Environment-friendly flame-retardant high-Tg copper-clad plate

Abstract

The utility model relates to the field of copper-clad plates, and discloses an environment-friendly flame-retardant high-Tg copper-clad plate which comprises a central base material, heat-insulating support frames are respectively arranged on the top surface and the bottom surface of the central base material, copper foil is fixedly mounted on one surface, far away from the central base material, of each heat-insulating support frame, a heat-insulating layer is fixedly mounted in each heat-insulating support frame, and a heat-insulating layer is fixedly mounted in each heat-insulating support frame. The heat insulation layer is installed in the heat insulation supporting frame, the heat insulation effect is enhanced by filling argon, when the copper foil generates heat in the using process, due to the existence of the heat insulation layer and filling of argon, the heat can be effectively prevented from being continuously transmitted to the center base material, and therefore the influence on an adhesive is reduced, the structure enables the high-Tg copper-clad plate to be firmer, and meanwhile the heat insulation effect is improved. Due to the existence of the heat insulation supporting frame, when the copper foil needs to be machined, the heat insulation layer can be supported, the heat insulation layer is prevented from being broken or damaged in the machining process, the overall strength is improved, the heat insulation layer is more durable, and therefore the service life of the high-Tg copper-clad plate is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of copper clad laminates, in particular to an environmentally friendly flame-retardant high-Tg copper clad laminate. Background Art

[0002] High Tg copper clad laminate is a high-performance circuit board material, mainly composed of substrate and copper foil. "Tg" refers to the glass transition temperature, which is an important indicator for evaluating the heat resistance of the material. High Tg copper clad laminate has a high glass transition temperature, usually higher than 150°C, which means it has excellent heat resistance and dimensional stability. Therefore, high Tg copper clad laminate is widely used in high-speed digital circuits, high-power electronic equipment, automotive electronics, aerospace and other fields. Its main advantages include excellent electrical properties, good thermal stability, high mechanical strength and good processing performance.

[0003] As disclosed in the utility model patent with announcement number CN220947021U, a heat-resistant copper-clad plate comprises a central layer and a copper-clad surface layer, and the copper-clad surface layer is fixedly bonded on both sides of the central layer, the copper-clad surface layer comprises a cladding layer and an outer copper-clad layer, the cladding layer and the outer copper-clad layer are press-connected, and a thermal insulation layer is arranged between the cladding layer and the outer copper-clad layer, and the thermal insulation layer is fixedly clamped between the cladding layer and the outer copper-clad layer, the central layer comprises a base layer, and both sides of the base layer are coated with an adhesive layer for bonding the cladding layer. In the utility model, when in use, the thermal insulation layer is fixedly clamped between the cladding layer and the outer copper-clad layer to play a role in heat insulation, thereby preventing heat from being transferred to the adhesive layer through the copper-clad surface layer, affecting the stability of the adhesive between the central layer and the copper-clad surface layer, and the thermal insulation layer is arranged between the cladding layer and the outer copper-clad layer. When installing the thermal insulation layer, mechanical pressing is adopted instead of gluing to avoid the influence of heat on the installation stability of the thermal insulation layer.

[0004] However, during actual use, it was discovered that the thermal insulation layer of the device was made of glass fiber or ceramic fiber;

[0005] Due to the fragility of glass fiber or ceramic fiber, multiple surface processing steps are often required during the use of copper clad laminates, such as machining, electroplating, etching, drilling and grinding. These processing steps are intended to change the surface morphology of the copper foil, improve its conductivity or add other functions. However, the pressure or other factors generated during the processing of the copper clad laminates can cause rupture or damage to the thermal insulation layer. Therefore, the fragility of the thermal insulation layer not only affects the performance and service life of the copper clad laminates, but may also cause safety hazards. For this purpose, an environmentally friendly flame-retardant high-Tg copper clad laminate is provided. Utility Model Content

[0006] The purpose of the present invention is to provide an environmentally friendly flame-retardant high-Tg copper clad laminate in order to solve the above-mentioned problems.

[0007] The technical solution adopted by the present invention is as follows: an environmentally friendly flame-retardant high-Tg copper-clad laminate, comprising a central substrate, wherein the top and bottom surfaces of the central substrate are respectively provided with a thermal insulation support frame, a copper foil is fixedly installed on a side of the thermal insulation support frame away from the central substrate, and an insulation layer is fixedly installed inside the thermal insulation support frame.

