Cooling unit and vehicle

Abstract

The utility model relates to a cooling unit and a vehicle. The cooling unit comprises a liquid cooling circulation loop formed by connecting a plurality of liquid supply pumps, a heat exchanger, a cooling module and a flow resistance device in series; the processor is in communication connection with the flow resistance device and is configured to control the flow resistance device according to the flow of the liquid in the liquid cooling circulation loop, and the liquid supply pumps are connected in parallel and are configured to drive the liquid in the liquid cooling circulation loop to flow; the heat exchanger is configured to enable liquid in the liquid cooling circulation loop to exchange heat with equipment to be cooled; the cooling module is configured to cool liquid in the liquid cooling circulation loop; and the flow resistance device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor, so that the flow of the liquid in the liquid cooling circulation loop is within a working range under the condition that all the liquid supply pumps work normally and part of the liquid supply pumps break down. According to the invention, the occupied area of the pump can be reduced and the service life of the pump is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the field of refrigeration, and in particular to a cooling unit and a vehicle. Background Art

[0002] As communication technology advances, the heat density of various communication devices is also increasing. However, in some scenarios, the space available for cooling units to cool these devices is limited. For example, for mobile communication devices installed in vehicles, due to limited energy and space, it is necessary to maximize the space available for the communication equipment. In this case, the space available for cooling units is very limited and is easily interfered with by the communication equipment.

[0003] In addition, in order to ensure the long-term reliable operation of the cooling unit, it is necessary to consider the situation where the pump in the cooling unit fails and make alternative plans.

[0004] One alternative solution in the related art includes using a backup pump. For example, the cooling unit's pumps are configured with two working pumps and one backup pump, or one working pump and one backup pump. In the event of a working pump failure, the backup pump is used. This backup pump solution may complicate the piping structure or increase the size of the pump itself, taking up too much space and making it unsuitable for cooling mobile communication equipment in vehicles.

[0005] Another alternative solution in related art involves using bypass regulation, which involves employing multiple high-power pumps and including an additional bypass branch. This bypass branch is configured to divert liquid flow when the pumps are operating simultaneously; in the event of a pump failure, it disconnects and stops diversion, ensuring that the flow rate in the cooling unit meets normal operating requirements. This bypass regulation solution requires the pumps to operate at high power at all times, resulting in a reduced lifespan. Utility Model Content

[0006] In the related art, the pump in the cooling unit has problems such as occupying too much space and having a shortened lifespan.

[0007] In view of this, the present disclosure provides a cooling unit that can save installation space while ensuring the reliability of the cooling unit, and can reduce the operating load of a pump in the cooling unit and increase the life of the pump.

[0008] According to one aspect of some embodiments of the present disclosure, a cooling unit is provided, comprising: a liquid cooling circulation loop composed of a plurality of liquid supply pumps, a heat exchanger, a cooling module and a flow resistance device connected in series; a processor, communicatively connected to the flow resistance device and configured to control the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop, wherein: the plurality of liquid supply pumps are connected in parallel and configured to drive the flow of the liquid in the liquid cooling circulation loop; the heat exchanger is configured to exchange heat between the liquid in the liquid cooling circulation loop and the equipment to be cooled, and the inlet of the heat exchanger is fluidically connected to the outlet of the plurality of liquid supply pumps; the cooling module is configured to cool the liquid in the liquid cooling circulation loop, the inlet of the cooling module is fluidically connected to the outlet of the heat exchanger, and the outlet of the cooling module is fluidically connected to the inlet of the plurality of liquid supply pumps; the flow resistance device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor, so that when all the plurality of liquid supply pumps are operating normally and when some of the liquid supply pumps fail, the flow rate of the liquid in the liquid cooling circulation loop is within the operating range.

[0009] The technical solution in the embodiments of the present disclosure improves space utilization by eliminating the need for a backup pump, saving installation space for the cooling unit. A flow resistance device applies resistance to the liquid flowing in the cooling unit's liquid cooling circuit, reducing the flow rate output by the liquid supply pumps and thereby reducing the operating power of the multiple liquid supply pumps. This allows the multiple liquid supply pumps to operate at a lower load while all are functioning normally, thereby increasing their lifespan. Furthermore, by controlling the flow resistance device, the flow rate of the liquid in the cooling circuit can be maintained within the operating range, thereby ensuring the reliability of the cooling unit.

[0010] In some embodiments, the flow resistance device includes: a regulating valve with adjustable opening, configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by adjusting the opening according to the control of the processor; or a pipe section switching device, configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by allowing part of the liquid cooling circulation loop to be selectively connected to pipe sections with different diameters or different curvatures according to the control of the processor.

