Efficient space heat dissipation module

Abstract

The utility model provides a high-efficiency space heat dissipation module. The high-efficiency space heat dissipation module comprises a plurality of switch heat dissipation units and capacitor heat dissipation units, the switch heat dissipation units are vertically arranged on the main body circuit structure, the switch heat dissipation units are arranged at intervals corresponding to the switches, and the capacitor heat dissipation units are attached to the upper portion of the capacitor and located among the multiple switch heat dissipation units. According to the high-efficiency space heat dissipation module provided by the utility model, through reasonable heat dissipation unit arrangement and compact structural design, the heat dissipation efficiency of the main body circuit structure is improved, faults caused by overheating of the switch and the capacitor can be avoided, the service life of equipment is prolonged, and the stability and the reliability are improved. The utility model further comprises an inverter with the high-efficiency space heat dissipation module, and heat dissipation can be carried out on a main body circuit structure with a switch and a capacitor.

Description

Technical Field

[0001] The utility model relates to the field of electronic equipment, and in particular to a high-efficiency spatial heat dissipation module. Background Art

[0002] Inverters are widely used in power systems. During operation, components such as switches and capacitors generate significant heat. Switching components (such as IGBTs and MOSFETs) and capacitors are the primary sources of heat in inverters. If heat dissipation is not timely or adequate, system efficiency and equipment life will be severely impacted. To ensure stable inverter operation, efficient heat dissipation modules must be designed for these heat-generating components to ensure they operate within a safe temperature range.

[0003] In existing technologies, heat sinks are typically used within inverters to dissipate heat. Most heat sinks utilize fins combined with air flow to increase the heat dissipation area and achieve effective cooling. However, due to limited space within the inverter, particularly the close spacing between key components like switches and capacitors, existing heat sink designs struggle to fully utilize the space while ensuring effective heat dissipation. This results in uneven heat dissipation from some components, leading to localized overheating and potentially impacting inverter performance.

[0004] Therefore, there is an urgent need for an efficient heat dissipation module that can adapt to the compact layout of the inverter. This module can not only independently dissipate heat for the switches and capacitors, but also improve overall heat dissipation efficiency within a limited space, ensuring stable operation of the inverter and extending its service life. This new heat dissipation module should be able to optimize the arrangement of the heat dissipation units, making the heat dissipation path more reasonable and the heat dissipation effect more uniform. Utility Model Content

[0005] The utility model aims to provide a high-efficiency spatial heat dissipation module to solve the problem of uneven heat dissipation inside the inverter and achieve efficient heat dissipation of switches and capacitors.

[0006] The utility model provides a high-efficiency spatial heat dissipation module, which is arranged in an inverter to dissipate heat for a main circuit structure having switches and capacitors, and includes multiple switch heat dissipation units and capacitor heat dissipation units; the switch heat dissipation units are vertically arranged on the main circuit structure, and each of the switch heat dissipation units is arranged corresponding to the switch interval, and the capacitor heat dissipation unit is attached to the capacitor and located between the multiple switch heat dissipation units.

[0007] The present utility model also provides an inverter, including a main circuit structure and a high-efficiency spatial heat dissipation module, wherein the main circuit structure is provided with a plurality of switches and capacitors, and the main circuit structure includes a plurality of switch heat dissipation units and a capacitor heat dissipation unit, wherein the switch heat dissipation unit and the capacitor heat dissipation unit are respectively arranged corresponding to the switches and the capacitors; the switch heat dissipation unit is vertically arranged on the main circuit structure, and each of the switch heat dissipation units is arranged corresponding to the switch interval, and the capacitor heat dissipation unit is attached to the capacitor and located between the plurality of switch heat dissipation units.

[0008] Compared to existing technologies, the efficient spatial heat dissipation module provided by this utility model solves the heat dissipation problem within the limited internal space of the inverter through a rational layout of the heat dissipation units, ensuring stable operation of the switches and capacitors within the confined space. Inverters using this efficient spatial heat dissipation module not only improve heat dissipation but also increase system space utilization through a compact design, thereby extending the service life of the equipment and improving the operating reliability of the inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic diagram of the three-dimensional structure of an inverter provided by the utility model;

[0010] Figure 2 This is an exploded view of the three-dimensional structure of an inverter provided by the utility model;

[0011] Figure 3 for Figure 2 A top view of the capacitor heat dissipation unit structure shown;

[0012] Figure 4 for Figure 2 A side view of the capacitor heat dissipation unit structure shown;

[0013] Figure 5 for Figure 2 The three-dimensional structural diagram of the switch heat dissipation unit shown; and

[0014] Figure 6 The figure is a schematic diagram of the three-dimensional structure of another embodiment of an inverter provided by the utility model. DETAILED DESCRIPTION

[0015] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only a portion of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments derived by persons of ordinary skill in the art without inventive effort are also within the scope of protection of the present invention.

