Heat exchange structure and electronic equipment

Abstract

The utility model provides a heat exchange structure and electronic equipment, and belongs to the technical field of heat dissipation equipment. The heat exchange structure comprises a base and a cover body which are in butt joint in a covering mode, and a cavity is defined by the base and the cover body jointly. The supporting piece is arranged in the cavity, and the supporting piece is provided with a plurality of channels for phase change fluid to pass through; the auxiliary supporting piece is arranged in the supporting piece so as to support the base and the cover body together with the supporting piece. According to the heat exchange structure, the base and the cover body are supported through the supporting piece and the auxiliary supporting piece, backflow of the phase change fluid is assisted, stable supporting can be guaranteed, meanwhile, the number of the supporting columns in the cavity is reduced, and therefore the situation that the outflow diffusion efficiency of the phase change fluid is affected due to the fact that the number of the supporting columns is too large is prevented.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a heat exchange structure and electronic equipment. Background Art

[0002] A vapor chamber is a passive thermal management device that dissipates heat through evaporation and condensation of an internal working fluid. The support structure within the vapor chamber is a key component. It not only provides strong structural strength but also guides the flow of vapor within the chamber, promoting the return of the condensed working fluid and regulating and enhancing the gas-liquid phase transition.

[0003] In related technologies, the support structure of the temperature equalizing plate is generally a solid metal support column or a sintered metal powder metal support column structure. However, for a large-sized temperature equalizing plate, more column structures need to be set up, resulting in a larger evaporation area and gaseous working medium flow space being occupied, increasing the working medium flow resistance and affecting the heat exchange efficiency. Utility Model Content

[0004] The present application provides a heat exchange structure and an electronic device, which are used to solve the technical problem in the related art that when the size of the heat exchange structure is too large, the number of internal support columns increases, thereby hindering the flow of phase change fluid.

[0005] In one aspect, the present application provides a heat exchange structure, comprising:

[0006] The base and the cover are connected together to form a cavity, and the cavity is filled with a phase change fluid;

[0007] a support member disposed in the cavity, the support member being provided with a plurality of channels for the phase-change fluid to pass through;

[0008] An auxiliary support member is provided in the support member to support the base and the cover together with the support member.

[0009] In a possible embodiment, the cavity has an evaporation area and a condensation area separated from each other, the evaporation area is used for the phase change fluid to evaporate under heat, and the condensation area is used for the phase change fluid to condense and reflux;

[0010] The support member is disposed in the evaporation region.

[0011] In a possible embodiment, a plurality of through holes are configured on the support member, a capillary powder ring is sleeved on the outer circumference of the auxiliary support member, and the auxiliary support member is passed through the through holes via the capillary powder ring.

[0012] In a possible implementation, the auxiliary support member is a metal sintered core column, and the capillary powder ring is a powder metal ring.

[0013] In a possible implementation manner, a thickness of the cavity corresponding to the evaporation region is greater than a thickness of the cavity corresponding to the condensation region.

[0014] In a possible implementation, the method further includes:

[0015] The capillary structure layer is provided on the inner side wall of the base and / or the cover to guide the phase-change fluid in the cavity to flow back.

[0016] In a possible implementation, both ends of the auxiliary support member extend out of the support member, and a portion of the auxiliary support member extending out of the support member enters into the capillary structure layer.

[0017] In a possible implementation, the method further includes:

[0018] A plurality of support columns are arranged at intervals in the condensation area of ​​the cavity to support the base and the cover; the outer diameter of the support column is greater than the outer diameter of the auxiliary support member.

[0019] In a possible implementation, the support member is a hydrophilic foam metal member or a hydrophilic foam ceramic member; the skeleton wire diameter of the support member is not less than 1 mm, the porosity is not less than 90%, and the pore size is 10-20 ppi.

[0020] On the other hand, an embodiment of the present application further provides an electronic device, comprising a device body and a heat exchange structure as described above and arranged on the device body.

[0021] The heat exchange structure provided in the present application utilizes a base and a cover to enclose a cavity, which is filled with a phase-change fluid. An auxiliary support member is provided in the support member to jointly support the base and the cover member with the support member. Since a plurality of channels for the phase-change fluid to pass through are provided inside the support member, the support member can support the base and the cover while reducing the obstruction to the outflow and diffusion of the phase-change fluid, thereby reducing the occupied area covered by the support column, thereby facilitating ensuring the heat dissipation efficiency of the heat exchange structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0023] Figure 1 This is a partial structural side sectional view of the heat exchange structure in an embodiment of the present application;

[0024] Figure 2 for Figure 1 Assembly diagram of the middle support member and the auxiliary support member;

[0025] Figure 3 for Figure 2 A top view of

[0026] Figure 4 This is a partial structural side sectional view of the heat exchange structure in an embodiment of the present application;

[0027] Figure 5 Schematic diagram of the assembly of the support member and the auxiliary support member in another embodiment.

