High-reliability radiator chip cushion block

Abstract

The utility model provides a highly reliable radiator chip cushion block, including a cushion block base and a radiating chip, the cushion block base is internally provided with a cushion cavity, the inside of the cushion cavity is fixedly connected with a first support block, the two side walls of the cushion block base and the two sides of the first support block are all provided with first slots, and the first slots are fixedly connected with the first support block. A first open groove is formed in the first supporting block, a clamping assembly is arranged in the first open groove, second supporting blocks are fixedly connected to the two sides of the first supporting block, elastic clamping pieces are clamped between the second supporting blocks and the clamping assembly, and the heat dissipation chip is placed on the two elastic clamping pieces on the two sides of the first supporting block. According to the scheme, the slidable clamping assembly is arranged in the first open groove, after the elastic clamping piece is clamped between the second supporting block and the clamping assembly, the heat dissipation chip is arranged on the elastic clamping piece in a cushioned mode, and the sliding baffle is arranged in the second open groove in a sliding mode, so that the heat dissipation chip is clamped between the elastic clamping piece and the sliding baffle; therefore, the heat dissipation chip is detachable, and the purpose of improving the fixing effect of the heat dissipation chip is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a high-reliability radiator chip pad. Background Art

[0002] Heat sink chip pads are critical components used in electronic devices, particularly for dissipating heat from high-performance chips. As electronic devices improve in performance and miniaturize in size, the heat flux density generated by chips is increasing, requiring more efficient and sophisticated cooling solutions. The design and material selection of heat sink chip pads significantly impact the cooling performance of chips.

[0003] For example, a Chinese patent discloses a "Double-Sided Heat Dissipation Large-Size Flip-Chip Package Structure and Package Method" (Patent No.: CN112447625A). This patent includes a chip, the bottom surface of which is configured to be soldered to the top surface of a heat dissipation soldering layer, which conducts heat between the chip and the heat dissipation soldering layer; and a heat dissipation pad, the top surface of which is configured to be soldered to the bottom surface of the heat dissipation soldering layer, which conducts heat between the heat dissipation pad and the heat dissipation soldering layer. This patent has the advantage of easy heat dissipation.

[0004] However, in the above assembly process, the heat dissipation chip cannot be disassembled and replaced, and the fixing effect of the heat dissipation chip is not strong. Utility Model Content

[0005] (1) Technical problems solved

[0006] In view of the deficiencies in the prior art, the present invention provides a high-reliability heat sink chip pad, which solves the problems raised in the above-mentioned background technology.

[0007] (2) Technical solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions: a high-reliability heat sink chip pad, characterized in that: it includes a pad base and a heat dissipation chip, a pad cavity is provided in the pad base, a first support block is fixedly connected to the pad cavity, first grooves are provided on both side walls of the pad base and both sides of the first support block, a clamping assembly is provided in the first groove, second support blocks are fixedly connected on both sides of the first support block, an elastic clip is clamped between the second support block and the clamping assembly, and the heat dissipation chip is placed on the two elastic clips on both sides of the first support block.

[0009] Preferably, limit blocks are provided on both side walls of the pad base and both sides of the first support block, a sliding baffle is slidably connected inside the limit block, and a second slot is fixedly provided at both ends of the sliding baffle, and the second slot is slidably connected to the limit block.

[0010] Preferably, the clamping assembly includes two elastic members and a clamping block, one end of the elastic member is fixedly connected to the clamping block, the other end of the elastic member is fixedly connected to a side wall of the first slot, and the clamping block is slidably connected to the first slot.

[0011] Preferably, the width of the second slot is equal to the width of the limiting block.

[0012] Preferably, a limiting groove is provided on an end surface of the clamping block away from the elastic member, and the limiting groove is adapted to the elastic clip.

[0013] Preferably, a plurality of heat dissipation holes are provided on the heat dissipation chip, and the heat dissipation holes extend along the extension direction of the first support block, and the plurality of heat dissipation holes are arranged at equal distances.

[0014] (3) Beneficial effects

[0015] The utility model provides a high-reliability heat sink chip pad. It has the following beneficial effects:

[0016] 1. This solution sets a slidable clamping component in the first slot, clamps the elastic clip between the second support block and the clamping component, pads the heat sink chip on the elastic clip, and slides the sliding baffle into the second slot, so that the heat sink chip is clamped between the elastic clip and the sliding baffle, thereby making the heat sink chip detachable and achieving the purpose of improving the fixing effect of the heat sink chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0018] Figure 2 It is a right side structural schematic diagram of the present utility model.

