Circuit board, circuit board assembly and electronic equipment

Abstract

The utility model relates to a circuit board, a circuit board assembly and electronic equipment. The circuit board comprises a circuit board body; the common bonding pad is arranged on the circuit board body and comprises a first bonding pad, a second bonding pad connected to the first side of the first bonding pad and a third bonding pad connected to the second side of the first bonding pad; the second side and the first side are two sides of the first bonding pad along a first direction; the part, close to the first side, of the first bonding pad and the second bonding pad are used for welding the side wall of one of two adjacent shielding cases; the part, close to the second side, of the first bonding pad and the third bonding pad are used for welding the side wall of the other shielding case in the two adjacent shielding cases. According to the embodiment of the invention, the occupied space for welding two adjacent shielding covers on the circuit board can be saved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic products, and in particular to a circuit board, a circuit board assembly, and an electronic device. Background Art

[0002] As electronic products become more multifunctional, the space inside these circuit boards is becoming increasingly limited, limiting the space available for the placement of individual electronic components. Due to manufacturing limitations, the distance between shielding covers covering electronic components is typically greater than 0.4 mm. Therefore, reserving more space for electronic components within circuit board design has become a pressing issue. Utility Model Content

[0003] In order to overcome the problems existing in the related art, the present disclosure provides a circuit board, a circuit board assembly and an electronic device, which can save the space occupied by welding two adjacent shielding covers on the circuit board.

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided a circuit board, comprising:

[0005] Circuit board body;

[0006] a common pad, disposed on the circuit board body, and comprising a first pad, a second pad connected to a first side of the first pad, and a third pad connected to a second side of the first pad; the second side and the first side being two sides of the first pad along a first direction;

[0007] The portion of the first soldering pad close to the first side and the second soldering pad are used to solder the side wall of one of the two adjacent shielding covers;

[0008] The portion of the first soldering pad close to the second side and the third soldering pad are used for soldering the side wall of the other shielding cover among the two adjacent shielding covers.

[0009] In some embodiments, the second pad and the third pad are both plural;

[0010] a plurality of second pads, spaced apart and arranged on the first side along the second direction of the first pad;

[0011] A plurality of third pads are spaced apart and arranged on the second side along the second direction of the first pad;

[0012] The second direction is perpendicular to the first direction.

[0013] In some embodiments, the second pad and the third pad are alternately arranged on both sides of the first pad along the second direction of the first pad; or,

[0014] The second pad and the third pad are oppositely arranged on both sides of the first pad along a first direction of the first pad.

[0015] In some embodiments, the distance between adjacent second pads and third pads is between 0.5 mm and 1.5 mm.

[0016] In some embodiments, a plurality of the second pads are arranged at equal intervals on the first side; and / or a plurality of the third pads are arranged at equal intervals on the second side.

[0017] In some embodiments, the distance between two adjacent second pads is between 0.3 mm and 0.5 mm; and / or the distance between two adjacent third pads is between 0.3 mm and 0.5 mm.

[0018] In some embodiments, the second pad at least partially overlaps with the first pad; and / or the third pad at least partially overlaps with the first pad.

[0019] In some embodiments, the first pad is in a strip shape, and a length along the first direction is between 0.25 mm and 0.4 mm.

[0020] In some embodiments, the lengths of the second pad and the third pad along the first direction are both between 0.25 mm and 0.35 mm; and / or,

[0021] The lengths of the second pad and the third pad along the second direction are both between 1.5 mm and 2.5 mm.

[0022] According to a second aspect of an embodiment of the present disclosure, there is provided a circuit board assembly, comprising:

[0023] Multiple shielding covers;

[0024] The circuit board according to the first aspect;

[0025] The side wall of one shielding cover and the side wall of the other shielding cover of the two adjacent shielding covers are welded to the same common pad in the circuit board, and the two adjacent shielding covers are different and correspondingly welded to different common pads.

