Through-flow module

Abstract

The utility model relates to a through-flow module, which is mounted on a circuit board to provide an additional through-flow channel, and comprises an electric conductor and an insulator covered on the electric conductor, the electric conductor is of a polyhedral structure, and a plurality of faces of the electric conductor are covered with insulators. The electric conductor comprises a mounting surface connected with the circuit board, a bonding pad is arranged on the mounting surface, and an anti-oxidation layer is arranged on the surface of the bonding pad. The through-flow module designed by the utility model is simple in structure, has an insulation protection function, can avoid the problem of short circuit caused by contact with surrounding components, and is high in corrosion resistance and reliability.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a flow-through module. Background Art

[0002] With the continuous advancement of science and technology, consumer electronic products have ushered in a booming development, and more and more consumer electronic products are developing in the direction of being portable and small in size. As an indispensable and important component of electronic products, the size of circuit boards is constantly getting smaller, while the number of integrated electronic components is increasing and the functions are becoming more and more powerful. When working, some electronic components require more and more current, and the circuits of small-sized circuit boards cannot carry such a large current. Therefore, it is necessary to mount a flow module on the circuit board to provide an additional flow channel. In the existing technical solutions, simple conductive materials are usually used as flow modules. When used in high-density electronic products, they may come into contact with surrounding components and cause short circuits. They are also not corrosion-resistant and have poor reliability. Utility Model Content

[0003] In response to the above-mentioned problems, the purpose of the present invention is to design a flow module with a simple structure and an insulation protection function, which can avoid the problem of short circuit caused by contact with surrounding components and has strong corrosion resistance and reliability.

[0004] The purpose of the utility model is achieved through the following technical solutions:

[0005] A flow module is designed to be mounted on a circuit board to provide an additional flow channel, including a conductor and an insulator covering the conductor; the conductor is a polyhedron structure, and several surfaces of the conductor are covered with an insulator; the conductor includes a mounting surface connected to the circuit board, the mounting surface is provided with a soldering pad, and the surface of the soldering pad is provided with an anti-oxidation layer.

[0006] The flow module designed in this solution is mounted on the circuit board to form a flow channel that carries a large current. The flow module consists of a conductor and an insulator covering the conductor. The conductor can usually be made of conductive materials such as copper, aluminum, and nickel. Depending on the use environment and scenario, except for the mounting surface of the conductor that connects to the circuit board, the remaining surfaces of the conductor can be selectively covered with an insulator for protection to avoid contact with other components and cause short circuits. The soldering pads are designed on the mounting surface. The soldering pads can be integral soldering pads or multiple small soldering pads to fully utilize the flow capacity of the flow module. The soldering pads are formed into an anti-oxidation layer through nickel plating, tin plating, silver plating, and gold plating to prevent oxidation of the soldering pads, which reduces the solderability of the soldering pads, resulting in loose solder joints during mounting, causing cold solder joints or poor soldering, and affecting the reliability of the circuit board.

[0007] Furthermore, the conductor is a rectangular parallelepiped structure, the surface opposite to the mounting surface is the top surface, and the four surfaces between the mounting surface and the top surface are side surfaces.

[0008] The conductor can be designed as a rectangular parallelepiped with a length ranging from 3 to 500 mm, a width ranging from 0.5 to 5 mm, and a height ranging from 0.2 to 3 mm. Its specific dimensions are designed based on the actual required resistance. The circuit size is designed according to the resistance law: R = ρL / S, where ρ is the resistivity of the resistor material, L is the conductor length, S is the conductor's cross-sectional area, and R is the resistance value.

[0009] Furthermore, the top surface and the four side surfaces are covered with an insulator, and the entire mounting surface serves as a soldering pad.

[0010] The through-flow module is designed as a rectangular parallelepiped. Except for the mounting surface, the remaining five surfaces are fully insulated. This through-flow module is used in complex and demanding environments to provide comprehensive protection against short circuits caused by contact with other components. The entire mounting surface acts as a single solder pad, providing excellent current flow capacity.

[0011] Furthermore, the insulator is a parylene coating.

[0012] The flow module is designed as a rectangular parallelepiped structure. Except for the mounting surface, the other five surfaces are fully covered with insulators. In this case, the insulator can be coated with parylene, which uses dichloroparaxylene dimer or paraxylene dimer to form a coating on the surface of the conductor using a chemical vapor deposition process.

[0013] Furthermore, the top surface and the two opposite side surfaces are covered with an insulator.

[0014] The through-flow module is designed as a rectangular parallelepiped structure. The three sides of the conductor are completely covered with insulators, and the mounting surface may be partially or not covered with insulators. This through-flow module is used for protection in more complex environments to avoid short circuits caused by contact with other components.

