Acquisition assembly and energy storage power supply

Abstract

The utility model discloses an acquisition assembly and an energy storage power supply. The acquisition assembly comprises a circuit board which comprises a bonding pad; the collecting piece comprises a first connecting part; and the first connecting part is connected with the bonding pad through the conductive reinforcing layer. In the acquisition assembly, the first connecting part is connected with the bonding pad through the conductive reinforcing layer, so that the welding firmness of the acquisition piece and the circuit board can be improved to a certain extent, and the product reliability and yield are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, in particular to a collection component and an energy storage power supply. Background Art

[0002] In related technologies, energy storage power supplies include a nickel sheet that connects to an aluminum busbar and a printed circuit board (PCB). The PCB uses this sheet and the aluminum busbar to collect parameter information about the battery cells. However, due to manufacturing and assembly errors, the aluminum busbar and the PCB can have height and position deviations. This can cause varying degrees of stress on the nickel sheet when it is soldered to both the PCB and the aluminum busbar. If the external force exceeds the strength of the solder connection, the nickel sheet can fall off, causing product failure. Utility Model Content

[0003] The embodiments of the present invention provide a collection component and an energy storage power supply to solve at least one of the above-mentioned technical problems.

[0004] A collection component according to an embodiment of the present invention includes:

[0005] A circuit board, the circuit board comprising a solder pad;

[0006] A collecting member, the collecting member comprising a first connecting portion, and;

[0007] A conductive reinforcement layer, wherein the first connection portion is connected to the pad through the conductive reinforcement layer.

[0008] In the above-mentioned acquisition component, the first connection portion is connected to the pad through the conductive reinforcement layer, which can improve the welding firmness between the acquisition component and the circuit board to a certain extent, and improve product reliability and yield.

[0009] In some embodiments, the conductive reinforcement layer includes a first conductive layer and a second conductive layer, the first conductive layer is provided at the first connecting portion, the second conductive layer is provided at the pad, and the first conductive layer is connected to the second conductive layer.

[0010] In the above-mentioned acquisition component, the conductive reinforcement layer can not only provide good electrical connection performance, but also improve the welding quality to a certain extent.

[0011] In certain embodiments, the first conductive layer and the second conductive layer are connected by welding using a welding torch.

[0012] In the above-mentioned acquisition component, the acquisition component and the circuit board form a relatively firm connection to a certain extent.

[0013] In some embodiments, the material of the collecting member includes nickel or aluminum, and the material of the conductive reinforcement layer includes copper.

[0014] In the above-mentioned collection component, the accuracy of the parameter information of the battery cell collected by the circuit board through the collection component is guaranteed to a certain extent.

[0015] In some embodiments, the collecting member includes a second connecting portion and a third connecting portion, the second connecting portion connects the third connecting portion and the first connecting portion, the third connecting portion is used to connect to a bus, and the second connecting portion includes an arched protrusion, which protrudes upward compared to the plane where the first connecting portion is located.

[0016] The above-mentioned acquisition components can absorb and reduce the stress caused by the height difference between the bus and the circuit board, and reduce the welding problems such as cold welding during the welding process between the acquisition components and the circuit board.

[0017] In some embodiments, the first connecting portion is provided with a through hole along a thickness direction, and the through hole is filled with solder.

[0018] In certain embodiments, the through-hole comprises a waist-shaped through-hole.

[0019] In some embodiments, a notch is provided on a periphery of the first connecting portion, and the notch is filled with solder.

[0020] In the above-mentioned collection component, the design of through holes and notches can increase the effective contact area of ​​solder, thereby improving the welding quality and reliability to a certain extent.

[0021] An energy storage power supply according to an embodiment of the present invention includes a battery cell, an inverter, a bus bar and a collection component according to any of the above embodiments, wherein the bus bar connects the battery cell and the collection component, and the inverter is connected to the circuit board.

[0022] In the above energy storage power supply, the first connection portion is connected to the pad through the conductive reinforcement layer, which can improve the welding firmness between the acquisition component and the circuit board to a certain extent, and improve product reliability and yield.