[0011] In the technical solutions of the embodiments disclosed herein, the flow resistance device can be implemented in the form of a regulating valve with adjustable opening or a pipe segment switching device. Specifically, by adjusting the opening of the regulating valve or adjusting the diameter or curvature of the pipe, the flow area of ​​the liquid can be changed or the flow of the liquid can be blocked, thereby applying resistance to the liquid flowing in the liquid cooling circuit. The resistance applied by the flow resistance device can control the flow rate of the liquid in the liquid cooling circuit.

[0012] In some embodiments, the liquid supply pump is a fixed frequency pump.

[0013] The technical solutions in the embodiments of the present disclosure utilize a fixed-frequency pump, thereby avoiding signal interference caused by a variable-frequency pump. Furthermore, the present disclosure utilizes a flow resistance device to control the flow rate of liquid in the liquid cooling circuit, eliminating the need for a variable-frequency pump. The technical solutions of the present disclosure also ensure the reliability of the cooling unit.

[0014] In some embodiments, the liquid cooling circulation loop also includes: a flow sensor, communicatively connected to the processor, configured to sense the flow of liquid in the liquid cooling circulation loop; and / or at least one pressure sensor, communicatively connected to the processor, configured to sense the pressure of the liquid in the liquid cooling circulation loop.

[0015] In the technical solution in the embodiment of the present disclosure, accurate measurement of the flow rate and / or pressure of the liquid in the liquid cooling circulation loop of the cooling unit can be achieved through a flow sensor and / or a pressure sensor, which facilitates control by the processor in the cooling unit.

[0016] In some embodiments, the at least one pressure sensor includes: a first pressure sensor located at an inlet of the heat exchanger; and / or a second pressure sensor located at an outlet of the plurality of liquid supply pumps.

[0017] In the technical solution of the embodiments disclosed herein, the first pressure sensor monitors the pressure of the liquid at the heat exchanger inlet, ensuring that the liquid flowing through the heat exchanger inlet does not exceed the safe pressure at the heat exchanger inlet, effectively protecting the relatively fragile interface. The second pressure sensor monitors the pressure of the liquid at the outlets of multiple liquid supply pumps, thereby accurately determining the operating status of the multiple liquid supply pumps.

[0018] In some embodiments, the liquid cooling circulation loop further includes: a bypass branch connected in parallel with the heat exchanger, configured to divert the liquid in the liquid cooling circulation loop when the pressure at the heat exchanger inlet is greater than a threshold.

[0019] In the technical solution in the embodiment of the present disclosure, through the bypass branch, the liquid in the liquid cooling circulation loop can be diverted when the pressure of the liquid at the heat exchanger inlet is close to the safety pressure of the heat exchanger inlet, thereby reducing the pressure of the liquid in the loop and protecting the heat exchanger inlet.

[0020] In some embodiments, the bypass branch includes a bypass valve, and the processor is in communication with the bypass valve and controls the bypass valve according to the pressure sensed by the first pressure sensor.

[0021] In the technical solution in the embodiment of the present disclosure, through the bypass valve and the control of the bypass valve by the processor, the bypass branch can be controlled to divert when the pressure sensed by the first pressure sensor is greater than the threshold, thereby achieving accurate control of the bypass branch and protecting the heat exchanger inlet.

[0022] In some embodiments, the liquid cooling circulation loop further includes: ball valves respectively connected to inlets and outlets of the plurality of liquid supply pumps; and flexible joints respectively connected between the plurality of liquid supply pumps and the ball valves.

[0023] In the technical solution of the embodiment of the present disclosure, by installing ball valves and flexible joints at both ends of the liquid supply pump, the connection between the liquid supply pump and other parts of the liquid cooling circulation loop can be effectively cut off when the liquid supply pump fails, thereby repairing the liquid supply pump and improving the convenience of the system.

[0024] In some embodiments, the liquid cooling circulation loop further includes: a one-way valve configured to allow the liquid in the liquid cooling circulation loop to flow in one direction.

[0025] By installing a one-way valve at the outlet of the liquid supply pump, it is possible to ensure that the liquid in the liquid cooling circulation loop flows in one direction, thereby preventing the liquid from flowing back into the liquid supply pump due to unexpected circumstances and causing damage.

[0026] According to one aspect of some other embodiments of the present disclosure, a vehicle is provided, comprising: a communication device; and the cooling unit as described above, configured to cool the communication device.