[0015] Furthermore, the insulator is insulating tape, PI film or epoxy resin.

[0016] The insulator can be made of insulating tape or PI film. Choose one of them according to the use environment and scene requirements. PI film has more outstanding performance in high temperature resistance and radiation resistance, insulating tape has more advantages in price, and epoxy resin has better bonding performance and mechanical strength.

[0017] Furthermore, the entire mounting surface serves as a soldering pad.

[0018] The through-flow module is designed as a rectangular structure. When the three sides of the conductor are completely covered with an insulator, if the size of the through-flow module is small, the entire mounting surface is used as a pad to improve the stability of welding. The pad is plated with nickel, tin, silver and gold to form an anti-oxidation layer to prevent oxidation of the pad and reduce the solderability of the pad.

[0019] Furthermore, the mounting surface is partially covered with an insulator.

[0020] The through-flow module is designed as a rectangular parallelepiped structure. When the three surfaces of the conductor are completely covered with an insulator, if the size of the through-flow module is large, the mounting surface is partially covered with an insulator, and the rest of the mounting surface can be used as a soldering pad. While improving the protection, the size of the soldering pad is reduced to reduce the anti-oxidation layer and the materials used during welding, saving costs.

[0021] Furthermore, on the mounting surface, the insulators are distributed along four sides of the mounting surface, and the insulators enclose the pads in the middle of the mounting surface.

[0022] The flow module is designed as a rectangular structure. On the mounting surface, the insulator is extended along the four sides to form an enclosed structure. The pad is located inside the enclosed structure. The pad is an integral pad with good flow capacity.

[0023] Furthermore, the mounting surface is provided with a plurality of pads, and the plurality of pads are spaced apart along the length direction of the mounting surface, and the insulator covers areas on the mounting surface other than the pads.

[0024] The flow module is designed as a rectangular parallelepiped structure. On the mounting surface, the pads are arranged at intervals along the length direction of the mounting surface. The insulator covers the area outside the pads on the mounting surface to form multiple small pads with better flow capacity.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] The flow module designed in this solution is mounted on the circuit board to form a flow channel that carries a large current. The flow module consists of a conductor and an insulator covering the conductor. The conductor can usually be made of conductive materials such as copper, aluminum, and nickel. Depending on the use environment and scenario, except for the mounting surface of the conductor that connects to the circuit board, the remaining surfaces of the conductor can be selectively covered with an insulator for protection to avoid contact with other components and cause short circuits. The soldering pads are designed on the mounting surface. The soldering pads can be integral soldering pads or multiple small soldering pads to fully utilize the flow capacity of the flow module. The soldering pads are formed into an anti-oxidation layer through nickel plating, tin plating, silver plating, and gold plating to prevent oxidation of the soldering pads, which reduces the solderability of the soldering pads, resulting in loose solder joints during mounting, causing cold solder joints or poor soldering, and affecting the reliability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The structure of the flow module of an embodiment of the present invention is Figure 1 .

[0028] Figure 2 for Figure 1 Schematic cross-section of .

[0029] Figure 3 Schematic diagram of the flow module framework design.

[0030] Figure 4 The structure of the flow module of an embodiment of the present invention is Figure 2 .

[0031] Figure 5 for Figure 4 Schematic cross-section of .

[0032] Figure 6 This is a schematic diagram of a conductive body attached to a substrate according to an embodiment of the present invention.

[0033] Figure 7 The structure of the flow module of an embodiment of the present invention is Figure 3 .

[0034] Figure 8 for Figure 7 Schematic cross-section of .

[0035] Figure 9 The structure of the flow module of an embodiment of the present invention is Figure 4 .

[0036] Figure 10 for Figure 9 Schematic cross-section of .

[0037] Illustration: 1. Current-carrying module; 2. Conductor; 3. Insulator; 21. Mounting surface; 22. Solder pad. DETAILED DESCRIPTION

[0038] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0039] This embodiment provides a flow module 1, which is mounted on a circuit board to provide an additional flow channel, including a conductor 2 and an insulator 3 covering the conductor 2; the conductor 2 is a polyhedron structure, and several surfaces of the conductor 2 are covered with the insulator 3; the conductor 2 includes a mounting surface 21 connected to the circuit board, and the mounting surface 21 is provided with a soldering pad 22, and the surface of the soldering pad 22 is provided with an anti-oxidation layer.