[0016] See Figure 1 and Figure 2 , Figure 1 This is a three-dimensional structural diagram of an inverter of the utility model. Figure 2 This is an exploded view of the three-dimensional structure of an inverter provided by the present invention. The inverter 100 includes a main circuit structure 1 and a high-efficiency spatial heat dissipation module 7. The main circuit structure 1 is provided with a plurality of switches 11 and capacitors 13. The main circuit structure 1 is a relatively common setting in the prior art, including DC and AC input and output terminals, as well as a built-in boost / buck module, a DC / AC conversion module and a circuit board structure for displaying the above modules. Among them, a module controlled by a bridge circuit is provided with a plurality of switches 11 for realizing the functions inside the module. The switch 11 is mainly a switch tube, such as IGBT, MOSfet, etc., which is not limited here.

[0017] The capacitor 13 is a key component in the main circuit structure 1, and is mainly used for smoothing current fluctuations, storing and releasing electric energy. A plurality of the capacitors 13 are arranged in parallel or in series on the main circuit structure 1, adjacent to the switch 11 or distributed between the DC / AC conversion modules to optimize the storage and conversion efficiency of energy. The selection and layout of the capacitor elements are designed according to the voltage and current requirements of different modules to ensure the power balance and stable output of the module when the high-frequency switch is working. Among them, in the module controlled by a bridge circuit, the capacitor 13 is particularly arranged between the DC input terminal and the AC output terminal for filtering the DC voltage and smoothing the AC waveform, and preventing the transient voltage from being too high and damaging the switch tube (such as IGBT, MOSFET, etc.), which is not limited here.

[0018] The high-efficiency spatial heat dissipation module 7 is arranged in the inverter 100 to dissipate heat for the main circuit structure 1 having the switch 11 and the capacitor 13. The high-efficiency spatial heat dissipation module 7 includes multiple switch heat dissipation units 71 and capacitor heat dissipation units 73; the switch heat dissipation units 71 are vertically arranged on the main circuit structure 1, and each of the switch heat dissipation units 71 is arranged at intervals corresponding to the switch 11 to effectively dissipate the heat generated by the switch 11.

[0019] The capacitor heat dissipation unit 73 is attached above the capacitor 13 and is located between the multiple switch heat dissipation units 71. It accelerates the heat dissipation of the capacitor 13 and saves space inside the inverter 100 through the heat conduction of the solid medium. Different from the existing technology, the high-efficiency space heat dissipation module 7 is additionally provided with the capacitor heat dissipation unit 73 to ensure that the capacitor 13 can also dissipate heat effectively. Since the switch 11 and the capacitor 13 generate heat during operation, the temperature at the bottom of the main circuit structure 1 is relatively high. The switch heat dissipation unit 71 can effectively transfer the heat of the switch 11. However, the capacitor 13 can only be cooled by air flow, which is less efficient. By providing the capacitor heat dissipation unit 73, the heat dissipation problem of the capacitor 13 is effectively solved, and the heat dissipation effect at the bottom of the main circuit structure 1 is ensured.

[0020] Please continue to refer to Figure 3 and Figure 4 In this embodiment, the capacitor heat dissipation unit 73 includes a heat-conducting substrate 731 and a plurality of heat-dissipating fins 733. The heat-conducting substrate 731 is arranged on top of the capacitor 13 to fully contact the surface of the capacitor 13 and promptly dissipate the heat generated by the operation of the capacitor 13. The plurality of heat-dissipating fins 733 are vertically arranged at the bottom of the heat-conducting substrate 731. The heat-dissipating fins 733 are arranged in a square matrix, and the heat-dissipating fins 733 are evenly spaced and form at least two mutually perpendicular heat-dissipating channels. In this way, the heat-dissipating surface area can be effectively increased, so that air can flow from multiple directions to remove heat.

[0021] It should be noted that the capacitor heat dissipation unit 73 can be composed of a variety of different heat dissipation devices, such as guide grooves, heat pipes, fans, thermal paste, etc. In this embodiment, the capacitor heat dissipation unit 73 is bonded to the thermally conductive substrate 731 for heat transfer. Thermally conductive paste is provided between the thermally conductive substrate and the capacitor 13 to ensure heat conduction while fixing the capacitor heat dissipation unit 73. The heat dissipation fins 733 are perpendicular to the thermally conductive substrate 731 and extend outward from the thermally conductive substrate 731. They transfer the temperature near the bottom of the main circuit structure 1 to the outside, so that the temperature is transferred to a height as close as possible to the switch heat dissipation unit 71, which is conducive to heat dissipation.

