Heat dissipation integrated semiconductor transistor
Through the design of thermal rod, thermal block and circulation tube, combined with coolant circulation and automatic temperature adjustment, the problem of low heat dissipation efficiency of transistors in high-temperature environments is solved, and efficient thermal management and stable operation are achieved.
Patent Information
- Application Number
- CN202422567322.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-23
AI Technical Summary
The prior art is difficult to effectively dissipate heat in high temperature environments, resulting in thermal runaway in transistors, affecting their working performance and life.
The design of thermal rod, thermal block, circulation tube and adjustment components is adopted, combined with coolant circulation and automatic temperature adjustment, heat is transferred through the thermal rod and thermal block, and the circulation tube is used to form fluid convection heat dissipation, and the coolant reflux is controlled through a thermostat at high temperature to improve heat dissipation efficiency.
It realizes efficient thermal management in high-temperature environments, ensures stable operation and performance of transistors, avoids thermal runaway, and adapts to high power density working conditions.
Smart Images
Figure CN223273281U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a heat dissipation integrated semiconductor transistor. Background Art
[0002] Transistors are one of the most important basic components in modern electronic devices, widely used in amplification, switching, and signal processing. With technological advancements and rising performance demands on electronic products, the power density of transistors continues to increase, leading to a significant increase in the heat generated during operation. Excessive temperatures not only affect transistor performance but can also damage the device and shorten its lifespan, necessitating heat dissipation from the transistor.
[0003] Traditional heat dissipation solutions include heat sinks, fans, and liquid cooling systems. Heat sinks increase surface area to improve heat dissipation efficiency, while fans accelerate heat dissipation by forcing air flow. However, these methods often struggle to meet the heat dissipation requirements of high-power-density transistors. Especially in high-temperature environments, the heat dissipation effect can be significantly reduced, leading to thermal runaway in the transistor. Therefore, a heat dissipation integrated semiconductor transistor is proposed. Utility Model Content
[0004] In order to remedy the above deficiencies, the present invention provides a heat dissipation integrated semiconductor transistor, aiming to improve the problem in the prior art that the heat dissipation effect may be significantly reduced in a high temperature environment.
[0005] To achieve the above-mentioned object, the present invention adopts the following technical solution: a heat dissipation integrated semiconductor transistor, comprising a housing, a thermoplastic connection plate mounted on the upper side of the housing, a plurality of pins mounted on the bottom of the housing, and a heat dissipation assembly disposed on the inner side of the housing;
[0006] The heat dissipation assembly includes a heat-conducting rod and a circulation pipe. The outer side of the heat-conducting rod is fixedly connected to the middle side of the interior of the shell, the outer side of the circulation pipe is fixedly connected to the front side of the interior of the shell, a heat-conducting block is fixedly connected to the left side of the bottom of the circulation pipe, a heat dissipation plate is fixedly connected to the middle side of the bottom of the circulation pipe, and an adjustment assembly is fixedly connected to the upper left side of the circulation pipe.
[0007] As a further description of the above technical solution:
[0008] The regulating assembly includes a shell, the interior of the shell is fixedly connected to the upper left side of the circulation pipe, a thermostat is fixedly connected to the interior of the shell, and a blocking assembly is provided on the right side of the thermostat.
[0009] As a further description of the above technical solution:
[0010] The blocking assembly includes a connecting rod, the left side of the connecting rod is fixedly connected to the right side of the thermostat, the side of the connecting rod away from the thermostat is fixedly connected to a baffle, and the left bottom of the shell is fixedly connected to a return pipe.
[0011] As a further description of the above technical solution:
[0012] The heat conducting rod is connected to the heat conducting block, and both the heat conducting rod and the heat conducting block are made of gallium nitride.
[0013] As a further description of the above technical solution:
[0014] A spring is sleeved on the outer side of the connecting rod, one end of the spring is fixedly connected to the left side of the thermostat, and the other end of the spring is fixedly connected to the right side of the baffle.
[0015] As a further description of the above technical solution:
[0016] The outer bottom of the baffle is slidably connected to the inside of the shell, and the length of the baffle is greater than the distance between the circulation pipe and the return pipe.
[0017] As a further description of the above technical solution:
[0018] One end of the return pipe away from the shell is fixedly connected to the right side of the heat sink.
[0019] As a further description of the above technical solution:
[0020] A coolant adding port is provided on the upper side of the shell.
[0021] The utility model has the following beneficial effects:
[0022] 1. In this utility model, by providing a heat-conducting rod, a heat-conducting block, and a circulation tube within the transistor, when the transistor generates high temperatures during operation, heat is effectively transferred to the circulation tube through the heat-conducting rod and the heat-conducting block. Heat generated on one side of the circulation tube creates convection, causing the coolant inside to circulate. Heat is dissipated by the heat sink, thus achieving efficient thermal management and ensuring stable operation of the transistor in high-temperature environments.
