Semiconductor device packaging structure

Abstract

The utility model relates to the field of semiconductor packaging, in particular to a semiconductor device packaging structure, which comprises a shell, a top cover arranged above the shell, a chip main body arranged in the shell, a lead fixedly connected to one side of the chip main body, a rectangular frame arranged below the top cover, an abutting block arranged at the bottom of the rectangular frame, and a clamping block arranged below the abutting block. The bottom of the rectangular frame is provided with a limiting mechanism for fixing the chip body through an abutting block, the two sides of the shell are provided with clamping plates, the two sides of the shell are provided with clamping mechanisms for fixing the top cover through the clamping plates, one side of the shell is provided with a first rectangular plate, and pins are installed on the first rectangular plate. During use, by pressing one ends of the clamping plates on the two sides, the second spring contracts, the other ends of the clamping plates tilt and move out of the limiting grooves, and then the pressing plate is pressed, so that the chip body in the first rectangular groove can be conveniently taken out for replacement, and the shell and the top cover can be continuously used.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor device packaging structure. Background Art

[0002] Semiconductors are materials with electrical conductivity intermediate between conductors (such as copper) and insulators (such as rubber). Their unique value lies in their ability to be precisely controlled through temperature, light, electric fields, or doping. Semiconductors are a core building block of today's technology, essential for nearly all modern electronic devices.

[0003] After searching, the existing semiconductor packaging structure is a semiconductor device packaging structure disclosed with publication number CN218887178U, which fixes the bent part of the pin in the lower fixing groove on the inner groove during use, and fixes the pin again while electrically connecting the pin through the connecting plate to avoid the pin from moving when the upper cover and the outer shell are welded. However, in this practice, the upper cover is directly welded to the top of the outer shell. Once the chip body in the chip slot is damaged and cannot be used normally, the chip body cannot be taken out for replacement and can only be replaced together with the upper cover and the outer shell, resulting in unnecessary cost increase. Therefore, a semiconductor device packaging structure is proposed. Utility Model Content

[0004] The purpose of the utility model is to solve the disadvantage that the upper cover is directly welded to the top of the outer shell. Once the chip body in the chip body groove is damaged and cannot be used normally, the chip body cannot be taken out for replacement and can only be replaced together with the upper cover and the outer shell, which leads to unnecessary cost increase. A semiconductor device packaging structure is proposed.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A semiconductor device packaging structure includes a shell, a top cover is provided above the shell, a chip body is provided in the shell, a wire is fixedly connected to one side of the chip body, a rectangular frame is provided below the top cover, an abutment block is provided at the bottom of the rectangular frame, a limiting mechanism for fixing the chip body through the abutment block is provided at the bottom of the rectangular frame, a card plate is provided on both sides of the shell, a clamping mechanism for fixing the top cover through the card plate is provided on both sides of the shell, a first rectangular plate is provided on one side of the shell, a pin is installed on the first rectangular plate, the limiting mechanism includes a rectangular shell fixedly connected to the bottom of the rectangular frame, the The inner bottom of the rectangular shell is fixedly connected to a first spring, one end of the first spring is fixedly connected to a second rectangular plate, the abutment block is fixedly connected to the top of the second rectangular plate, one side of the rectangular shell is provided with a first rectangular opening, one side of the second rectangular plate is fixedly connected to a connecting plate, one side of the connecting plate is fixedly connected to a pressing plate, and a second rectangular opening is provided at the bottom of the rectangular frame, the clamping mechanism includes a third rectangular plate fixedly connected to both sides of the shell, the third rectangular plate is fixedly connected to a connecting rod, the clamping plate is rotatably connected to the connecting rod, and the two sides of the shell are fixedly connected to a second spring, and one end of the second spring is fixedly connected to one side of the clamping plate.

[0007] Preferably, the rectangular frame is provided with a first rectangular groove, the chip body is located in the first rectangular groove, the connecting plate is located in the first rectangular opening, the abutment block abuts against the bottom of the chip body through the second rectangular opening, the bottom of the shell is fixedly connected with a second connecting block, and the bottom of the second connecting block is fixedly connected to the top of the rectangular frame.

