Communication terminal shell

Abstract

The utility model discloses a communication terminal shell which comprises a bottom shell, a top shell is arranged on the bottom shell in a matched mode, a sealing structure is arranged between the bottom shell and the top shell, the bottom of the bottom shell and the top of the top shell are each provided with a plurality of cooling fins, a cooling flow channel is formed between every two adjacent cooling fins, a cooling fan is arranged on one side of each cooling fin, and a cooling fan is arranged on the other side of each cooling fin. The inner bottom end of the bottom shell and the corresponding cooling fins are connected with an installation base, an elastic heat conduction piece is arranged in the top shell, a pressing plate is arranged at the bottom end of the elastic heat conduction piece, a plurality of pressing blocks are evenly and elastically arranged at the bottom end of the pressing plate, and semiconductor chilling plates are arranged on the top shell and the bottom shell correspondingly. According to the utility model, the sealing performance of electrical elements in the communication terminal can be ensured, the overall heat dissipation effect can be ensured, active refrigeration and cooling can be realized when necessary, and the operation effect of the electrical elements in the communication terminal can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of communication terminal shells, and more particularly to a communication terminal shell. Background Art

[0002] A communication terminal is a device used to implement communication functions. It can be fixed or portable. A communication terminal is the part of the communication network that directly contacts the user, enabling the user to send and receive information.

[0003] The communication terminal housing is the external protective structure of the communication terminal equipment. It not only protects the internal electronic components, but also affects the appearance design and user experience of the equipment.

[0004] A large number of electrical components are installed inside the communication terminal, so a lot of heat is generated during operation, which needs to be dissipated in a timely manner. The main heat dissipation method of the existing communication terminal shell is to set a heat sink on the surface of the shell to dissipate heat. Although this method ensures the sealing of the communication terminal, the heat dissipation effect is poor.

[0005] In addition, some communication terminals have heat dissipation holes on the outside of the communication terminals to ensure heat dissipation, and are equipped with a driving fan. Although this method improves the heat dissipation and ventilation effect inside the communication terminal shell, it also affects the sealing inside the communication terminal and the waterproof and dustproof effect inside the communication terminal. Utility Model Content

[0006] (1) Technical problems solved

[0007] In view of the problems existing in the prior art, the present invention provides a communication terminal housing to solve the technical problem of poor heat dissipation effect of the communication terminal housing in the prior art mentioned in the background art.

[0008] (2) Technical solution

[0009] To achieve the above objectives, the present invention provides the following technical solutions:

[0010] A communication terminal shell includes a bottom shell, a top shell is arranged on the bottom shell, a sealing structure is arranged between the bottom shell and the top shell, a plurality of heat sinks are arranged on the bottom of the bottom shell and the top of the top shell, a heat dissipation channel is formed between two adjacent heat sinks, a cooling fan is arranged on one side of the heat sink, a mounting seat is arranged at the inner bottom end of the bottom shell and connected to the corresponding heat sink, an elastic heat conductive part is arranged inside the top shell, a pressure plate is arranged at the bottom end of the elastic heat conductive part, and a plurality of pressure blocks are evenly and elastically arranged on the bottom end of the pressure plate, semiconductor refrigeration fins are arranged on the top shell and the bottom shell, and the heat dissipation ends of the semiconductor refrigeration fins are connected to the corresponding heat sinks.

[0011] The present invention is further configured such that temperature controllers are provided inside the bottom shell and the top shell in conjunction with the semiconductor refrigeration chips for controlling the temperature of the semiconductor refrigeration chips.

[0012] The utility model is further configured such that the elastic heat-conducting member includes a first spring arranged between the pressure plate and the top shell, and a heat-conducting telescopic member is provided inside the first spring to realize an elastic connection between the pressure plate and the top shell.

[0013] The utility model is further configured such that the heat-conducting telescopic part includes a fixed column connected to the top shell, a telescopic column is slidably and telescopically provided on the fixed column, and the bottom end of the telescopic column is connected to the top end of the pressure plate, thereby improving the connection stability and heat conduction effect between the pressure plate and the heat sink on the top shell.

[0014] The utility model is further configured such that a plurality of mounting grooves are evenly opened at the bottom end of the pressure plate, the pressure block slides in the mounting groove, and a plurality of second springs are arranged between the pressure block and the inner wall of the mounting groove, so as to realize the elastic installation of the pressure block at the bottom of the pressure plate, thereby improving the fitting effect between the pressure block and different electrical components and improving the heat conduction effect.