[0026] In some embodiments, the circuit board body of the circuit board is further provided with a plurality of fourth solder pads;

[0027] The common pad can form a first annular area with a portion of the fourth pads, and can form a second annular area with another portion of the fourth pads;

[0028] Two adjacent shielding covers are welded to the first annular area and the second annular area respectively.

[0029] According to a third aspect of an embodiment of the present disclosure, an electronic device is provided, comprising the circuit board assembly as described in the second aspect above.

[0030] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0031] By providing a common solder pad on the circuit board body of the circuit board for soldering two adjacent shielding covers, the disclosed embodiments can save space on the circuit board that would otherwise be required for soldering two adjacent shielding covers, thereby improving the space utilization of the circuit board and allowing the circuit board to accommodate more electronic components. Furthermore, the disclosed embodiments do not require special shielding cover materials, i.e., do not require modification of the shielding cover materials, and can reduce the low soldering yield caused by the difficulty in processing special shielding cover materials. Furthermore, the disclosed embodiments can improve the soldering yield of the shielding covers while saving space required for soldering two adjacent shielding covers.

[0032] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0034] Figure 1 This is a schematic diagram of a circuit board structure of the present disclosure shown in an exemplary embodiment. Figure 1 .

[0035] Figure 2 This is a schematic diagram of an existing circuit board shown in an exemplary embodiment. Figure 1 .

[0036] Figure 3 This is a schematic diagram of an existing circuit board shown in an exemplary embodiment. Figure 2 .

[0037] Figure 4A This is a schematic diagram of a circuit board structure of the present disclosure shown in an exemplary embodiment. Figure 2 .

[0038] Figure 4B This is a schematic diagram of a circuit board structure of the present disclosure shown in an exemplary embodiment. Figure 3 .

[0039] Figure 5 FIG. 1 is a schematic diagram showing the structure of a circuit board assembly of the present disclosure, showing an exemplary embodiment.

[0040] Figure 6 The figure is a structural block diagram of an electronic device according to an exemplary embodiment.

[0041] The accompanying drawings are as follows:

[0042] 101. Circuit board body; 102. Common pad; 103. Fourth pad; 104. Electronic components;

[0043] 1021, first pad; 1022, second pad; 1023, third pad;

[0044] 20. Middle pad; A, first direction; B, second direction;

[0045] 11. First existing shielding cover; 12. Second existing shielding cover; 13. First shielding cover; 14. Second shielding cover; 15. Third shielding cover; 102a. First common pad; 102b. Second common pad. DETAILED DESCRIPTION

[0046] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0047] The present disclosure provides a circuit board for use in applications where multiple shielding covers are provided. For example, when multiple shielding covers are provided on a circuit board, the circuit board can be used to allow two adjacent shielding covers to share a common solder pad, thereby reserving more space on the circuit board for other electronic components.

[0048] Figure 1 This is a schematic diagram of a circuit board structure shown in an exemplary embodiment. Figure 1 .like Figure 1 As shown, the circuit board includes:

[0049] Circuit board body 101;

[0050] The common pad 102 is disposed on the circuit board body 101 and includes a first pad 1021, a second pad 1022 connected to a first side of the first pad 1021, and a third pad 1023 connected to a second side of the first pad 1021. The second side and the first side are two sides of the first pad 1021 along the first direction A.

[0051] The portion of the first soldering pad 1021 close to the first side and the second soldering pad 1022 are used for soldering the side wall of one of the two adjacent shielding covers;

[0052] The portion of the first soldering pad 1021 close to the second side and the third soldering pad 1023 are used for soldering the side wall of the other shielding cover of the two adjacent shielding covers.

[0053] In the disclosed embodiments, the circuit board body includes, but is not limited to, a printed circuit board (PCB) and a flexible printed circuit (FPC). This embodiment and the following embodiments are illustrative of a PCB as the circuit board body. The shape of the circuit board body includes, but is not limited to, a rectangle, square, polygon, circle, and the like.

[0054] The circuit board body may be composed of alternating metal layers and insulating dielectric layers, wherein the metal layers include signal lines and / or metal reference surfaces. Within the circuit board body, signal lines in different metal layers are connected using metallized vias. The circuit board body is used to carry and electrically connect to electronic components.

