 can be adjusted according to the requirement of the avoidance space.

[0111] In one embodiment, each first air avoidance area 33 is located in the radial direction of the circular plane where the first branch portion 312 and / or the second branch portion 322 of the circular electrode partition closest to the inner side of the first air avoidance area 33 are located in the spacing ring area 24, and the first electrode area and the second electrode area close to the first air avoidance area 33 are deformed to obtain space for setting the first air avoidance area 33.

[0112] In one embodiment, Figure 3-Figure 5 As shown, each first avoidance area 33 is located in the radial direction of the circular plane where the first branch portion 312 of the circular electrode partition closest to the inner side of the first avoidance area 33 is located in the spacing ring area 24, and the first electrode area and the second electrode area close to the first avoidance area 33 are deformed to avoid the position to obtain a space for setting the first avoidance area 33;

[0113] The portion of the first electrode region of the circular electrode partition closest to the outside of the first clearance area 33 corresponding to the first clearance area 33 is a first clearance arc 331 surrounding the outside of the first clearance area 33 with the center point of the first clearance area 33 as the center;

[0114] The portion of the second electrode region of the annular electrode partition closest to the inner side of the first clearance area 33 corresponding to the first clearance area 33 is a second clearance arc 332 surrounding the inner side of the first clearance area 33 with the center point of the first clearance area 33 as the circle center.

[0115] Specifically, the “inner side” of a structure mentioned herein refers to the side of the structure close to the center of the circular plane, and the “outer side” of a structure refers to the side of the structure away from the center of the circular plane.

[0116] In this embodiment, Figure 3-Figure 5As shown, a third avoidance arc 333 is formed by surrounding the first avoidance arc 331 with the center point of the first avoidance area 33 as the center, and the second arc electrodes 321 closest to the first avoidance arc 331 on both sides are connected to the second branch portion 322 closest to the first avoidance arc 331 through the third avoidance arc 333; a fourth avoidance arc 334 is formed by surrounding the second avoidance arc 332 with the center point of the first avoidance area 33 as the center, and the first arc electrodes 311 closest to the second avoidance arc 332 on both sides are connected to the first branch portion 312 closest to the second avoidance arc 332 through the fourth avoidance arc 334.

[0117] The present invention sets the arc electrode closest to the first avoidance area 33 as the third avoidance arc 333 surrounding the first avoidance arc 331, and the arc electrode closest to the second avoidance arc 332 as the fourth avoidance arc 334 surrounding the second avoidance arc 332, thereby further reducing the electrode area lost due to the need to deform to avoid the first avoidance area 33, thereby further increasing the electrode area and electrode distribution density, and improving the electrostatic adsorption device to ensure the strength of the electrostatic adsorption force while setting avoidance areas that adapt to different application scenarios.

[0118] In one embodiment, the first electrode region and the second electrode region near the second avoidance region 34 are deformed to obtain a space for setting the second avoidance region 34;

[0119] like Figure 3-Figure 5 As shown, in each second circular electrode partition 23, the second avoidance area 34 passing through the first branch portion 312 is an empty area formed within the seventh avoidance arc 343 on the first branch portion 312 through which the second avoidance area 34 passes; the seventh avoidance arc 343 is a full arc portion that surrounds the second avoidance area 34 with the center point of the second avoidance area 34 passing through the first branch portion 312 as the center of the circle; the first arc electrodes 311 located on both sides of the seventh avoidance arc 343 are separated by the seventh avoidance arc 343.

[0120] In one embodiment, the second avoidance area 34 passing through the second branch portion 322 is an empty area formed within the eighth avoidance arc 344 on the second branch portion 322 through which the second avoidance area 34 passes; the eighth avoidance arc 344 is a full arc portion that surrounds the second avoidance area 34 with the center point of the second avoidance area 34 through which the second branch portion 322 passes as the center of the circle; the second arc electrodes 321 located on both sides of the eighth avoidance arc 344 are separated by the eighth avoidance arc 344.

[0121] The present invention can further improve the spatial utilization of electrode distribution by setting the seventh avoidance arc 343 and the eighth avoidance arc 344 of the second avoidance area 34 to be electrically connected to the electrode arcs corresponding to the branch parts where they are located, thereby further improving the achievable electrostatic adsorption force and improving the adsorption reliability.

[0122] In one embodiment, the central electrode portion 35 is a major arc with an opening; or the central electrode portion 35 is a full circular ring;

[0123] The edge electrode portion 37 is a major arc with an opening; or the edge electrode portion 37 is a full circular ring.

[0124] The present invention sets the central electrode portion 35 or the edge electrode portion 37 as a full circular ring, so that more branches can be set while ensuring that only two electrode connection points are required in each circular electrode partition. This can further increase the electrode area and electrode distribution density while minimizing the wiring space, thereby improving the electrostatic adsorption force.

[0125] In one embodiment, Figure 3-Figure 5 As shown, the central electrode portion 35 is in the shape of a full circle ring, and the edge electrode portion 37 is in the shape of a full circle ring.

[0126] In one embodiment, Figure 3 As shown, each first clearance area 33 in each spacing ring area 24 is evenly distributed along the first circumferential direction 13 or the second circumferential direction 14 of the circular plane; and / or, as shown Figure 3 As shown, the second clearance areas 34 within each annular electrode partition are evenly distributed along the first circumferential direction 13 or the second circumferential direction 14 of the circular plane.

[0127] The utility model adjusts the distribution uniformity of the first air-avoiding area 33 and the second air-avoiding area 34 to adapt to the position distribution of the air-avoiding areas required by the commonly used substrate 40 to be adsorbed, thereby improving the universality of the electrostatic adsorption device.

