Multilayer circuit board capable of realizing hidden wiring

By setting up a hidden trace structure and a miniature fan on the multi-layer circuit board, the problems of exposed and wound lines are solved, and the hidden and heat dissipation effects of lines are achieved.

CN223274264UActive Publication Date: 2025-08-26LIPU XINHONGXING MULTILAYER ELECTRONIC TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422230370.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-11
Publication Date
2025-08-26
Estimated Expiration
2034-09-11

AI Technical Summary

Technical Problem

When the multi-layer circuit board is connected to an external power supply or device, the lines are not beautiful and easily entangled with each other, which affects the use effect.

Method used

A multi-layer circuit board with hidden traces is designed, by setting the first trace groove and the second trace groove in the protective cover on the base, combining a micro fan for heat dissipation, and using the outer edge cover plate to hide the wires to prevent winding.

Benefits of technology

The line is hidden and protected, avoiding the line exposed and entangled, and improving the heat dissipation performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223274264U_ABST
    Figure CN223274264U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of multilayer circuit boards, and discloses a multilayer circuit board with hidden wiring, which comprises a base and a multilayer circuit board body, the base is provided with a mounting groove for mounting the multilayer circuit board body, the periphery of the base is provided with a first wiring groove, one end of the base is provided with a wiring terminal, and the other end of the base is provided with a second wiring groove. Welding spots are arranged on the multilayer circuit board body, first through grooves communicated with the mounting grooves are formed in the positions, corresponding to the welding spots of the multilayer circuit board body, of the first wiring grooves, and the wiring terminals are communicated with the first wiring grooves through the second through grooves. A protective cover is arranged above the mounting groove, a miniature fan is mounted on the protective cover, an outer edge cover plate capable of covering the first wiring groove is arranged on the periphery of the protective cover, and a second wiring groove is formed in the inner surface of the protective cover. According to the utility model, hidden wiring is adopted, so that lines are not easy to expose and are not easy to intertwine.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of multilayer circuit boards, in particular to a multilayer circuit board with concealed wiring. Background Art

[0002] A multilayer circuit board (PCB) is a board with three or more layers. It utilizes multiple layers of internal wiring to achieve interconnectivity between layers, offering advantages such as high capacity, compact size, and thinness. However, when connecting a multilayer PCB to an external power source or other device, the exposed wiring is unsightly and can easily lead to entanglement when there are many wires. Utility Model Content

[0003] The purpose of the utility model is to solve the above problems and provide a multi-layer circuit board with concealed wiring. The hidden wiring makes the circuits less likely to be exposed and entangled with each other.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: a multi-layer circuit board with concealed wiring, comprising a base and a multi-layer circuit board body, the base being provided with a mounting groove for mounting the multi-layer circuit board body, the base being provided with a first wiring groove around the periphery, a wiring terminal being provided at one end of the base, a soldering point being provided on the multi-layer circuit board body, the first wiring groove being provided with a first through groove connected to the mounting groove corresponding to the soldering point of the multi-layer circuit board body, the wiring terminal being connected to the first wiring groove through a second through groove; a protective cover being provided above the mounting groove, a micro fan being installed on the protective cover, an outer edge cover being provided around the protective cover that can cover the first wiring groove, and a second wiring groove being provided on the inner surface of the protective cover.

[0005] Furthermore, the four corners of the multilayer circuit board body are provided with first screw holes, the four corners of the mounting slot are provided with second screw holes corresponding to the first screw holes, and the multilayer circuit board body is connected to the base through first screws.

[0006] Furthermore, third screw holes are provided around the outer edge cover plate, and fourth screw holes corresponding to the third screw holes are provided at the four corners of the base, and the outer edge cover plate and the base are connected by second screws.

[0007] Furthermore, the base is provided with a plurality of heat dissipation holes.

[0008] Furthermore, the second wiring trough is provided with a partition at the bend, and a wire hole is provided at the bottom of the partition.

[0009] Furthermore, the depth of the mounting groove is equal to the thickness of the multilayer circuit board body.

[0010] Furthermore, a corner pressing plate for pressing the corners of the multi-layer circuit board body is provided on the inner side of the outer edge cover.

[0011] Furthermore, the width of the first wiring groove and the second wiring groove is 5 to 8 mm.

[0012] Due to the adoption of the above technical solution, the utility model has the following beneficial effects:

[0013] The utility model provides a protective cover to protect the multi-layer circuit board body. A micro-fan is provided on the protective cover to improve heat dissipation performance. A first wiring trough for accommodating wires is provided on the base, and a second wiring trough for accommodating wires is provided on the inner wall of the protective cover. The outer edge plate of the protective cover covers the first wiring trough, thereby achieving the purpose of concealing the wiring. The wires are not exposed and are not easily entangled. The multi-layer circuit board of the utility model has good heat dissipation, which not only provides good protection for the circuit board body, but also ensures that the guides for external connection wiring can be hidden and prevent entanglement. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of a multi-layer circuit board with concealed wiring according to the present invention from one perspective;

[0015] Figure 2 This is a structural diagram of a multi-layer circuit board with concealed wiring from another perspective of the present invention;

[0016] Figure 3 For the utility model Figure 2 A partial enlarged view of middle A;

[0017] In the figure: 1-base, 11-first wiring trough, 12-first through slot, 13-second through slot, 14-terminal, 15-second screw hole, 16-heat dissipation hole, 17-fourth screw hole, 2-multi-layer circuit board body, 21-first screw hole, 3-protective cover, 31-outer edge cover, 311-third screw hole, 32-angle plate, 34-partition, 33-second wiring trough, 341-wire hole. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0019] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0020] like Figure 1 、 Figure 2 As shown, a multi-layer circuit board with concealed wiring includes a base 1 and a multi-layer circuit board body 2. The base 1 is provided with a mounting groove for mounting the multi-layer circuit board body 2. A first wiring groove 11 is provided around the base 1, and a wiring terminal 14 is provided at one end of the base 1. The multi-layer circuit board body 2 is provided with a soldering point. The first wiring groove 11 is provided with a first through groove 12 connected to the mounting groove corresponding to the soldering point of the multi-layer circuit board body 2, and the wiring terminal 14 is connected to the first wiring groove 11 through a second through groove 13; a protective cover 3 is provided above the mounting groove, and a micro fan is installed on the protective cover 3. The protective cover 3 is provided with an outer edge cover 31 that can cover the first wiring groove 11 around the protective cover 3, and a second wiring groove 33 is provided on the inner surface of the protective cover 3.