[0055] Here, electronic components include but are not limited to chips, resistors, capacitors, inductors, potentiometers, electron tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, etc.

[0056] It's important to note that during the use of circuit boards, electronic components may be subject to interference from external signals, as well as signals from neighboring electronic components. Excessive interference can affect the proper functioning of the electronic components, and in turn, the proper functioning of the electronic equipment. Therefore, multiple shielding covers are often required on circuit boards to minimize interference with the electronic components.

[0057] Based on this, in the embodiment of the present disclosure, a common pad is provided on the circuit board body for welding two adjacent shielding covers on the circuit board, that is, the side wall of one shielding cover and the side wall of the other shielding cover of the two adjacent shielding covers are welded to the same common pad.

[0058] It should be noted that the common pad can be provided on the insulating dielectric layer of the circuit board body. The shape of the common pad includes, but is not limited to, a rectangle, a square, a polygon, a circle, an ellipse, or a special shape. The arrangement of the multiple pads included in the common pad can be in an array arrangement. Of course, the multiple pads included in the common pad can also be arranged irregularly.

[0059] Here, a welding material may be provided on the common pad, and two adjacent shielding covers may be welded to the common pad via the welding material. For example, solder paste included in the welding material may be heated and melted, and then the two adjacent shielding covers may be welded to the circuit board body via the solder paste.

[0060] In the embodiment of the present disclosure, the common pad includes a first pad, a second pad disposed on a first side of the first pad, and a third pad disposed on a second side of the first pad. It can be seen that the second pad and the third pad are disposed on both sides of the first pad in the first direction on the circuit board.

[0061] It should be noted that the second pad and the third pad can be connected to the first pad, but neither of them forms at least partial overlap with the first pad. They can also form at least partial overlap with the first pad. This is not limited in the embodiment of the present disclosure.

[0062] In some embodiments, as Figure 1 As shown, the second pad 1022 at least partially overlaps with the first pad 1021 ; and / or the third pad 1023 at least partially overlaps with the first pad 1021 .

[0063] That is to say, in the circuit board, the second solder pad may at least partially overlap with the first solder pad, and the third solder pad may partially overlap with the first solder pad; the second solder pad may at least partially overlap with the first solder pad, and the third solder pad may not overlap with the first solder pad; the second solder pad may not overlap with the first solder pad, and the third solder pad may at least partially overlap with the first solder pad.

[0064] Here, at least partially overlapping may include completely overlapping or partially overlapping, that is, the second pad and the first pad may partially overlap or completely overlap; the third pad and the first pad may partially overlap or completely overlap.

[0065] In the disclosed embodiment, two adjacent shielding covers may be arranged along a first direction, that is, the first direction may be parallel to the arrangement direction of the two adjacent shielding covers, so as to better facilitate welding the two adjacent shielding covers to a common pad.

[0066] Here, the first pad may be strip-shaped, and the first direction may be perpendicular to the strip extension direction of the first pad, that is, the first direction is parallel to the width direction of the first pad and perpendicular to the length direction of the first pad.

[0067] The second pad and the third pad may be one or more. In some embodiments, the second pad may be one and the third pad may be multiple. In other embodiments, the second pad may be multiple and the third pad may be one. In other embodiments, the second pad and the third pad may both be multiple.

[0068] In the disclosed embodiment, the sidewall of one of the two adjacent shielding covers is welded to the portion of the first soldering pad near the first side and the second soldering pad; the sidewall of the other of the two adjacent shielding covers is welded to the portion of the second soldering pad near the second side and the third soldering pad. In other words, the two sidewalls of the two adjacent shielding covers are welded to different portions of the first soldering pad.

[0069] Here, the length of the first pad along the first direction can be set according to the two side walls of two adjacent shielding covers. For example, the length of the first pad along the first direction can be greater than or equal to the length of the two side walls of two adjacent shielding covers.

