Three-dimensional vapor chamber combination structure

Abstract

The utility model relates to a three-dimensional vapor chamber combination structure, which comprises a shell, a heat pipe, a capillary structure and a working fluid, the shell comprises a first shell plate and a second shell plate, a cavity is formed between the first shell plate and the second shell plate, the second shell plate is provided with a through hole, and the periphery of the through hole is provided with a concave groove; the heat pipe is arranged corresponding to the through hole in a penetrating mode, the heat pipe is provided with an opening end, a flange is arranged at the opening end, the flange is contained in the concave groove, and the heat pipe is combined to the second shell plate through the flange and the welding layer in the concave groove; the capillary tissue is arranged in the accommodating cavity and is attached to the shell; the working fluid is arranged in the containing cavity. Therefore, not only is the combination stable and the strength high, but also the welding flux can be prevented from entering the accommodating cavity to influence the transmission of the working fluid.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a three-dimensional temperature uniform plate combined structure. Background Art

[0002] The existing three-dimensional temperature evaporating plate structure mainly includes a temperature evaporating plate and multiple heat pipes. The heat pipes are installed vertically on the temperature evaporating plate at intervals, and the internal cavity of the temperature evaporating plate is interconnected with the chambers of each heat pipe, thereby achieving rapid heat conduction and heat dissipation efficiency through the change of vapor-liquid phase.

[0003] However, while existing three-dimensional vapor chamber structures offer excellent heat conduction and dissipation performance, they present several challenges in practical use. Because the heat pipes and vapor chamber are connected using solder, such as copper or tin paste, vibration during assembly or handling can easily cause loosening and other undesirable issues. Furthermore, during the manufacturing process, copper or tin paste can easily enter the chamber, affecting or blocking the flow of the working fluid within, thereby reducing thermal conductivity and dissipation performance. Summary of the Invention

[0004] An object of the present invention is to provide a three-dimensional temperature-equalizing plate bonding structure, which is not only firmly bonded and has high strength, but also can prevent solder from entering the cavity and affecting the transmission of the working fluid.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a three-dimensional temperature equilibrium plate combination structure, including a shell, a plurality of heat pipes, a capillary structure and a working fluid, the shell including a first shell plate and a second shell plate tightly sealed to the first shell plate, a cavity is formed between the first shell plate and the second shell plate, a plurality of through holes are provided in the second shell plate, and a recessed groove is provided on the outer periphery of each through hole; each heat pipe is respectively corresponding to each through hole and penetrates, each heat pipe has an open end, a flange is provided at the open end, and each flange is respectively accommodated in each recessed groove, wherein each heat pipe is combined to the second shell plate through the flange and a welding layer in the recessed groove; the capillary structure is arranged in the cavity and attached to the shell; the working fluid is arranged in the cavity.

[0006] In one embodiment, the welding layer is formed by a resistance welding method.

[0007] In one embodiment, the second shell plate includes a top plate, and a convex bulge higher than the outer surface of the top plate is formed at a position corresponding to each of the recessed grooves.

[0008] In one embodiment, the recessed groove is a circular recessed groove having an inner diameter, and the flange is a circular flange having an outer diameter, and the outer diameter of the flange is greater than or equal to the inner diameter of the recessed groove.

[0009] In one embodiment, the flange extends from the open end of the heat pipe in an expanded diameter manner, and the flange and the center line of the heat pipe are vertically arranged.

[0010] In one embodiment, a ring wall extends from the periphery of each through hole, and each heat pipe passes through each ring wall.

[0011] In one embodiment, a sealing layer is further provided between each of the heat pipes and each of the annular walls.

[0012] In one embodiment, the sealing layer is formed by a soft soldering method or a hard soldering method.

[0013] In one embodiment, a plurality of support columns are further included, each of which is spaced apart in the cavity and vertically disposed between the first shell plate and the second shell plate.

[0014] In one embodiment, a heat dissipation fin group is further included, and the heat dissipation fin group is sleeved on each of the heat pipes.

[0015] This invention also offers the following benefits: Because resistance welding eliminates the need for solder, it reduces costs. The tight fit between the flange and the recessed groove effectively prevents solder, such as copper or tin paste, from entering the cavity, thereby improving overall thermal conductivity and heat dissipation. The manufacturing process is remarkably simple and easy, and the resulting connection offers exceptional strength and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an exploded view of the second shell plate, heat pipes and capillary structure of the present invention.