[0128] In one embodiment, Figure 3 As shown, the angle between two adjacent first branches 312 and the angle between two adjacent second branches 322 in each first circular electrode partition 22 are equal; the angle between adjacent first branches 312 and second branches 322 in each second circular electrode partition 23 are equal.

[0129] The utility model makes the branches evenly distributed by setting the included angles between adjacent branches that are not in the same radial direction equal, thereby further improving the spatial utilization of the electrode distribution to improve the electrostatic adsorption force; at the same time, it can also improve the reliability of the connection between the electrodes to improve the adsorption reliability of the electrostatic adsorption device.

[0130] In one embodiment, the area ratio of the first electrode region to the second electrode region in each circular electrode partition is greater than or equal to 0.1 and less than or equal to 7, or the area ratio of the second electrode region to the first electrode region in each circular electrode partition is greater than or equal to 0.1 and less than or equal to 7.

[0131] In one embodiment, the area ratio of the first electrode region to the second electrode region in each annular electrode partition is equal to 1.

[0132] The utility model can maximize the gradient force by setting the areas of the first electrode area and the second electrode area in each circular electrode partition to be equal, thereby maximizing the adsorption force generated by the first electrode area and the second electrode area.

[0133] In one embodiment, the radial length of each first arc electrode 311 along the circular plane is greater than or equal to 0.3 mm and less than or equal to 5 mm, and the radial length of each second arc electrode 321 along the circular plane is greater than or equal to 0.3 mm and less than or equal to 5 mm.

[0134] In one embodiment, the radial length of each first arc electrode 311 along the circular plane is greater than or equal to 0.3 mm and less than 0.5 mm, and the radial length of each second arc electrode 321 along the circular plane is greater than or equal to 0.3 mm and less than 0.5 mm.

[0135] The present invention increases the arc density that can be accommodated by the electrostatic adsorption device by setting the distribution mode of the first electrode area and the second electrode area within the second circular electrode partition 23, and setting the width of the first arc electrode 311 and the second arc electrode 321 along the radial direction of the circular plane. When a potential difference is applied between the electrodes, a non-uniform electric field can be formed on the attraction surface of the insulating dielectric layer 20 between the electrodes. In the non-uniform electric field, part of the insulating dielectric layer 20 is polarized, and a gradient force of attraction in the direction of strong electric field intensity is generated, thereby greatly improving the adsorption force that the electrostatic adsorption device can provide, which is beneficial to the adsorption reliability and adaptability of the substrate 40 to be adsorbed with higher resistivity. In conjunction with the setting of the arc electrode partition, the adaptability of the electrostatic adsorption device to different substrates 40 to be adsorbed is further improved. In addition, by setting the length range of the first arc electrode 311 and the second arc electrode 321 along the radial direction of the circular plane, the width of the first arc electrode 311 is minimized, while ensuring that the arc electrodes will not produce adverse phenomena such as high-voltage breakdown due to being too close, so as to maximize the gradient force that the electrostatic adsorption device can generate, while ensuring the normal operation of the electrode to generate adsorption force.

[0136] In one embodiment, the electrostatic adsorption device further includes a protective layer, which covers the insulating dielectric layer 20 , and is used to contact the substrate 40 to be adsorbed by the electrostatic adsorption device.

[0137] In one embodiment, the volume resistivity of the protective layer is greater than or equal to 10 14 Ω·cm.

[0138] In one embodiment, the volume resistivity of the insulating dielectric layer 20 is greater than or equal to 10 14 Ω·cm.

[0139] The utility model can improve the wear resistance of the electrostatic adsorption device and improve the service life and reliability of the electrostatic adsorption device by arranging a protective layer on the surface of the insulating medium layer 20; at the same time, by using the insulating medium layer 20 and the protective layer with high body resistivity, the leakage current of the electrostatic adsorption device is reduced, so that the electrostatic adsorption device can maintain the adsorption of the substrate 40 to be adsorbed for a longer time, thereby improving the adsorption reliability of the electrostatic adsorption device.

[0140] In one embodiment, the insulating dielectric layer 20 is made of a material with a high melting point and high bulk resistivity, such as aluminum oxide, AlN, or polyimide.

[0141] Specifically, the insulating dielectric layer 20 covers all exposed surfaces of the first electrode region and each part of the second electrode region in each circular electrode partition and fills the gaps between any adjacent parts of the first electrode region and the second electrode region and the spacer ring region 24 to ensure that the first electrode region is not short-circuited with the second electrode region, while protecting the electrodes from oxidation or damage.

[0142] Specifically, if Figure 2 Shown Figure 1 In the locally enlarged detail diagram, the electrode connection point of the first electrode area in each circular electrode partition is electrically connected to one end of the first electrode connection line 361, the electrode connection point of the second electrode area is electrically connected to one end of the second electrode connection line 362, and the other end of the first electrode connection line 361 (not connected to the first electrode area) and the other end of the second electrode connection line 362 (not connected to the second electrode area) are respectively connected to the two electrodes of the power supply 363, thereby supplying power to the first electrode area and the second electrode area.

[0143] In one embodiment, the first electrode connection line 361 and the first branch portion 312312 are fixedly connected by brazing, conductive adhesive bonding, or the like; the second electrode connection line 362 and the second branch portion 322322 are fixedly connected by brazing, conductive adhesive bonding, or the like.

[0144] In one embodiment, the first electrode region is electrically connected to the positive electrode of the power source 363 , and the second electrode region is electrically connected to the negative electrode of the power source 363 .