[0028] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments.

[0029] Description of Reference Numerals

[0030] 101-base; 102-cover;

[0031] 200-support member; 201-auxiliary support member; 202-capillary powder ring;

[0032] 300-capillary structure layer; 400-support column;

[0033] 500-evaporation area; 600-condensation area; 700-heat source; 800-cavity. DETAILED DESCRIPTION

[0034] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0035] The vapor chamber is a passive thermal management device that dissipates heat through evaporation and condensation of an internal working fluid. Due to its simple structure, high reliability, and ability to perform two-dimensional heat transfer from point to surface, it is widely used in various thermal management fields.

[0036] The main structure of the vapor chamber consists of upper and lower shells, a supporting structure, a wick, and an internal phase-change fluid. The side closest to the heat source is the evaporation end, and the other side is the condensation end. Under the action of the heat source, the fluid at the evaporation end is transformed into a gaseous state and transferred to the condensation end. Then, under the action of an external heat sink such as a finned heat sink, it releases heat and condenses into a liquid state. The liquid is then pumped back to the evaporation end by the wick and supporting structure, entering the next phase-change cycle.

[0037] In the related art, for large-sized temperature averaging plates, multiple support columns are generally set at intervals inside the cavity of the temperature averaging plate to ensure the overall structural strength of the temperature averaging plate. However, for the central evaporation area of ​​the large-sized temperature averaging plate, it has a larger evaporation area and a higher cavity thickness. If a traditional support column structure is used to ensure that the shell surface is flat and not collapsed, setting too many column structures will occupy a larger evaporation area and gaseous working medium flow space, increase the working medium flow resistance, and weaken the evaporation efficiency.

[0038] Based on the above relevant description, one or more embodiments of the present application provide a heat exchange structure, in which a cavity is formed by a base and a cover, the cavity is filled with a phase change fluid, and an auxiliary support member is embedded in the support member to jointly support the base and the cover with the support member. Since the support member has evenly distributed openings inside, it can support the bottom plate and the cover while reducing the obstruction to the outflow and diffusion of the phase change fluid, reducing the occupied area covered by the support column, thereby helping to ensure the heat dissipation efficiency of the heat exchange structure.

[0039] The heat exchange structure in the embodiment of the present application is described below with reference to the accompanying drawings.

[0040] like Figure 1 As shown, the heat exchange structure provided in the embodiment of the present application includes a base 101 and a cover 102 that are connected to each other, a support member 200 and an auxiliary support member 201.

[0041] The base 101 and the cover 102 together form a cavity 800, which is filled with a phase-change fluid; the support member 200 is arranged in the cavity, and the support member 200 is provided with a plurality of channels for the phase-change fluid to pass through; the auxiliary support member 201 is embedded in the support member 200 to jointly support the base 101 and the cover 102 with the support member 200.

[0042] In the above-mentioned heat exchange structure, the base 101 and the cover 102 are constructed to form a cavity 800, and the phase change fluid can undergo a gas-liquid phase change in the cavity 800. The base 101 and the cover 102 are jointly supported by the support member 200 and the auxiliary support member 201. The auxiliary support member 201 can enhance the structural strength of the above-mentioned support structure to the heat exchange structure, avoiding the problem that the support strength of the support member 200 is low when used alone, which makes the base 101 and the cover 102 easily compressed and deformed. The support member 200 can also reduce the number of support columns 400 used, thereby minimizing the space occupied by the support columns 400 in the cavity 800, reducing the flow and diffusion resistance of the phase change fluid, and helping to improve the overall heat exchange efficiency of the heat exchange structure.

[0043] In the embodiment of the present application, the heat exchange structure is a temperature equalizing plate, which can be used in heat-generating components of electronic products such as mobile phones, computers, and servers, and can also be used in related components that require thermal management such as lasers and medical equipment. There is no absolute limitation on this.

[0044] The phase change fluid in the embodiments of the present application can be selected according to specific application requirements or actual design scenarios. For example, the phase change fluid can be water, alcohols (such as ethanol or propanol), Freon or silicone oil. The phase change fluid needs to be considered in combination with multiple factors such as the compatibility, safety, and cost of the temperature equalizing plate material, and there is no absolute limitation on this.