[0015] The utility model is further configured such that a protective cover is provided on the outside of the heat dissipation fan, ventilation slots are opened at both ends of the protective cover, and dustproof nets are provided in the ventilation slots to improve the ventilation and dustproof protection effect of the heat dissipation fan.

[0016] The utility model is further configured such that the sealing structure includes a sealing gasket arranged between the top shell and the bottom shell, and sealing teeth are provided on both the top shell and the bottom shell, and sealing grooves are provided on the sealing gasket that engage the sealing teeth. The setting of the sealing gasket can improve the sealing performance between the top shell and the bottom shell when they are buckled together, and make the sealing teeth and the sealing grooves engage with each other, so that the sealing performance between the top shell and the bottom shell can be further improved.

[0017] The present invention is further configured such that a driving fan is provided inside the bottom shell, and two sets of air guide covers are symmetrically provided in the upper and lower parts of the bottom shell to cooperate with the driving fan, thereby improving the air flow inside the communication terminal shell and improving the uniformity and sufficiency of heat dissipation and cooling.

[0018] The top shell and the bottom shell in the present invention can be detachably fixed by bolts or the like, or can be connected and fixed by hinged connection at one end and locked connection at the other end. The above-mentioned detachable connection methods between the top shell and the bottom shell are all existing well-known technologies, and the present invention will not elaborate on them.

[0019] (3) Beneficial effects

[0020] Compared with the prior art, the present invention provides a communication terminal housing with the following beneficial effects:

[0021] 1. When the utility model is in use, the installation of the internal electrical components of the communication terminal is realized through the mounting base. The mounting base is made of a material with good thermal conductivity. In this way, when the electrical components are in operation, the heat from the bottom is conducted outward, thereby improving the heat dissipation effect of the bottom of the electrical components during operation. The heat will be conducted to the corresponding heat sink through the mounting base and dissipated through the corresponding heat sink. During this process, the cooling fan can be started, and the cooling fan allows the air flow to pass through the heat dissipation flow channel, taking away the heat from the surface of the heat sink, thereby enhancing the surface heat dissipation effect of the heat sink, and further improving the heat dissipation effect of the internal electrical components.

[0022] 2. When the present invention is in use, the cooperation of the bottom shell and the top shell can realize the overall protection of the internal electrical components. At this time, the pressure plate at the bottom end of the top shell will carry the pressure block and be tightly fixed on the top of the electrical component under the cooperation of the first spring and the second spring. Among them, the pressure plate, pressure block, first spring, second spring, fixed column and telescopic column are all supported by materials with good thermal conductivity, such as copper material, thermal conductive ceramic material, etc., and suitable insulating products can be selected as needed. In this way, during use, the pressure block can be stably fitted with the top of the corresponding electrical component, so that the heat generated at the top of the electrical component during operation can be transferred outward to the pressure plate in time, and transferred to the heat dissipation fin position on the top shell through the cooperation of the pressure plate, the first spring, the fixed column and the telescopic column, and the corresponding heat dissipation fan is started to enhance the heat dissipation effect of the heat sink. In this way, while ensuring the internal sealing of the communication terminal, the overall heat dissipation effect can be improved.

[0023] 3. The utility model is provided with semiconductor refrigeration plates on both the top shell and the bottom shell, and the heat dissipation ends of the semiconductor refrigeration plates are connected to the corresponding heat sinks. In this way, when the operating temperature is high and the demand cannot be met by natural heat dissipation, the semiconductor refrigeration plates are operated to realize active cooling inside the communication terminal shell, and can realize active cooling inside the communication terminal shell, thereby improving the operating effect of the electrical components inside the communication terminal. Among them, the setting of the thermostat can control the cooling temperature of the semiconductor refrigeration plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of a communication terminal shell in the present utility model;

[0025] Figure 2 This is a schematic cross-sectional view of the overall internal structure of the utility model Figure 1 ;

[0026] Figure 3 This is a schematic cross-sectional view of the overall internal structure of the utility model Figure 2 ;

[0027] Figure 4 This is a schematic cross-sectional view of the overall internal structure of the utility model Figure 3 ;

[0028] Figure 5 This is a schematic cross-sectional view of the overall structure of the elastic heat-conducting element in the present invention;

[0029] Figure 6 For this utility model Figure 4 A magnified view of the local structure of the middle A.