[0023] In certain embodiments, the collecting member is connected to the busbar by laser welding.

[0024] In the above energy storage power supply, the collection component and the bus are connected by laser welding, which can ensure the high precision, high strength and high reliability of the connection to a certain extent, so that the parameter information of the battery cell can be transmitted stably.

[0025] Additional aspects and advantages of the embodiments of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments with reference to the following drawings, in which:

[0027] Figure 1 It is a structural diagram of the busbar and the collection component of the embodiment of the utility model;

[0028] Figure 2 It is a schematic structural diagram of the collection component of the embodiment of the present utility model;

[0029] Figure 3 This is another structural diagram of the collection component of the embodiment of the utility model;

[0030] Figure 4 yes Figure 2 An enlarged schematic diagram of part A of the collection component;

[0031] Figure 5 yes Figure 3 An enlarged schematic diagram of part B of the collection component;

[0032] Figure 6 It is a structural schematic diagram of a collection piece according to an embodiment of the present utility model;

[0033] Figure 7 It is another structural schematic diagram of the collecting piece according to the embodiment of the present utility model.

[0034] Description of main component symbols:

[0035] Busbar 10, collecting member 20, first connecting portion 21, second connecting portion 22, third connecting portion 23, through hole 25, notch 28, circuit board 30, pad 32, conductive reinforcement layer 40, arched protrusion 50, collecting assembly 100. DETAILED DESCRIPTION

[0036] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting the present invention. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0038] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, removable connections, or integral connections. They may refer to mechanical connections or electrical connections. They may refer to direct connections or indirect connections through an intermediary, and they may refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0039] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0040] The disclosure herein provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described herein. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0041] See also Figures 1 to 7The present invention provides a collection assembly 100 including a circuit board 30, a collection member 20, and a conductive reinforcement layer 40. The circuit board 30 includes a pad 32, and the collection member 20 includes a first connection portion 21, which is connected to the pad 32 via the conductive reinforcement layer 40.

[0042] In the above-mentioned acquisition component 100 , the first connection portion 21 is connected to the pad 32 through the conductive reinforcement layer 40 , thereby improving the welding firmness between the acquisition component 20 and the circuit board 30 to a certain extent, and improving product reliability and yield.

[0043] Specifically, the data acquisition component 100 can be applied to, but is not limited to, energy storage power supplies, which are devices that store electrical energy and release it when needed. The energy storage power supply includes battery cells, a busbar 10, and the data acquisition component 100. The battery cells store and provide electrical energy for the entire energy storage power supply, while the busbar 10 electrically connects the battery cells to transmit current. The data acquisition component 100 can collect parameter information (such as voltage, temperature, and current) from the battery cells.

[0044] Optionally, the energy storage power supply includes an inverter, which can be electrically connected to the circuit board 30 and thus electrically connected to the battery cells. The inverter can convert the direct current output by the battery cells into alternating current output for use by the load.

[0045] Please combine Figures 2 to 5 The data acquisition component 100 includes a data acquisition element 20 and a circuit board 30. The circuit board 30 includes a solder pad 32. The data acquisition element 20 includes a first connection portion 21, which is connected to the solder pad 32. The data acquisition element 20 is connected to the bus 10 and transmits the battery cell parameter information to the circuit board 30. The circuit board 30 can be connected to the battery management system of the energy storage power supply. The battery management system can obtain the battery cell parameter information through the data acquisition component 100, thereby controlling the discharge or charging of the battery cells.

[0046] In one embodiment, the conductive reinforcement layer 40 is provided on the contact surface between the first connection portion 21 and the pad 32, and the first connection portion 21 and the pad 32 are connected via the conductive reinforcement layer 40. On the one hand, the conductive reinforcement layer 40 can provide better electrical connection performance, allowing current to be more efficiently transferred from the acquisition component 20 to the circuit board 30. On the other hand, the conductive reinforcement layer 40 can provide better connection strength between the first connection portion 21 and the pad 32, allowing the acquisition component 20 and the circuit board 30 to be more firmly connected.