[0023] 2. In this utility model, a regulating assembly is installed outside the circulation pipe. When the temperature is too high, the paraffin inside the thermostat will melt, pushing the baffle to slide and blocking the backflow of the circulation pipe. This design allows the coolant to flow back through the return pipe quickly, increasing the circulation speed, thereby significantly improving heat dissipation efficiency and ensuring that the system can maintain good heat dissipation performance under high load conditions. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1This is a three-dimensional diagram of a heat dissipation integrated semiconductor transistor proposed by the present utility model;
[0025] Figure 2 This is a cross-sectional view of a housing of a heat dissipation integrated semiconductor transistor proposed in the present invention;
[0026] Figure 3 This is a schematic diagram of a circulating tube of a heat dissipation integrated semiconductor transistor proposed in the present invention;
[0027] Figure 4 This is a cross-sectional view of a shell of a heat dissipation integrated semiconductor transistor proposed by the present invention.
[0028] Legend:
[0029] 1. Outer shell; 2. Thermoplastic connecting plate; 3. Pins; 4. Heat conducting rod; 5. Circulation pipe; 6. Heat conducting block; 7. Heat sink; 8. Shell; 9. Thermostat; 10. Connecting rod; 11. Baffle; 12. Spring; 13. Return pipe. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0031] Reference Figure 1-3 The present invention provides an embodiment of a heat dissipation integrated semiconductor transistor, comprising a housing 1, the housing 1 being used to protect the electrical components within the transistor; a thermoplastic plate 2 being mounted on the upper side of the housing 1, the thermoplastic plate 2 being used to provide good thermal conductivity and mechanical support to ensure the stability of the semiconductor transistor in a high-temperature environment; a plurality of pins 3 being mounted on the bottom of the housing 1, the pins 3 being used to electrically connect and secure the semiconductor transistor to facilitate connection with a circuit board or other electronic components; a heat dissipation assembly being disposed on the middle side of the interior of the housing 1, the heat dissipation assembly being used to effectively dissipate heat, ensure temperature control of the semiconductor transistor during operation, and prevent performance degradation or damage due to overheating;
[0032] The heat dissipation component includes a heat-conducting rod 4 and a circulation pipe 5. The outer side of the heat-conducting rod 4 is fixedly connected to the middle side of the inner shell 1 to enhance the heat dissipation effect and improve the heat conduction efficiency. The outer side of the circulation pipe 5 is fixedly connected to the front side of the inner shell 1 to form a fluid circulation channel to facilitate the flow of the heat dissipation liquid. A heat-conducting block 6 is fixedly connected to the left side of the bottom of the circulation pipe 5. The heat-conducting block 6 is used to further improve the heat conduction efficiency and ensure that heat can be quickly dissipated. A heat dissipation plate 7 is fixedly connected to the middle side of the bottom of the circulation pipe 5. The heat dissipation plate 7 is used to increase the heat dissipation area, thereby improving the heat dissipation capacity. An adjustment component is fixedly connected to the upper left side of the circulation pipe 5 to facilitate adjusting the operating state of the heat dissipation system and ensure effective heat dissipation under different working conditions.
[0033] The regulating assembly includes a shell 8, which is fixedly connected to the upper left side of the circulation pipe 5. The shell 8 provides protection for the regulating assembly to prevent it from being affected by the external environment. A thermostat 9 is fixedly connected to the inside of the shell 8. The thermostat 9 is used to monitor and control the temperature of the heat dissipation system to achieve automatic regulation. A blocking assembly is provided on the right side of the thermostat 9. The blocking assembly prevents unnecessary fluid flow, thereby improving the efficiency of the system and ensuring the stability of the heat dissipation process.
[0034] The blocking assembly includes a connecting rod 10, the left side of the connecting rod 10 is fixedly connected to the right side of the thermostat 9, realizing the linkage between the thermostat 9 and the blocking assembly, ensuring timely adjustment when the temperature changes. The side of the connecting rod 10 away from the thermostat 9 is fixedly connected to a baffle 11, and the baffle 11 is used to physically block the flow of the fluid. The bottom left side of the shell 8 is fixedly connected to a return pipe 13, and the return pipe 13 is used to return the heat dissipation liquid to other parts of the system to form a closed loop circulation and improve the heat dissipation efficiency.
[0035] The heat-conducting rod 4 and the heat-conducting block 6 are connected to ensure that heat can be effectively transferred between the heat-conducting rod 4 and the heat-conducting block 6. The heat-conducting rod 4 and the heat-conducting block 6 are both made of gallium nitride to improve their thermal conductivity, ensure the heat dissipation effect, and adapt to high power density working environments.