[0145] In one embodiment, the first electrode region is electrically connected to the negative electrode of the power source 363 , and the second electrode region is electrically connected to the positive electrode of the power source 363 .

[0146] In one embodiment, Figure 1-Figure 2As shown, a bump layer 41 may be further provided between the insulating medium layer 20 and the protective layer (not shown in the figure) of the electrostatic adsorption device, and the protective layer covers the exposed surface of the bump layer 41 .

[0147] In one embodiment, the material of the bump layer 41 is consistent with the material of the insulating dielectric layer 20 .

[0148] In one embodiment, the bump layer 41 can be formed on the insulating dielectric layer 20 by processes such as exposure, etching, and sandblasting.

[0149] In one embodiment, the protection layer can be combined with the bump layer 41 by vapor deposition, magnetron sputtering or other processes.

[0150] Specifically, the electrostatic adsorption device provided with the bump layer 41 increases the particle accommodation space between the substrate 40 to be adsorbed and the electrostatic adsorption device through the presence of the bumps, reducing the risk of particles directly getting stuck on the contact surface between the substrate 40 to be adsorbed and the electrostatic adsorption device, causing surface damage to the substrate 40 to be adsorbed, thereby improving the yield rate of the substrate 40 to be adsorbed after adsorption by the electrostatic adsorption device; however, at the same time, the presence of the bump layer 41 reduces the polarization electric field between the substrate 40 to be adsorbed and the electrostatic adsorption device, thereby reducing the adsorption force strength of the electrostatic adsorption device on the substrate 40 to be adsorbed. Those skilled in the art can choose whether to provide the bump layer 41 based on the requirements for the surface quality and adsorption force strength of the substrate 40 to be adsorbed in actual applications. This embodiment is mainly used to provide a stronger adsorption force for the substrate 40 to be adsorbed with a high resistivity, so the bump layer 41 is preferably not provided.

[0151] In one embodiment, the volume resistivity of the substrate 40 to be adsorbed is greater than or equal to 10 13 Specifically, the volume resistivity of the substrate 40 to be adsorbed can also be a smaller value, but only when the volume resistivity of the substrate 40 to be adsorbed is higher can the solution of the present invention achieve the adsorption effect of the high-resistivity substrate 40 to be adsorbed that cannot be adsorbed by the prior art.

[0152] In one embodiment, the substrate 40 to be adsorbed is a material with high resistivity such as sapphire, glass substrate, ceramic substrate, etc., or other suitable materials.

[0153] In one embodiment, Figure 1-Figure 2 As shown, the electrostatic adsorption device also includes a carrier layer 10, the first electrode area and the second electrode area are located on the upper surface of the carrier layer 10, and the insulating medium layer 20 filling the gap between the first electrode area and the second electrode area and the spacer ring area 24 is also located on the upper surface of the carrier layer 10.

[0154] In one embodiment, the first electrode region and the second electrode region can be connected to the bottom carrier layer 10 respectively by spraying, vapor deposition or printing, and then sintered at high temperature to tightly combine the first electrode region and the second electrode region with the carrier layer 10.

[0155] In one embodiment, the insulating dielectric layer 20 can be tightly combined with the bottom carrier layer 10 by printing, casting, high-temperature co-firing or other processes.

[0156] In one embodiment, after the basic structure of the electrostatic adsorption device is prepared, the final electrostatic adsorption device is processed and manufactured through grinding, polishing and cleaning.

[0157] Example 2:

[0158] This embodiment provides an electrostatic adsorption device. Other features of the electrostatic adsorption device are the same as those of the first embodiment, except that:

[0159] In this embodiment, Figure 6-Figure 9 As shown, Figure 6 This is the overall top view of the electrostatic adsorption device. Figure 7 for Figure 6 A detailed enlarged view of part C in the middle. Figure 8 for Figure 6 A magnified view of the details of part D. Figure 9 for Figure 6 In the enlarged detail view of part E, the second arc electrodes 321 closest to the first avoidance arc 331 are separated by the first avoidance arc 331 , and the first arc electrodes 311 closest to the second avoidance arc 332 are separated by the second avoidance arc 332 .

[0160] In one embodiment, Figure 6 As shown, it includes two second circular electrode partitions 23 and a spacer ring area 24. The spacer ring area 24 includes three first air-avoidance areas 33. The inner second circular electrode partition 23 includes three second air-avoidance areas 34. Each first air-avoidance area 33 and the closest second air-avoidance area 34 correspond to each other in the same radial direction of the circular plane.

[0161] Each first clearance area 33 is located in the radial direction of the circular plane of the spacing ring area 24 corresponding to the second branch portion 322 of the circular electrode partition closest to the inner side of the first clearance area 33;

[0162] In each second circular electrode partition 23, the second avoidance area 34 passing through the second branch portion 322 is an empty area formed within the eighth avoidance arc 344 on the second branch portion 322 through which the second avoidance area 34 passes; the eighth avoidance arc 344 is a full arc portion that surrounds the second avoidance area 34 with the center point of the second avoidance area 34 through which the second branch portion 322 passes as the center of the circle; the second arc electrodes 321 located on both sides of the eighth avoidance arc 344 are separated by the eighth avoidance arc 344.

[0163] Example 3:

[0164] This embodiment provides an electrostatic adsorption device. Other features of the electrostatic adsorption device are the same as those of the first embodiment, except that:

[0165] In this embodiment, Figure 10-12 As shown, Figure 10 This is the overall top view of the electrostatic adsorption device. Figure 11 for Figure 10 A magnified view of the details of part F in the middle. Figure 12 for Figure 10 A detailed enlarged view of the middle G portion shows that any one or more spacing ring areas 24 include p first air avoidance areas 33, and any one or more circular electrode partitions include q second air avoidance areas 34; the closest first air avoidance areas 33 and second air avoidance areas 34 are not on the same radial direction of the circular plane; p and q are both integers greater than or equal to 0, and p and q are not 0 at the same time.