[0022] In order to further optimize the heat dissipation path, the capacitor heat dissipation unit 73 further includes a cross-flow baffle 735, which is vertically arranged at the bottom of the heat-conducting substrate 731 and located between two adjacent rows of heat dissipation fins 733. Figure 3The height of the cross-flow baffle 735 is slightly smaller than the heat dissipation fins 733, so that it cooperates with the heat dissipation fins 733 to form multiple first heat dissipation channels 7339. This allows the temperature on the surface of the capacitor 13 to be transferred outward along the first heat dissipation channels 7339 without mixing with the temperature on the surface of the switch 11. By dividing the heat dissipation channels, the cross-flow baffle 735 not only guides air flow to specific channels, improving air flow efficiency and thus heat dissipation capacity, but also provides a certain degree of protection for the capacitor 13.

[0023] It should be noted that the heat dissipation fins 733 can adopt different shapes and structures, such as flat plate, tubular, microchannel, etc., to meet different heat dissipation requirements.

[0024] In this embodiment, the heat dissipation fins 733 are configured as rectangular parallelepiped structures, evenly spaced and perpendicular to the thermally conductive substrate 731. This arrangement evenly distributes heat in all directions, maximizing the heat dissipation area within a limited volume, making it easier to integrate with other components and suitable for compact spaces. Compared to other complex shapes, rectangular parallelepiped structures are easier to manufacture and less expensive. In another embodiment, the heat dissipation fins 733 are configured as cylindrical structures, evenly spaced and perpendicular to the thermally conductive substrate 731. This arrangement optimizes the heat dissipation effect of the heat dissipation channel, and each surface of the cylinder is in uniform contact with the air, ensuring consistent overall heat dissipation efficiency and making partial damage less likely.

[0025] In this embodiment, the heat dissipation fins 733 include a first heat dissipation surface 7331 and a second heat dissipation surface 7333. For heat dissipation fins 733 arranged in the same row, the corresponding first heat dissipation surfaces 7331 are arranged in the same plane, and the first heat dissipation surfaces 7331 and the second heat dissipation surfaces 7333 are arranged perpendicular to each other. For heat dissipation fins arranged in the same column, the corresponding second heat dissipation surfaces are arranged in the same plane, and the first heat dissipation surfaces 7331 and the second heat dissipation surfaces 7333 correspond to different arrangement directions of the heat dissipation fins 733. This arrangement ensures smooth heat dissipation airflow, removing heat from the heat dissipation fins 733, without causing airflow turbulence.

[0026] Adjacent rows of heat dissipating fins 733 form a second heat dissipating channel 7335, and adjacent columns of heat dissipating fins 733 form a third heat dissipating channel 7337. The second heat dissipating channel 7335 and the third heat dissipating channel 7337 are perpendicular to each other. The width of the second heat dissipating surface 7333 is smaller than the width of the first heat dissipating surface 7331. The arrangement of the second heat dissipating channel 7335 and the third heat dissipating channel 7337 is related to the arrangement of the switch heat dissipating unit 71. The width of the second heat dissipating surface 7333 is smaller than the width of the first heat dissipating surface 7331 so that airflow primarily removes heat along the second heat dissipating channel 7335. Therefore, the second heat dissipating channel 7335 and the heat dissipating channel on the switch heat dissipating unit 71 must flow in the same direction.

[0027] Please refer to Figure 5 and Figure 6 The switch heat dissipation unit 71 includes a first heat dissipation fin 711 and a plurality of second heat dissipation fins 713. The first heat dissipation fin 711 is in close contact with one side of the switch 11 and can effectively conduct the heat generated when the switch 11 is working. The plurality of second heat dissipation fins 713 are vertically arranged on both sides of the first heat dissipation fin 711 and are perpendicular to the first heat dissipation fin 711 to increase the heat dissipation area and accelerate heat dissipation. In this embodiment, the first heat dissipation fin 711 is arranged parallel to the main circuit structure 1, the switch 11 is clamped between the main circuit structure 1 and the first heat dissipation fin 711, and the second heat dissipation fin 713 is arranged on the side away from the switch 11, providing a flexible structural design to adapt to different heat dissipation requirements. This arrangement is conducive to the disassembly and assembly between the first heat dissipation fin 711 and the switch 11. The two can be fixed by thermal conductive glue without the need for other fixing methods, and the heat conduction effect is better.

[0028] In another embodiment, the first heat dissipation fin 711 is arranged perpendicular to the main circuit structure 1, the switch 11 is attached to one side of the first heat dissipation fin 711, and the second heat dissipation fins 713 are evenly spaced on both sides of the first heat dissipation fin 711, further enhancing the heat dissipation effect.

[0029] It should be noted that the inverter 100 may be provided with multiple switch cooling units 71 at the same time, so different configurations of the first cooling fins 711 and the second cooling fins 713 may coexist in the inverter 100, that is, the switch cooling unit 71 may adopt two implementations at the same time, such as Figure 1 and Figure 6 As shown, the selection of the switch heat dissipation unit 71 corresponds to different embodiments, and there are many options, which are not specifically limited here.

