Uniform tin spraying device for PCB production

Abstract

The utility model relates to the field of PCBs (printed circuit boards), in particular to a uniform tin spraying device for PCB production, which comprises a tin spraying box main body, a lifting main control column, an adjusting plate, a tin bath, a recovery tank, a bottom table, a mounting table, an inclined table and a table groove, the bottom table is mounted at the bottom of the inner side of the tin spraying box main body, and the inclined table is mounted on the side surface of the bottom table; two tin grooves with the same specification are installed on the upper side of the inclined table, a table groove is formed between the inclined table and the tin spraying box main body, and a recycling groove is installed in the table groove, so that harmful products are intercepted by the filter screen, recycling treatment is facilitated through filtering, and the health and safety of the production environment are guaranteed; an adjusting plate is installed at the front end of the lifting main control column, a sliding groove is formed in the adjusting plate, a sliding block is installed in the sliding groove, an adjusting block is installed on the front side of the sliding block, an adjusting limiting hole is formed in the front side of the adjusting plate, and an adjusting block is installed in the adjusting limiting hole, so that the circuit board is clamped and is not prone to loosening, and the uniformity and efficiency of tin spraying are improved.

Description

Technical Field

[0001] The utility model relates to the field of PCB circuit boards, in particular to a uniform tin spraying device for PCB circuit board production. Background Art

[0002] A tin spraying device for circuit boards is a device specifically used in the production process of circuit boards. It includes a tin bath, a tin spraying nozzle, and a conveyor mechanism. The conveyor mechanism is used to transport the circuit board to be soldered, while the tin spraying nozzle is connected to the tin bath through its tin inlet end, and the tin outlet end is opened to face the conveyor mechanism to achieve the tin spraying operation on the circuit board. This device is widely used in production workshops in the electronics, hardware, printer and other industries. In particular, during the production process of circuit boards, the tin spraying operation is used to improve the soldering quality and reliability of the circuit boards. A Chinese patent discloses a uniform tin spraying device for PCB circuit board production (authorization announcement number CN 217336084U), this patented technology can achieve the circuit board being clamped by the clamping assembly during the tin spraying operation of the circuit board through the provision of a lifting plate, a connecting rod, a sleeve, a frame and a filter, and then the lifting plate is driven down by the electric telescopic rod. During the descent of the lifting plate, the first spring is first squeezed by the connecting rod. When the first spring is compressed to a certain extent, the lifting plate drives the frame to descend through the connecting rod, the first spring and the sleeve. When the frame descends, the filter ensures that the molten tin and lead above the box does not contain debris, thereby ensuring that each circuit board will not be contaminated by debris during the tin spraying operation, thereby improving the quality of the product. By providing the transmission plate, the slider, the first slide groove, the second slide groove and the first spring, it can be achieved that the circuit board is immersed in the molten After the tin-lead is injected, the frame is driven to continue to descend under the action of the first spring and the relative sliding between the sleeve and the sleeve. At this time, the frame drives the slider on the transmission plate to enter the second chute. Through the guidance of the second chute, the two transmission plates are moved away from each other, and then the two filter screens are driven to move away from each other, so that the debris generated by the circuit board entering the molten tin-lead will not be blocked by the filter screen and fall to the bottom of the box. There is no need to perform a large amount of debris processing work before each circuit board tin spraying work, which improves work efficiency. However, the circuit board is clamped by a spring between the clamping plates of this design. If the spring is used for too long, it will produce elastic deformation, thereby losing its function, which is not conducive to the clamping of the circuit board and is easy to loosen, resulting in uneven tin spraying, affecting subsequent work. Therefore, those skilled in the art provide a uniform tin spraying device for PCB circuit board production to solve the problems raised in the above background technology. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a uniform tin spraying device for PCB circuit board production, including a tin spraying box body, a lifting main control column, an adjustment plate, a tin bath, a recovery tank, a base, a mounting table, an inclined table, and a table tank. The base is installed at the bottom of the inner side of the tin spraying box body, the inclined table is installed on the side of the base, two tin baths of the same specifications are installed on the upper side of the inclined table, a table tank is provided between the inclined table and the tin spraying box body, the recovery tank is installed in the table tank, the mounting table is installed on the upper side of the base, the lifting main control column is installed on the upper side of the mounting table, and the adjustment plate is installed at the front end of the lifting main control column.