[0030] In the figure: 1. bottom shell; 2. top shell; 3. heat sink; 4. heat dissipation channel; 5. cooling fan; 6. mounting seat; 7. elastic heat conductor; 8. pressure plate; 9. pressure block; 10. semiconductor refrigeration plate; 11. thermostat; 12. first spring; 13. heat-conducting telescopic member; 14. fixing column; 15. telescopic column; 16. mounting slot; 17. second spring; 18. protective cover; 19. ventilation slot; 20. dustproof net; 21. sealing gasket; 22. sealing teeth; 23. sealing tooth groove; 24. driving fan; 25. air guide cover. DETAILED DESCRIPTION

[0031] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0033] In the present invention, unless otherwise specified, directions such as "up" and "down" are usually relative to the directions shown in the drawings, or relative to the vertical, perpendicular or gravity direction; similarly, for ease of understanding and description, "left" and "right" are usually relative to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned direction words are not used to limit the present invention.

[0034] See also Figure 1-Figure 5The heat dissipation fan 5 is a kind of heat dissipation fan 5, and the heat dissipation channel 4 is formed between the two adjacent heat dissipation fins 3. A heat dissipation fan 5 is provided on one side of the heat dissipation fin 3. The bottom end of the bottom shell 1 is connected to the corresponding heat dissipation fin 3 and is provided with a mounting base 6. When the utility model is in use, the internal electrical components of the communication terminal are installed through the mounting base 6. The mounting base 6 is made of a material with good thermal conductivity. In this way, when the electrical components are in operation, the heat from the bottom is conducted outwards, thereby improving the heat dissipation effect of the bottom of the electrical components during operation. The heat will be conducted to the corresponding heat dissipation fin 3 through the mounting base 6 and dissipated through the corresponding heat dissipation fin 3. In this process, the heat dissipation fan 5 can be started, and the heat dissipation fan 5 allows air to pass through the heat dissipation channel 4 to take away the heat from the surface of the heat dissipation fin 3, thereby enhancing the surface heat dissipation effect of the heat dissipation fin 3, and thus improving the heat dissipation effect of the internal electrical components.

[0035] The top shell 2 is provided with an elastic heat-conducting part 7 inside, and a pressure plate 8 is provided at the bottom end of the elastic heat-conducting part 7. A plurality of pressure blocks 9 are evenly and elastically provided at the bottom end of the pressure plate 8. The elastic heat-conducting part 7 includes a first spring 12 arranged between the pressure plate 8 and the top shell 2. A heat-conducting telescopic part 13 is provided inside the first spring 12. The heat-conducting telescopic part 13 includes a fixed column 14 connected to the top shell 2. A telescopic column 15 is slidably and telescopically provided on the fixed column 14. The bottom end of the telescopic column 15 is connected to the top end of the pressure plate 8. A plurality of mounting grooves 16 are evenly provided at the bottom end of the pressure plate 8. The pressure block 9 slides in the mounting groove 16 and a plurality of second springs 17 are provided between the inner wall of the mounting groove 16. When the utility model is in use, the overall protection of the internal electrical components can be achieved through the cooperation of the bottom shell 1 and the top shell 2. At this time, the pressure plate 8 at the bottom end of the top shell 2 will carry the pressure block 9 in the first elastic The spring 12 and the second spring 17 cooperate to press and fix it on the top of the electrical component. Among them, the pressure plate 8, the pressure block 9, the first spring 12, the second spring 17, the fixed column 14 and the telescopic column 15 are all supported by materials with good thermal conductivity, such as copper, thermal conductive ceramics, etc., and suitable insulating products can be selected as needed. In this way, during use, the pressure block 9 can be stably fitted with the top of the corresponding electrical component, so that the heat generated at the top of the electrical component during operation can be transferred outward to the pressure plate 8 in a timely manner, and transferred to the heat dissipation fin position on the top shell 2 through the cooperation of the pressure plate 8, the first spring 12, the fixed column 14 and the telescopic column 15, and the corresponding heat dissipation fan 5 is started to enhance the heat dissipation effect of the heat sink 3. In this way, while ensuring the internal sealing of the communication terminal, the overall heat dissipation effect can be improved;

[0036] Semiconductor refrigeration plates 10 are provided on both the top shell 2 and the bottom shell 1, and the heat dissipation ends of the semiconductors are connected to the corresponding heat sinks 3. The bottom shell 1 and the top shell 2 are both provided with temperature controllers 11 in conjunction with the semiconductor refrigeration plates 10. The utility model provides semiconductor refrigeration plates 10 on both the top shell 2 and the bottom shell 1, and the heat dissipation ends of the semiconductor refrigeration plates 10 are connected to the corresponding heat sinks 3. In this way, when the operating temperature is high and the demand cannot be met by natural heat dissipation, the semiconductor refrigeration plates 10 are operated to realize active cooling inside the communication terminal casing, and active cooling inside the communication terminal casing can be realized, thereby improving the operating effect of the electrical components inside the communication terminal, wherein the setting of the temperature controller 11 can control the cooling temperature of the semiconductor refrigeration plates 10.