[0008] In a preferred embodiment, a flame retardant layer is fixedly mounted on a side of the heat insulation support frame away from the copper foil.

[0009] In a preferred embodiment, adhesives are fixedly mounted on the top and bottom surfaces of the central substrate, and the side of the flame retardant layer away from the heat insulation support frame is in contact with the adhesive.

[0010] In a preferred embodiment, the interior of the thermal insulation support frame is filled with argon gas.

[0011] In a preferred embodiment, the thermal insulation support frame is made of metal material.

[0012] In a preferred embodiment, the flame retardant layer base plate is made of a plastic plate.

[0013] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0014] 1. In the present invention, due to the adoption of the above-mentioned solution, an insulation layer is installed inside the insulation support frame, and the insulation effect is enhanced by filling argon gas. When the copper foil generates heat during use, the heat will be transferred to the insulation support frame. Due to the presence of the insulation layer and the filling of argon gas, the heat can be effectively prevented from continuing to be transferred to the central substrate, thereby reducing the impact on the adhesive. This structure makes the high-Tg copper clad laminate more solid and improves the overall performance. At the same time, due to the presence of the insulation support frame, when the copper foil needs to be machined, it can provide support for the insulation layer to prevent the insulation layer from breaking or being damaged during the processing. In addition, by setting up the insulation support frame, the overall strength can be improved, making the insulation layer more durable, thereby extending the service life of the high-Tg copper clad laminate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the internal structure of the heat-insulating support frame of the present utility model;

[0017] Figure 3 For the utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0018] Markings in the figure: 1. Central substrate; 2. Thermal insulation support frame; 3. Copper foil; 4. Thermal insulation layer; 5. Flame retardant layer; 6. Adhesive. DETAILED DESCRIPTION

[0019] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0020] refer to Figure 1 、 Figure 2 and Figure 3 , an environmentally friendly flame-retardant high Tg copper clad laminate, comprising a central substrate 1, wherein the top and bottom surfaces of the central substrate 1 are respectively provided with a heat insulating support frame 2, and the heat insulating support frame 2 is made of a metal material;

[0021] The central substrate 1 is made of a composite material composed of prepreg, which is generally composed of resin and reinforcing material (such as glass fiber cloth). The resin impregnation process enhances the mechanical and electrical properties of the material, while improving its thermal stability and dimensional stability. At the same time, the substrate can be recycled, which meets the requirements of sustainable development, helps to achieve resource recycling, and reduces environmental pollution.

[0022] The thermal insulation support frame 2 is made of metal material, which not only improves the overall strength but also has good thermal insulation performance. Its metal material ensures that the installation in the high Tg copper clad laminate will not have adverse effects on other materials. In addition, due to the excellent properties of the metal material, the installation of the thermal insulation support frame 2 will not cause any damage to the surrounding materials while ensuring the stability of the structure, thereby ensuring the quality and environmental protection performance of the overall product.

[0023] refer to Figure 2 、 Figure 3 A copper foil 3 is fixedly installed on one side of the heat-insulating support frame 2 away from the central substrate 1, and a heat-insulating layer 4 is fixedly installed inside the heat-insulating support frame 2;

[0024] The thermal insulation support frame 2 and the copper foil 3 are firmly fixed together by pressing. In order to effectively isolate the heat transferred by the copper foil 3, a thermal insulation layer 4 is provided. This not only enables the thermal insulation support frame 2 to reliably support and fix the copper foil 3, but also through the effective effect of the thermal insulation layer 4, greatly reduces the impact of the heat generated on the copper foil 3 on the adhesive layer, thereby ensuring the stability and reliability of the overall product.

[0025] refer to Figure 2 、 Figure 3 , the interior of the thermal insulation support frame 2 is filled with argon gas;

[0026] In order to further enhance the thermal insulation performance of the thermal insulation support frame 2, argon, a colorless, odorless, non-toxic inert gas, is introduced into it. Argon has stable chemical properties at room temperature and is not easy to react with other substances. Therefore, it has excellent thermal insulation effect. In addition, argon has a high content in the air, is easy to obtain and has a relatively low cost, making its application in the thermal insulation support frame 2 more economical and practical.