[0045] like Figure 1 As shown, in some embodiments, the cavity 800 is filled with a phase change fluid, and the cavity 800 is divided into an evaporation area 500 for the phase change fluid to evaporate under heat, and a condensation area 600 for the phase change fluid to condense and reflux; the support member 200 is arranged in the evaporation area 500.

[0046] Generally, heat conducting components are provided on the base 101 and the cover 102 at positions corresponding to the evaporation area 500 and the condensation area 600. The heat conducting components may be thermal grease or fin heat sinks, etc., as long as they can transfer heat.

[0047] In the above embodiment, the evaporation area 500 is set to correspond to the position of the heat source 700, and the condensation area 600 corresponds to the position of the non-heat source 700. The heat source 700 is also the related component that requires heat exchange. When the evaporation area 500 of the heat exchange structure senses the heat of the heat source 700, the phase change fluid in liquid state is converted into gas state under the action of heat, and is transferred to the condensation area 600 along with the cavity 800. Then, the heat is released under the heat transfer effect of the heat-conducting component, and the phase change fluid condenses into liquid state and flows back to the evaporation area 500 to enter the next phase change cycle process.

[0048] Since the evaporation region 500 is the main region where the phase change fluid turns into vapor flow, the support member 200 is set in the evaporation region 500. Compared with setting multiple support columns 400 in the evaporation region 500, the support member 200 can reduce the occupied area of ​​the evaporation region 500 and the flow space of the phase change fluid in the vapor state, which is beneficial to reducing the flow resistance of the phase change fluid and improving the evaporation efficiency.

[0049] Furthermore, the thickness of the cavity 800 corresponding to the evaporation region 500 is greater than the thickness of the cavity 800 corresponding to the condensation region 600 .

[0050] As a result, the overall heat exchange structure is convex, with the portion of cavity 800 corresponding to the protruding evaporation region 500 facing the heat source 700. Since the evaporation region 500 is the input area for heat from the heat source 700, increasing the thickness of cavity 800 in the evaporation region 500 can increase the surface area, thereby promoting the evaporation of the phase-change fluid and allowing the vapor phase-change fluid to flow more smoothly to the condensation region 600, thereby improving heat transfer efficiency.

[0051] Furthermore, the thicker evaporation region 500 cavity 800 helps improve the dynamic characteristics of the internal phase-change fluid, ensuring gas-liquid separation of the phase-change fluid, reducing the possibility of liquid being carried into the condensation region 600, and preventing localized overheating in the condensation region 600. The thinner condensation region 600 allows heat to be more easily transferred from the vapor state to the external heat-conducting components, which helps reduce thermal resistance and improve the heat dissipation efficiency of the entire vapor chamber.

[0052] like Figure 1 As shown, in some embodiments, the heat exchange structure further includes a plurality of support columns 400 , which are spaced apart in the condensation area 600 of the cavity 800 to support the base 101 and the cover 102 ; the outer diameter of the support columns 400 is greater than the outer diameter of the auxiliary support member 201 .

[0053] One end of the support column 400 is fixed to the base 101, and the other end is fixed to the cover 102. The support column 400 can be made of metal material, formed by sintering powder, or fixed to the base 101 and the cover 102 by stamping, welding, etc.

[0054] Since there is very little phase change fluid in the vapor state in the condensation area 600, the flow resistance in the vapor state can be ignored. The outer diameter of the support column 400 is larger than the outer diameter of the auxiliary support member 201, which can enhance the support structure strength of the condensation area 600 and ensure the overall pressure resistance and deformation resistance of the temperature equalization plate.

[0055] like Figure 2 and Figure 3 As shown, in some embodiments, a plurality of through holes are constructed in the support member 200 , a capillary powder ring 202 is sleeved on the outer peripheral side of the auxiliary support member 201 , and the auxiliary support member 201 is penetrated by the through holes through the capillary powder ring 202 .

[0056] The auxiliary support member 201 is integrated with the support member 200 through the capillary powder ring 202. During the assembly of the heat exchange structure, the support member 200 embedded with the auxiliary support member 201 is placed as a whole on the base 101 or the cover 102, and then the base 101 or the cover 102 is docked and covered for subsequent processes.

[0057] The provision of the capillary powder ring 202 can enhance the structural rigidity of the through hole of the support member 200 and prevent the through hole from deforming during heat transfer. In addition, the capillary powder ring 202 also provides a stable installation point for the installation of the auxiliary support member 201 and the through hole, ensuring that the auxiliary support member 201 will not be offset or tilted when under pressure, further enhancing the overall structural stability.

