Circuit board module and electronic equipment

Abstract

The utility model provides a circuit board module and electronic equipment, and belongs to the technical field of electronics. The circuit board module comprises a circuit board body, a first electronic element and a heat dissipation assembly. The first electronic element is positioned on the front surface or the back surface of the circuit board body; the heat dissipation assembly comprises a liquid cooling film and a circulation driver, a liquid cooling flow channel is formed in the liquid cooling film, and the liquid cooling flow channel is filled with a liquid cooling medium; the circulation driver is connected with the liquid cooling flow channel and drives the cooling medium to circularly flow in the liquid cooling flow channel; one part of the liquid cooling film is located on the front face of the circuit board body, the other part of the liquid cooling film is bent to the back face of the circuit board body, and the liquid cooling film is in heat conduction contact with the first electronic element. According to the circuit board module provided by the utility model, the cooling medium can absorb heat at the first electronic component and then flow to the other surface of the circuit board body along the liquid cooling film, the heat dissipation efficiency of the position where the first electronic component is located is improved by using the heat dissipation assembly, and liquid cooling of the circuit board module is realized.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to a circuit board module and electronic equipment. Background Art

[0002] As electronic devices continue to develop towards higher frequency, integration, thinness and intelligence, the increase in device integration and functional complexity has squeezed the space of the heat dissipation system and greatly increased the internal heat flux density.

[0003] In related technologies, circuit board modules (such as motherboards) are the heat-prone areas of electronic devices, and heat dissipation structures usually need to be arranged on the front and / or back of the circuit board modules. However, these heat dissipation structures are all passive heat dissipation with limited heat dissipation efficiency, and cannot meet the increasingly enhanced heat dissipation needs of circuit board modules. Utility Model Content

[0004] The utility model provides a circuit board module and electronic equipment, which can solve the problem that the heat dissipation efficiency of the circuit board module is limited and cannot meet the increasingly enhanced heat dissipation demand.

[0005] The technical solution is as follows:

[0006] In one aspect, a circuit board module is provided, comprising: a circuit board body, a first electronic component, and a heat dissipation assembly;

[0007] The first electronic component is located on the front or back side of the circuit board body;

[0008] The heat dissipation component includes a liquid cooling film and a circulation driver. A liquid cooling channel is provided inside the liquid cooling film, and the liquid cooling channel is filled with a liquid cooling medium. The circulation driver is connected to the liquid cooling channel to drive the cooling medium to circulate in the liquid cooling channel.

[0009] A portion of the liquid cooling film is located on the front surface of the circuit board body, and another portion of the liquid cooling film is bent to the back surface of the circuit board body. The liquid cooling film is in thermal contact with the first electronic component.

[0010] In some embodiments, the liquid cooling film is attached to a surface of the first electronic component away from the circuit board body.

[0011] In some embodiments, the circuit board module further includes a shielding cover, the shielding cover is provided on the first electronic component, and the liquid cooling film is attached to the shielding cover.

[0012] In some embodiments, the circulation driver is located on the liquid-cooling film corresponding to the front side of the circuit board body, or is located on the liquid-cooling film corresponding to the back side of the circuit board body.

[0013] In some embodiments, the heat dissipation assembly further includes a drive control unit, which is located on the front or back of the circuit board body and is electrically connected to the circulation driver.

[0014] In some embodiments, the circulation drive is a piezoelectric pump.

[0015] In some embodiments, the circuit board module further includes a second electronic component, and the second electronic component is located on the front or back side of the circuit board body;

[0016] The liquid cooling film is provided with a notch portion for avoiding the second electronic component.

[0017] In some embodiments, the circuit board module further includes a third electronic component, the third electronic component and the first electronic component are located on the same surface of the circuit board body, and the third electronic component and the first electronic component have different protrusion heights along the surface of the circuit board body;

[0018] The liquid cooling film corresponding to the first electronic component and the liquid cooling film corresponding to the third electronic component have different protrusion heights toward the circuit board body, and the liquid cooling film is in thermal contact with the first electronic component and the third electronic component respectively.

[0019] On the other hand, an electronic device is provided, which includes the circuit board module described in the present utility model.

[0020] In some embodiments, the electronic device also includes a middle frame module and a battery module, the circuit board module and the battery module are arranged side by side in the middle frame module, the circuit board body has a first edge facing the battery module, and the liquid cooling film is bent along the first edge so that a part of the liquid cooling film is located on the front side of the circuit board body, and another part of the liquid cooling film is located on the back side of the circuit board body.

