Electronic device
By using the design of hollow carrier plates and liquid-cooled pipelines in electronic devices, the problem of poor heat dissipation effect is solved, and more efficient thermal management and simplified assembly process is achieved.
Patent Information
- Application Number
- CN202422056138.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-08-23
AI Technical Summary
The heat dissipation effect of existing electronic devices is limited, especially in multi-chip stacking designs. Traditional heat dissipation methods cannot effectively solve the thermal management problem of power supply modules.
The hollow carrier plate is used as the heat dissipation plate, and the liquid-cooled pipe is used as the flow channel of the coolant. The power chip is dissipated through the carrier plate, and an opening is set on the packaging layer to allow the coolant to flow through, increasing the heat conduction area, and combining the insulating layer and the connecting member to ensure electrical insulation and signal transmission.
It improves the heat dissipation effect of electronic devices, enhances the protection and heat dissipation design of power chips, simplifies the assembly process, and reduces assembly complexity.
Smart Images
Figure CN223273280U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an electronic device. Background Art
[0002] As computing power increases in electronic products, the resulting heat generation is becoming increasingly prominent. This is especially true for power modules, which operate in environments with high voltage. This high voltage generates heat, which can reduce power module performance and lifespan, necessitating even greater heat dissipation. Traditionally, exposing the chip or using a heatsink to cool the module has been used, but these methods are limited in effectiveness. Furthermore, given the increasing complexity of packaging designs, stacking multiple chips has become commonplace.
[0003] Figure 1 A side view showing a single-sided cooling structure of a power module is shown. Figure 2 A side view of the double-sided cooling structure of a power module is shown, comprising a die 1, a spacer 2, a packaging layer 3, and a copper layer 4. Both structures utilize the exposed copper layer 4 as a heat conduction medium / heat transfer contact area, removing heat energy from the exposed copper surface of the power module via heat conduction. However, the limited contact area between the single-sided and double-sided exposed copper designs limits the heat dissipation effect. Utility Model Content
[0004] In view of the problems existing in the related art, the purpose of the present invention is to provide an electronic device to at least improve the heat dissipation effect of the electronic device.
[0005] To achieve the above-mentioned objectives, the present invention provides an electronic device, comprising: a carrier board; a liquid cooling pipeline located inside the carrier board; a first power chip, the carrier board carrying the first power chip and separating the liquid cooling pipeline from the first power chip; and a packaging layer covering the carrier board and the first power chip, wherein the packaging layer has an opening exposing the liquid cooling pipeline, so as to allow coolant to flow through the liquid cooling pipeline and dissipate heat from the first power chip through the carrier board.
[0006] In some embodiments, the liquid cooling line passes through the carrier board.
[0007] In some embodiments, the openings of the encapsulation layer are disposed on opposite sides of the encapsulation layer.
[0008] In some embodiments, the liquid cooling circuit is electrically insulated from the first power chip.
[0009] In some embodiments, the electronic device further includes: a first insulating layer disposed between the carrier board and the first power chip.
[0010] In some embodiments, the electronic device further includes: a first circuit layer electrically connected to the first power chip, and a first insulating layer separating the first circuit layer and the carrier board.
[0011] In some embodiments, the electronic device further includes a connector passing through the packaging layer and electrically connected to the first circuit layer to provide an electrical signal path for the first power chip.
[0012] In some embodiments, the connector and the liquid inlet of the liquid cooling pipeline are exposed from different surfaces of the packaging layer.
[0013] In some embodiments, the connector is exposed from the first surface of the packaging layer, and the top surface of the first power chip faces the first surface.
[0014] In some embodiments, the electronic device further includes: a pin passing through the packaging layer and electrically connected to the first circuit layer, the pin being exposed from the second surface of the packaging layer, and a side surface of the first power chip facing the second surface.
[0015] In some embodiments, the electronic device further includes: a heat dissipation layer located above the first power chip, with a top surface of the heat dissipation layer exposed from the packaging layer; and a support member supported between the first power chip and the heat dissipation layer.
[0016] In some embodiments, a heat sink layer is located above the pins.