[0070] It should be noted that the shape of the first soldering pad can also be set based on the shape of the two sidewalls of the two adjacent shielding covers. For example, if the two sidewalls of the two adjacent shielding covers are straight, the first soldering pad can be set to a corresponding strip shape; if the two sidewalls of the two adjacent shielding covers are curved, the first soldering pad can be set to a corresponding curved shape. This can facilitate better soldering of the two adjacent shielding covers to the first soldering pad.

[0071] In the embodiment of the present disclosure, the size of the first pad, the size of the second pad, and the size of the third pad can be set according to the actual circuit layout. For example, the length of the first pad, the second pad, and the third pad along the first direction, i.e., the pad width, is less than 0.4 mm.

[0072] In some embodiments, as Figure 1 As shown, the first pad 1021 is strip-shaped, and the length along the first direction A is between 0.25 mm and 0.4 mm. Figure 1 As shown, the lengths of the second solder pad 1022 and the third solder pad 1023 along the first direction A are both between 0.25 mm and 0.35 mm; and / or, the lengths of the second solder pad 1022 and the third solder pad 1023 along the second direction B are both between 1.5 mm and 2.5 mm.

[0073] For example, in the embodiment of the present disclosure, the length of the first pad along the first direction can be set to 0.35 mm, the second pad and the third pad are the same pads, and the length along the first direction is 0.3 mm, and the length along the second direction is 2 mm.

[0074] In the embodiment of the present disclosure, a gap is reserved between two adjacent shielding covers welded on the circuit board. Here, a distance of 0.2 mm to 0.1 mm can be reserved between two adjacent shielding covers welded on the circuit board.

[0075] For example, the placement accuracy of a SMT machine is between -0.02 mm and +0.02 mm. After the shielding cover is soldered by the SMT machine, a distance of 0.15 mm can be reserved between two adjacent shielding covers soldered on the circuit board.

[0076] In related technologies, for shielding covers that protect non-RF electronic components, a gap of 0.4 mm is required between two adjacent shielding covers; for shielding covers that protect RF components, a gap of 0.5 mm is required between two adjacent shielding covers, thereby limiting the layout space of other components on the circuit board by the gaps between the adjacent shielding covers. Figure 2 As shown, the pad width S2 of the first conventional shielding cover 11 is 0.4 mm, the pad width S3 of the second conventional shielding cover 12 is 0.4 mm, the spacing S1 between the first conventional shielding cover 11 and the second conventional shielding cover 12 is 0.4 mm, and the length S4 of the adjacent side walls of the first conventional shielding cover 11 and the second conventional shielding cover 12 in the second direction B is 10 mm. Thus, the length of the first conventional shielding cover 11 and the second conventional shielding cover 12 in the first direction A is S1 + S2 + S3, that is, 1.2 mm, and the length in the second direction B is 10 mm.

[0077] In contrast, the disclosed embodiment proposes soldering two adjacent shielding covers together using a common solder pad. If the length of the two sidewalls of the two adjacent shielding covers in the second direction B is 10 mm, the length of the second and third solder pads in the first direction A, i.e., the solder pad width, is 0.3 mm, and the length of the first solder pad in the first direction A, i.e., the solder pad width, is 0.3 mm, then the soldered length of the two adjacent shielding covers in the first direction A, i.e., the length of the two adjacent shielding covers in the second direction B, is 0.9 mm.

[0078] It can be seen that the area saved by the embodiment of the present disclosure is (1.2-0.9)*10 square millimeters. Thus, by providing a common solder pad, the embodiment of the present disclosure can make the orthographic projection area of ​​the solder pad required for soldering two adjacent shielding covers on the circuit board body smaller, thereby accommodating more electronic components per unit area of ​​the circuit board body, or the same number of electronic components can be arranged on a smaller circuit board body. As a result, the layout area of ​​the shielding cover on the circuit board body can be saved, which is conducive to the development of miniaturization and ultra-thinness of the circuit board body.