[0166] In one embodiment, Figure 10 As shown, it includes 2 circular electrode partitions and 1 spacer ring area 24. The spacer ring area 24 includes 3 first air avoidance areas 33, and the inner circular electrode partition includes 3 second air avoidance areas 34. The first air avoidance areas 33 and the second air avoidance areas 34 are not on the same radial direction of the circular plane, and the angle between the radial directions of the circular planes where the closest first air avoidance areas 33 and second air avoidance areas 34 are located is 60°.

[0167] In one embodiment, it includes two circular electrode partitions and one spacer ring area 24, the spacer ring area 24 includes four first air avoidance areas 33, and the inner circular electrode partition includes four second air avoidance areas 34. The first air avoidance areas 33 and the second air avoidance areas 34 are not on the same radial direction of the circular plane, and the angle between the radial directions of the circular plane where the closest first air avoidance areas 33 and second air avoidance areas 34 are located is 45°.

[0168] In one embodiment, Figure 10-12As shown, a third avoidance arc 333 is formed by surrounding the first avoidance arc 331 with the center point of the first avoidance area 33 as the center, and the second arc electrodes 321 closest to both sides of the first avoidance arc 331 are connected to the second branch portions 322 closest to the first avoidance arc 331 through the third avoidance arc 333; a fourth avoidance arc 334 is formed by surrounding the second avoidance arc 332 with the center point of the first avoidance area 33 as the center, and the first arc electrodes 311 closest to both sides of the second avoidance arc 332 are connected to the first branch portions 312 closest to the second avoidance arc 332 through the fourth avoidance arc 334;

[0169] Each first avoidance region 33 is located in the radial direction of the circular plane of the first branch portion 312 of the circular electrode partition closest to the inner side of the first avoidance region 33 in the spacing ring region 24. The first electrode region and the second electrode region close to the first avoidance region 33 are deformed to avoid the position so as to obtain a space for the first avoidance region 33.

[0170] The second avoidance area 34 passing through the second branch portion 322 is an empty area formed within the eighth avoidance arc 344 on the second branch portion 322 through which the second avoidance area 34 passes; the eighth avoidance arc 344 is a full arc portion surrounding the second avoidance area 34 with the center point of the second avoidance area 34 through which the second branch portion 322 passes as the center of the circle; the second arc electrodes 321 located on both sides of the eighth avoidance arc 344 are separated by the eighth avoidance arc 344.

[0171] Example 4:

[0172] This embodiment provides an electrostatic adsorption device. Other features of the electrostatic adsorption device are the same as those of the third embodiment, except that:

[0173] In this embodiment, Figure 13-15 As shown, Figure 13 This is the overall top view of the electrostatic adsorption device. Figure 14 for Figure 13 A detailed enlarged view of the H part. Figure 15 for Figure 13 In the enlarged detail view of part I, the second arc electrodes 321 closest to the first avoidance arc 331 are separated by the first avoidance arc 331 , and the first arc electrodes 311 closest to the second avoidance arc 332 are separated by the second avoidance arc 332 .

[0174] In one embodiment, any one or more spacing ring areas 24 include p first air avoidance areas 33, and any one or more circular electrode partitions include q second air avoidance areas 34; the closest first air avoidance areas 33 and second air avoidance areas 34 are not on the same radial direction of the circular plane; p and q are both integers greater than or equal to 0, and p and q are not 0 at the same time.

[0175] In one embodiment, Figure 13 As shown, it includes 2 circular electrode partitions and 1 spacer ring area 24. The spacer ring area 24 includes 3 first air avoidance areas 33, and the inner circular electrode partition includes 3 second air avoidance areas 34. The first air avoidance areas 33 and the second air avoidance areas 34 are not on the same radial direction of the circular plane, and the angle between the radial directions of the circular planes where the closest first air avoidance areas 33 and second air avoidance areas 34 are located is 60°.

[0176] In one embodiment, Figure 13-15 As shown, each first clearance area 33 is located in the radial direction of the circular plane where the second branch portion 322 of the circular electrode partition closest to the inner side of the first clearance area 33 is located in the spacing ring area 24;

[0177] In each second circular electrode partition 23, the second avoidance area 34 passing through the first branch portion 312 is an empty area formed within the seventh avoidance arc 343 on the first branch portion 312 through which the second avoidance area 34 passes; the seventh avoidance arc 343 is a full arc portion that surrounds the second avoidance area 34 with the center point of the second avoidance area 34 passing through the first branch portion 312 as the center of the circle; the first arc electrodes 311 located on both sides of the seventh avoidance arc 343 are separated by the seventh avoidance arc 343.

[0178] Example 5:

[0179] This embodiment provides an electrostatic adsorption device. Other features of the electrostatic adsorption device are the same as those of the first embodiment, except that:

[0180] In this embodiment, the a circular electrodes are all the first circular electrode partition 22;

[0181] Each group of first arc portions within each first circular electrode partition 22 is distributed on the same side of the first circumferential direction 13 of the circular plane with its corresponding first branch portion 312, and each group of second arc portions within each first circular electrode partition 22 is distributed on the same side of the second circumferential direction 14 of the circular plane with its corresponding second branch portion 322; the closest first branch portion 312 and second branch portion 322 within each first circular electrode partition 22 are located back to back in the same radial direction of the circular plane; one of the first circumferential direction 13 and the second circumferential direction 14 is clockwise, and the other is counterclockwise.