[0017] In some embodiments, the first insulating layer is a ceramic material.
[0018] In some embodiments, the electronic device further includes: a second power chip disposed on a side of the carrier opposite to the first power chip.
[0019] The beneficial technical effects of the present utility model are:
[0020] The embodiments of the present application use a hollow carrier plate as a heat sink, wherein the hollow structure can be used as a liquid cooling pipe for circulating coolant, increasing the heat dissipation area of heat conduction, improving the heat dissipation effect of electronic devices, and providing protection and heat dissipation design for power chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 A side view of a single-sided cooling structure of a power module in the prior art is shown.
[0022] Figure 2 A side view of a double-sided cooling structure of a power module in the prior art is shown.
[0023] Figure 3 A carrier plate in strip form is shown.
[0024] Figure 4 It shows that the first power chip is arranged on the first circuit layer.
[0025] Figure 5 It shows a one-to-one correspondence between connectors and interfaces.
[0026] Figure 6 The structure obtained by molding and inserting the connector into the interface.
[0027] Figure 7 A singulated electronic device is shown.
[0028] Figure 8 It shows that the liquid inlet pipeline and the liquid outlet pipeline are connected to the liquid inlet of the liquid cooling pipeline.
[0029] Figure 9 A cross-sectional view of an electronic device according to an embodiment of the present application is shown.
[0030] Figures 10 to 12 shows electronic devices according to different embodiments of the present application, Figure 10 It's a stereogram. Figure 11 This is a diagram after connecting the liquid inlet and outlet pipelines. Figure 12 It is a cross-sectional view. DETAILED DESCRIPTION
[0031] In order to better understand the spirit of the embodiments of the present application, some preferred embodiments of the present application are further described below.
[0032] The embodiments of the present application will be described in detail below. Throughout this specification, identical or similar components and components having identical or similar functions are represented by similar reference numerals. The embodiments described herein with respect to the accompanying drawings are illustrative and diagrammatic and are intended to provide a basic understanding of the present application. The embodiments of the present application should not be construed as limiting the present application.
[0033] As used herein, the terms "substantially," "substantially," and "approximately" are used to describe and illustrate small variations. When used in conjunction with an event or circumstance, the terms may refer to instances where the event or circumstance occurred precisely as well as instances where the event or circumstance occurred very approximately.
[0034] In this specification, unless otherwise specified or limited, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "above", "below", "top", "bottom" and their derivatives (such as "horizontally", "downwardly", "upwardly", etc.) should be interpreted as referring to the directions described in the discussion or depicted in the drawings. These relative terms are only used for convenience of description and do not require that the present application be constructed or operated in a specific orientation.
[0035] For ease of description, “first,” “second,” “third,” etc. may be used herein to distinguish different components in a figure or a series of figures. “First,” “second,” “third,” etc. are not intended to describe the corresponding components.
[0036] Figures 3 to 7 The diagram shows a process for forming the electronic device 100 according to an embodiment of the present application.
[0037] See also Figure 3 , providing a strip-shaped carrier board 10, the carrier board 10 has a liquid cooling pipe 20 inside, and a first circuit layer 61 and a second circuit layer 62 are provided on the carrier board 10 (in Figure 3 The lower side is not shown. First circuit layer 61 connects pins 72 and interfaces 74 of connector 70 to be formed later. The configuration of second circuit layer 62 can be the same as or different from that of first circuit layer 61. For example, second circuit layer 62 may not have interfaces 74, and the locations of second circuit layer 62 corresponding to interfaces 74 on first circuit layer 61 may instead connect pins 72. Interfaces 74 and / or lead frame pins 72 can be designed and fine-tuned based on actual product requirements. Carrier board 10 is made of a highly thermally conductive material, such as metal.
[0038] See also Figure 4 , the first power chip 31 is set on the first circuit layer 61, and after the jig 400 is flipped in the direction as shown by the arrow, the second power chip 32 is set on the second circuit layer 62. The electronic device 100 after singulation of the present application includes the following Figure 4 The number of the three units of the first power chips 31 shown can be adjusted according to actual product requirements, and the second power chips 31 can be the same as or different from the first power chips 31 .