[0037] See also Figure 1-Figure 5 As an implementation of the cooling fan 5 , a protective cover 18 is provided on the outside of the cooling fan 5 , ventilation slots 19 are opened at both ends of the protective cover 18 , and a dustproof net 20 is provided in the ventilation slot 19 .

[0038] Specifically, the provision of the protective cover 18 can enhance the external protection of the heat dissipation fan 5 , and the provision of the ventilation slots 19 and the dustproof net 20 can improve the ventilation and dustproof effect of the heat dissipation fan 5 .

[0039] See also Figure 1-Figure 5 As an implementation of the sealing structure: the sealing structure includes a sealing gasket 21 arranged between the top shell 2 and the bottom shell 1, and sealing teeth 22 are provided on the top shell 2 and the bottom shell 1, and sealing grooves 23 are provided on the sealing gasket 21 to engage with the sealing teeth 22.

[0040] Specifically, the provision of the sealing gasket 21 can improve the sealing performance between the top shell 2 and the bottom shell 1 when they are buckled together, and make the sealing teeth 22 and the sealing grooves 23 engage with each other, so that the sealing performance between the top shell 2 and the bottom shell 1 can be further improved.

[0041] See also Figure 1-Figure 5 As an implementation of the bottom shell 1: a driving fan 24 is provided inside the bottom shell 1, and two sets of air guide covers 25 are symmetrically provided inside the bottom shell 1 to cooperate with the driving fan 24.

[0042] Specifically, the driving fan 24 is started so that the airflow inside the communication terminal forms a ring circulation inside the communication terminal under the action of the air guide cover 25, thereby enhancing the airflow circulation effect inside the communication terminal, improving the internal electrical components, and thus enhancing the heat dissipation and cooling effect of the internal electrical components.

[0043] In summary, when the overall equipment is in use:

[0044] When the present invention is in use, the installation of the internal electrical components of the communication terminal is achieved through the mounting base 6. The mounting base 6 is made of a material with good thermal conductivity. In this way, when the electrical components are in operation, the heat from the bottom is conducted outward, thereby improving the heat dissipation effect of the bottom of the electrical components when in operation. The heat is conducted to the corresponding heat sink 3 through the mounting base 6 and dissipated through the corresponding heat sink 3. During this process, the cooling fan 5 can be started, and the cooling fan 5 allows air to pass through the heat dissipation channel 4, taking away the heat from the surface of the heat sink 3, thereby enhancing the surface heat dissipation effect of the heat sink 3, and further improving the heat dissipation effect of the internal electrical components.

[0045] When the present invention is in use, the overall protection of the internal electrical components can be achieved through the cooperation of the bottom shell 1 and the top shell 2. At this time, the pressure plate 8 at the bottom end of the top shell 2 will carry the pressure block 9 and be tightly fixed on the top of the electrical component under the cooperation of the first spring 12 and the second spring 17. Among them, the pressure plate 8, the pressure block 9, the first spring 12, the second spring 17, the fixed column 14 and the telescopic column 15 are all supported by materials with good thermal conductivity, such as copper material, thermal conductive ceramic material, etc., and suitable insulating products can be selected as needed. In this way, during use, the pressure block 9 can be stably fitted with the top of the corresponding electrical component, so that the heat generated at the top of the electrical component during operation can be transferred outward to the pressure plate 8 in time, and transferred to the heat dissipation fin position on the top shell 2 through the cooperation of the pressure plate 8, the first spring 12, the fixed column 14 and the telescopic column 15, and the corresponding heat dissipation fan 5 is started to enhance the heat dissipation effect of the heat sink 3. In this way, while ensuring the internal sealing of the communication terminal, the overall heat dissipation effect can be improved;

[0046] The utility model is provided with semiconductor refrigeration plates 10 on both the top shell 2 and the bottom shell 1. The heat dissipation ends of the semiconductor refrigeration plates 10 are connected to the corresponding heat sinks 3. In this way, when the operating temperature is high and the demand cannot be met by natural heat dissipation, the semiconductor refrigeration plates 10 are operated to realize active cooling inside the communication terminal shell, and can realize active cooling inside the communication terminal shell, thereby improving the operating effect of the electrical components inside the communication terminal. Among them, the setting of the thermostat 11 can control the cooling temperature of the semiconductor refrigeration plates 10.