[0017] Figure 2 This is a cross-sectional view of the second shell plate and each heat pipe assembly and an enlarged view of a local area of ​​the present invention.

[0018] Figure 3 This is an exploded view of the combined structure of the three-dimensional temperature equalizing plate of the utility model.

[0019] Figure 4 This is the appearance diagram of the three-dimensional temperature equalizing plate combined structure of this utility model.

[0020] Figure 5 This is a cross-sectional view of the combined structure of the three-dimensional temperature equalizing plate of the utility model.

[0021] In the picture:

[0022] 10: Shell; 11: First shell plate; 111: Bottom plate; 112: Enclosure; 113: Flanged edge; 12: Second shell plate; 121: Top plate; 122: Through hole; 123: Recessed groove; 124: Convex bump; 125: Ring wall; 20: Heat pipe; 21: Open end; 211: Flange; 22: Closed end; 30: Capillary structure; 31: Lower capillary structure; 32: Upper capillary structure; 321: Perforation; 40: Working fluid; 50: Support column; 60: Heat sink fin assembly; A: Cavity; D1: Inner edge diameter; D2: Outer edge diameter; S: Sealing layer; W: Welding layer. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0024] See also Figures 1 to 5 As shown, the present invention provides a three-dimensional temperature-averaging plate combined structure, which mainly includes a shell 10 , a plurality of heat pipes 20 , a capillary structure 30 and a working fluid 40 .

[0025] Please see first Figure 3 and Figure 5 As shown, the housing 10 mainly includes a first shell plate 11 and a second shell plate 12. The first shell plate 11 and the second shell plate 12 are made of a material with good thermal conductivity, such as copper, aluminum, magnesium, or alloys thereof. The first shell plate 11 mainly includes a bottom plate 111 and a surrounding plate 112 that is bent upward and extended from the periphery of the bottom plate 111. A flange 113 extends outward from the end of the surrounding plate 112 away from the bottom plate 111.

[0026] The second shell plate 12 mainly includes a top plate 121 . The second shell plate 12 is tightly connected and sealed to the flange 113 of the first shell plate 11 via the top plate 121 , so as to form a cavity A between the first shell plate 11 and the second shell plate 12 .

[0027] Please continue reading Figure 1 and Figure 2 As shown, a plurality of through-holes 122 are spaced apart on the inner side of the top plate 121 of the second shell 12. A recessed groove 123 is formed around the outer periphery of each through-hole 122. A bulge 124 is formed at a position corresponding to each recessed groove 123, which is higher than the outer surface of the top plate 121. Furthermore, a ring wall 125 extends upward from the periphery of each through-hole 122. In this embodiment, the recessed groove 123 is an annular recessed groove having an inner diameter D1.

[0028] Each heat pipe 20 is disposed corresponding to each through-hole 122. Each heat pipe 20 has an open end 21 and a closed end 22. A flange 211 is provided at the open end 21. Each flange 211 is received in a respective recessed groove 123, and the lower surface of the flange 211 is flush with or lower than the inner surface of the top plate 121 of the second shell 12. In this embodiment, the flange 211 is an annular flange having an outer diameter D2. The outer diameter D2 of the flange 211 is greater than or equal to the inner diameter D1 of the recessed groove 123, thereby forming an interference fit or a tight fit between the flange 211 and the recessed groove 123. The flange 211 extends from the open end 21 of the heat pipe 20 in an expanded manner and is disposed perpendicular to the centerline of the heat pipe 20.

[0029] During bonding, the closed end 22 of the heat pipe 20 is inserted through the through-hole 122 and the annular wall 125 of the second shell plate 12, and the flange 211 is inserted into the recessed groove 123. A welding device and jig (not shown) are used to form a weld layer W between the flange 211 and the recessed groove 123, thereby bonding each heat pipe 20 to the second shell plate 12. In this embodiment, welding is performed using a spot welder. Pressure is first applied to bring the flange 211 of the heat pipe 20 into close contact with the wall of the recessed groove 123 of the second shell plate 12. Then, an electric current is applied, causing the contact area to melt due to resistance heat, and upon cooling, the weld layer W is formed.