[0021] The beneficial effects of the technical solution provided by the utility model include at least:

[0022] In the circuit board module of the present invention, the first electronic component is located on the front or back side of the circuit board body. The first electronic component generates heat during operation, causing the temperature of the surface of the circuit board body where the first electronic component is located to rise. The liquid cooling film of the heat dissipation component is in thermal contact with the first electronic component. After the circulation drive is started, as the cooling medium flows, the cooling medium can absorb heat at the first electronic component and then flow along the liquid cooling film to the other surface of the circuit board body. Since there is no first electronic component on this surface, the temperature is lower, and the heat in the cooling medium is dissipated outward. Therefore, the heat dissipation efficiency at the location where the first electronic component is located can be improved by utilizing the heat dissipation component, thereby realizing liquid cooling of the circuit board module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic structural diagram of a circuit board module provided by an embodiment of the present utility model from a first viewing angle;

[0025] Figure 2 This is a schematic structural diagram of a circuit board module provided by an embodiment of the present utility model at a second viewing angle;

[0026] Figure 3 This is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present utility model;

[0027] Figure 4 This is a structural cross-sectional view of a circuit board module provided by an embodiment of the present utility model;

[0028] Figure 5 This is a structural cross-sectional view of a circuit board module provided by another embodiment of the present utility model;

[0029] Figure 6 It is a structural diagram of an electronic device provided by an embodiment of the present utility model.

[0030] The reference numerals in the figures represent respectively:

[0031] 1. Circuit board body;

[0032] 101. front side; 102. back side; 103. first edge;

[0033] 11. Positioning hole;

[0034] 2. a first electronic component;

[0035] 3. Heat dissipation components;

[0036] 31. Liquid cooling film; 311. Liquid cooling channel; 312. Notch; 313. Avoidance portion; 32. Circulation driver;

[0037] 4. Shielding cover;

[0038] 5. Drive control unit;

[0039] 6. Second electronic component;

[0040] 7. The third electronic component;

[0041] 8. Battery module;

[0042] 9. Middle frame module. DETAILED DESCRIPTION

[0043] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with certain aspects of the present invention, as detailed in the appended claims.

[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate directions or positional relationships based on the attached figures. Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0045] It should be understood that in the present invention, "electrical connection" can be understood as the physical contact and electrical conduction of components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals. "Communication connection" can refer to electrical signal transmission, including wireless communication connection and wired communication connection. Wireless communication connection does not require a physical medium and does not belong to a connection relationship that limits the product structure. "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship, that is, A and B are connected or A and B are connected, which means that there is a fastening component (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate.

[0046] Unless otherwise defined, all technical terms used in the embodiments of the present invention have the same meanings as commonly understood by those skilled in the art.

[0047] In related technologies, the motherboard, also known as the main control board or main chip board, is the core component of electronic devices. It integrates key electronic components such as the processor, memory, storage chips, wireless communication chips, and power management chips. It is responsible for controlling various functions and operations of the mobile phone. For example, the processor is responsible for data calculations, the memory chip stores data, and the wireless communication chip transmits mobile phone signals.

[0048] The various electronic components on the motherboard generate significant heat during operation. Heat from the front of the motherboard is typically transferred passively outward through the adjacent midframe structure or heat sink, while heat from the back of the motherboard is typically transferred passively outward through structures such as the heat sink on the bracket structure. On the one hand, the midframe structure, heat sink, and other structures all passively dissipate heat, resulting in limited heat dissipation efficiency. On the other hand, using the midframe structure's heat sink to dissipate heat separately from the front and back of the circuit board module results in different heat dissipation efficiencies on the front and back of the circuit board module, leading to uneven temperature distribution on the circuit board module.

[0049] Therefore, the utility model provides a circuit board module, which can use the heat dissipation component to transfer the heat of the first electronic component on the front of the mainboard to the back of the mainboard, thereby improving the heat dissipation efficiency of the front of the mainboard and achieving liquid cooling of the mainboard.

[0050] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0051] On the one hand, combined with Figures 1 to 3 As shown, this embodiment provides a circuit board module, which includes: a circuit board body 1, a first electronic component 2 and a heat dissipation assembly 3.

[0052] The first electronic component 2 is located on the front surface 101 or the back surface 102 of the circuit board body 1 .