[0047] In all the solutions mentioned above, the connection between two components can be selected according to actual conditions by welding, bolt and nut connection, bolt or screw connection or other well-known connection methods, which are not listed here one by one. In the above, whenever there is a fixed connection, welding is preferably considered. Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

[0048] In all the solutions mentioned above, if there is no clear description about the operation of electrical components, they are all controlled by the controller. Since the devices matched with the controller are common devices, their control principles and circuit connections are well-known and mature technologies. Therefore, their electrical connection relationships and specific circuit structures will not be described in detail here.

[0049] In all the solutions mentioned above, those involving motors can be combined with reducers if necessary. The connection structure and working principle between the motor and the reducer are well-known technologies and will not be described in detail in this utility model.

[0050] In all the solutions mentioned above, those involving the connection between solar panels and batteries can be used in conjunction with essential accessories such as inverters, battery charging controllers, cables, fuses, and brackets. Their control principles and line connections are all well-known and mature technologies. Their electrical connection relationships and specific circuit structures will not be described in detail here.

Claims

1. A communication terminal housing, comprising a bottom housing (1), a top housing (2) being provided on the bottom housing (1), a sealing structure being provided between the bottom housing (1) and the top housing (2), a plurality of heat sinks (3) being provided on the bottom of the bottom housing (1) and the top of the top housing (2), wherein: A heat dissipation channel (4) is formed between two adjacent heat sinks (3), a heat dissipation fan (5) is provided on one side of the heat sink (3), a mounting seat (6) is provided at the inner bottom end of the bottom shell (1) and connected to the corresponding heat sink (3), an elastic heat conductive member (7) is provided inside the top shell (2), a pressure plate (8) is provided at the bottom end of the elastic heat conductive member (7), and a plurality of pressure blocks (9) are uniformly and elastically provided at the bottom end of the pressure plate (8), semiconductor cooling fins (10) are provided on both the top shell (2) and the bottom shell (1), and the heat dissipation ends of the semiconductor cooling fins (10) are connected to the corresponding heat sink (3).

2. A communication terminal housing according to claim 1, characterized in that: The bottom shell (1) and the top shell (2) are both provided with a temperature controller (11) in conjunction with the semiconductor refrigeration plate (10).

3. A communication terminal housing according to claim 1, characterized in that: The elastic heat-conducting component (7) comprises a first spring (12) arranged between the pressure plate (8) and the top shell (2), and a heat-conducting telescopic component (13) is arranged in the interior of the first spring (12).

4. A communication terminal housing according to claim 3, characterized in that: The heat-conducting telescopic member (13) includes a fixed column (14) connected to the top shell (2), a telescopic column (15) is slidably and telescopically provided on the fixed column (14), and the bottom end of the telescopic column (15) is connected to the top end of the pressure plate (8).

5. A communication terminal housing according to claim 4, characterized in that: The bottom end of the pressure plate (8) is evenly provided with a plurality of mounting grooves (16), the pressure block (9) is slidably located in the mounting groove (16), and a plurality of second springs (17) are provided between the pressure block (9) and the inner wall of the mounting groove (16).

6. A communication terminal housing according to any one of claims 1 to 5, characterized in that: A protective cover (18) is provided on the outside of the heat dissipation fan (5), ventilation slots (19) are provided at both ends of the protective cover (18), and a dustproof net (20) is provided in the ventilation slot (19).

7. The communication terminal housing according to claim 1, wherein: The sealing structure comprises a sealing gasket (21) arranged between a top shell (2) and a bottom shell (1); sealing teeth (22) are provided on both the top shell (2) and the bottom shell (1); and sealing tooth grooves (23) are provided on the sealing gasket (21) to engage with the sealing teeth (22).

8. The communication terminal housing according to claim 1, wherein: A driving fan (24) is provided inside the bottom shell (1), and two groups of air guide covers (25) are symmetrically provided in the bottom shell (1) to match the driving fan (24).

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