[0004] Preferably, a controller is installed on the lifting main control column, a driver is installed on the lower side of the controller, and a lifting column is installed on the lower side of the driver;

[0005] Preferably, the lower side of the lifting column is connected to the installation adjustment plate, a slide groove is provided in the adjustment plate, a slider is installed in the slide groove, an adjustment block is installed on the front side of the slider, an adjustment limit hole is provided on the front side of the adjustment plate, an adjustment block is installed in the adjustment limit hole, a clamping head is installed on the lower side of the slider, and an anti-slip convex groove is provided on the inner side of the clamping head;

[0006] Preferably: a filter port is provided on the lower side of the tin bath, and a filter screen is installed in the tin bath;

[0007] Preferably, a convex plate is provided in the recovery tank, an isolation plate is installed on the convex plate, and a plurality of mesh holes of the same size are provided on the isolation plate.

[0008] The technical effects and advantages of this utility model are:

[0009] 1. A slide groove is provided in the adjustment plate, a slider is installed in the slide groove, an adjustment block is installed in the front side of the slider, an adjustment limit hole is provided on the front side of the adjustment plate, an adjustment block is installed in the adjustment limit hole, a clamping head is installed on the lower side of the slider, and an anti-slip groove is provided on the inside of the clamping head, so that the circuit board is clamped and not prone to loosening, thereby improving the uniformity and efficiency of tin spraying;

[0010] 2. A convex plate is installed in the recovery tank, and an isolation plate is installed on the convex plate. The isolation plate is provided with multiple meshes of the same size to intercept harmful products and facilitate recycling through filtration to ensure the health and safety of the production environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic structural diagram of a uniform tin spraying device for PCB circuit board production provided in an embodiment of the present application;

[0012] Figure 2 This is a partial structural diagram of a uniform tin spraying device for PCB circuit board production provided in an embodiment of the present application. Figure 1 ;

[0013] Figure 3 This is a schematic diagram of the explosion structure in a uniform tin spraying device for PCB circuit board production provided in the embodiment of the present application. Figure 1 ;

[0014] Figure 4 This is a partial structural diagram of a uniform tin spraying device for PCB circuit board production provided in an embodiment of the present application. Figure 2 ;

[0015] Figure 5 This is a schematic diagram of the explosion structure in a uniform tin spraying device for PCB circuit board production provided in the embodiment of the present application. Figure 2 .

[0016] In the figure: 1. Main body of tin spray box; 2. Main lifting control column; 3. Adjustment plate; 4. Tin bath; 5. Recovery tank; 101. Base; 102. Mounting table; 103. Inclined table; 104. Table tank; 201. Controller; 202. Driver; 203. Lifting column; 301. Slide; 302. Adjustment limit hole; 303. Slider; 304. Adjustment block; 305. Clamping head; 306. Anti-slip convex groove; 401. Filter port; 402. Filter screen; 501. Convex plate; 502. Isolation plate; 503. Mesh. DETAILED DESCRIPTION

[0017] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for specific applications.

[0018] Example

[0019] See also Figures 1 to 5 In this embodiment, a uniform tin spraying device for PCB circuit board production is provided, including a tin spraying box body 1, a lifting main control column 2, an adjustment plate 3, a tin bath 4, a recovery tank 5, a base 101, a mounting table 102, an inclined table 103, and a table tank 104. The base 101 is installed at the bottom of the inner side of the tin spraying box body 1, the inclined table 103 is installed on the side of the base 101, two tin baths 4 of the same specifications are installed on the upper side of the inclined table 103, a table tank 104 is provided between the inclined table 103 and the tin spraying box body 1, the recovery tank 5 is installed in the table tank 104, the mounting table 102 is installed on the upper side of the base 101, the lifting main control column 2 is installed on the upper side of the mounting table 102, and the adjustment plate 3 is installed at the front end of the lifting main control column 2;