[0053] The heat dissipation component 3 includes a liquid cooling film 31 and a circulation driver 32. A liquid cooling channel 311 is provided inside the liquid cooling film 31, and the liquid cooling channel 311 is filled with liquid cooling medium; the circulation driver 32 is connected to the liquid cooling channel 311 to drive the cooling medium to circulate in the liquid cooling channel 311.

[0054] A portion of the liquid cooling film 31 is located on the front surface 101 of the circuit board body 1 , and another portion of the liquid cooling film 31 is bent to the back surface 102 of the circuit board body 1 . The liquid cooling film 31 is in thermal contact with the first electronic component 2 .

[0055] In the circuit board module of this embodiment, the first electronic component 2 is located on the front side 101 or the back side 102 of the circuit board body 1. The first electronic component 2 generates heat during operation, causing the temperature of the surface of the circuit board body 1 where the first electronic component 2 is located to rise. The liquid cooling film 31 of the heat dissipation component 3 is in thermal contact with the first electronic component 2. After the circulation driver 32 is started, as the cooling medium flows, the cooling medium can absorb heat at the first electronic component 2, and then flow along the liquid cooling film 31 to the other surface of the circuit board body 1. Since there is no first electronic component 2 on this surface, the temperature is lower, and the heat in the cooling medium dissipates outward. Therefore, the heat dissipation efficiency at the location of the first electronic component 2 can be improved by using the heat dissipation component 3, thereby achieving liquid cooling of the circuit board module.

[0056] In some possible implementations, the circuit board module is a mainboard, and the first electronic component 2 includes but is not limited to a processor, a memory, a storage chip, a wireless communication chip, a power management chip, and the like.

[0057] In some possible implementations, circuit board body 1 is provided with multiple positioning holes 11 for mounting and securing circuit board body 1. Liquid cooling film 31 is provided with relief portions 313 , which are positioned to correspond to the positions of positioning holes 11. This relief portion 313 avoids positioning holes 11, preventing liquid cooling film 31 from interfering with the mounting and securing of circuit board body 1.

[0058] Combine Figure 1 As shown, in some embodiments, the liquid cooling film 31 is attached to the surface of the first electronic component 2 away from the circuit board body 1 .

[0059] Through the above arrangement, the liquid cooling film 31 is directly attached to and in contact with the surface of the first electronic component 2, so that the heat generated by the first electronic component 2 can be directly transferred to the liquid cooling film 31, and the liquid cooling channel 311 in the liquid cooling film 31 is further used to transfer the heat to the other surface of the circuit board body 1, thereby improving the heat dissipation efficiency of the first electronic component 2.

[0060] In some possible implementations, thermally conductive silica gel is filled between the liquid cooling film 31 and the surface of the first electronic component 2 . The thermally conductive silica gel can improve the heat conduction efficiency between the first electronic component 2 and the liquid cooling film 31 .

[0061] Combine Figure 4 As shown, in some embodiments, the circuit board module further includes a shielding cover 4 , which covers the first electronic component 2 , and the liquid cooling film 31 is attached to the shielding cover 4 .

[0062] In this embodiment, by covering the first electronic component 2 with a shielding cover 4, the shielding cover 4 can provide electromagnetic protection for the first electronic component 2. On this basis, the liquid cooling film 31 is attached to the shielding cover 4, which can transfer the heat of the first electronic component 2 to the shielding cover 4, and then transfer the heat on the shielding cover 4 to the liquid cooling film 31.

[0063] Combine Figure 1 As shown, in some embodiments, the circulation driver 32 is located on the liquid cooling film 31 corresponding to the front side 101 of the circuit board body 1 , or is located on the liquid cooling film 31 corresponding to the back side 102 of the circuit board body 1 .

[0064] In this embodiment, the circulation driver 32 can drive the cooling medium to flow along the liquid cooling channel 311, so that the cooling medium continuously circulates on the liquid cooling film 31 corresponding to the front side 101 and the back side 102 of the circuit board body 1, thereby continuously transporting the heat of the first electronic component 2 to the back side 102 of the circuit board body 1.

[0065] Combine Figure 1 As shown, in some embodiments, the heat dissipation assembly 3 further includes a drive control unit 5 , which is located on the front side 101 or the back side 102 of the circuit board body 1 and is electrically connected to the circulation driver 32 .

[0066] Through the above arrangement, the circulation driver 32 can be controlled by the drive control unit 5 to realize the control of the flow rate or working efficiency of the circulation driver 32, so that the flow rate of the cooling medium in the liquid cooling channel 311 is different, and then the heat dissipation component 3 can realize the regulation of liquid cooling heat dissipation efficiency, and can be adaptively adjusted according to different heat dissipation requirements.

