Camera module

Abstract

The utility model discloses a camera module, comprising a photosensitive chip comprising a photosensitive surface; the circuit board comprises an upper surface, a lower surface and a mounting through hole, the mounting through hole penetrates through the upper surface and the lower surface, and the photosensitive chip is arranged in the mounting through hole and electrically connected with the circuit board; the pouring sealant covers the photosensitive surface, and the pouring sealant is made of a light-transmitting material; and the optical filter is arranged on the surface, far away from the light-sensitive surface, of the pouring sealant and directly faces the light-sensitive surface. The mounting through hole is used for accommodating the photosensitive chip and the pouring sealant is used for placing the optical filter, so that the height and the width of the camera module are reduced, and the miniaturization requirement of the camera module is met.

Description

Technical Field

[0001] The utility model relates to the technical field of camera technology, in particular to a camera module. Background Art

[0002] With the continuous advancement of technology, electronic devices are gradually moving towards thinner and lighter designs, or with higher screen-to-body ratios. As a key component in electronic devices, camera modules are essential for image acquisition. For example, mobile phones typically feature at least one camera module to capture images. As mobile phones become thinner and lighter, and feature higher screen-to-body ratios, traditional camera modules, due to their large space requirements, have become a significant constraint on these designs.

[0003] The thickness of the camera module results in a relatively large electronic product. Furthermore, when the camera module is wide, it takes up a significant amount of space, hindering the improvement of the screen-to-body ratio of the electronic product. Therefore, a small, ultra-thin camera module is urgently needed. Utility Model Content

[0004] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art. The present invention provides a camera module, comprising: a photosensitive chip, comprising a photosensitive surface; a circuit board, comprising an upper surface, a lower surface and a mounting through-hole, wherein the mounting through-hole passes through the upper surface and the lower surface, the photosensitive chip is arranged in the mounting through-hole and is electrically connected to the circuit board; a potting compound covering the photosensitive surface, and the potting compound is made of a light-transmitting material; and a filter, which is arranged on the surface of the potting compound away from the photosensitive surface and facing the photosensitive surface. By providing a mounting through-hole passing through the upper and lower surfaces of the circuit board and arranging the photosensitive chip in the mounting through-hole, the installation height of the photosensitive chip on the circuit board is reduced, that is, the height of the camera module is reduced, meeting the thinness requirement. At the same time, the photosensitive surface of the photosensitive chip is provided with a potting glue made of transparent material, and a filter is provided on the surface of the potting glue, so that light can pass through the filter and the potting glue in turn to reach the photosensitive surface for imaging. The potting glue will not affect the imaging of the photosensitive chip. The filter is directly set on the photosensitive chip through the potting glue, eliminating the use of the filter bracket, reducing the use area of ​​the upper surface of the circuit board, and then reducing the width of the camera module to meet the miniaturization requirements.

[0005] Further preferably, the camera module further includes a dam member disposed on the upper surface of the circuit board and in contact with the potting compound. The dam member prevents the potting compound from overflowing onto the upper surface of the circuit board, causing contamination that could affect the appearance and the normal operation of other electronic components. The dam member also helps shape the potting compound as it is poured onto the photosensitive surface, ensuring that the potting compound fills the gap between the filter and the photosensitive chip, thereby reducing potting compound usage.

[0006] Further preferably, the optical filter is partially disposed on the dam. The optical filter is partially disposed on the dam, that is, the optical filter can cover the potting compound, preventing dust or moisture from entering the potting compound and affecting the imaging quality of the final product. At the same time, the optical filter can better shape the potting compound.

[0007] Further preferably, the dam is annular and made of DAM glue. The annular dam prevents the potting glue from overflowing onto other locations on the circuit board. Furthermore, considering DAM glue's poor fluidity, high thixotropy, and tendency to accumulate, it facilitates the creation of a potting area and facilitates the injection of the potting glue.

[0008] Further preferably, the bottom surface of the photosensitive chip is flush with the lower surface. The bottom surface of the photosensitive chip and the lower surface of the circuit board are controlled to be flush to ensure the flatness of both, which is convenient for pouring the potting glue and installing the filter flatly.

[0009] Further preferably, a gap exists between the photosensitive chip and the circuit board, and the potting compound partially fills the gap. Controlling the area of ​​the photosensitive chip to be smaller than the area of ​​the mounting hole facilitates installation of the photosensitive chip into the mounting hole of the circuit board, prevents the photosensitive chip from being bumped during installation, and prevents the photosensitive chip from being tilted during installation.

[0010] Further preferably, the camera module further comprises a light shielding member, which is arranged on the lower surface and covers the mounting through hole. The light shielding member is arranged at the bottom of the camera module to prevent light from leaking from the bottom of the camera module and causing light pollution.

[0011] Further preferably, the light shielding member is an ink layer. The light shielding member is an ink layer, which is easy to process onto the lower surface of the circuit board, and the ink layer is low in cost, which can reduce the cost of the product.