[0079] In related technologies, such as Figure 3As shown, to save layout space, the existing design employs a cross-recessed, overlapping middle pad 20. This cross-recessed design increases the difficulty of processing the shield cover material, affecting flatness and, consequently, the soldering yield of the actual shield cover. Therefore, the disclosed embodiment does not improve the shield cover material, but instead optimizes the solder pad side of the circuit board, providing a common solder pad so that the two sidewalls of two adjacent shield covers can be positioned on the first, second, and third solder pads.

[0080] In this way, the embodiment of the present disclosure can solve the problem of affecting the welding yield due to the difficulty in processing the shielding cover material. Furthermore, the embodiment of the present disclosure can save the space occupied by welding two adjacent shielding covers on the basis of improving the welding yield, thereby improving the space utilization of the circuit board.

[0081] In some embodiments, as Figure 4A As shown, there are multiple second pads 1022 and multiple third pads 1023;

[0082] A plurality of second pads 1022 are spaced apart and arranged on the first side along the second direction B of the first pad 1021;

[0083] A plurality of third pads 1023 are spaced apart and arranged on the second side along the second direction B of the first pad 1021;

[0084] The second direction B is perpendicular to the first direction A.

[0085] In the embodiment of the present disclosure, the plurality of second soldering pads and the plurality of third soldering pads are provided, so that two adjacent shielding covers can be better soldered to the common soldering pad, thereby improving the soldering yield.

[0086] Here, the first pad, the second pad and the third pad may be an integrated structure, and the integrated structure may be in a sawtooth state, that is, the integrated structure may be a sawtooth-shaped pad.

[0087] In the embodiment of the present disclosure, the plurality of second pads may be arranged at unequal intervals on the first side, or may be arranged at equal intervals on the first side, that is, evenly distributed on the first side.

[0088] Similarly, the plurality of third pads may be arranged at unequal intervals on the second side, or may be evenly distributed on the second side.

[0089] In the embodiment of the present disclosure, the second pads and the third pads distributed on both sides of the first pad can be arranged in different distribution modes. In some embodiments, the second pads and the third pads are arranged on both sides of the first pad relative to each other along the first direction of the first pad.

[0090] That is, the plurality of second pads and the plurality of third pads may be arranged in an array, and each row of pads in the array includes a second pad and a third pad arranged opposite to the second pad.

[0091] It should be noted that a second pad and a third pad disposed opposite to the second pad may be symmetrically disposed on both sides of the first pad with the first pad as the axis of symmetry. Here, a line connecting the center point of the second pad and the center point of the third pad disposed opposite to the second pad may be parallel to the first direction.

[0092] In other embodiments, Figure 4A As shown, the second pads 1022 and the third pads 1023 are alternately arranged on both sides of the first pad 1021 along the second direction B of the first pad 1021 .

[0093] That is, the line connecting the center points of the adjacent second pads and the third pads intersects the line of the first direction. A third pad can be located between two adjacent second pads, and a second pad can be located between two adjacent third pads.

[0094] In the embodiment of the present disclosure, by alternately arranging the second pads and the third pads on both sides of the first pad, the number of second pads and third pads can be reduced, and more space can be reserved on the circuit board.

[0095] It should be noted that if Figure 4A As shown, the space between two adjacent second pads 1022 and the space between two adjacent third pads 1023 can be used to accommodate electronic components 104. In this way, the circuit board can further accommodate more electronic components.

[0096] In the embodiment of the present disclosure, the spacing between the plurality of second pads and the spacing between the plurality of third pads can be set according to the actual layout requirements. Figure 4A As shown, a plurality of second pads 1022 are arranged at equal intervals on the first side; and a plurality of third pads 1023 are arranged at equal intervals on the second side.

[0097] That is, in the embodiment of the present disclosure, the plurality of second pads are evenly distributed on the first side, and the plurality of third pads are evenly distributed on the second side, so that the layout of the pads on the circuit board can be more regular.

[0098] In some embodiments, as Figure 4B As shown, the distance H3 between the adjacent second pads 1022 and the third pads 1023 is between 0.5 mm and 1.5 mm.