[0030] Through the above design, the high-efficiency spatial heat dissipation module 7 can effectively provide sufficient heat dissipation for the switch 11 and the capacitor 13 components in the main circuit structure 1, avoiding equipment performance degradation or damage due to overheating. The switch heat dissipation unit 71 uses the first heat dissipation fins 711 or the second heat dissipation fins 713 arranged vertically to greatly increase the heat dissipation area, while the capacitor heat dissipation unit 73 achieves uniform and efficient heat dissipation of the capacitor 13 through the thermally conductive substrate 731 and the heat dissipation fins 733 arranged in a matrix. The design of the cross-flow baffle 735 further optimizes the air flow path of the capacitor heat dissipation unit 73, enhancing the overall heat dissipation effect.

[0031] In addition, the structural design of the utility model is simple and reasonable, easy to install, can adapt to inverters of different specifications, and can flexibly expand the scope of application through modular design, making it suitable for wide application in various industrial and consumer electronic devices.

[0032] Obviously, the present invention is not limited to the above-mentioned specific embodiments, and any changes or improvements made by ordinary technicians in this technical field based on the present invention should be included in the protection scope of the present invention.

Claims

1. A high-efficiency spatial heat dissipation module, installed in an inverter, to dissipate heat from a main circuit structure having switches and capacitors, characterized in that: include: A plurality of switch heat dissipation units are vertically arranged on the main circuit structure, and each of the switch heat dissipation units is arranged corresponding to the switch interval; and The capacitor heat dissipation unit is attached to the capacitor and located between the plurality of switch heat dissipation units.

2. The high-efficiency spatial heat dissipation module according to claim 1, characterized in that: The capacitor heat dissipation unit includes: a heat-conducting substrate, the heat-conducting substrate being bonded to the capacitor; and A plurality of heat dissipation fins are vertically arranged on the bottom of the heat-conducting substrate and arranged in a square matrix. The heat dissipation fins are spaced apart and form at least two mutually perpendicular heat dissipation channels.

3. The high-efficiency spatial heat dissipation module according to claim 2, characterized in that: The capacitor heat dissipation unit further includes a cross-flow baffle, which is vertically arranged at the bottom of the heat-conducting substrate and located between two adjacent rows of heat dissipation fins.

4. According to the high-efficiency spatial heat dissipation module of claim 3, the height of the cross-flow baffle is smaller than the heat dissipation fins, and the cross-flow baffle and the heat dissipation fins cooperate with each other to form a plurality of first heat dissipation channels.

5. The high-efficiency spatial heat dissipation module according to claim 2, characterized in that: The heat dissipation fins are cylindrical structures and are evenly spaced.

6. The high-efficiency spatial heat dissipation module according to claim 2, characterized in that: The heat dissipation fin is a rectangular parallelepiped structure, comprising: The first heat dissipation surface, the heat dissipation fins arranged in the same row, and the corresponding first heat dissipation surfaces are arranged in the same plane; and The second heat dissipation surface is perpendicular to the first heat dissipation surface, and the heat dissipation fins arranged in the same row are arranged in the same plane with the corresponding second heat dissipation surfaces.

7. The high-efficiency spatial heat dissipation module according to claim 6, characterized in that: The heat dissipation fins arranged in adjacent rows form a second heat dissipation channel, and the heat dissipation fins arranged in adjacent columns form a third heat dissipation channel. The second heat dissipation channel and the third heat dissipation channel are perpendicular to each other, and the width of the second heat dissipation surface is smaller than that of the first heat dissipation surface.

8. The high-efficiency spatial heat dissipation module according to claim 1, characterized in that: The switch heat dissipation unit includes: a first heat dissipation fin, the first heat dissipation fin being arranged in contact with the switch; and A plurality of second heat dissipation fins are evenly spaced apart from each other on the first heat dissipation fins and are perpendicular to the first heat dissipation fins.

9. The high-efficiency spatial heat dissipation module according to claim 8, characterized in that: The first heat dissipation fin is arranged perpendicular to the main circuit structure, the switch is arranged on one side of the first heat dissipation fin, and the second heat dissipation fin is arranged on both sides of the first heat dissipation fin; or The first heat dissipation fin is arranged parallel to the main circuit structure, the switch is clamped between the main circuit structure and the first heat dissipation fin, and the second heat dissipation fin is arranged on a side of the first heat dissipation fin away from the switch.

10. An inverter, characterized in that: include: A main circuit structure, wherein the main circuit structure is provided with a plurality of switches and capacitors; and According to the high-efficiency spatial heat dissipation module according to any one of claims 1 to 9, the switch heat dissipation unit and the capacitor heat dissipation unit are respectively arranged corresponding to the switch and the capacitor.

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