[0008] Preferably, a first rectangular block is fixedly connected to both sides of the shell, a placement groove is provided on the top of the shell and the first rectangular block, a second rectangular block is fixedly connected to both sides of the top cover, the top cover and the second rectangular block are located in the placement groove, a limiting groove is provided on one side of the second connecting block and the second rectangular block, and one end of the clamping plate is located in the limiting groove.

[0009] Preferably, a third rectangular opening is provided on one side of the shell, a second rectangular groove is provided at the third rectangular opening, the first rectangular plate is located in the second rectangular groove, threaded holes are provided in the first rectangular plate and the second rectangular groove, the threaded holes are threadedly connected with fixing bolts, a mounting plate is fixedly connected to the bottom of the shell, and heat dissipation holes are provided on both sides of the shell.

[0010] Compared with the prior art, the beneficial effects of the present invention are:

[0011] When the device is in use, by pressing one end of the card plates on both sides, the second spring contracts, the other end of the card plates tilts up and moves out of the limit groove, and then the rectangular frame is taken out from the inside of the shell. Next, the pressing plate is pressed, the connecting plate drives the second rectangular plate to move, the first spring contracts, and the second rectangular plate drives the abutment block to descend, thereby facilitating the removal of the chip body in the first rectangular groove for replacement, and the shell and top cover can continue to be used, avoiding unnecessary cost increases. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a semiconductor device packaging structure proposed by the present invention;

[0013] Figure 2 This is a schematic diagram of the three-dimensional structure of a clamping mechanism of a semiconductor device packaging structure proposed by the present invention;

[0014] Figure 3 for Figure 2 Schematic diagram of the three-dimensional structure at A in the middle;

[0015] Figure 4 This is a schematic diagram of the three-dimensional structure of a limiting mechanism of a semiconductor device packaging structure proposed by the present invention;

[0016] Figure 5 for Figure 4 Schematic diagram of the three-dimensional structure at point B in the middle.

[0017] In the figure: 1. Shell; 2. Top cover; 3. Chip body; 4. Wire; 5. Rectangular frame; 6. Abutment block; 7. Card; 8. First rectangular plate; 9. Pin; 10. Rectangular shell; 11. First spring; 12. Second rectangular plate; 13. First rectangular opening; 14. Connecting plate; 15. Pressing plate; 16. Second rectangular opening; 17. Second connecting block; 18. Third rectangular plate; 19. Second spring; 20. First rectangular block; 21. Second rectangular block; 22. Limiting groove; 23. Mounting plate; 24. Heat dissipation hole. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0019] Reference Figure 1-Figure 5A semiconductor device packaging structure includes a shell 1, a top cover 2 is arranged above the shell 1, a chip body 3 is arranged inside the shell 1, and a wire 4 is fixedly connected to one side of the chip body 3. The shell 1 and the top cover 2 protect the internally packaged chip body 3.

[0020] A rectangular frame 5 is provided below the top cover 2, and an abutment block 6 is provided at the bottom of the rectangular frame 5. A limiting mechanism is provided at the bottom of the rectangular frame 5 for fixing the chip body 3 through the abutment block 6. The limiting mechanism allows the abutment block 6 to abut and limit the chip body 3, preventing the chip body 3 from falling off the rectangular frame 5.

[0021] It should be noted that the abutting block 6 is made of rubber and has an anti-slip pattern on the bottom, so as to prevent the chip body 3 from sliding.

[0022] Card plates 7 are provided on both sides of the shell 1, and card connection mechanisms for fixing the top cover 2 through the card plates 7 are provided on both sides of the shell 1. Through the card connection mechanism, the card plates 7 limit and fix the top cover 2 above the shell 1. When the top cover 2 needs to be removed, the angle of the card plates 7 is changed to remove the top cover 2.

[0023] A first rectangular plate 8 is provided on one side of the housing 1 , on which a pin 9 is mounted. One end of the pin 9 is connected to the wire 4 , thereby connecting the internal circuit of the chip body 3 with the external system.

[0024] The limiting mechanism includes a rectangular shell 10 fixedly connected to the bottom of the rectangular frame 5, the inner bottom of the rectangular shell 10 is fixedly connected to a first spring 11, one end of the first spring 11 is fixedly connected to a second rectangular plate 12, and the abutment block 6 is fixedly connected to the top of the second rectangular plate 12. The elasticity of the first spring 11 allows the second rectangular plate 12 to rise, so that the abutment block 6 contacts the bottom of the chip body 3, thereby fixing and limiting the chip body 3.

