Microphone and electronic equipment
By designing the inclined side walls and substrate reinforcement layers in the microphone, the substrate deformation caused by external forces is alleviated, and the performance degradation of the microphone due to circuit board deformation and housing load is solved, ensuring the sensitivity and acoustic performance of the microphone.
Patent Information
- Application Number
- CN202422448199.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-10
AI Technical Summary
In electronic products, microphones have deteriorated performance due to circuit board deformation and housing load, making it difficult to maintain the target performance at the factory.
The side wall part of the microphone is offset toward the accommodating cavity, forming an inclination angle between 3° and 10°. Combined with the substrate reinforcement layer, it alleviates substrate deformation caused by external forces and ensures the stability of the MEMS chip diaphragm.
Effectively alleviate substrate deformation caused by external forces, maintain the sensitivity and acoustic performance of the microphone, and avoid performance degradation caused by deformation.
Smart Images
Figure CN223274219U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic products, and more specifically, to a microphone and electronic equipment. Background Art
[0002] With the development of science and technology and the improvement of living standards, various electronic products have gradually entered thousands of households and become people's necessities of life; people's requirements for the performance of electronic products are also getting higher and higher.
[0003] Microphones are installed in many electronic products, such as mobile phones, tablets, and electronic watches. The increasing number of functional components in these products has led to a congested internal space, while the layout of their circuit boards has also diversified. Consequently, microphones mounted on these circuit boards are subject to additional loads due to these factors. For example, the overall housing of the electronic product can exert pressure on the microphone housing, or the overall circuit board can deform due to positioning. This deformation can be transferred to the microphone through soldering, subjecting it to additional loads. These additional loads can cause the microphone's performance to deviate from the target set at the factory.
[0004] In view of this, it is necessary to propose a new technical solution to solve the above technical problems. Utility Model Content
[0005] One purpose of this application is to provide a new technical solution for microphones and electronic devices.
[0006] According to a first aspect of the present application, a microphone is provided, comprising:
[0007] A housing having a housing bottom and a side wall; a first end of the side wall is connected to an edge of the housing bottom;
[0008] a substrate connected to the second end of the side wall; the housing and the substrate are enclosed to form a receiving cavity;
[0009] Relative to a reference plane vertically extending from an edge of the shell bottom, at least a portion of the side wall is offset toward the accommodating cavity.
[0010] Optionally, relative to the reference plane, the side wall is at least partially inclined gradually toward the accommodating cavity in a direction from the first end to the second end.
[0011] Optionally, the side wall is inclined relative to the reference plane at an angle greater than or equal to 3° and less than or equal to 10°.
[0012] Optionally, the substrate includes a first side and a second side connected to each other, and the length of the first side is greater than the length of the second side;
[0013] Corresponding to the first side, the side wall and the reference plane have a first angle;
[0014] Corresponding to the second side, the side wall and the reference plane have a second included angle;
[0015] The first angle is smaller than the second angle.
[0016] Optionally, the side wall includes a first wall segment, a second wall segment, and a step surface, the first wall segment is connected to the shell bottom, the second wall segment is connected to the base plate; the step surface is connected between the first wall segment and the second wall segment;
[0017] The first wall segment coincides with the reference surface, and the step surface extends toward the accommodating cavity by a first distance.
[0018] Optionally, the first distance is greater than or equal to 0.5 times the thickness of the side wall, and less than or equal to 5 times the thickness of the side wall.
[0019] Optionally, the substrate includes a first area and a second area, the second area is configured as a connecting device; and the first area is provided with a reinforcement layer.
[0020] Optionally, the thickness of the reinforcement layer is greater than or equal to one tenth of the thickness of the substrate, and less than or equal to one quarter of the thickness of the substrate.
[0021] Optionally, the microphone further includes a MEMS chip, and the MEMS chip is connected to the substrate; the substrate is provided with a sound hole, and the MEMS chip is arranged corresponding to the sound hole.
[0022] According to a second aspect of the present application, an electronic device is provided, comprising the microphone as described in the first aspect.