[0047] Optionally, the first connecting portion 21 is soldered to the pad 32 by soldering. The pad 32 is the area on the circuit board 30 used for soldering. The conductive reinforcement layer 40 is located on this welding area, which can prevent the metal in the welding area from oxidizing before and during welding to a certain extent, and prevent the welding strength from decreasing due to oxidation reducing the bonding force between the solder and the metal, thereby improving the welding firmness of the collection piece 20 and the circuit board 30 to a certain extent.

[0048] In some embodiments, the conductive reinforcement layer 40 includes a first conductive layer and a second conductive layer. The first conductive layer is provided on the first connecting portion 21 , and the second conductive layer is provided on the pad 32 . The first conductive layer is connected to the second conductive layer.

[0049] In this way, the conductive reinforcement layer 40 can not only provide good electrical connection performance, but also improve welding quality to a certain extent.

[0050] Specifically, the conductive reinforcement layer 40 includes a first conductive layer and a second conductive layer. The first conductive layer is provided on the first connection portion 21 of the acquisition component 20, and the second conductive layer is provided on the solder pad 32 of the circuit board 30. The first and second conductive layers are connected. The first and second conductive layers enhance the electrical connection between the acquisition component 20 and the circuit board 30, allowing for more efficient current transfer from the acquisition component 20 to the circuit board 30. The first and second conductive layers also prevent oxidation of the metal portions welded between the acquisition component 20 and the circuit board 30 before and during welding, thereby improving weld quality.

[0051] Optionally, the first conductive layer may be formed on the surface of the first connecting portion 21 facing the pad 32 by electroplating, and the second conductive layer may be formed on the surface of the pad 32 facing the first connecting portion 21 by electroplating.

[0052] In other embodiments, the conductive reinforcement layer 40 may be disposed on one of the first connection portion 21 and the pad 32, that is, the conductive reinforcement layer 40 may be disposed on the first connection portion 21 and connected to the pad 32, or the conductive reinforcement layer 40 may be disposed on the pad 32 and connected to the first connection portion 21. Figure 6 and Figure 7 In the illustrated embodiment, the conductive reinforcement layer 40 may be disposed on the first connection portion 21 .

[0053] In certain embodiments, the first conductive layer and the second conductive layer are connected by welding using a welding torch.

[0054] In this way, the collecting member 20 and the circuit board 30 form a relatively firm connection to a certain extent.

[0055] Specifically, in order to form a relatively strong connection between the acquisition component 20 and the circuit board 30, the first conductive layer and the second conductive layer are connected by soldering. During the soldering process, the solder is heated to above the melting point and then coated or applied to the conductive layer. The molten solder wets the surface of the conductive layer and forms a strong solder joint after cooling and solidification, which can withstand the stress caused by vibration, impact and temperature changes to a certain extent. The solder acts as a "bridge" between the two conductive layers, and to a certain extent, the electrical signal can flow smoothly from the acquisition component 20 to the circuit board 30. This connection method ensures that the electrical contact points between the acquisition component 20 and the circuit board 30 have high conductivity and mechanical strength to a certain extent.

[0056] In some embodiments, the material of the collecting member 20 includes nickel or aluminum, and the material of the conductive reinforcement layer 40 includes copper.

[0057] In this way, the accuracy of the parameter information of the battery cells collected by the circuit board 30 through the collecting component 20 is guaranteed to a certain extent.

[0058] Specifically, in order for the collection member 20 to have good electrical conductivity and corrosion resistance, the collection member 20 can be made of nickel or aluminum. Both nickel and aluminum have good electrical conductivity, which can ensure the accurate collection of parameter information of the battery cell. At the same time, both nickel and aluminum have good corrosion resistance and maintain long-term chemical stability, thereby ensuring the long-term reliable operation of the energy storage power supply to a certain extent. In summary, the collection member 20 made of nickel or aluminum can stabilize the parameter information collected from the bus 10 while maintaining long-term chemical stability, ensuring the accuracy of the parameter information collected from the bus 10 by the collection member 20 to a certain extent. It is understandable that the collection member 20 can also be made of conductive metals such as tin, gold, or other alloys.