[0067] In some embodiments, the circulation driver 32 is a piezoelectric pump. A piezoelectric pump is a fluid driver that does not require an additional drive motor. Instead, it uses the inverse piezoelectric effect of piezoelectric ceramics to deform a piezoelectric vibrator. This deformation then changes the volume of the pump chamber to achieve fluid output or uses the piezoelectric vibrator to generate fluctuations to transfer liquid.

[0068] For example, a piezoelectric pump consists of a piezoelectric vibrator, a pump valve, and a pump body. During operation, when an AC power source U is applied to both ends of the piezoelectric vibrator, the piezoelectric vibrator is radially compressed under the action of the electric field, generating tensile stress inside the vibrator, causing it to bend and deform. When the piezoelectric vibrator bends in the positive direction, it stretches, the pump chamber volume increases, the fluid pressure in the chamber decreases, the pump valve opens, and liquid enters the pump chamber. When the piezoelectric vibrator bends in the negative direction, it contracts, the pump chamber volume decreases, the fluid pressure in the chamber increases, the pump valve closes, and the liquid in the pump chamber is squeezed out, forming a smooth, continuous, directional flow.

[0069] Combine Figure 2 As shown, in some embodiments, the circuit board module further includes a second electronic component 6 , which is located on the front side 101 or the back side 102 of the circuit board body 1 ; the liquid cooling film 31 is provided with a notch 312 for avoiding the second electronic component 6 .

[0070] With the above arrangement, the liquid cooling film 31 can utilize the notch 312 to avoid the second electronic component 6 on the front side 101 or the back side 102 of the circuit board body 1 , thereby improving the heat dissipation efficiency without affecting the assembly and stacking of the second electronic component 6 and the circuit board body 1 .

[0071] In some possible implementations, the second electronic component 6 is a camera component, such as a front camera or a rear camera. The camera component needs to be connected to the circuit board body 1 on the one hand, and on the other hand, needs to face outward to achieve image acquisition, so the notch 312 needs to be used to avoid it.

[0072] Combine Figure 5 As shown, in some embodiments, the circuit board module further includes a third electronic component 7, which is located on the same surface of the circuit board body 1 as the first electronic component 2, and the third electronic component 7 and the first electronic component 2 have different protrusion heights along the surface of the circuit board body 1.

[0073] The liquid cooling film 31 corresponding to the first electronic component 2 and the liquid cooling film 31 corresponding to the third electronic component 7 have different protrusion heights toward the circuit board body 1 . The liquid cooling film 31 is in thermal contact with the first electronic component 2 and the third electronic component 7 respectively.

[0074] When the same surface of the circuit board body 1 has a first electronic component 2 and a third electronic component 7 of different heights, the liquid cooling film 31 can be designed with different concave and convex areas to adapt to the heights of the first electronic component 2 and the third electronic component 7, so that the total thickness of the first electronic component 2 and the liquid cooling film 31 in the corresponding area is consistent with the total thickness of the liquid cooling film 31 in the third electronic component 7 and the corresponding area. The outer surface of the liquid cooling film 31 remains flat, which is conducive to the stacking and positioning of the circuit board module in the electronic device.

[0075] On the other hand, this embodiment provides an electronic device, which includes the circuit board module of the present invention. The electronic device of this embodiment adopts the circuit board module of the present invention and has all the beneficial technical effects of the present invention.

[0076] Exemplarily, the electronic device can be any of various types of computer system devices that are mobile or portable and perform wireless communication. Specifically, the electronic device can be a mobile phone or smart phone (e.g., an iPhone™-based phone, an Android™-based phone), a portable gaming device (e.g., a Nintendo DS™, a PlayStation Portable™, a Gameboy Advance™, an iPhone™), a laptop computer, a PDA, a portable internet device, a music player, a data storage device, other handheld devices, and devices such as headphones. The electronic device can also be other wearable devices that require charging (e.g., a head-mounted device (HMD) such as an electronic bracelet, an electronic necklace, an electronic device, or a smart watch).

[0077] The electronic device can also be any one of a plurality of electronic devices, including but not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, other media recorders, radios, medical devices, vehicle transportation instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital assistants (PDAs), portable multimedia players (PMPs), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices, and digital cameras and combinations thereof.