[0012] Further preferably, the camera module further includes a bracket and a lens, the lens being connected to the bracket, which is disposed on the upper surface of the circuit board and outside the potting compound. The lens is disposed on the upper surface of the circuit board via the bracket, reducing the complexity of lens installation. The bracket also encapsulates the potting compound, preventing dust and moisture from entering the filter or potting compound, isolating the photosensitive chip, potting compound, and filter from the outside world, thereby improving image quality.

[0013] Further preferably, the lens and the bracket are connected by threads. The threaded connection can ensure the connection stability between the lens and the bracket and improve the service life of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the camera module provided by the present invention;

[0015] Figure 2 for Figure 1 An exploded diagram of the camera module;

[0016] Wherein, the reference numerals in the accompanying drawings are as follows:

[0017] 1-photosensitive chip; 11-photosensitive surface; 2-circuit board; 21-upper surface; 22-lower surface; 23-mounting hole; 3-potting glue; 4-filter; 5-dam; 6-gap; 7-light shielding member; 8-bracket; 9-lens. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0019] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances.

[0021] See also Figure 1-Figure 2 As shown, in this specific embodiment, a camera module includes: a photosensitive chip 1, including a photosensitive surface 11; a circuit board 2, including an upper surface 21, a lower surface 22 and a mounting through hole 23, the mounting through hole 23 passing through the upper surface 21 and the lower surface 22, the photosensitive chip 1 is arranged in the mounting through hole 23, and is electrically connected to the circuit board 2; a potting glue 3, covering the photosensitive surface 11, and the potting glue 3 is made of a light-transmitting material; a filter 4, arranged on the surface of the potting glue 3 away from the photosensitive surface 11, and facing the photosensitive surface 11. It should be noted that the potting glue 3 of this solution covers the photosensitive surface 11, which means that the potting glue 3 completely covers the photosensitive surface 11. The photosensitive surface 11 is an important part of the photosensitive chip 1 for receiving light for imaging. By making the potting glue 3 from a light-transmitting material, it will not affect the imaging of the photosensitive chip 1. Among them, the light-transmitting material can be optical glue or UV glue. By providing a mounting hole 23 on the circuit board 2 that passes through the upper surface 21 and the lower surface 22 thereof, and by placing the photosensitive chip 1 within the mounting hole 23, the mounting height of the photosensitive chip 1 on the circuit board 2 is reduced, that is, the height of the camera module is reduced, meeting the thinness requirement. At the same time, the photosensitive surface 11 of the photosensitive chip 1 is provided with a potting compound 3 made of a transparent material, and a filter 4 is provided on the surface of the potting compound 3, so that light can pass through the filter 4 and the potting compound 3 in sequence to reach the photosensitive surface 11 for imaging. The potting compound 3 will not affect the imaging of the photosensitive chip 1. The filter 4 is directly provided on the photosensitive chip 1 through the potting compound 3, eliminating the need for a filter bracket, reducing the usable area of ​​the upper surface 21 of the circuit board 2, and further reducing the width of the camera module, meeting the miniaturization requirement.

[0022] It should be noted that the potting compound 3 is arranged to cover the photosensitive surface 11 through a potting process. The potting process is mature and simple, and does not require complex molds. The photosensitive chip 1 can be placed in the mounting hole 23 of the circuit board 2 to meet the needs of mass production. The potting compound 3 is transparent and can achieve optical transmittance. Covering the photosensitive surface 11 will not affect the imaging of the camera module. In the prior art, the photosensitive chip 1 and the circuit board 2 are encapsulated through an injection molding process. The encapsulation material is an opaque material, so the encapsulation material cannot be set on the photosensitive surface 11, but can only be set on other areas of the photosensitive chip 1. In addition, the injection molding process requires complex molds and processes. The encapsulation material needs to be injected into the connection between the photosensitive chip 1 and the circuit board 2 by high temperature and high pressure. This requires a reinforcing plate structure to be set at the bottom of the circuit board 2 to prevent the photosensitive chip 1 from being displaced during injection molding, which seriously affects the yield of the camera module. In comparison, the present application directly fills the potting compound 3 on the photosensitive surface 11 of the photosensitive chip 1 through a potting process. The process is simple, the camera module yield is high, and it does not affect the imaging quality of the camera module. At the same time, the potting glue 3 can prevent moisture or dust from entering the photosensitive surface 11 , and plays a good sealing role for the photosensitive chip 1 .

[0023] In one embodiment, the camera module further includes a dam 5 , which is disposed on the upper surface 21 of the circuit board 2 and is in contact with the potting compound 3 . The dam 5 prevents the potting compound 3 from overflowing onto the upper surface 21 of the circuit board 2 , thereby contaminating the surface and affecting the appearance and the normal operation of other electronic components. The dam 5 also helps to shape the potting compound 3 as it is poured onto the photosensitive surface 11 , ensuring that the potting compound 3 fills the gap between the filter 4 and the photosensitive chip 1 , thereby reducing the amount of potting compound 3 used.