[0019] In the figure: 11, pad base; 12, pad cavity; 13, first support block; 14, heat dissipation chip; 15, heat dissipation hole; 16, second support block; 17, elastic clip; 18, sliding baffle; 20, first slot; 21, elastic member; 22, clamping block; 23, limit slot; 24, limit block; 25, second slot. DETAILED DESCRIPTION

[0020] The present invention provides a high-reliability heat sink chip pad. Figure 1-2 As shown, it includes a pad base 11, a pad cavity 12, a first support block 13, a heat dissipation chip 14, a heat dissipation hole 15, a second support block 16, an elastic clip 17, a sliding baffle 18, a first slot 20, an elastic part 21, a clamping block 22, a limit slot 23, a limit block 24, and a second slot 25.

[0021] like Figure 1-2 As shown, a pad cavity 12 is provided in the pad base 11, and a first support block 13 is fixedly connected in the pad cavity 12. First slots 20 are provided on both side walls of the pad base 11 and both sides of the first support block 13. A clamping assembly is provided in the first slot 20. Second support blocks 16 are fixedly connected on both sides of the first support block 13. An elastic clip 17 is clamped between the second support block 16 and the clamping assembly. The heat dissipation chip 14 is placed on the two elastic clips 17 on both sides of the first support block 13. The elastic clips 17 are made of elastic metal material.

[0022] A plurality of heat dissipation holes 15 are formed on the heat dissipation chip 14 . The heat dissipation holes 15 extend along the extension direction of the first support block 13 , and the heat dissipation holes 15 are arranged at equal distances from each other.

[0023] Limit blocks 24 are also provided on both side walls of the pad base 11 and both sides of the first support block 13. A sliding baffle 18 is slidably connected inside the limit block 24. A second slot 25 is fixedly provided at both ends of the sliding baffle 18. The second slot 25 is slidably connected to the limit block 24, and the width of the second slot 25 is equal to the width of the limit block 24.

[0024] The clamping assembly includes two elastic members 21 and a clamping block 22. One end of the elastic member 21 is fixedly connected to the clamping block 22, and the other end of the elastic member 21 is fixedly connected to a side wall of the first slot 20. The clamping block 22 is slidably connected to the first slot 20. A limiting groove 23 is provided on an end surface of the clamping block 22 away from the elastic member 21, and the limiting groove 23 is adapted to the elastic clip 17.

[0025] When the chip is assembled according to this scheme, first, the elastic clip 17 is clamped between the second support block 16 and the clamping block 22 respectively. When the elastic clip 17 is clamped between the second support block 16 and the clamping block 22, the elastic clip 17 pushes the clamping block 22 toward the first slot 20 through the limit groove 23. The first slot 20 compresses the elastic part 21, and the elastic part 21 generates a reaction force on the elastic clip 17 through the clamping block 22.

[0026] Then, the heat dissipation chip 14 is pressed onto the elastic clip 17, the limit block 24 is aligned with the second slot 25, and the limit block 24 is pushed into the second slot 25. Finally, the sliding baffle 18 slides relative to the second slot 25, and the elastic clip 17 generates a reaction force on the first slot 20.

[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-reliability heat sink chip pad, characterized by: The heat dissipation device comprises a pad base (11) and a heat dissipation chip (14), wherein a pad cavity (12) is provided in the pad base (11), a first support block (13) is fixedly connected in the pad cavity (12), first slots (20) are provided on both side walls of the pad base (11) and both sides of the first support block (13), a clamping assembly is provided in the first slot (20), second support blocks (16) are fixedly connected on both sides of the first support block (13), an elastic clip (17) is clamped between the second support block (16) and the clamping assembly, and the heat dissipation chip (14) is placed on the two elastic clips (17) on both sides of the first support block (13).

2. The high-reliability heat sink chip pad according to claim 1, characterized in that: Limiting blocks (24) are also provided on both side walls of the cushion block base (11) and both sides of the first support block (13); a sliding baffle (18) is slidably connected inside the limiting block (24); and a second slot (25) is fixedly provided at both ends of the sliding baffle (18); the second slot (25) is slidably connected to the limiting block (24).

3. The high-reliability heat sink chip pad according to claim 2, characterized in that: The clamping assembly comprises two elastic members (21) and a clamping block (22), one end of the elastic member (21) is fixedly connected to the clamping block (22), the other end of the elastic member (21) is fixedly connected to a side wall of the first slot (20), and the clamping block (22) is slidably connected to the first slot (20).

4. The high-reliability heat sink chip pad according to claim 2, characterized in that: The width of the second slot (25) is equal to the width of the limiting block (24).

5. The high-reliability heat sink chip pad according to claim 3, characterized in that: A limiting groove (23) is provided on an end surface of the clamping block (22) away from the elastic member (21), and the limiting groove (23) is adapted to the elastic clip (17).

6. The high-reliability heat sink chip pad according to claim 1, characterized in that: A plurality of heat dissipation holes (15) are provided on the heat dissipation chip (14), the heat dissipation holes (15) extend along the extension direction of the first support block (13), and the plurality of heat dissipation holes (15) are arranged at equal distances.

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