[0099] For example, the distance between adjacent second pads and third pads may be set to 1 mm.

[0100] In the embodiment of the present disclosure, the distance between two adjacent second pads and the distance between two adjacent third pads can be set to be equal or unequal, and the embodiment of the present disclosure does not limit this.

[0101] In some embodiments, as Figure 4B As shown, the distance H1 between two adjacent second pads 1022 is between 0.3 mm and 0.5 mm; and / or the distance H2 between two adjacent third pads 1023 is between 0.3 mm and 0.5 mm.

[0102] For example, the distance between two adjacent second pads and the distance between two adjacent third pads may be set to 0.4 mm.

[0103] It is understandable that by setting the distance between two adjacent second pads to be between 0.3 mm and 0.5 mm and the distance between two adjacent third pads to be between 0.3 mm and 0.5 mm, the welding of the shielding cover can be made more reliable while saving the space occupied by the welding shielding cover.

[0104] The present disclosure also provides a circuit board assembly, the circuit board assembly comprising:

[0105] A circuit board as in one or more of the above embodiments;

[0106] The plurality of shielding covers are welded to a common pad in the circuit board, and the side wall of one shielding cover and the side wall of the other shielding cover of two adjacent shielding covers are welded to a common pad in the circuit board.

[0107] In the disclosed embodiments, different shielding covers can be used to protect different electronic components. In some embodiments, a first shielding cover among the multiple shielding covers shields interference signals emitted by the first electronic component within the first shielding cover and shields external interference signals outside the first shielding cover, thereby ensuring that the first electronic component is not affected by the interference signal.

[0108] It should be noted that, in order to further save space, two shielding covers with side walls of the same length can be set as adjacent shielding covers. In this way, when common pads are set for welding adjacent shielding covers, the length of the first pad in the common pads can be set to the shortest possible, thereby also saving space.

[0109] The side wall of one of the two adjacent shielding covers and the side wall of the other shielding cover are welded to the same common solder pad in the circuit board, and may include: the side wall of one of the two adjacent shielding covers is welded to the part of the first solder pad close to the first side and the second solder pad included in the same common solder pad in the circuit board; the side wall of the other of the two adjacent shielding covers is welded to the part of the first solder pad close to the second side and the third solder pad included in the same common solder pad in the circuit board.

[0110] The adjacent shielding covers are different from each other and are soldered to different common pads. In other words, the more adjacent shielding covers there are, the more common pads need to be set, and the smaller the space occupied by the shielding covers in the circuit board assembly, the more space can be saved.

[0111] For example, Figure 5 As shown, the circuit board assembly includes a first shielding cover 13, a second shielding cover 14 and a third shielding cover 15; if the first shielding cover 13 and the second shielding cover 14 are arranged adjacent to each other, a first common soldering pad 102a can be correspondingly provided on the circuit board body 101, and the first common soldering pad 102a is used for soldering the adjacently arranged first shielding cover 13 and the second shielding cover 14;

[0112] If the first shielding cover 13 and the third shielding cover 15 are also arranged adjacent to each other, a second common soldering pad 102 b may be correspondingly provided on the circuit board body 101 . The second common soldering pad 102 b is used for soldering the adjacent first shielding cover 13 and the third shielding cover 15 .

[0113] It can be understood that the circuit board assembly includes the circuit boards of one or more embodiments. By setting a common solder pad on the circuit board body of the circuit board to weld two adjacent shielding covers, the space occupied by welding two adjacent shielding covers on the circuit board can be saved, thereby improving the space utilization of the circuit board and allowing the circuit board to accommodate more electronic components.

[0114] Moreover, the disclosed embodiment does not require special shielding cover materials, that is, there is no need to improve the shielding cover materials, which can reduce the low welding yield caused by the difficulty of processing special shielding cover materials, and thus can improve the welding yield of the shielding cover while saving the space occupied by welding two adjacent shielding covers.