[0182] In one embodiment, the first electrode region and the second electrode region near the second avoidance region 34 are deformed to obtain a space for setting the second avoidance region 34;

[0183] In each first annular electrode partition 22 , a second avoidance area 34 is an empty area formed between a fifth avoidance arc 341 on the first branch portion 312 through which the second avoidance area 34 passes and a sixth avoidance arc 342 on the second branch portion 322 through which the second avoidance area 34 passes.

[0184] The fifth avoidance arc 341 is a semicircular arc portion that surrounds one side of the second avoidance area 34 with the center point of the second avoidance area 34 through which the first branch portion 312 of the first annular electrode partition 22 passes as the center.

[0185] The sixth avoidance arc 342 is a semicircular arc portion that surrounds the other side of the second avoidance area 34 with the center point of the second avoidance area 34 through which the second branch portion 322 of the same first circular electrode partition 22 passes as the center.

[0186] The first arc electrodes 311 located on both sides of the second avoidance area 34 are separated by the fifth avoidance arc 341 and the sixth avoidance arc 342 at corresponding positions. The second arc electrodes 321 located on both sides of the second avoidance area 34 are separated by the fifth avoidance arc 341 and the sixth avoidance arc 342 at corresponding positions.

[0187] Specifically, the "one side surrounding the second air avoidance area 34" mentioned in this article refers to the side that the first branch portion 312 through which the second air avoidance area 34 passes is close to, and the "other side surrounding the second air avoidance area 34" refers to the side that the second branch portion 322 through which the second air avoidance area 34 passes is close to.

[0188] In one embodiment, the portion of the second electrode region within the first annular electrode partition 22 outside the first clearance area 33 that is closest to the first clearance arc 331 is a first secondary clearance arc that surrounds the first clearance arc 331 with the center point of the first clearance area 33 as the center.

[0189] The portion of the first electrode region in the first annular electrode partition 22 inside the first clearance area 33 closest to the second clearance arc 332 is a second clearance secondary arc 3321 surrounding the second clearance arc 332 with the center point of the first clearance area 33 as the center.

[0190] Example 6:

[0191] This embodiment provides an electrostatic adsorption device, such as Figure 16-19 As shown, Figure 16 This is the overall top view of the electrostatic adsorption device. Figure 17 for Figure 16 A detailed enlarged view of the middle J part. Figure 18 for Figure 16 A detailed enlarged view of the K part. Figure 19 for Figure 16In the enlarged detail view of part L, a circular electrode partitions include b first circular electrode partitions 22 and c second circular electrode partitions 23, and any circular electrode partition is a first circular electrode partition 22 or a second circular electrode partition 23; b is an integer greater than 0 and less than a, and c is an integer greater than 0 and less than a.

[0192] Specifically, the first circular electrode partition 22 is the first circular electrode partition 22 in Example 5, and each group of first arc portions in each first circular electrode partition 22 is distributed on the same side of the first branch portion 312 connected to it along the first circumferential direction 13 of the circular plane, and each group of second arc portions in each first circular electrode partition 22 is distributed on the same side of the second branch portion 322 connected to it along the second circumferential direction 14 of the circular plane; the closest first branch portion 312 and second branch portion 322 in each first circular electrode partition 22 are located back to back in the same radial direction of the circular plane; one of the first circumferential direction 13 and the second circumferential direction 14 is clockwise, and the other is counterclockwise.

[0193] Specifically, the second circular electrode partition 23 is any one of the second circular electrode partitions 23 in Examples 1-4, and each group of first arc portions in each second circular electrode partition 23 is distributed on one side of the first circumferential direction 13 of the circular plane and on one side of the second circumferential direction 14 of the circular plane to which it is correspondingly connected, and each group of second arc portions in each second circular electrode partition 23 is distributed on one side of the second circumferential direction 13 of the circular plane and on one side of the second circumferential direction 14 of the circular plane to which it is correspondingly connected; there is an angle between the closest first branch portion 312 and the second branch portion 322 in each second circular electrode partition 23, and they are not located on the same radial direction of the circular plane; one of the first circumferential direction 13 and the second circumferential direction 14 is clockwise, and the other is counterclockwise.

[0194] In this embodiment, any one or more spacing ring areas 24 include p first air avoidance areas 33, and any one or more first circular electrode partitions 22 include q second air avoidance areas 34; the closest first air avoidance areas 33 and second air avoidance areas 34 are not on the same radial direction of the circular plane; p and q are both integers greater than or equal to 0, and p and q are not 0 at the same time.

[0195] In one embodiment, Figure 16As shown, the electrostatic adsorption device includes a first circular electrode partition 22 and a second circular electrode partition 23, and there is a spacer ring area 24 between the first circular electrode partition 22 and the second circular electrode partition 23. The first circular electrode partition 22 is located on the inner side of the spacer ring area 24, and the second circular electrode partition 23 is located on the outer side of the spacer ring area 24; there are three first avoidance areas evenly distributed on the spacer ring area 24 with the central axis 12 as the center, and there are three second avoidance areas evenly distributed in the first circular electrode partition 22 with the central axis 12 as the center, and the closest first avoidance area 33 and second avoidance area 34 are not on the same radial direction of the circular plane.

[0196] In one embodiment, Figure 16-Figure 19 As shown, the first electrode region and the second electrode region close to the second avoidance region 34 are arranged to avoid deformation to obtain a space for setting the second avoidance region 34;

[0197] In each first annular electrode partition 22 , a second avoidance area 34 is an empty area formed between a fifth avoidance arc 341 on the first branch portion 312 through which the second avoidance area 34 passes and a sixth avoidance arc 342 on the second branch portion 322 through which the second avoidance area 34 passes.