[0058] In the related art, when the support column 400 is placed separately on the base 101 or the cover 102, the support column 400 is prone to tilt, affecting the supporting effect. By embedding the auxiliary support member 201 in the support member 200, the support member 200 can be placed as a whole on the base 101 or the cover 102. The auxiliary support member 201 is constrained by the support member 200 to always remain in an upright state, thereby simplifying the placement process of the auxiliary support member 201 and reducing the difficulty of assembly.

[0059] In the above embodiment, the auxiliary support member 201 is a metal sintered core column, and the capillary powder ring 202 is a powdered metal ring. Generally, the support column 400, the auxiliary support member 201 and the capillary powder ring 202 can be made of copper or aluminum, which is not absolutely limited in the embodiments of the present application.

[0060] In the embodiment of the present application, the support member 200 is a hydrophilic foam metal or a hydrophilic foam ceramic.

[0061] Exemplarily, the support member 200 is a hydrophilic foam metal. Further, the foam metal is aluminum foam metal, copper foam metal or nickel foam metal.

[0062] Foam metal is a porous material with a high porosity. The high porosity gives the foam metal wick a high permeability, which can effectively reduce fluid resistance. The large specific surface area of ​​foam metal can increase the contact area between the wick and the working fluid, which is conducive to the evaporation of the working fluid and reduces the evaporation thermal resistance. Foam metal also has the characteristics of low density, weighing only 20-60% of the same volume of metal, and the thickness can be as low as 0.2mm, so it can effectively reduce the conduction thermal resistance.

[0063] It should be noted that the openings in the support member 200 are complete micropores, and the openings in the outermost layer are semi-openings, so as to form a good flow channel for facilitating the passage of the phase change fluid in the vapor state.

[0064] As an alternative embodiment, the support member 200 may also be made of other materials. For example, the support member 200 is an integrated hollow skeleton made by 3D printing technology. In addition to metal materials and ceramic materials, the support member 200 may also be made of graphite materials, heat-resistant polymers and other materials. The embodiments of the present application do not make absolute limitations on this.

[0065] In some embodiments, the skeleton wire diameter of the support member 200 is not less than 1 mm, the porosity is not less than 90%, and the pore size is 10-20 ppi.

[0066] The above parameter settings should be considered based on the actual size of the temperature plate, structural strength requirements, safety and other factors. For example, for a size of 150×150mm 2The large-size temperature plate has an evaporation area of ​​500 corresponding to a cavity area of ​​800 of 30×30mm. 2 The support member 200 has a skeleton wire diameter of 1.2 mm, a porosity of 95%, and a pore size of 10 ppi. Alternatively, the support member 200 has a skeleton wire diameter of 1 mm, a porosity of 90%, and a pore size of 20 ppi.

[0067] like Figure 1 As shown, in some embodiments, the heat exchange structure further includes a capillary structure layer 300 , which is disposed on the inner wall of the base 101 and / or the cover 102 to guide the phase change fluid in the cavity 800 to flow back.

[0068] Capillary structure refers to a structure that uses capillary action to transport liquid. Capillary action refers to the phenomenon that liquid moves spontaneously in small tubes or pores due to surface tension and adhesion. Capillary structure can be formed by structures such as capillaries and porous materials.

[0069] Specifically, a capillary structure layer 300 is provided on the inner sidewalls of the base 101 and the cover 102 . The capillary structure layer 300 can be made of sintered powder metal, or a metal mesh layer, as long as it can promote the reflux of the phase change fluid.

[0070] In some embodiments, both ends of the auxiliary support member 201 protrude from the support member 200 , and the protruding portion of the auxiliary support member 201 extends into the capillary structure layer 300 .

[0071] The aforementioned auxiliary support member 201 is interlocked and plugged into the capillary structure layer 300, increasing the number of contact points between the auxiliary support member 201 and the capillary structure layer 300. This prevents the base 101 and the cover 102 from deforming or collapsing under high-temperature or high-pressure conditions, particularly at the interface between the condensation region 600 and the evaporation region 500. Furthermore, because the protruding portion of the auxiliary support member 201 extends into the capillary structure layer 300, the auxiliary support member 201 and the capillary structure layer 300 create a capillary effect that helps the condensed phase-change fluid flow back to the evaporation region 500 more quickly, thereby improving the circulation efficiency of the phase-change fluid.

[0072] like Figure 4 As shown, in some embodiments, both ends of the auxiliary support member 201 extend into the capillary structure layer 300 and abut against the inner walls of the base 101 and the cover 102 . This design can further enhance the overall support strength of the support member 200 .