[0115] In some embodiments, as Figure 1 and Figure 4A The circuit board body of the circuit board is further provided with a plurality of fourth solder pads 103;

[0116] The common pad 102 can form a first annular area with a portion of the fourth pad 103, and can form a second annular area with another portion of the fourth pad 103;

[0117] Two adjacent shielding covers are welded to the first annular area and the second annular area respectively.

[0118] In the embodiment of the present disclosure, the first annular area and the second annular area can both be circular, square, or irregularly shaped. Here, the first annular area and the second annular area can be respectively configured according to the shapes of two adjacent shielding covers welded to the annular area, and the embodiment of the present disclosure does not limit this.

[0119] For example, when two adjacent shielding covers are rectangular, the corresponding first annular area and the second annular area may be square annular areas respectively.

[0120] An embodiment of the present disclosure further provides an electronic device, which includes the circuit board assembly in one or more of the above embodiments.

[0121] In the embodiment of the present disclosure, the electronic device is a type of electronic device with a circuit board. The electronic device can be a user equipment (UE) or a terminal device (terminal). For example, the electronic device can be a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a terminal in industrial control (industrial control), a terminal in self-driving (selfdriving), a terminal in remote medical (remote medical), a terminal in a smart grid (smart grid), a terminal in transportation safety (transportation safety), a terminal in a smart city (smart city), and a terminal in a smart home (smart home). Among them, large-screen display terminals include but are not limited to smart screens, tablet computers (portable android device, PAD), laptop computers, desktop computers, televisions, projectors and other devices.

[0122] It can be understood that the electronic device includes a circuit board assembly, which includes a circuit board in one or more embodiments. By setting a common solder pad on the circuit board body of the circuit board to weld two adjacent shielding covers, the space occupied by welding two adjacent shielding covers on the circuit board can be saved, thereby improving the space utilization of the circuit board and allowing the circuit board to accommodate more electronic components.

[0123] Moreover, the disclosed embodiment does not require special shielding cover materials, that is, there is no need to improve the shielding cover materials, which can reduce the low welding yield caused by the difficulty of processing special shielding cover materials, and thus can improve the welding yield of the shielding cover while saving the space occupied by welding two adjacent shielding covers.

[0124] Figure 6 FIG. 1 is a structural block diagram of an electronic device according to an exemplary embodiment. Figure 6 , the electronic device 600 may include one or more of the following components: a processing component 602 , a memory 604 , a power component 606 , a multimedia component 608 , an audio component 610 , an input / output (I / O) interface 612 , a sensor component 614 , and a communication component 616 .

[0125] The processing component 602 generally controls the overall operation of the electronic device 600, such as operations associated with at least one of display, phone calls, data communications, camera operation, and recording operations. The processing component 602 may include one or more processors 620 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 602 may include one or more modules to facilitate interaction between the processing component 602 and other components. For example, the processing component 602 may include a multimedia module to facilitate interaction between the multimedia component 608 and the processing component 602.

[0126] The memory 604 is configured to store various types of data to support operations on the electronic device 600. Examples of such data include at least one of the following: instructions for any application or method operating on the electronic device 600, contact data, phone book data, messages, pictures, and videos. The memory 604 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0127] The power supply component 606 provides power to various components of the electronic device 600. The power supply component 606 may include at least one of the following: a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device 600.

[0128] The multimedia component 608 includes a screen that provides an output interface between the electronic device 600 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor can not only sense the boundaries of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 608 includes a front camera and / or a rear camera. When the electronic device 600 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0129] The audio component 610 is configured to output and / or input audio signals. For example, the audio component 610 includes a microphone (MIC), which is configured to receive external audio signals when the electronic device 600 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 604 or transmitted via the communication component 616. In some embodiments, the audio component 610 also includes a speaker for outputting audio signals.

[0130] I / O interface 612 provides an interface between processing component 602 and peripheral interface modules, such as a keyboard, click wheel, and buttons. These buttons may include, but are not limited to, a home button, volume buttons, a start button, and a lock button.