[0023] In the microphone provided in the embodiment of the present application, when an external force acts on the outer shell, the external force is transmitted to the solder joint. Since the second end of the side wall at the solder joint is retracted a certain distance toward the inner side of the outer shell, the deformation of the substrate caused by the external force can be alleviated to a certain extent, thereby alleviating the deformation of the diaphragm of the MEMS chip, thereby ensuring that the microphone can maintain a high sensitivity.
[0024] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.
[0026] Figure 1'a~Figure 1 'c is the force analysis diagram of a conventional microphone;
[0027] Figure 1 This is a schematic diagram of the structure of a microphone according to an embodiment of the present application. Figure 1 ;
[0028] Figure 2 This is a schematic diagram of the structure of a microphone according to an embodiment of the present application. Figure 2 ;
[0029] Figure 3 is a schematic diagram of the main structure of a substrate in a microphone according to an embodiment of the present application;
[0030] Figure 4 1 is a schematic diagram of a top view of a substrate in a microphone according to an embodiment of the present application.
[0031] Description of reference numerals:
[0032] 1. Microphone; 11. Housing; 100. Accommodating cavity; 111. Housing bottom; 112. Side wall; 1121. First wall segment; 1122. Second wall segment; 1120. Step surface; 12. Substrate; 120. Acoustic hole; 121. First region; 122. Second region; 123. Reinforcement layer; 13. MEMS chip. DETAILED DESCRIPTION
[0033] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application.
[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.
[0035] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.
[0036] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.
[0037] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0038] Reference Figures 1-4 As shown, according to one embodiment of the present application, a microphone 1 is provided. The microphone 1 includes a housing 11 and a substrate 12. The housing 11 has a housing bottom 111 and a side wall 112. A first end of the side wall 112 is connected to an edge of the housing bottom 111.
[0039] The substrate 12 is connected to the second end of the side wall 112; the housing 11 and the substrate 12 enclose a receiving cavity 100;
[0040] Relative to a reference plane perpendicularly extending from an edge of the housing bottom 111 , at least a portion of the sidewall 112 is offset toward the accommodating cavity 100 .
[0041] Furthermore, the microphone further includes a MEMS chip 13 , which is connected to the substrate 12 ; the substrate 12 is provided with a sound hole 120 , and the MEMS chip 13 is arranged corresponding to the sound hole 120 ; the substrate 12 is a PCB board.
[0042] Reference Figure 1'a~Figure 1 As shown in 'c, in a conventional microphone, when an external force F0 acts on the outer shell of the microphone, the force is transmitted to the substrate through the solder joint, thereby forming an outward tension F on the surface of the substrate; according to the translation theorem of force, F' and F form a moment M, and the moment causes the substrate to have a tendency to bend and deform toward the outer shell; and the MEMS chip is arranged on the substrate, and the deformation of the substrate drives the deformation of the MEMS chip, and the MEMS chip and the substrate have the same deformation tendency. This deformation causes the diaphragm of the MEMS chip to bear a stress dominated by tensile stress, and the tensile stress increases the bending stiffness of the diaphragm (the diaphragm is in a tightened state), so that under the same sound pressure, the deformation of the diaphragm is reduced, the output voltage is reduced, and the sensitivity is reduced.
[0043] For the microphone 1 provided in the embodiment of the present application, in the housing 11, its side wall 112 is not perpendicularly connected to the edge of the housing bottom 111, but the side wall 112 is at least partially offset toward the inner side of the housing 11 (that is, toward the accommodating cavity 100); specifically, the first end of the side wall 112 is connected to the edge of the housing bottom 111, and the second end of the side wall 112 is connected to the substrate 12 in a posture offset toward the accommodating cavity 100 relative to a reference plane extending perpendicularly from the edge of the housing bottom 111; the second end of the side wall 112 is connected to the substrate 12 via a solder joint; when an external force acts on the housing 11, the external force is transmitted to the solder joint. Since the second end of the side wall 112 at the solder joint is retracted a certain distance toward the inner side of the housing 11, the bending moment generated by the external force on the substrate is reduced, thereby alleviating the deformation of the substrate 12 caused by the external force to a certain extent, thereby alleviating the deformation of the diaphragm of the MEMS chip 13, thereby ensuring that the microphone can maintain a high sensitivity.