[0039] Figure 5 The connector 70 and the interface 74 are shown to correspond to each other. After the release film is attached to the interface 74, the packaging layer 40 is wrapped. Figure 4 The structure shown in FIG, then remove the release film, and insert the connector (such as a pin) 70 into the interface 74 one by one to obtain Figure 6 In the structure shown, when forming the packaging layer 40 , the jig 400 is located in the liquid cooling pipe 20 to prevent the packaging layer 40 from being poured into the liquid cooling pipe 20 .
[0040] along Figure 6 The dotted lines shown in FIG. 1 are used to perform a singulation process (eg, cutting) to obtain the following: Figure 7 The monolithic electronic device 100 shown in FIG. 1 can be used as follows: Figure 8As shown, the liquid inlet pipe 76 and the liquid outlet pipe 78 are connected to the liquid inlet 200 of the liquid cooling pipe 20, so that the cooling liquid (such as water) in the liquid cooling pipe 20 can flow along the liquid cooling pipe 20. Figure 7 Flow in the direction indicated by the arrow.
[0041] Figure 9 A cross-sectional view of an electronic device 100 according to an embodiment of the present application is shown. The electronic device 100 includes: a carrier 10, a liquid cooling pipe 20, a first power chip 31, and a packaging layer 40. The liquid cooling pipe 20 is located inside the carrier 10; the carrier 10 supports the first power chip 31 and separates the liquid cooling pipe 20 from the first power chip 31; the packaging layer 40 covers the carrier 10 and the first power chip 31, wherein the packaging layer 40 has an opening 48 that exposes the liquid cooling pipe 20, for allowing coolant to flow through the liquid cooling pipe 20 and dissipate heat from the first power chip 31 through the carrier 10. The embodiment of the present application uses a hollow carrier 10 as a heat sink, wherein the hollow structure can be used to circulate coolant, increase the heat dissipation area for heat conduction, improve the heat dissipation effect of the electronic device 100, and provide protection and heat dissipation design for the power chip.
[0042] See also Figure 7 The liquid cooling pipeline 20 passes through the carrier board 10 , the openings 48 of the packaging layer 40 are arranged on opposite sides of the packaging layer 40 , and the liquid inlet 200 of the liquid cooling pipeline 20 is also arranged on opposite sides of the packaging layer 40 .
[0043] See also Figure 9 The second power chip 32 is disposed on the side of the carrier 10 opposite the first power chip 31. The second circuit layer 62 is electrically connected to the second power chip 32. The liquid cooling line 20 is electrically insulated from the first power chip 31. A first insulating layer 51 disposed between the carrier 10 and the first circuit layer 61 can be used to block the first circuit layer 61 from the carrier 10, thereby electrically isolating the carrier 10 from the first power chip 31 and, in turn, electrically isolating the liquid cooling line 20 from the first power chip 31. The coolant in the liquid cooling line 20 does not affect the first circuit layer 61 and the first power chip 31. Similarly, a second insulating layer 52 is disposed between the second circuit layer 62 and the carrier 10, thereby electrically isolating the second circuit layer 62 from the carrier 10 and, in turn, from the carrier 10 to the second power chip 32. The first insulating layer 51 and the second insulating layer 52 are made of ceramic material and are relatively thin to achieve insulation while avoiding interference with heat conduction.
[0044] A solder layer 92, such as solder paste, may be disposed between the first power chip 31 and the first circuit layer 61 to electrically connect the first circuit layer 61 and the first power chip 31. A connector 70 passes through the packaging layer 40 and is electrically connected to the interface 74 to electrically connect to the first circuit layer 61. The connector 70 provides an electrical signal path for the first power chip 31 to connect externally. The connector 70 and the liquid inlet 200 of the liquid cooling circuit 20 are exposed from different surfaces of the packaging layer 40. The connector 70 is exposed from the first surface 41 of the packaging layer 40, with the top surface 311 of the first power chip 31 facing the first surface 41. Pins 72 pass through the packaging layer 40 and are electrically connected to the first circuit layer 61. The pins 72 are exposed from the second surface 42 of the packaging layer 40, with the side surfaces 312 of the first power chip 31 facing the second surface 42.