[0131] The sensor assembly 614 includes one or more sensors for providing various aspects of the status assessment of the electronic device 600. For example, the sensor assembly 614 can detect the open / closed state of the electronic device 600, the relative positioning of components, such as the display and keypad of the electronic device 600. The sensor assembly 614 can also detect changes in the position of the electronic device 600 or a component thereof, the presence or absence of user contact with the electronic device 600, the orientation or acceleration / deceleration of the electronic device 600, and changes in the temperature of the electronic device 600. The sensor assembly 614 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 614 can also include an optical sensor, such as a complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) image sensor, for use in imaging applications. In some embodiments, the sensor assembly 614 can also include, but is not limited to, at least one of the following: an accelerometer, a gyroscope, a magnetic sensor, a pressure sensor, and a temperature sensor.

[0132] The communication component 616 is configured to facilitate communication between the electronic device 600 and other devices in a wired or wireless manner. The electronic device 600 can access a wireless network based on a communication standard, such as Wi-Fi, 4G, 5G, or a combination thereof. In an exemplary embodiment, the communication component 616 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 616 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0133] In an exemplary embodiment, the electronic device 600 may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0134] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the claims.

[0135] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A circuit board, characterized in that: include: Circuit board body; a common pad, disposed on the circuit board body, and comprising a first pad, a second pad connected to a first side of the first pad, and a third pad connected to a second side of the first pad; the second side and the first side being two sides of the first pad along a first direction; The portion of the first soldering pad close to the first side and the second soldering pad are used to solder the side wall of one of the two adjacent shielding covers; The portion of the first soldering pad close to the second side and the third soldering pad are used for soldering the side wall of the other shielding cover among the two adjacent shielding covers.

2. The circuit board according to claim 1, wherein: There are multiple second pads and multiple third pads; a plurality of second pads spaced apart on the first side along the second direction of the first pad; A plurality of third pads are spaced apart and arranged on the second side along the second direction of the first pad; The second direction is perpendicular to the first direction.

3. The circuit board according to claim 2, wherein: The second pads and the third pads are alternately arranged on both sides of the first pad along the second direction of the first pad; or, The second pad and the third pad are oppositely arranged on both sides of the first pad along a first direction of the first pad.

4. The circuit board according to claim 3, wherein: The distance between adjacent second pads and third pads is between 0.5 mm and 1.5 mm.

5. The circuit board according to claim 2, wherein: A plurality of the second pads are arranged at equal intervals on the first side; and / or a plurality of the third pads are arranged at equal intervals on the second side.

6. The circuit board according to claim 2, wherein: The distance between two adjacent second pads is between 0.3 mm and 0.5 mm; and / or, The distance between two adjacent third pads is between 0.3 mm and 0.5 mm.

7. The circuit board according to any one of claims 1 to 6, characterized in that: The second pad at least partially overlaps with the first pad; and / or the third pad at least partially overlaps with the first pad.

8. The circuit board according to any one of claims 1 to 6, characterized in that: The first pad is in a strip shape, and a length along the first direction is between 0.25 mm and 0.4 mm.

9. The circuit board according to any one of claims 1 to 6, characterized in that: The lengths of the second pad and the third pad along the first direction are both between 0.25 mm and 0.35 mm; and / or, The lengths of the second pad and the third pad along the second direction are both between 1.5 mm and 2.5 mm.

10. A circuit board assembly, characterized in that: include: Multiple shielding covers; The circuit board according to any one of claims 1 to 9; The side wall of one shielding cover and the side wall of the other shielding cover of the two adjacent shielding covers are welded to the same common pad in the circuit board, and the two adjacent shielding covers are different and correspondingly welded to different common pads.

11. The circuit board assembly according to claim 10, wherein: The circuit board body of the circuit board is further provided with a plurality of fourth solder pads; The common pad can form a first annular area with a portion of the fourth pads, and can form a second annular area with another portion of the fourth pads; Two adjacent shielding covers are welded to the first annular area and the second annular area respectively.

12. An electronic device, characterized in that: Comprising the circuit board assembly according to claim 10 or 11.

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