[0040] The flow module 1 of this embodiment is mounted on a circuit board to form a flow channel that carries a large current. The flow module 1 is composed of a conductor 2 and an insulator 3 covering the conductor 2. The conductor 2 can generally be made of conductive materials such as copper, aluminum, and nickel. Depending on the use environment and usage scenario, except for the mounting surface 21 of the conductor 2 for connecting to the circuit board, the remaining surfaces of the conductor 2 can be selectively covered with the insulator 3 for protection to avoid contact with other components and causing short circuits. A soldering pad 22 is designed on the mounting surface 21. The soldering pad 22 is an integral soldering pad or multiple small soldering pads, which can fully utilize the flow capacity of the flow module 1. The soldering pad 22 is formed with an anti-oxidation layer by nickel plating, tin plating, silver plating, and gold plating to prevent oxidation of the soldering pad 22, which reduces the solderability of the soldering pad 22, resulting in a loose solder joint during mounting, causing a cold solder joint or poor soldering, and affecting the reliability of the circuit board.

[0041] In this embodiment, conductor 2 is a rectangular parallelepiped structure. The surface opposite mounting surface 21 is the top surface, and the four surfaces between mounting surface 21 and the top surface are side surfaces. Other shapes, such as an L-shaped structure, can also be designed based on actual use. Conductor 2 has a length range of 3 to 500 mm, a width range of 0.5 to 5 mm, and a height range of 0.2 to 3 mm. Conductor 2 is designed as a rectangular parallelepiped structure, and its dimensions are designed based on the actual required resistance. The circuit size is designed according to the resistance law, which is R = ρL / S, where ρ is the resistivity of the material making up the resistor, L is the length of the conductor, S is the cross-sectional area of ​​the conductor, and R is the resistance value.

[0042] Example 1:

[0043] like Figures 1 to 3 As shown, the conductor 2 is designed as a rectangular parallelepiped structure, and the top surface and four side surfaces of the conductor 2 are completely covered with an insulator 3, and the entire mounting surface 21 serves as a soldering pad 22. Except for the mounting surface 21, the other five surfaces are fully covered with the insulator 3. This flow module 1 is used for all-round protection in complex and demanding environments to avoid short circuits caused by contact with other components. The entire mounting surface 21 serves as an integral soldering pad 22, and has good flow capacity. In this case, the insulator 3 can be coated with parylene, using dichloroparaxylene dimer or paraxylene dimer, and a chemical vapor deposition process to polymerize on the surface of the conductor 2 to form a coating. The following process can be used to produce the flow module 1:

[0044] S1: lead frame design. The material thickness is designed according to actual needs. The frame design of flow module 1 is as follows: Figure 3 shown.

[0045] S2: Apply UV film to the lead frame. The size of the UV film should be the same as the frame.

[0046] S3: Praylene coating process: the product is placed in a fully automatic coating equipment, using dichloroparaxylene dimer or paraxylene dimer to polymerize on the surface of the product to form a coating.

[0047] S4: cutting, cutting the frame of the flow module 1 to obtain a semi-finished flow module 1.

[0048] S5: Remove the UV film and place the cut product under ultraviolet light to make the glue on the UV film lose its stickiness so that the UV film can be removed, thereby obtaining a separate flow module 1.

[0049] Example 2:

[0050] like Figures 3 to 6 As shown, the conductor 2 is designed as a rectangular parallelepiped structure, with three sides fully covered with insulation. Specifically, the top surface and the two side surfaces defined by the length and height of the conductor 2 are covered with insulation 3. The two side surfaces defined by the width and height of the conductor 2 are not covered with insulation 3, nor is the mounting surface 21. This flow module 1 is designed for protection in complex environments, preventing short circuits caused by contact with other components. The insulation 3 can be made of epoxy resin, which offers advantages in adhesion and mechanical strength.

[0051] The entire mounting surface 21 of the conductor 2 serves as the soldering pad 22. If the size of the through-flow module 1 is small, the entire mounting surface 21 serves as the soldering pad 22 to improve the stability of soldering. The soldering pad 22 is formed with an anti-oxidation layer by nickel plating, tin plating, silver plating, or gold plating to prevent oxidation of the soldering pad and reduce the solderability of the soldering pad.

[0052] The flow module 1 can be manufactured using the following process:

[0053] S1: Design the substrate and paste the adhesive on the substrate. The thickness of the adhesive is 0.025mm~0.15mm, and the adhesive force is usually 0.3~2.0kgf / 25mm. The substrate design is as follows Figure 6 shown.

[0054] S2: The conductor 2 is pasted on the adhesive backing of the substrate using a placement machine. The size of the conductor 2 is designed according to needs.

[0055] S3: Place the substrate with the conductor 2 attached into an injection molding machine to complete the injection molding of epoxy resin.

[0056] S4: cutting, cutting the injection-molded substrate along the path where the conductor 2 is pasted to obtain a semi-finished flow module 1.

[0057] S5: Freeze to remove glue. Store the semi-finished flow module 1 in an environment of -20°C for 3 hours to make the back glue lose its stickiness. Remove the substrate to obtain the finished flow module 1.