[0059] To further enhance the weld strength and electrical connectivity between the acquisition piece 20 and the circuit board 30, a conductive reinforcement layer 40 is provided between the acquisition piece 20 and the circuit board 30. The conductive reinforcement layer 40 can be made of copper. The copper layer can improve the thermal conductivity of the weld area, helping the solder to heat and cool more quickly, thereby improving weld quality and reducing solder joint defects. The copper layer also allows the solder to spread and adhere to the metal surface during the welding process, forming uniform, continuous solder joints to a certain extent, thereby improving weld strength. The copper layer also prevents oxidation of the metal in the welding area before and during welding, preventing a decrease in weld strength due to oxidation that reduces the bonding strength between the solder and the metal. At the same time, the low resistivity of the copper layer ensures good electrical contact between the acquisition piece 20 and the circuit board 30, ensuring electrical connectivity to a certain extent. In summary, forming a copper layer on the contact surface between the acquisition piece 20 and the circuit board 30 can, to a certain extent, ensure the accuracy of the parameter information of the battery cell collected by the circuit board 30 through the acquisition piece 20, and to a certain extent improve the reliability and yield of the product.

[0060] Optionally, a copper layer may be formed on the contact surface between the collecting member 20 and the circuit board 30 by electroplating.

[0061] In some embodiments, the collecting member 20 includes a second connecting portion 22 and a third connecting portion 23. The second connecting portion 22 connects the third connecting portion 23 and the first connecting portion 21. The third connecting portion 23 is used to connect to the bus 10. The second connecting portion 22 includes an arched protrusion 50. The arched protrusion 50 protrudes upward compared to the plane where the first connecting portion 21 is located.

[0062] In this way, the stress generated by the height difference between the busbar 10 and the circuit board 30 can be absorbed and reduced, and welding defects such as cold solder joints generated during the welding process of the collecting component 20 and the circuit board 30 can be reduced.

[0063] Specifically, please combine Figure 1 The circuit board 30 is positioned above the busbar 10. The surface of the busbar 10 facing away from the battery cells is connected to the surface of the circuit board 30 facing away from the busbar 10 via the collecting member 20. A third connecting portion 23 is provided at the other end of the collecting member 20. The third connecting portion 23 is connected to the surface of the busbar 10 facing away from the battery cells and extends along the surface of the busbar 10 facing away from the battery cells. The collecting member 20 also includes a second connecting portion 22, which connects the third connecting portion 23 and the first connecting portion 21.

[0064] In related technologies, collection components typically adopt a "Z"-shaped structure, which has certain limitations in terms of mechanical strength. This "Z"-shaped structure is prone to stress concentration on the inner or outer sides of the bend. This means that higher stress is concentrated in the curved area of ​​the collection component than in the surrounding areas, leading to product failure.

[0065] In this embodiment of the present invention, the second connecting portion 22 includes an arched protrusion 50. This arched protrusion 50 protrudes upward from the plane of the first connecting portion 21, increasing the expansion of the collection member 20 to a certain extent and acting as a stress buffer. This arched protrusion increases the deformation of the collection member 20, absorbing and reducing stress caused by the height difference between the busbar 10 and the circuit board 30, and thus reducing welding defects such as cold joints that may occur during the welding process between the collection member 20 and the circuit board 30.

[0066] Optionally, the collecting piece 20 is an integrally formed stamped structure, which enhances the strength of the collecting piece 20 itself to a certain extent.

[0067] In some embodiments, the first connecting portion 21 is provided with a through hole 25 along the thickness direction, and the through hole 25 is filled with solder.

[0068] In this way, the through hole 25 can increase the effective contact area of ​​the solder, thereby improving the soldering quality and reliability to a certain extent.