[0027] refer to Figure 2 、 Figure 3 , a flame retardant layer 5 is fixedly installed on one side of the heat insulation support frame 2 away from the copper foil 3, and the base plate of the flame retardant layer 5 is made of a plastic plate;

[0028] The base plate of the flame retardant layer 5 is made of plastic board, and flame retardants are added during the production of the plastic board. These flame retardants, such as inorganic or organic compounds, such as phosphate esters and brominated flame retardants, can play an important role in combustion. They can hinder the spread of flames, reduce the combustion rate, and effectively suppress the heat and harmful gases generated by combustion. This not only improves the flame retardancy of the high Tg copper clad laminate, but also enhances its safety and reliability.

[0029] The flame retardant layer 5 and the heat insulation support frame 2 can be fixed by pressing or using an adhesive.

[0030] refer to Figure 2 、 Figure 3 , the top and bottom surfaces of the central substrate 1 are respectively fixed with adhesive 6, and the side of the flame retardant layer 5 away from the thermal insulation support frame 2 is in contact with the adhesive 6;

[0031] The provided adhesive 6 can conveniently bond and fix the thermal insulation support frame 2. In this way, the central substrate 1, the adhesive 6, the flame retardant layer 5, the thermal insulation support frame 2 and the copper foil 3 can form an integral high-Tg copper clad laminate. The adhesive 6 has good bonding properties and high-temperature resistance to ensure that it can still maintain stable performance in a high-temperature environment. This design makes the high-Tg copper clad laminate more structurally firm and improves its overall performance and reliability.

[0032] The implementation principle of an environmentally friendly flame-retardant high Tg copper clad laminate embodiment of the present invention is as follows: the copper foil 3 is fixed to the thermal insulation support frame 2 by pressing, and the thermal insulation support frame 2 is bonded and fixed to the central substrate 1 by an adhesive 6, so as to form an integral high Tg copper clad laminate. A thermal insulation layer 4 is installed inside the thermal insulation support frame 2, and the thermal insulation effect is enhanced by filling argon gas. When the copper foil 3 generates heat during use, the heat will be transferred to the thermal insulation support frame 2. Due to the presence of the thermal insulation layer 4 and the filling of argon gas, the heat can be effectively prevented from continuing to be transferred to the central substrate 1, thereby reducing the impact on the adhesive 6. This structure makes the high Tg copper clad laminate more solid and improves the overall performance. At the same time, due to the presence of the thermal insulation support frame 2, when the copper foil 3 needs to be mechanically processed, it can provide support for the thermal insulation layer 4 to prevent the thermal insulation layer from breaking or being damaged during the processing. In addition, by setting the thermal insulation support frame 2, the overall strength can be improved, making the thermal insulation layer 4 more durable, thereby extending the service life of the high Tg copper clad laminate.

[0033] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An environmentally friendly flame-retardant high Tg copper-clad laminate, comprising a central substrate (1), characterized in that: The top and bottom surfaces of the central substrate (1) are respectively provided with a heat-insulating support frame (2); a copper foil (3) is fixedly mounted on a side of the heat-insulating support frame (2) away from the central substrate (1); and a heat-insulating layer (4) is fixedly mounted inside the heat-insulating support frame (2).

2. The environmentally friendly flame-retardant high Tg copper clad laminate according to claim 1, characterized in that: A flame retardant layer (5) is fixedly mounted on a side of the heat-insulating support frame (2) away from the copper foil (3).

3. The environmentally friendly flame-retardant high Tg copper clad laminate according to claim 2, characterized in that: Adhesive (6) is fixedly mounted on the top and bottom surfaces of the central substrate (1), respectively, and a side of the flame retardant layer (5) away from the heat insulation support frame (2) is in contact with the adhesive (6).

4. The environmentally friendly flame-retardant high Tg copper clad laminate according to claim 1, characterized in that: The interior of the heat-insulating support frame (2) is filled with argon gas.

5. The environmentally friendly flame-retardant high Tg copper clad laminate according to claim 1, characterized in that: The heat-insulating support frame (2) is made of metal material.

6. The environmentally friendly flame-retardant high Tg copper clad laminate according to claim 2, characterized in that: The base plate of the flame retardant layer (5) is made of a plastic plate.

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