[0045] Figures 10 to 12 shows an electronic device 100 according to different embodiments of the present application, Figure 10 It's a stereogram. Figure 11 This is a diagram after connecting the liquid inlet pipe 76 and the liquid outlet pipe 78. Figure 12 The electronic device 100 is a cross-sectional view. The electronic device 100 further includes a heat sink layer 80 positioned above the first power chip 31, with the top surface of the heat sink layer 80 exposed from the packaging layer 40. The electronic device 100 also includes a support member 90 supported between the first power chip 31 and the heat sink layer 80. Similarly, the heat sink layer 80 and the support member 90 are also positioned on one side of the second power chip 32. The heat sink layer 80 is positioned above the pins 72 to avoid interfering with signal transmission there. The support member 90 serves as a spacer to elevate the heat sink layer 80 and can be made of a thermally conductive conductor.
[0046] An embodiment of the present application further provides an electronic device 100, comprising: a carrier 10; a liquid cooling pipe 20 located within the carrier 10; a first power chip 31 and a second power chip 32 disposed on opposite sides of the carrier 10; and an encapsulation layer 40 covering the carrier 10, the first power chip 31, and the second power chip 32. The encapsulation layer 40 has an opening 48 exposing the liquid cooling pipe 20, allowing coolant to flow through the liquid cooling pipe 20 and dissipate heat from the first power chip 31 and the second power chip 32 via the carrier 10. The electronic device 100 also includes a first insulating layer 51 located between the carrier 10 and the first power chip 31; and a second insulating layer 52 located between the carrier 10 and the second power chip 32.
[0047] The embodiment of the present application provides a power module with both heat dissipation and chip stacking. The first power chip 31 and the second power chip 32 can be stacked on the upper and lower sides of the carrier 10 respectively. Only one fixture needs to be designed, and only one Figure 4The device can be flipped over to continue mounting components on the other side. Unlike the die side capacitor (DSC) structure, which requires two jigs to achieve stacking in both directions, it does not require top and bottom assembly, thus reducing assembly errors.
[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. An electronic device, characterized in that: include: carrier board; a liquid cooling pipeline, located inside the carrier plate; a first power chip, the carrier board carrying the first power chip and separating the liquid cooling pipeline from the first power chip; a packaging layer covering the carrier board and the first power chip, The packaging layer has an opening exposing the liquid cooling pipeline, so as to allow cooling liquid to flow through the liquid cooling pipeline and dissipate heat for the first power chip through the carrier board.
2. The electronic device according to claim 1, wherein The liquid cooling pipeline passes through the carrier plate.
3. The electronic device according to claim 2, wherein: The openings of the encapsulation layer are arranged on opposite sides of the encapsulation layer.
4. The electronic device according to claim 1, wherein Also includes: The first insulating layer is arranged between the carrier board and the first power chip.
5. The electronic device according to claim 4, characterized in that Also includes: The first circuit layer is electrically connected to the first power chip, and the first insulating layer isolates the first circuit layer and the carrier board.
6. The electronic device according to claim 5, characterized in that Also includes: The connecting member passes through the packaging layer and is electrically connected to the first circuit layer to provide an electrical signal path for the first power chip.
7. The electronic device according to claim 6, characterized in that The connecting piece and the liquid inlet of the liquid cooling pipeline are exposed from different surfaces of the packaging layer respectively.
8. The electronic device according to claim 7, wherein: The connecting member is exposed from a first surface of the packaging layer, and a top surface of the first power chip faces the first surface.
9. The electronic device according to claim 5, wherein: Also includes: A pin passes through the packaging layer and is electrically connected to the first circuit layer, the pin is exposed from the second surface of the packaging layer, and the side surface of the first power chip faces the second surface.
10. The electronic device according to claim 9, characterized in that Also includes: a heat dissipation layer, located above the first power chip, wherein a top surface of the heat dissipation layer is exposed from the packaging layer; A support member is supported between the first power chip and the heat dissipation layer.