[0044] Reference Figure 1 As shown, in one embodiment, relative to the reference plane, the side wall 112 is at least partially inclined gradually toward the accommodating cavity 100 from the first end to the second end.
[0045] In this specific example, the sidewall 112 is an inclined surface arranged relative to the reference plane, that is, the sidewall 112 is not perpendicular to the substrate 12. Such an inclined sidewall can not only effectively alleviate the deformation of the substrate 12 caused by external forces, but also is easier to manufacture.
[0046] Reference Figure 1 As shown, in one embodiment, the side wall 112 is inclined relative to the reference plane at an angle greater than or equal to 3° and less than or equal to 10°.
[0047] If the angle at which the side wall 112 is tilted relative to the reference plane is too small, the side wall 112 will essentially coincide with the reference plane, and thus will not effectively mitigate deformation of the substrate 12 caused by external forces. If the angle at which the side wall 112 is tilted relative to the reference plane is too large, the overall strength of the housing 11 will be affected. Therefore, in this specific example, the angle at which the side wall 112 is tilted relative to the reference plane is set within a range of 3° to 10°.
[0048] In one embodiment, the substrate 12 includes a first side and a second side connected to each other, wherein the length of the first side is greater than the length of the second side;
[0049] Corresponding to the first side, the side wall 112 and the reference plane have a first angle;
[0050] Corresponding to the second side, the side wall 112 and the reference plane have a second angle;
[0051] The first angle is smaller than the second angle.
[0052] In this specific example, since substrate 12 is generally rectangular rather than square, it has a longer first side and a shorter second side. Corresponding to the longer first side, the angle between sidewall 112 and the reference plane is smaller; corresponding to the shorter second side, the angle between sidewall 112 and the reference plane is larger. This can better mitigate deformation of substrate 12 caused by external forces.
[0053] Reference Figure 2As shown, in one embodiment, the side wall 112 includes a first wall segment 1121, a second wall segment 1122 and a step surface 1120, wherein the first wall segment 1121 is connected to the shell bottom 111, and the second wall segment 1122 is connected to the substrate 12; the step surface 1120 is connected between the first wall segment 1121 and the second wall segment 1122;
[0054] The first wall segment 1121 coincides with the reference plane, and the stepped surface 1120 extends a first distance toward the accommodating cavity 100 .
[0055] In this specific example, the sidewall 112 is configured as a segmented structure, wherein a first wall segment 1121 is perpendicularly connected to the shell bottom 111 and located at the edge of the shell bottom 111, and a second wall segment 1122 is connected to the first wall segment 1121 via a stepped surface 1120 extending toward the accommodating cavity 100, thereby forming an inwardly retracted structure with the stepped surface 1120 and the second wall segment 1122. This sidewall 112 not only effectively mitigates deformation of the substrate 12 caused by external forces, but also has high overall strength.
[0056] Reference Figure 2 As shown, in one embodiment, the first distance is greater than or equal to 0.5 times the thickness of the sidewall 112 and less than or equal to 5 times the thickness of the sidewall 112 .
[0057] If the distance that the second wall segment 1122 is retracted toward the inside of the housing 11 is too small, it will not effectively mitigate deformation of the substrate 12 caused by external forces. If the distance that the second wall segment 1122 is retracted toward the inside of the housing 11 is too large, the volume of the microphone's rear cavity will be too small, affecting its acoustic performance. Therefore, in this specific example, the first distance that the second wall segment 1122 is retracted toward the inside of the housing 11 is set to be greater than or equal to 0.5 times the thickness of the side wall 112, and less than or equal to 5 times the thickness of the side wall 112.