[0198] The fifth avoidance arc 341 is a semicircular arc portion that surrounds one side of the second avoidance area 34 with the center point of the second avoidance area 34 through which the first branch portion 312 of the first annular electrode partition 22 passes as the center.

[0199] The sixth avoidance arc 342 is a semicircular arc portion that surrounds the other side of the second avoidance area 34 with the center point of the second avoidance area 34 through which the second branch portion 322 of the same first circular electrode partition 22 passes as the center.

[0200] The first arc electrodes 311 located on both sides of the second avoidance area 34 are separated by the fifth avoidance arc 341 and the sixth avoidance arc 342 at corresponding positions. The second arc electrodes 321 located on both sides of the second avoidance area 34 are separated by the fifth avoidance arc 341 and the sixth avoidance arc 342 at corresponding positions.

[0201] In one embodiment, Figure 16-Figure 19 As shown, the portion of the first electrode region in the first circular electrode partition 22 inside the first clearance area 33 closest to the second clearance arc 332 is a second clearance secondary arc 3321 surrounding the second clearance arc 332 with the center point of the first clearance area 33 as the center.

[0202] In one embodiment, Figure 16-19 As shown, the central electrode portion 35 of the innermost first annular electrode partition 22 is a hollow hole 38 or is filled with the insulating medium layer 20 .

[0203] Example 7:

[0204] This embodiment provides an electrostatic adsorption device. Other features of the electrostatic adsorption device are the same as those of Example 6, except that:

[0205] In this embodiment, Figure 20-23 As shown, Figure 20 This is the overall top view of the electrostatic adsorption device. Figure 21 for Figure 20 A detailed enlarged view of the M part in the middle. Figure 22 for Figure 20 A detailed enlarged view of part N. Figure 23 for Figure 20 In the enlarged detail view of the middle O part, any one or more spacing ring areas 24 include p first air avoidance areas 33, and any one or more circular electrode partitions include q second air avoidance areas 34; each first air avoidance area 33 and the closest second air avoidance area 34 correspond to each other in the same radial direction of the circular plane; p and q are both integers greater than or equal to 0, and p and q are not 0 at the same time.

[0206] In one embodiment, Figure 20 As shown, it includes two first circular electrode partitions 22 and a spacer ring area 24, the spacer ring area 24 includes three first air avoidance areas 33, and the inner first circular electrode partition 22 includes three second air avoidance areas 34; each first air avoidance area 33 and the closest second air avoidance area 34 are on the same radial direction of the circular plane.

[0207] Example 8:

[0208] This embodiment provides an electrostatic adsorption device. Other features of the electrostatic adsorption device are the same as those of any of the electrostatic adsorption devices in Embodiments 1-7, except that:

[0209] In this embodiment, there are first clearance areas 33 at positions of e spacing ring areas 24 in the radial direction of the circular plane, where e is an integer greater than 0 and less than a; and there is no second clearance area 34 .

[0210] Example 9:

[0211] This embodiment provides an electrostatic adsorption device. Other features of the electrostatic adsorption device are the same as those of any of the electrostatic adsorption devices in Embodiments 1-7, except that:

[0212] In this embodiment, there is no first air-avoidance area 33 ; a second air-avoidance area 34 exists in the radial direction of the circular plane within the d annular electrode partitions, where d is an integer greater than 0 and less than or equal to a.

[0213] In summary, the electrostatic adsorption device of the present invention can be used to adsorb substrates of different sizes by setting a spacing ring area between the circular electrode partitions, thereby improving the application flexibility of the electrostatic adsorption device, so that there is no need to specially customize the electrostatic adsorption device for each size of the substrate to be adsorbed, while ensuring a wider range of applications and reducing production costs; at the same time, by setting the distribution of the first avoidance area and the second avoidance area, it can adapt to space application requirements such as the avoidance area for the movement of the ejector pin required by the substrate to be adsorbed and the through-hole area for the fixation of the insert, so as to improve the application universality of the electrostatic adsorption device; in addition, by setting the spacing ring area between adjacent circular electrode partitions The minimum distance between the two circular electrode partitions is ensured to ensure that there is no leakage between the two circular electrode partitions while maximizing space utilization; finally, by setting the coordination of the two electrode distribution methods of the first circular electrode partition and the second circular electrode partition, only two electrode connection points are needed in each circular electrode partition to realize the lead-out of the electrode, which is beneficial to reducing the wiring space required on the back of the electrostatic adsorption device and reducing the spacing between the electrode connection points between different circular electrode partitions, facilitating the integration and debugging of the electrostatic adsorption device, and increasing the arc density that the electrostatic adsorption device can accommodate, thereby improving the electrostatic adsorption adaptability of the electrostatic adsorption device to substrates to be adsorbed of different materials.

[0214] Therefore, the utility model effectively overcomes various shortcomings of the prior art and has high industrial utilization value.

[0215] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. An electrostatic adsorption device, characterized in that: The electrostatic adsorption device comprises: an insulating dielectric layer (20) and a concentric annular electrode partitions, a being an integer greater than or equal to 2; a spacing ring region (24) is present between two adjacent annular electrode partitions, each of the annular electrode partitions comprising a first electrode region and a second electrode region, the first electrode region and the second electrode region in each annular electrode partition having opposite electrical polarities; a cross section of the insulating dielectric layer (20) at a preset height is a circular plane, the center of the circular plane coincides with the central axis (12) of each annular electrode partition; e spacing ring regions (24) have first air-avoidance regions (33) at positions radially on the circular plane, e being an integer greater than or equal to 0 and less than a; and d annular electrode partitions have second air-avoidance regions (34) at positions radially on the circular plane, d being an integer greater than or equal to 0 and less than or equal to a; e and d are not both 0.