[0058] In this embodiment, the above process is only one process for manufacturing the flow module 1. In other embodiments, there are still other possible manufacturing processes, such as (1) lead frame design, (2) injection molding, (3) cutting, etc., which will not be described in detail here.

[0059] Example 3:

[0060] like Figures 7 to 10 As shown, the conductor 2 is designed as a rectangular parallelepiped structure, with three sides fully covered with insulation. That is, the top surface of the conductor 2 and the two side surfaces formed by the length and height of the conductor 2 are covered with insulation 3, while the two side surfaces formed by the width and height of the conductor 2 are not covered with insulation 3. If the conductor 2 is large, the mounting surface 21 can be partially covered with insulation 3. This flow module 1 is used in complex environments for protection to avoid short circuits caused by contact with other components. Insulator 3 can be made of PI film or insulating tape, and the choice is based on the use environment and scenario requirements. PI film has better performance in high temperature and radiation resistance, while insulating tape is more cost-effective.

[0061] The mounting surface 21 of the conductor 2 is partially covered with an insulator 3, and the remaining portion of the mounting surface can be used as a pad 22. While improving protection, the size of the pad 22 is reduced to reduce the anti-oxidation layer and the material used during welding, saving costs. Figure 7 and Figure 8 As shown, the mounting surface 21 is provided with a plurality of pads 22, and the plurality of pads 22 are spaced apart along the length direction of the mounting surface 21, and the insulator 3 covers the area other than the pads 22 on the mounting surface 21. Figure 9 and Figure 10 As shown, on the mounting surface 21, the insulator 3 is distributed along the four sides of the mounting surface 21, and the insulator 3 encloses the pad 22 in the middle of the mounting surface 21. The insulator 3 extends along the four sides of the mounting surface 21 to form an enclosed structure, and the pad 22 is located inside the enclosed structure. The insulator is made of PI film, and the flow module 1 can be manufactured using the following process:

[0062] S1: Calculate the size of the conductor 2 metal plate and cut the conductor 2 metal plate according to the size.

[0063] S2: Cut the metal plate of the conductor 2 into a plurality of metal strips of the conductor 2 according to the width of the conductor 2.

[0064] S3: Apply film, apply AD glue on all four sides of the metal strip of conductor 2, and cover it with PI mold.

[0065] S4: Cutting: Cutting the metal strip of the conductor 2 with the film attached into several short metal strips of the conductor 2 to obtain a semi-finished flow module 1.

[0066] S5: Open the window; remove the PI film from the portion of the mounting surface 21 of the semi-finished flow module 1 that needs to be used as the solder pad 22.

[0067] S6: Remove glue, wipe the pad 22 with alcohol to remove residual glue, and obtain the finished flow module 1.

[0068] In this embodiment, the above process is only one process for manufacturing the flow module 1. In other embodiments, there are still other possible manufacturing processes, such as first opening a window on the PI film, then covering it on the conductor 2 metal strip, and finally cutting it into short conductor 2 metal strips to obtain a finished flow module 1.

[0069] In the description of the present invention, it should be understood that terms such as "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0070] Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Therefore, the term "first," "second," and the like may explicitly or implicitly include one or more of the features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0071] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A through-flow module mounted on a circuit board to provide an additional through-flow channel, characterized in that: It includes a conductor and an insulator covering the conductor; the conductor is a polyhedron structure, and several surfaces of the conductor are covered with insulators; the conductor includes a mounting surface connected to the circuit board, the mounting surface is provided with a soldering pad, and the surface of the soldering pad is provided with an anti-oxidation layer.

2. The flow module according to claim 1, characterized in that The conductor is a rectangular parallelepiped structure, the surface opposite to the mounting surface is the top surface, and the four surfaces between the mounting surface and the top surface are side surfaces.

3. The flow module according to claim 2, characterized in that The top surface and the four side surfaces are covered with an insulator, and the entire mounting surface serves as a soldering pad.

4. The flow module according to claim 3, characterized in that The insulator is a parylene coating.

5. The flow module according to claim 2, characterized in that The top surface and the two opposite side surfaces are covered with an insulator.

6. The flow module according to claim 5, characterized in that The insulator is insulating tape, PI film or epoxy resin.

7. The flow module according to claim 5, characterized in that The entire mounting surface serves as a soldering pad.

8. The flow module according to claim 5, characterized in that The mounting surface is partially covered with an insulator.

9. The flow module according to claim 8, characterized in that On the mounting surface, the insulators are distributed along the four sides of the mounting surface, and the insulators surround the pads at the middle position of the mounting surface.

10. The throughflow module according to claim 8, characterized in that The mounting surface is provided with a plurality of pads, which are spaced apart along the length direction of the mounting surface, and the insulator covers areas other than the pads on the mounting surface.

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