[0020] Specifically, a controller 201 is installed on the lifting main control column 2, a driver 202 is installed on the lower side of the controller 201, a lifting column 203 is installed on the lower side of the driver 202, an adjustment plate 3 is connected and installed on the lower side of the lifting column 203, a slide groove 301 is provided in the adjustment plate 3, a slider 303 is installed in the slide groove 301, an adjustment block 304 is installed on the front side of the slider 303, an adjustment limit hole 302 is provided on the front side of the adjustment plate 3, an adjustment block 304 is installed in the adjustment limit hole 302, a clamping head 305 is installed on the lower side of the slider 303, an anti-slip convex groove 306 is provided on the inner side of the clamping head 305, a filter port 401 is provided on the lower side of the tin bath 4, a filter screen 402 is installed in the tin bath 4, a convex plate 501 is provided in the recovery tank 5, an isolation plate 502 is installed on the convex plate 501, and a plurality of meshes 503 of the same size are provided on the isolation plate 502.

[0021] The working principle of this utility model is:

[0022] When using a uniform tin-spraying device for PCB circuit board production, the clamping head 305 is clamped to the circuit board by moving the adjustment block 304. Since the adjustment block 304 is installed in the adjustment limit hole 302, the inner side of the clamping head 305 is provided with an anti-slip groove 306, which can clamp the circuit board and prevent it from loosening, thereby improving the uniformity and efficiency of tin-spraying. The driver 202 drives the lifting column 203 to descend to spray tin on the circuit board. After completion, the remaining filter residue flows into the recovery tank 5, which can intercept harmful products and facilitate recycling and processing through filtration, thereby ensuring the health and safety of the production environment.

[0023] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without making any creative efforts should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in this utility model shall be implemented in accordance with conventional means in the field unless otherwise specified or limited.

Claims

1. A uniform tin spraying device for PCB circuit board production, characterized in that: The invention comprises a tin spray box body (1), a lifting main control column (2), an adjustment plate (3), a tin bath (4), a recovery tank (5), a base (101), a mounting platform (102), an inclined platform (103), and a platform tank (104). The base (101) is installed at the bottom of the inner side of the tin spray box body (1), the inclined platform (103) is installed on the side of the base (101), two tin baths (4) of the same specification are installed on the upper side of the inclined platform (103), a platform tank (104) is provided between the inclined platform (103) and the tin spray box body (1), the recovery tank (5) is installed in the platform tank (104), the mounting platform (102) is installed on the upper side of the base (101), the lifting main control column (2) is installed on the upper side of the mounting platform (102), and the adjustment plate (3) is installed at the front end of the lifting main control column (2).

2. A uniform tin spraying device for PCB circuit board production according to claim 1, characterized in that: A controller (201) is installed on the lifting main control column (2), a driver (202) is installed on the lower side of the controller (201), and a lifting column (203) is installed on the lower side of the driver (202).

3. A uniform tin spraying device for PCB circuit board production according to claim 2, characterized in that: The lower side of the lifting column (203) is connected to the installation adjustment plate (3), a sliding groove (301) is provided in the adjustment plate (3), a sliding block (303) is installed in the sliding groove (301), and an adjustment block (304) is installed on the front side of the sliding block (303).

4. A uniform tin spraying device for PCB circuit board production according to claim 3, characterized in that: The front side of the adjustment plate (3) is provided with an adjustment limit hole (302), and an adjustment block (304) is installed in the adjustment limit hole (302).

5. The uniform tin spraying device for PCB circuit board production according to claim 3, characterized in that: A clamping head (305) is installed on the lower side of the slider (303), and an anti-slip convex groove (306) is provided on the inner side of the clamping head (305).

6. A uniform tin spraying device for PCB circuit board production according to claim 1, characterized in that: A filter port (401) is provided on the lower side of the tin bath (4), and a filter screen (402) is installed in the tin bath (4).

7. The uniform tin spraying device for PCB circuit board production according to claim 1, characterized in that: A convex plate (501) is provided in the recovery tank (5), an isolation plate (502) is installed on the convex plate (501), and a plurality of mesh holes (503) of the same size are provided on the isolation plate (502).

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