[0069] Specifically, please combine Figure 2 、 Figure 4 and Figure 6 The first connection portion 21 connected to the pad 32 by solder is provided with a through hole 25 along the thickness direction, so that the solder can flow into the pad 32 through the through hole 25. During the soldering process, when the solder is heated and melted, the solder will flow into the through hole 25, and form a part of the solder joint after cooling and solidification. Therefore, the solder not only covers the surface of the collection piece 20, but also fills the through hole 25, thereby significantly increasing the effective contact area of ​​the solder. The solder can form more mechanical locking points between the first connection portion 21 and the pad 32 through the through hole 25, which is conducive to maintaining the stability of the solder joint when subjected to vibration, impact or thermal cycling, reducing the risk of the solder joint falling off, and to a certain extent improving the quality and reliability of the solder connection between the collection piece 20 and the circuit board 30.

[0070] The shape of the through hole 25 can be specifically limited according to actual conditions, and the present invention does not make any specific limitation on this.

[0071] In certain embodiments, the through-hole 25 comprises a waist-shaped through-hole.

[0072] In this way, the waist-shaped through hole can increase the effective contact area of ​​the solder, thereby improving the soldering quality and reliability to a certain extent.

[0073] Specifically, please combine Figure 2 、 Figure 4 and Figure 6The through hole 25 includes a waist-shaped through hole, which is provided on the first connecting portion 21, so that the solder can flow into the pad 32 through the waist-shaped through hole. The waist-shaped through hole has a simple structure, which not only allows the solder to form a larger contact area with the inner wall of the waist when filling, but also helps to disperse stress and reduce stress concentration, thereby improving the overall mechanical strength and durability of the solder joint to a certain extent.

[0074] The number of waist-shaped through holes can be specifically limited according to actual conditions, and the present invention does not impose any specific restrictions on this. In an example, please combine Figure 6 Two waist-shaped through holes are provided on a first connecting portion 21 .

[0075] In some embodiments, a notch 28 is provided on the periphery of the first connecting portion 21 , and the notch 28 is filled with solder.

[0076] In this way, by designing the notch 28 , the effective contact area of ​​the solder is increased, thereby improving the firmness of the soldering to a certain extent.

[0077] Specifically, please combine Figure 3 、 Figure 5 and Figure 7 , the periphery of the first connection part 21 is provided with a notch 28, so that the solder can flow into the pad 32 through the notch 28. During the soldering process, when the solder is heated and melted, the solder will flow into the notch 28, and form a part of the solder joint after cooling and solidification. The notch 28 can make it easier for the solder to flow and diffuse to the edge area where the first connection part 21 contacts the pad 32. In this way, the solder not only covers the surface of the collection part 21, but also fills these notches 28, thereby significantly increasing the actual contact area between the solder and the collection part 20 and the circuit board 32. The solder can form more mechanical locking points between the first connection part 21 and the pad 32 through the notch 28, which is beneficial to maintain the stability of the solder joint when subjected to vibration, impact or thermal cycling, reduce the risk of the solder joint falling off, and to a certain extent improve the quality and reliability of the solder connection between the collection part 20 and the circuit board 30.

[0078] The number and shape of the notches 28 can be specifically limited according to actual conditions, and the present invention does not make specific limitations on this. In an example, please combine Figure 7 The first connecting portion 21 includes three edges, each edge is provided with a notch 28, and the shape of the notch 28 is not specifically limited.

[0079] An energy storage power supply provided by an embodiment of the present invention includes a battery cell, an inverter, a busbar 10 and a collection component 100 of any of the above embodiments. The busbar 10 connects the battery cell and the collection component 20, and the inverter is connected to the circuit board 30.

[0080] In the above energy storage power supply, the first connection portion 21 is connected to the pad 32 through the conductive reinforcement layer 40, thereby improving the welding firmness between the acquisition component 20 and the circuit board 30 to a certain extent, and improving product reliability and yield.

[0081] Specifically, an energy storage power supply is a device that can store electrical energy and release it when needed. It can provide power to electrical devices, including but not limited to vehicles and household appliances. The energy storage power supply includes battery cells, an inverter, a bus 10, and a collection component 100. The battery cells are the core of the energy storage power supply, responsible for storing and releasing electrical energy. The energy storage power supply can include multiple battery cells, which can be connected in series, parallel, or in a hybrid manner. Hybrid means that multiple battery cells are connected in both series and parallel.