[0073] like Figure 5As shown, in some embodiments, a capillary powder ring 202 is provided on the outer cover of the auxiliary support member 201. When the auxiliary support member 201 protrudes from the support member 200, the capillary powder ring 202 is flush with the height of the auxiliary support member 201. The protruding part of the auxiliary support member 201 passes through the capillary structure layer 300 and abuts against the base 101 and the cover body 102, thereby further improving the supporting strength of the auxiliary support member 201.

[0074] In some embodiments, the support member 200 is hydrophilically modified.

[0075] Exemplarily, when the support member 200 is copper foam metal, it is ultrasonically cleaned with acetone, ethanol, and deionized water in sequence and then dried. The washing time is 5 minutes respectively. Then, the copper foam metal obtained above is immersed in a 96°C etching solution for 20 to 40 minutes. The etching solution uses NaClO2+NaOH+NaPO4·12H2O+H2O with a ratio of 3.75:5:10:100wt.%. After etching is completed, the surface is thoroughly rinsed with 100°C deionized water. After being completely rinsed, it is vacuum dried at 50°C until there is no liquid at all for about 3 hours. Finally, the dried copper foam metal and the capillary structure layer 300 of the heat exchange structure are placed in a vacuum sintering furnace and sintered to combine the two. The sintering temperature is 900°C and the sintering time is 40 minutes. The support member 200 and the capillary structure layer 300 are completed.

[0076] Another embodiment of the present application provides an electronic device, including a device body and a heat exchange structure as described above and arranged on the device body.

[0077] The above-mentioned electronic device can be a server, switch or other communication equipment in the related technology. The device body has a heating area, and the heat exchange structure is correspondingly arranged on the heating area of ​​the device body to facilitate heat exchange of the device body.

[0078] Since the electronic device includes the above heat exchange structure, it has all the advantages of the heat exchange structure.

[0079] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0080] It should be understood that the present application is not limited to the exact structure described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A heat exchange structure, characterized in that: include: The base (101) and the cover (102) are joined together to form a cavity (800), and the cavity (800) is filled with a phase-change fluid; A support member (200) is disposed in the cavity (800), and the support member (200) is provided with a plurality of channels for the phase-change fluid to pass through; An auxiliary support member (201) is provided in the support member (200) to support the base (101) and the cover (102) together with the support member (200).

2. The heat exchange structure according to claim 1, characterized in that: The cavity (800) has an evaporation region (500) and a condensation region (600) separated from each other, the evaporation region (500) is used for the phase-change fluid to evaporate under heat, and the condensation region (600) is used for the phase-change fluid to condense and reflux; The support member (200) is disposed in the evaporation region (500).

3. The heat exchange structure according to claim 2, characterized in that: The support member (200) is provided with a plurality of through holes, the outer peripheral side of the auxiliary support member (201) is sleeved with a capillary powder ring (202), and the auxiliary support member (201) is passed through the through holes via the capillary powder ring (202).

4. The heat exchange structure according to claim 3, characterized in that: The auxiliary support member (201) is a metal sintered core column, and the capillary powder ring (202) is a powdered metal ring.

5. The heat exchange structure according to claim 2, characterized in that: The thickness of the cavity corresponding to the evaporation region (500) is greater than the thickness of the cavity corresponding to the condensation region (600).

6. The heat exchange structure according to any one of claims 1 to 5, characterized in that: Also includes: The capillary structure layer (300) is provided on the inner side wall of the base (101) and / or the cover (102) to guide the phase-change fluid in the cavity (800) to flow back.

7. The heat exchange structure according to claim 6, characterized in that: Both ends of the auxiliary support member (201) extend out of the support member (200), and the portion of the auxiliary support member (201) extending out of the support member enters into the capillary structure layer (300).

8. The heat exchange structure according to any one of claims 1 to 5, characterized in that: Also includes: A plurality of support columns (400) are arranged at intervals in the condensation area (600) of the cavity to support the base (101) and the cover (102); the outer diameter of the support column (400) is greater than the outer diameter of the auxiliary support member (201).

9. The heat exchange structure according to any one of claims 1 to 5, characterized in that: The support member (200) is a hydrophilic foam metal member or a hydrophilic foam ceramic member; the support member (200) has a skeleton wire diameter of not less than 1 mm, a porosity of not less than 90%, and a pore diameter of 10-20 ppi.

10. An electronic device, characterized in that: The heat exchange device comprises a device body and a heat exchange structure according to any one of claims 1 to 9 arranged on the device body.

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