[0078] In some cases, the electronic device can perform multiple functions (e.g., play music, display video, store pictures, and receive and send phone calls). If desired, the electronic device can be a cellular phone, a media player, other handheld device, a wristwatch device, a pendant device, an earpiece device, or other compact portable device.

[0079] Combine Figure 6 As shown, in some embodiments, the electronic device further includes a middle frame module 9 and a battery module 8, the circuit board module and the battery module 8 are arranged side by side in the middle frame module 9, the circuit board body 1 has a first edge 103 facing the battery module 8, and the liquid cooling film 31 is bent along the first edge 103 so that a portion of the liquid cooling film 31 is located on the front side 101 of the circuit board body 1, and another portion of the liquid cooling film 31 is located on the back side 102 of the circuit board body 1.

[0080] Through the above arrangement, the liquid cooling film 31 is bent toward the first edge 103 of the battery module 8 using the circuit board body 1. The first edge 103 of the circuit board body 1 is close to the battery module 8. Compared with other edges of the circuit board body 1 (such as the upper edge and left and right side edges), the first edge 103 does not need to be arranged with sensors, antennas and other functional components. The stacking environment is relatively simple, and the difficulty of bending the liquid cooling film 31 is minimal.

[0081] It should be pointed out that, in the present invention, unless otherwise expressly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above", and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below", and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0082] In the description of this specification, the reference terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention.

[0083] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A circuit board module, characterized in that: The circuit board module comprises: a circuit board body (1), a first electronic component (2) and a heat dissipation assembly (3); The first electronic component (2) is located on the front side (101) or the back side (102) of the circuit board body (1); The heat dissipation component (3) comprises a liquid cooling film (31) and a circulation driver (32); a liquid cooling channel (311) is provided inside the liquid cooling film (31), and the liquid cooling channel (311) is filled with a liquid cooling medium; the circulation driver (32) is connected to the liquid cooling channel (311) to drive the cooling medium to circulate in the liquid cooling channel (311); A portion of the liquid cooling film (31) is located on the front side (101) of the circuit board body (1), another portion of the liquid cooling film (31) is bent to the back side (102) of the circuit board body (1), and the liquid cooling film (31) is in thermal contact with the first electronic component (2).

2. The circuit board module according to claim 1, wherein: The liquid cooling film (31) is attached to the surface of the first electronic component (2) away from the circuit board body (1).

3. The circuit board module according to claim 1, wherein: The circuit board module further comprises a shielding cover (4), the shielding cover (4) is covered on the first electronic component (2), and the liquid cooling film (31) is attached to the shielding cover (4).

4. The circuit board module according to claim 1, wherein: The circulation driver (32) is located on the liquid cooling film (31) corresponding to the front side (101) of the circuit board body (1), or is located on the liquid cooling film (31) corresponding to the back side (102) of the circuit board body (1).

5. The circuit board module according to claim 4, characterized in that: The heat dissipation assembly (3) further comprises a drive control unit (5), which is located on the front side (101) or the back side (102) of the circuit board body (1) and is electrically connected to the circulation driver (32).

6. The circuit board module according to claim 1, wherein: The circulation driver (32) is a piezoelectric pump.

7. The circuit board module according to claim 1, wherein: The circuit board module further comprises a second electronic component (6), wherein the second electronic component (6) is located on the front side (101) or the back side (102) of the circuit board body (1); The liquid cooling film (31) is provided with a notch (312) for avoiding the second electronic component (6).

8. The circuit board module according to claim 1, wherein: The circuit board module further comprises a third electronic component (7), the third electronic component (7) and the first electronic component (2) being located on the same surface of the circuit board body (1), and the third electronic component (7) and the first electronic component (2) having different protrusion heights along the surface of the circuit board body (1); The liquid cooling film (31) corresponding to the first electronic component (2) and the liquid cooling film (31) corresponding to the third electronic component (7) have different protrusion heights toward the circuit board body (1), and the liquid cooling film (31) is in thermal contact with the first electronic component (2) and the third electronic component (7), respectively.

9. An electronic device, characterized in that: The electronic device includes the circuit board module according to any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that The electronic device further comprises a middle frame module (9) and a battery module (8), the circuit board module and the battery module (8) are arranged side by side in the middle frame module (9), the circuit board body (1) has a first edge (103) facing the battery module (8), and the liquid cooling film (31) is bent along the first edge so that a portion of the liquid cooling film (31) is located on the front side (101) of the circuit board body (1), and another portion of the liquid cooling film (31) is located on the back side (102) of the circuit board body (1).

Images