[0082] The busbar 10 is a conductive component used to electrically connect multiple battery cells, connecting the cells to the data acquisition component 20. In one example, the busbar 10 can connect multiple battery cells in series. The data acquisition component 100 includes the data acquisition component 20 and a circuit board 30, which is used to collect parameter information from the battery cells via the busbar 10. The inverter is connected to the circuit board 30 and converts the direct current (DC) output from the battery cells into alternating current (AC) to power AC loads.

[0083] The busbar 10 has good electrical conductivity and corrosion resistance, thereby ensuring the reliability of the energy storage power supply. The material of the busbar 10 can be specifically limited according to actual conditions, and the present invention does not make specific restrictions on this. In one example, the material of the busbar 10 can be a conductive metal such as nickel, aluminum, or other alloys.

[0084] Therefore, the battery cells provide electrical energy, the busbar 10 transmits current, the acquisition component 100 collects parameter information, and the inverter converts DC power into AC power. The interplay of these components is key to achieving efficient and safe operation of the energy storage power supply.

[0085] In some embodiments, the collector 20 is connected to the busbar 10 by laser welding.

[0086] In this way, the collecting member 20 is connected to the busbar 10 by laser welding, which can ensure high precision, high strength and high reliability of the connection to a certain extent, so that the parameter information of the battery cell can be stably transmitted.

[0087] Specifically, please combine Figure 1The collection component 20 includes a third connecting portion 23, which is connected to the busbar 10 via laser welding. Since the busbar 10 electrically connects multiple battery cells, the collection component 20 is used to accurately collect parameter information of the battery cells via the busbar 10, so a highly precise connection method is required. Furthermore, the busbar 10 can be made of nickel or aluminum, and the collection component 20 can be made of nickel sheet. Soldering components made of these two materials is not stable enough. Therefore, laser welding the collection component 20 to the busbar 10 can, to a certain extent, ensure high precision, high strength, and high reliability of the connection.

[0088] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0089] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above implementation methods within the scope of the present invention.

Claims

1. A collection component, characterized in that: include: A circuit board, the circuit board comprising a solder pad; A collecting member, the collecting member comprising a first connecting portion, and; A conductive reinforcement layer, wherein the first connection portion is connected to the pad through the conductive reinforcement layer.

2. The collection component according to claim 1, characterized in that: The conductive reinforcement layer includes a first conductive layer and a second conductive layer, the first conductive layer is provided at the first connecting portion, the second conductive layer is provided at the pad, and the first conductive layer is connected to the second conductive layer.

3. The collection component according to claim 2, characterized in that: The first conductive layer and the second conductive layer are connected by welding.

4. The collection component according to claim 1, characterized in that: The material of the collecting member includes nickel or aluminum, and the material of the conductive reinforcement layer includes copper.

5. The collection component according to claim 1, characterized in that: The collecting part includes a second connecting part and a third connecting part, the second connecting part connects the third connecting part and the first connecting part, the third connecting part is used to connect the bus, and the second connecting part includes an arched protrusion, which protrudes upward compared to the plane where the first connecting part is located.

6. The collection component according to claim 1, characterized in that: The first connecting portion is provided with a through hole along the thickness direction, and the through hole is filled with solder.

7. The collection component according to claim 6, characterized in that: The through hole comprises a waist-shaped through hole.

8. The collection component according to claim 1, characterized in that: A notch is provided on the periphery of the first connecting portion, and the notch is filled with solder.

9. An energy storage power supply, characterized in that: It comprises a battery cell, an inverter, a bus bar and the collection component according to any one of claims 1 to 8, wherein the bus bar connects the battery cell and the collection component, and the inverter is connected to the circuit board.

10. The energy storage power supply according to claim 9, characterized in that: The collecting piece is connected to the busbar by laser welding.

Images