2. The electrostatic adsorption device according to claim 1, characterized in that: The minimum distance between two adjacent circular electrode partitions is 1 mm to 10 mm.

3. The electrostatic adsorption device according to claim 1, characterized in that: Any one or more of the spacer ring areas (24) include p first air-avoidance areas (33), and any one or more of the circular electrode partitions include q second air-avoidance areas (34); each of the first air-avoidance areas (33) and the closest second air-avoidance area (34) correspond to each other in the same radial direction of the circular plane; Or, any one or more of the spacer ring areas (24) include p first air-avoidance areas (33), and any one or more of the circular electrode partitions include q second air-avoidance areas (34); the closest first air-avoidance areas (33) and second air-avoidance areas (34) are not on the same radial direction of the circular plane; Both p and q are integers greater than or equal to 0, and p and q cannot be 0 at the same time.

4. The electrostatic adsorption device according to any one of claims 1 to 3, characterized in that: The first electrode area in each of the circular electrode partitions includes a central electrode portion (35), m first branch portions (312) and m groups of first arc portions, and each group of the first arc portions includes n first arc electrodes (311); the central electrode portion (35) is a first arc coinciding with the center of the circular plane, and the m first branch portions (312) extending radially along the circular plane are all connected to the outer periphery of the central electrode portion (35); each group of the first arc portions and the first branch portions (312) are connected in pairs, and the n first arc electrodes (311) in the same group of the first arc portions are arcs corresponding to n concentric circles with different radii and larger than the first arc shape at the same central angle; The second electrode area within each of the circular electrode partitions includes an edge electrode portion (37), m second branch portions (322), and m groups of second circular arc portions, and each group of the second circular arc portions includes n second circular arc electrodes (321); The edge electrode portion (37) is a second arc shaped portion coinciding with the center of the circular plane, and m second branch portions (322) extending radially along the circular plane are all connected to the inner circumference of the edge electrode portion (37); each group of the second arc portions is connected to the second branch portions (322) in pairs, and the n second arc electrodes (321) in the same group of the second arc portions are arcs corresponding to n concentric circles with different radii and smaller than the second arc shape at the same central angle; m is an integer greater than or equal to 1, and n is an integer greater than 2; the first circular arc electrodes (311) and the second circular arc electrodes (321) radially adjacent to each other along the circular plane are distributed in an interdigitated manner, and the insulating dielectric layer (20) covers the exposed surfaces of the first circular arc electrodes (311) and the second circular arc electrodes (321) in each circular electrode partition and fills the gaps between the surfaces; the radius of the central electrode portion (35) in each circular electrode partition is smaller than the radius of the second circular arc electrode (321) in the corresponding circular electrode partition, and the radius of the edge electrode portion (37) in each circular electrode partition is larger than the radius of the first circular arc electrode (311) in the corresponding circular electrode partition; The a circular electrode partitions include b first circular electrode partitions (22) and c second circular electrode partitions (23), and any one of the circular electrode partitions is the first circular electrode partition (22) or the second circular electrode partition (23); b is an integer greater than or equal to 0 and less than or equal to a, and c is an integer greater than or equal to 0 and less than or equal to a; Each group of the first arc portions in each first circular electrode partition (22) is distributed on the same side of the first branch portion (312) to which it is connected along the first circumferential direction (13) of the circular plane, and each group of the second arc portions in each first circular electrode partition (22) is distributed on the same side of the second branch portion (322) to which it is connected along the second circumferential direction (14) of the circular plane; the first branch portion (312) and the second branch portion (322) closest to each other in each first circular electrode partition (22) are located back to back in the same radial direction of the circular plane; one of the first circumferential direction (13) and the second circumferential direction (14) is a clockwise direction, and the other is a counterclockwise direction; Each group of the first arc portions in each second circular electrode partition (23) is distributed on one side of the first branch portion (312) connected thereto along the first circumferential direction (13) of the circular plane and on one side of the second circumferential direction (14) of the circular plane, and each group of the second arc portions in each second circular electrode partition (23) is distributed on one side of the second branch portion (322) connected thereto along the first circumferential direction (13) of the circular plane and on one side of the second circumferential direction (14) of the circular plane; an angle exists between the first branch portion (312) and the second branch portion (322) closest to each other in each second circular electrode partition (23), and the two branches are not located in the same radial direction of the circular plane; one of the first circumferential direction (13) and the second circumferential direction (14) is clockwise, and the other is counterclockwise.

5. The electrostatic adsorption device according to claim 4, characterized in that: The central electrode portion (35) is a major arc with an opening; or the central electrode portion (35) is a full-circular ring; The edge electrode portion (37) is a major arc with an opening; or the edge electrode portion (37) is a full circular ring.

6. The electrostatic adsorption device according to claim 4, characterized in that: The angle between two adjacent first branch portions (312) and the angle between two adjacent second branch portions (322) in each first circular electrode partition (22) are equal; the angle between adjacent first branch portions (312) and second branch portions (322) in each second circular electrode partition (23) are equal.