[0024] Based on the above solution, the filter 4 is partially disposed on the dam 5. The filter 4 is partially disposed on the dam 5, that is, the filter 4 can completely cover the potting compound 3, preventing dust or moisture from entering the potting compound and affecting the imaging quality of the final product. At the same time, the filter 4 can better shape the potting compound 3.

[0025] Preferably, the dam 5 is annular and made of DAM glue. The annular dam 5 prevents the potting glue 3 from overflowing onto other locations on the circuit board 2. Furthermore, considering the poor fluidity, high thixotropy, and easy accumulation of DAM glue, the dam 5 facilitates the construction of a potting area and the pouring of the potting glue 3.

[0026] In one embodiment, the bottom surface of the photosensitive chip 1 is flush with the lower surface 22. The bottom surface of the photosensitive chip 1 and the lower surface 22 of the circuit board 2 are controlled to be flush to ensure the flatness of both, which facilitates the pouring of the potting compound 3 and the installation flatness of the filter 4.

[0027] In one embodiment, a gap 6 exists between the photosensitive chip 1 and the circuit board 2, and the potting compound 3 partially fills the gap 6. Controlling the area of ​​the photosensitive chip 1 to be smaller than the area of ​​the mounting through-hole 23 facilitates installation of the photosensitive chip 1 into the mounting through-hole 23 of the circuit board 2, prevents the photosensitive chip 1 from being bumped during installation, and prevents the photosensitive chip 1 from tilting during installation.

[0028] In one embodiment, the camera module further includes a light shielding member 7, which is disposed on the lower surface 22 and covers the mounting through hole 23. The light shielding member 7 is disposed at the bottom of the camera module to prevent light from leaking from the bottom of the camera module and causing light pollution.

[0029] Preferably, the light shielding member 7 is an ink layer. Using an ink layer for the light shielding member 7 facilitates processing onto the lower surface 22 of the circuit board 2, and the ink layer is low-cost, which can reduce product costs. Of course, in some embodiments, the light shielding member 7 can also be made of black Mylar sheeting. Any structure that can achieve a light shielding effect falls within the scope of protection of this application and is not listed here.

[0030] In one embodiment, the camera module is characterized in that the camera module further includes a bracket 8 and a lens 9, and the lens 9 is connected to the bracket 8. The bracket 8 is arranged on the upper surface 21 of the circuit board 2 and is located outside the potting compound 3. The lens 9 is used to collect external light, and transmit the light after processing. The processed light passes through the filter 4 and the potting compound 3 in sequence, and then reaches the photosensitive surface 11 of the photosensitive chip 1 for imaging. Among them, the lens 9 is arranged on the upper surface 21 of the circuit board 2 through the bracket 8, which reduces the installation complexity of the lens 9, and the bracket 8 wraps the potting compound 3 to prevent dust or moisture from entering the filter 4 or the potting compound 3, isolating the photosensitive chip 1, the potting compound 3 and the filter 4 from the outside world, and improving the imaging quality.

[0031] On the basis of the above solution, the lens 9 and the bracket 8 are connected by threads. The threaded connection can ensure the connection stability of the lens 9 and the bracket 8 and improve the service life of the camera module.

[0032] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and improved ideas of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A camera module, characterized in that: include: A photosensitive chip (1) includes a photosensitive surface (11); A circuit board (2) comprising an upper surface (21), a lower surface (22) and a mounting through hole (23), wherein the mounting through hole (23) passes through the upper surface (21) and the lower surface (22), and the photosensitive chip (1) is disposed in the mounting through hole (23) and is electrically connected to the circuit board (2); A potting glue (3) covers the photosensitive surface (11), and the potting glue (3) is made of a light-transmitting material; The optical filter (4) is arranged on a surface of the potting compound (3) away from the photosensitive surface (11) and facing the photosensitive surface (11).

2. The camera module according to claim 1, wherein: The camera module further comprises a dam member (5), the dam member (5) being arranged on the upper surface (21) of the circuit board (2), and the dam member (5) being in contact with the potting glue (3).

3. The camera module according to claim 2, wherein: The optical filter (4) is partially arranged on the dam (5).

4. The camera module according to claim 2, wherein: The dam member (5) is an annular structure, and the material of the dam member (5) is DAM glue.

5. The camera module according to claim 1, wherein: The bottom surface of the photosensitive chip (1) is flush with the lower surface (22).

6. The camera module according to claim 1, wherein: There is a gap (6) between the photosensitive chip (1) and the circuit board (2), and the potting glue (3) is partially filled in the gap (6).

7. The camera module according to claim 1, wherein: The camera module further comprises a light shielding member (7), wherein the light shielding member (7) is arranged on the lower surface (22) and covers the mounting through hole (23).

8. The camera module according to claim 7, wherein: The light-shielding member (7) is an ink layer.

9. The camera module according to claim 1, wherein: The camera module further comprises a bracket (8) and a lens (9), wherein the lens (9) is connected to the bracket (8), and the bracket (8) is arranged on the upper surface (21) of the circuit board (2) and is located outside the potting glue (3).

10. The camera module according to claim 9, wherein: The lens (9) and the bracket (8) are connected via threads.

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