[0058] Reference Figure 3 、 Figure 4 As shown, in one embodiment, the substrate 12 includes a first area 121 and a second area 122 , wherein the second area 122 is configured as a connecting device; and the first area 121 is provided with a reinforcement layer 123 .
[0059] In this specific example, a reinforcement layer 123 is provided in the first area 121 which does not affect the connection of the devices on the substrate 12. The reinforcement layer 123 may be, for example, a copper layer, thereby improving the bending resistance of the substrate 12 and making the substrate 12 less likely to deform, thereby further ensuring the acoustic performance of the microphone.
[0060] For example, the second region 122 is a middle region of the substrate 12 , and the first region 121 is an annular edge region disposed around the second region 122 .
[0061] Reference Figure 3 、 Figure 4 As shown, in one embodiment, the thickness of the reinforcement layer 123 is greater than or equal to one tenth of the thickness of the substrate 12 , and less than or equal to one quarter of the thickness of the substrate 12 .
[0062] If the thickness of the reinforcing layer 123 is too small, the bending resistance of the substrate 12 cannot be effectively improved; if the thickness of the reinforcing layer 123 is too large, it will affect the back cavity volume of the microphone; therefore, in this specific example, the thickness of the reinforcing layer 123 is set to be greater than or equal to one tenth of the thickness of the substrate 12, and less than or equal to one quarter of the thickness of the substrate 12.
[0063] According to another embodiment of the present application, an electronic device is provided, comprising the microphone 1 as described above.
[0064] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.
[0065] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.
Claims
1. A microphone, characterized in that: The microphone includes: A housing (11), the housing (11) comprising a housing bottom (111) and a side wall (112); a first end of the side wall (112) being connected to an edge of the housing bottom (111); a substrate (12), the substrate (12) being connected to the second end of the side wall (112); the housing (11) and the substrate (12) enclose a receiving cavity (100); Relative to a reference plane vertically extending from an edge of the shell bottom (111), the side wall (112) is at least partially offset toward the accommodating cavity (100).
2. The microphone according to claim 1, wherein Relative to the reference plane, the side wall (112) is at least partially gradually inclined toward the accommodating cavity (100) from its first end toward its second end.
3. The microphone according to claim 2, wherein The side wall (112) is tilted relative to the reference plane at an angle greater than or equal to 3° and less than or equal to 10°.
4. The microphone according to claim 2, wherein The substrate (12) comprises a first side and a second side connected to each other, wherein the length of the first side is greater than the length of the second side; Corresponding to the first side, the side wall (112) and the reference plane have a first angle; Corresponding to the second side, the side wall (112) and the reference plane have a second included angle; The first angle is smaller than the second angle.
5. The microphone according to claim 1, wherein The side wall (112) comprises a first wall section (1121), a second wall section (1122) and a step surface (1120); the first wall section (1121) is connected to the shell bottom (111), and the second wall section (1122) is connected to the base plate (12); the step surface (1120) is connected between the first wall section (1121) and the second wall section (1122); The first wall section (1121) coincides with the reference plane, and the step surface (1120) extends a first distance toward the accommodating cavity (100).
6. The microphone according to claim 5, characterized in that The first distance is greater than or equal to 0.5 times the thickness of the side wall (112) and less than or equal to 5 times the thickness of the side wall (112).
7. The microphone according to any one of claims 1 to 6, characterized in that The substrate (12) comprises a first region (121) and a second region (122), wherein the second region (122) is configured as a connecting device; and the first region (121) is provided with a reinforcement layer (123).
8. The microphone according to claim 7, wherein The thickness of the reinforcement layer (123) is greater than or equal to one tenth of the thickness of the substrate (12), and less than or equal to one quarter of the thickness of the substrate (12).
9. The microphone according to claim 1, wherein The microphone further comprises a MEMS chip (13), and the MEMS chip (13) is connected to the substrate (12); the substrate (12) is provided with a sound hole (120), and the MEMS chip (13) is arranged corresponding to the sound hole (120).
10. An electronic device, characterized in that: The electronic device comprises a microphone (1) according to any one of claims 1 to 9.