[0025] A first rectangular opening 13 is opened on one side of the rectangular shell 10, a connecting plate 14 is fixedly connected to one side of the second rectangular plate 12, and a pressing plate 15 is fixedly connected to one side of the connecting plate 14. By pressing the pressing plate 15, the connecting plate 14 drives the second rectangular plate 12 to descend, and the abutment block 6 descends, so that the chip body 3 can be removed.

[0026] A second rectangular opening 16 is formed at the bottom of the rectangular frame 5 , and the second rectangular opening 16 allows the abutting block 6 below the rectangular frame 5 to abut and limit the position of the toy body on the rectangular frame 5 .

[0027] The rectangular frame 5 is provided with a first rectangular groove, the chip body 3 is located in the first rectangular groove, the connecting plate 14 is located in the first rectangular opening 13, the abutment block 6 abuts against the bottom of the chip body 3 through the second rectangular opening 16, and the connecting plate 14 descends along the first rectangular opening, thereby allowing the chip body 3 to descend to the bottom of the second rectangular opening 16.

[0028] It should be noted that one side of the rectangular frame is not sealed. The rectangular frame is generally U-shaped. When the chip body needs to be taken out, the top cover is lifted and the rectangular frame and the chip body are moved out of the shell together through the second connecting block. The pressing plate is pressed first to allow the abutment block to be retracted into the interior of the rectangular shell, so that the chip body can be pulled out from the unsealed side of the rectangular frame.

[0029] At the same time, remove the first rectangular plate together with the pins from one side of the shell. After the chip is replaced, put the chip body back into the shell, and then reinstall the first rectangular plate to one side of the shell to facilitate the connection between the pins and the wires on one side of the chip body.

[0030] The bottom of the shell 1 is fixedly connected to a second connecting block 17 , and the bottom of the second connecting block 17 is fixedly connected to the top of the rectangular frame 5 . Through the connection of the second connecting block 17 , the shell 1 can drive the rectangular frame 5 to move together.

[0031] The clamping mechanism includes a third rectangular plate 18 fixedly connected to both sides of the shell 1. The third rectangular plate 18 is fixedly connected to a connecting rod. The clamping plate 7 is rotatably connected to the connecting rod. Through the connecting rod, when one end of the clamping plate 7 is pressed, the clamping plate 7 can change its angle.

[0032] Second springs 19 are fixedly connected to both sides of the shell 1 , and one end of the second spring 19 is fixedly connected to one side of the clamping plate 7 . The elasticity of the second spring 19 allows one end of the clamping plate 7 to be clamped and limited by the first top cover 2 .

[0033] A first rectangular block 20 is fixedly connected to both sides of the shell 1, and a placement groove is provided on the top of the shell 1 and the first rectangular block 20. A second rectangular block 21 is fixedly connected to both sides of the top cover 2, and the top cover 2 and the second rectangular block 21 are located in the placement groove. The placement groove is used to limit the top cover 2 when it is placed on the top of the shell 1, so that the clamping plate 7 can limit it.

[0034] A limiting groove 22 is provided on one side of the second connecting block 17 and the second rectangular block 21 , and one end of the clamping plate 7 is located in the limiting groove 22 . Under the elastic action of the second spring 19 , one end of the clamping plate 7 is clamped into the limiting groove 22 , thereby limiting the top cover 2 .

[0035] A third rectangular opening is provided on one side of the shell 1, and a second rectangular groove is provided at the third rectangular opening. The first rectangular plate 8 is located in the second rectangular groove. Threaded holes are provided in the first rectangular plate 8 and the second rectangular groove. The threaded holes are threadedly connected with fixing bolts. The first rectangular plate 8 in the second rectangular groove is fixed using the fixing bolts through the threaded holes, thereby fixing the pin 9 in a suitable position.

[0036] A mounting plate 23 is fixedly connected to the bottom of the shell 1, and heat dissipation holes 24 are opened on both sides of the shell 1. The mounting plate 23 is used to install the device in a suitable position, and the heat dissipation holes 24 dissipate heat inside the shell 1 to prevent the chip body 3 from being damaged due to overheating.