7. The electrostatic adsorption device according to claim 4, characterized in that: Each first air avoidance area (33) is located in the radial direction of the circular plane where the first branch portion (312) or / and the second branch portion (322) of the circular electrode partition closest to the inner side of the first air avoidance area (33) are located in the spacing ring area (24), and the first electrode area and the second electrode area close to the first air avoidance area (33) are deformed to avoid position so as to obtain a space for setting the first air avoidance area (33); The portion of the first electrode region of the circular electrode partition closest to the outside of the first avoidance area (33) corresponding to the first avoidance area (33) is a first avoidance arc (331) surrounding the outside of the first avoidance area (33) with the center point of the first avoidance area (33) as the center of the circle; The portion of the second electrode region of the circular electrode partition closest to the inner side of the first air avoidance area (33) corresponding to the first air avoidance area (33) is a second avoidance arc (332) surrounding the inner side of the first air avoidance area (33) with the center point of the first air avoidance area (33) as the center of the circle.

8. The electrostatic adsorption device according to claim 7, characterized in that: When the first circular electrode partition (22) is located outside the first avoidance area (33), the portion of the second electrode area within the first circular electrode partition (22) closest to the first avoidance arc (331) is a first avoidance secondary arc that surrounds the first avoidance arc (331) with the center point of the first avoidance area (33) as the center; When the inner side of the first avoidance area (33) is the first circular electrode partition (22), the part of the first electrode area in the first circular electrode partition (22) closest to the second avoidance arc (332) is a second avoidance secondary arc (3321) that surrounds the second avoidance arc (332) with the center point of the first avoidance area (33) as the center of the circle.

9. The electrostatic adsorption device according to claim 7, characterized in that: A third avoidance arc (333) is formed by surrounding the first avoidance arc (331) with the center point of the first avoidance area (33) as the center of the circle, and the second arc electrode (321) closest to both sides of the first avoidance arc (331) is connected to the second branch portion (322) closest to the first avoidance arc (331) through the third avoidance arc (333); a fourth avoidance arc (334) is formed by surrounding the second avoidance arc (332) with the center point of the first avoidance area (33) as the center of the circle, and the first arc electrode (311) closest to both sides of the second avoidance arc (332) is connected to the first branch portion (312) closest to the second avoidance arc (332) through the fourth avoidance arc (334); Alternatively, the second arc electrodes (321) closest to both sides of the first avoidance arc (331) are separated by the first avoidance arc (331), and the first arc electrodes (311) closest to both sides of the second avoidance arc (332) are separated by the second avoidance arc (332).

10. The electrostatic adsorption device according to claim 4, characterized in that: The first electrode area and the second electrode area close to the second air avoidance area (34) are arranged in an avoidance deformation manner to obtain a space for arranging the second air avoidance area (34); In the first circular electrode partition (22), one of the second avoidance regions (34) is an empty area formed between a fifth avoidance arc (341) on the first branch portion (312) through which the second avoidance region (34) passes, and a sixth avoidance arc (342) on the second branch portion (322) through which the same second avoidance region (34) passes; The fifth avoidance arc (341) is a semicircular arc portion that surrounds one side of the second avoidance area (34) with the center point of the second avoidance area (34) through which the first branch portion (312) of the first circular electrode partition (22) passes as the center of the circle; The sixth avoidance arc (342) is a semicircular arc portion that surrounds the other side of the second avoidance area (34) with the center point of the second avoidance area (34) through which the second branch portion (322) of the same first circular electrode partition (22) passes as the center of the circle; The first arc electrodes (311) located on both sides of the second avoidance area (34) are separated by the fifth avoidance arc (341) and the sixth avoidance arc (342) at corresponding positions, and the second arc electrodes (321) located on both sides of the second avoidance area (34) are separated by the fifth avoidance arc (341) and the sixth avoidance arc (342) at corresponding positions.

11. The electrostatic adsorption device according to claim 4, characterized in that: The first electrode area and the second electrode area close to the second air avoidance area (34) are arranged in an avoidance deformation manner to obtain a space for arranging the second air avoidance area (34); In the second circular electrode partition (23), the second avoidance area (34) passing through the first branch portion (312) is an empty area formed within the seventh avoidance arc (343) on the first branch portion (312) through which the second avoidance area (34) passes, and the second avoidance area (34) passing through the second branch portion (322) is an empty area formed within the eighth avoidance arc (344) on the second branch portion (322) through which the second avoidance area (34) passes; The seventh avoidance arc (343) is a full arc portion that surrounds the second avoidance area (34) with the center point of the second avoidance area (34) through which the first branch portion (312) passes as the center of the circle; the first arc electrodes (311) located on both sides of the seventh avoidance arc (343) are separated by the seventh avoidance arc (343); The eighth avoidance arc (344) is a full arc portion that surrounds the second avoidance area (34) with the center point of the second avoidance area (34) through which the second branch portion (322) passes as the center of the circle; the second arc electrodes (321) located on both sides of the eighth avoidance arc (344) are separated by the eighth avoidance arc (344).

12. The electrostatic adsorption device according to claim 1, characterized in that: The first air-avoidance regions (33) within each of the spacer ring regions (24) are uniformly distributed along the first circumferential direction (13) or the second circumferential direction (14) of the circular plane; and / or the second air-avoidance regions (34) within each of the circular electrode partitions are uniformly distributed along the first circumferential direction (13) or the second circumferential direction (14) of the circular plane.

13. The electrostatic adsorption device according to claim 1, characterized in that: The area ratio of the first electrode area to the second electrode area in each of the circular electrode partitions is equal to 1; the electrostatic adsorption device further comprises a protective layer, the protective layer covering the insulating dielectric layer (20), the protective layer being used to contact the substrate (40) to be adsorbed by the electrostatic adsorption device, and the volume resistivity of the protective layer being greater than or equal to 10 14 Ω·cm; or the volume resistivity of the insulating dielectric layer (20) is greater than or equal to 10 14 Ω·cm.

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