[0021] The four corners of the multilayer circuit board body 2 are provided with first screw holes 21, and the four corners of the mounting slot are provided with second screw holes 15 corresponding to the first screw holes 21. The multilayer circuit board body 2 is connected to the base 1 via the first screws. When the multilayer circuit board body 2 is placed in the mounting slot, the first screw holes 21 and the second screw holes 15 are aligned vertically, and the multilayer circuit board body 2 can be fixed in the mounting slot using the first screws, conveniently securing the connection.

[0022] The outer edge cover 31 is provided with third screw holes 311 around its perimeter, and the base 1 has corresponding fourth screw holes 17 at its four corners. The outer edge cover 31 is connected to the base 1 via second screws. When the third screw holes 311 and the fourth screw holes 17 align vertically, the second screws secure the protective cover 3 and cover the first wiring trough 11.

[0023] In order to further improve the heat dissipation performance, a plurality of heat dissipation holes 16 are provided on the base 1 .

[0024] like Figure 3 As shown, the second wiring trough 33 is provided with a partition 34 at the bend, and a wire hole 341 is provided at the bottom of the partition 34. During installation, the wire passes through the wire hole 341 and is positioned by the partition 34 to prevent the wire from falling out of the second wiring trough 33.

[0025] like Figure 2 As shown, the depth of the mounting groove is equal to the thickness of the multilayer circuit board body 2. In order to prevent the corners of the multilayer circuit board body 2 from tilting, a corner pressing plate 32 for pressing the corners of the multilayer circuit board body 2 is provided on the inner side of the outer edge cover 31.

[0026] In this embodiment, the width of the first wiring groove 11 and the second wiring groove 33 is 5-8 mm.

[0027] When in use, the multilayer circuit board body 2 is placed in the mounting groove, the first screw hole 21 on the mounting groove corresponds to the first screw hole 21 on the multilayer circuit board body 2, and then fixed by the first screw, and then the wires welded on the solder joints of the multilayer circuit board body 2 are routed in the first wiring groove 11, and the wires connected to the micro fan are routed in the second wiring groove 33 and the first wiring groove 11 and connected to the terminal 14, and then the outer edge plate of the protective cover 3 is covered on the first wiring groove 11, so that the third screw hole 311 on the outer edge plate corresponds to the fourth screw hole 17 on the base 1, and then fixed by the second screw, because the depth of the mounting groove is equal to the thickness of the multilayer circuit board body 2, the corner pressure plate 32 of the outer edge cover 31 can press the corner position of the multilayer circuit board body 2 to prevent the corners from deforming and warping. The utility model has good heat dissipation effect and plays a good protective role, and has the function of hiding the external wiring of the wires, so that the wires are not exposed and are not easily entangled with each other.

[0028] The above generally describes the present invention in detail. However, it is obvious to those skilled in the art that modifications or improvements may be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A multi-layer circuit board with concealed wiring, characterized in that: It includes a base and a multi-layer circuit board body, the base is provided with a mounting groove for installing the multi-layer circuit board body, the base is provided with a first wiring groove around the periphery, one end of the base is provided with a wiring terminal, the multi-layer circuit board body is provided with a soldering point, the first wiring groove is provided with a first through groove connected to the mounting groove corresponding to the soldering point of the multi-layer circuit board body, and the wiring terminal is connected to the first wiring groove through a second through groove; a protective cover is provided above the mounting groove, a micro fan is installed on the protective cover, an outer edge cover that can cover the first wiring groove is provided around the protective cover, and a second wiring groove is provided on the inner surface of the protective cover.

2. The multi-layer circuit board with concealed wiring according to claim 1, characterized in that: The four corners of the multilayer circuit board body are provided with first screw holes, the four corners of the mounting slot are provided with second screw holes corresponding to the first screw holes, and the multilayer circuit board body is connected to the base through first screws.

3. The multi-layer circuit board with concealed wiring according to claim 1, characterized in that: The outer edge cover is provided with third screw holes around the periphery, and the four corners of the base are provided with fourth screw holes corresponding to the third screw holes. The outer edge cover is connected to the base through second screws.

4. The multi-layer circuit board with concealed wiring according to claim 1, characterized in that: The base is provided with a plurality of heat dissipation holes.

5. The multi-layer circuit board with concealed wiring according to claim 1, characterized in that: The second wiring trough is provided with a partition at the bend, and a wire hole is provided at the bottom of the partition.

6. The multi-layer circuit board with concealed wiring according to claim 1, characterized in that: The depth of the mounting groove is equal to the thickness of the multilayer circuit board body.

7. The multi-layer circuit board with concealed wiring according to claim 6, characterized in that: The inner side of the outer edge cover is provided with a corner pressing plate for pressing the corners of the multilayer circuit board body.

8. The multi-layer circuit board with concealed wiring according to claim 1, characterized in that: The width of the first wiring groove and the second wiring groove is 5-8 mm.