[0036] A spring 12 is sleeved on the outside of the connecting rod 10 , one end of the spring 12 is fixedly connected to the left side of the thermostat 9 , and the other end of the spring 12 is fixedly connected to the right side of the connecting rod 10 . The baffle 11 provides an adjusting force to ensure the flexibility of the connecting rod 10 .
[0037] The outer bottom of the baffle 11 is slidably connected to the inside of the shell 8, allowing the baffle 11 to move freely inside 87 to achieve more precise fluid control. The length of the baffle 11 is greater than the distance between the circulation pipe 5 and the return pipe 13, ensuring that no jamming occurs during the adjustment process, thereby ensuring smooth operation of the system.
[0038] One end of the return pipe 13 away from the housing 8 is fixedly connected to the right side of the heat sink 7 to form a complete heat dissipation loop, ensuring that the heat dissipation liquid can circulate effectively and improve the heat dissipation efficiency.
[0039] A coolant addition port is provided on the upper side of the housing 1, which is convenient for adding coolant to the heat dissipation system when needed, ensuring continuous and effective heat dissipation of the system to meet the needs of long-term work.
[0040] Working principle: When the transistor is in use, heat is generated. When heat is generated, the heat will be transferred to the left side of the bottom of the circulation tube 5 through the heat-conducting rod 4 and the heat-conducting block 6. The coolant on the left side of the bottom of the circulation tube 5 will heat up. The heat of the coolant on the left side of the bottom of the circulation tube 5 causes the liquid inside the circulation tube 5 to flow upward through liquid convection, forming a reflux. During the reflux process, the coolant will pass through the heat sink 7 to cool down and absorb the heat generated by the transistor. During the reflux process, if the temperature is too high, the paraffin inside the thermostat 9 will melt, thereby pushing the connecting rod 10 to slide, and driving the baffle 11 to slide, blocking the circulation tube 5, and causing the coolant to reflux through the reflux tube 13, thereby quickly cooling down and improving the heat dissipation efficiency.
[0041] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A heat dissipation integrated semiconductor transistor, comprising a housing (1), characterized in that: A thermoplastic connecting plate (2) is installed on the upper side of the housing (1), a plurality of pins (3) are installed on the bottom of the housing (1), and a heat dissipation component is provided on the inner middle side of the housing (1); The heat dissipation assembly comprises a heat conducting rod (4) and a circulation pipe (5); the outer side of the heat conducting rod (4) is fixedly connected to the middle side of the interior of the housing (1); the outer side of the circulation pipe (5) is fixedly connected to the front side of the interior of the housing (1); a heat conducting block (6) is fixedly connected to the left side of the bottom of the circulation pipe (5); a heat dissipation plate (7) is fixedly connected to the middle side of the bottom of the circulation pipe (5); and an adjustment assembly is fixedly connected to the upper left side of the circulation pipe (5).
2. The heat dissipation integrated semiconductor transistor according to claim 1, characterized in that: The regulating assembly comprises a shell (8), the interior of the shell (8) is fixedly connected to the upper left side of the circulation pipe (5), a thermostat (9) is fixedly connected to the interior of the shell (8), and a blocking assembly is provided on the right side of the thermostat (9).
3. The heat dissipation integrated semiconductor transistor according to claim 2, characterized in that: The blocking assembly comprises a connecting rod (10), the left side of the connecting rod (10) is fixedly connected to the right side of the thermostat (9), the side of the connecting rod (10) away from the thermostat (9) is fixedly connected to a baffle (11), and the left bottom of the shell (8) is fixedly connected to a return pipe (13).
4. The heat dissipation integrated semiconductor transistor according to claim 1, characterized in that: The heat-conducting rod (4) and the heat-conducting block (6) are connected to each other, and the heat-conducting rod (4) and the heat-conducting block (6) are both made of gallium nitride.
5. The heat dissipation integrated semiconductor transistor according to claim 3, characterized in that: A spring (12) is sleeved on the outside of the connecting rod (10), one end of the spring (12) is fixedly connected to the left side of the thermostat (9), and the other end of the spring (12) is fixedly connected to the right side of the baffle (11).
6. The heat dissipation integrated semiconductor transistor according to claim 3, characterized in that: The outer bottom of the baffle (11) is slidably connected to the inside of the shell (8), and the length of the baffle (11) is greater than the distance between the circulation pipe (5) and the return pipe (13).
7. The heat dissipation integrated semiconductor transistor according to claim 3, characterized in that: One end of the return pipe (13) away from the housing (8) is fixedly connected to the right side of the heat sink (7).
8. The heat dissipation integrated semiconductor transistor according to claim 1, characterized in that: A coolant addition port is provided on the upper side of the housing (1).