[0037] The working principle of this utility model:

[0038] When the chip body 3 inside the housing 1 needs to be taken out for replacement, by pressing one end of the clamping plates 7 on both sides, the clamping plates 7 rotate along the connecting rod between the third rectangular plates 18, the second spring contracts, and the other end of the clamping plates 7 rises and moves out of the limiting groove 22. Then, the rectangular frame 5 is taken out of the housing 1 through the top cover 2 and the second connecting block 17;

[0039] Then, press the pressing plate 15, the pressing plate 15 drives the connecting plate 14 to move, the connecting plate 14 drives the second rectangular plate 12 to move, the first spring contracts, and the second rectangular plate 12 drives the abutment block 6 to descend and descend from the second rectangular opening 16, thereby facilitating the removal of the chip body 3 in the first rectangular groove for replacement.

[0040] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor device packaging structure, comprising a housing (1), characterized in that: A top cover (2) is provided above the shell (1), a chip body (3) is provided in the shell (1), a wire (4) is fixedly connected to one side of the chip body (3), a rectangular frame (5) is provided below the top cover (2), a contact block (6) is provided at the bottom of the rectangular frame (5), a limiting mechanism for fixing the chip body (3) through the contact block (6) is provided at the bottom of the rectangular frame (5), a card plate (7) is provided on both sides of the shell (1), a clamping mechanism for fixing the top cover (2) through the card plate (7) is provided on both sides of the shell (1), a first rectangular plate (8) is provided on one side of the shell (1), a pin (9) is installed on the first rectangular plate (8), the limiting mechanism includes a rectangular shell (10) fixedly connected to the bottom of the rectangular frame (5), the inner bottom of the rectangular shell (10) is fixed A first spring (11) is connected, one end of the first spring (11) is fixedly connected to a second rectangular plate (12), the abutting block (6) is fixedly connected to the top of the second rectangular plate (12), a first rectangular opening (13) is opened on one side of the rectangular shell (10), a connecting plate (14) is fixedly connected to one side of the second rectangular plate (12), a pressing plate (15) is fixedly connected to one side of the connecting plate (14), a second rectangular opening (16) is opened on the bottom of the rectangular frame (5), the clamping mechanism includes a third rectangular plate (18) fixedly connected to both sides of the shell (1), the third rectangular plate (18) is fixedly connected to a connecting rod, the clamping plate (7) is rotatably connected to the connecting rod, and a second spring (19) is fixedly connected to both sides of the shell (1), and one end of the second spring (19) is fixedly connected to one side of the clamping plate (7).

2. The semiconductor device packaging structure according to claim 1, wherein: The rectangular frame (5) is provided with a first rectangular groove, the chip body (3) is located in the first rectangular groove, the connecting plate (14) is located in the first rectangular opening (13), the abutting block (6) abuts against the bottom of the chip body (3) through the second rectangular opening (16), the bottom of the shell (1) is fixedly connected to a second connecting block (17), and the bottom of the second connecting block (17) is fixedly connected to the top of the rectangular frame (5).

3. The semiconductor device packaging structure according to claim 2, wherein: The shell (1) is fixedly connected to first rectangular blocks (20) on both sides, and placement grooves are provided on the tops of the shell (1) and the first rectangular block (20). The top cover (2) is fixedly connected to second rectangular blocks (21) on both sides, and the top cover (2) and the second rectangular block (21) are located in the placement grooves. A limiting groove (22) is provided on one side of the second connecting block (17) and the second rectangular block (21), and one end of the clamping plate (7) is located in the limiting groove (22).

4. The semiconductor device packaging structure according to claim 3, wherein: A third rectangular opening is provided on one side of the shell (1), a second rectangular slot is provided at the third rectangular opening, the first rectangular plate (8) is located in the second rectangular slot, threaded holes are provided on the first rectangular plate (8) and the second rectangular slot, fixing bolts are threadedly connected to the threaded holes, a mounting plate (23) is fixedly connected to the bottom of the shell (1), and heat dissipation holes (24) are provided on both sides of the shell (1).

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