[0030] Next, solder is applied to the heat pipe 20 and the annular wall 127 by either soft soldering or brazing, and then heated to fill the gap between the heat pipe 20 and the annular wall 125, thereby forming a sealing layer S. Soft soldering uses pastes of zinc, tin, and lead, while brazing uses pastes of copper, aluminum, and magnesium.

[0031] Please continue reading Figures 3 to 5 As shown, the capillary structure 30 is disposed within the aforementioned cavity A and can be made of a material with excellent capillary adsorption, such as a metal woven mesh, porous sintered powder, or fiber bundle. Its shape is generally similar to that of the aforementioned housing 10. The capillary structure 30 of this embodiment primarily comprises a lower capillary structure 31 and an upper capillary structure 32. The lower capillary structure 31 is attached to the first housing plate 11 and affixed to the inner surface of the first housing plate 11 through a thermal diffusion welding process. The upper capillary structure 32 is attached to the second housing plate 12 and affixed to the inner surface of the second housing plate 12 through a thermal diffusion welding process. The upper capillary structure 32 is further provided with a plurality of through-holes 321, each of which roughly corresponds to the arrangement of the heat pipes 20, and the upper capillary structure 32 is in contact with the capillary structure of the heat pipes 20.

[0032] The working fluid 40 can be pure water, which is injected into the aforementioned cavity A and subjected to a degassing and sealing process, so that the cavity A is formed into a vacuum chamber.

[0033] In one embodiment, the three-dimensional temperature-averaging plate combination structure of the present invention further includes a plurality of support columns 50 . Each support column 50 is spaced apart in the cavity A and vertically disposed between the first shell plate 11 and the second shell plate 12 .

[0034] In one embodiment, the three-dimensional temperature-vaporizing plate combination structure of the present invention further includes a heat dissipation fin assembly 60, which is sleeved on each heat pipe 20. The heat dissipation fin assembly 60 includes a plurality of heat dissipation fins stacked on each other.

[0035] The above-described embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. A three-dimensional temperature plate combination structure, characterized in that: include: A housing, comprising a first shell plate and a second shell plate tightly sealed to the first shell plate, a cavity being formed between the first shell plate and the second shell plate, a plurality of through holes being provided in the second shell plate, and a recessed groove being provided around the outer periphery of each through hole; a plurality of heat pipes, each corresponding to each through-hole, each heat pipe having an open end, a flange disposed at the open end, each flange being received in each recessed groove, wherein each heat pipe is bonded to the second shell plate via the flange and a fusion layer within the recessed groove; a capillary structure disposed in the cavity and attached to the housing; and A working fluid is disposed in the cavity.

2. The three-dimensional temperature plate combination structure according to claim 1, characterized in that: The welding layer is formed by a resistance welding method.

3. The three-dimensional temperature plate combination structure according to claim 1, characterized in that: The second shell plate includes a top plate, and a convex bulge higher than the outer surface of the top plate is formed at a position corresponding to each of the concave grooves.

4. The three-dimensional temperature uniform plate combination structure according to claim 1, characterized in that: The concave groove is a circular ring-shaped concave groove having an inner edge diameter. The flange is a circular ring-shaped flange having an outer edge diameter. The outer edge diameter of the flange is greater than or equal to the inner edge diameter of the concave groove.

5. The three-dimensional temperature uniform plate combination structure according to claim 1, characterized in that: The flange extends from the open end of the heat pipe in an expanded diameter manner, and the flange and the center line of the heat pipe are vertically arranged.

6. The three-dimensional temperature uniform plate combination structure according to claim 1, characterized in that: A ring wall extends from the periphery of each through hole, and each heat pipe passes through each ring wall.

7. The three-dimensional temperature uniform plate combination structure according to claim 6, characterized in that: A sealing layer is also provided between each heat pipe and each annular wall.

8. The three-dimensional temperature uniform plate combination structure according to claim 7, characterized in that: The sealing layer is formed by a soft soldering method or a hard soldering method.

9. The three-dimensional temperature uniform plate combination structure according to claim 1, characterized in that: It also includes a plurality of support columns, each of which is arranged at intervals in the cavity and vertically arranged between the first shell plate and the second shell plate.

10. The three-dimensional temperature uniform plate combination structure according to claim 1, characterized in that: The device also comprises a heat dissipation fin group, which is sleeved on each of the heat pipes.

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