[0027] In the technical solution of the embodiment of the present disclosure, the cooling unit described above does not use a backup pump, which improves space utilization and saves installation space for the cooling unit. At the same time, when all multiple liquid supply pumps are working normally, multiple liquid supply pumps can be operated at a lower load, thereby increasing the life of the liquid supply pumps. In addition, by controlling the flow resistance device, the flow rate of the liquid in the liquid cooling circulation loop can be maintained within the working range, thereby ensuring the reliability of the cooling unit. The cooling unit described above is used for cooling communication equipment in a vehicle, which can save the vehicle's load energy while ensuring the effectiveness of cooling the communication equipment in the vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0029] The present disclosure can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0030] Figure 1 is a schematic structural diagram showing a cooling unit according to some embodiments of the present disclosure;

[0031] Figure 2 is a graph showing the power-flow relationship of a liquid supply pump according to some embodiments of the present disclosure;

[0032] Figure 3 is a diagram showing characteristic curves of a liquid supply pump and pipelines in a liquid cooling circulation loop according to some embodiments of the present disclosure;

[0033] Figure 4 is a schematic structural diagram showing a cooling unit according to other embodiments of the present disclosure;

[0034] Figure 5 is a flow chart illustrating a flow control method according to some embodiments of the present disclosure;

[0035] Figure 6 is a block diagram illustrating a computer system for implementing some embodiments of the present disclosure.

[0036] It should be understood that the size of each part shown in the drawings is not drawn according to the actual proportional relationship.In addition, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0037] Various embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the embodiments is merely illustrative and is in no way intended to limit the present disclosure, its application, or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps described in these embodiments should be interpreted as being merely illustrative and not as limiting.

[0038] The terms "first," "second," and similar terms used in this disclosure do not denote any order, quantity, or importance, but are merely used to distinguish between different parts. Terms such as "include" and "comprise" mean that the elements preceding the term include the elements listed after the term, and do not exclude the possibility of also including other elements.

[0039] It should also be understood that any component, data or structure mentioned in the embodiments of the present disclosure can generally be understood as one or more, unless explicitly limited or otherwise indicated in the context.

[0040] All terms (including technical or scientific terms) used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in, for example, commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or highly formal sense, unless explicitly defined as such herein.

[0041] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0042] In the related art, the cooling unit has the problem that the pump occupies too large an area or the pump life is shortened.

[0043] In view of this, the present disclosure proposes a cooling unit that can avoid the above problems.

[0044] First, combine Figure 1 Some embodiments of the cooling unit in the present disclosure are described. Figure 1 Schematic diagram showing the structure of a cooling unit according to some embodiments of the present disclosure. Figure 1 As shown, the cooling unit 1 includes: a liquid cooling circulation loop 10, which is composed of multiple liquid supply pumps, heat exchangers, cooling modules and flow resistance devices connected in series; a processor 20, which is communicated with the flow resistance device and is configured to control the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop.

[0045] The liquid cooling circulation loop 10 includes: a plurality of liquid supply pumps 11 ; a heat exchanger 12 ; a cooling module 13 ; and a flow resistance device 14 .

[0046] The plurality of liquid supply pumps 11 are connected in parallel and configured to drive the liquid in the liquid cooling circulation loop to flow, in other words, to provide power for the liquid in the liquid cooling circulation loop. The liquid supply pump 11 can be a pump such as a centrifugal pump.

[0047] In some embodiments, the liquid supply pump 11 is a fixed-frequency pump. In the above embodiments, the use of a fixed-frequency pump can avoid signal interference caused by a variable-frequency pump. Furthermore, the disclosed technical solution utilizes a flow resistance device to control the flow rate of the liquid in the liquid cooling circuit, eliminating the need for a variable-frequency pump and ensuring the reliability of the cooling unit.

[0048] The power-flow relationship of the liquid supply pump 11 is as follows: Figure 2 shown. Figure 2 is a diagram showing the power-flow relationship of the liquid supply pump according to some embodiments of the present disclosure. Figure 2 It can be seen that the power and flow rate of the liquid supply pump 11 are positively correlated, that is, the greater the flow rate flowing through the liquid supply pump 11 , the greater the power of the liquid supply pump 11 .

[0049] The heat exchanger 12 is configured to exchange heat between the liquid in the liquid cooling loop and the device to be cooled. The inlet of the heat exchanger is in fluid communication with the outlets of the plurality of liquid supply pumps 11. The heat exchanger 12 can be, for example, a plate heat exchanger, a heat pipe heat exchanger, or the like, and can cool the device to be cooled using the cooling liquid in the liquid cooling loop.

[0050] In some embodiments, the device to be cooled may be a communication device in a vehicle.

[0051] The cooling module 13 is configured to cool the liquid in the liquid cooling loop. The inlet of the cooling module 13 is in fluid communication with the outlet of the heat exchanger 12, and the outlet of the cooling module 13 is in fluid communication with the inlets of the plurality of liquid supply pumps 11. The cooling module 13 can be a device capable of cooling the liquid, such as an electric refrigerator, a chemical refrigerator, or a heat exchanger.

[0052] The flow resistance device 14 is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor 20, so that when all multiple liquid supply pumps 11 are operating normally and when some liquid supply pumps fail, the flow rate of the liquid in the liquid cooling circulation loop is within the working range.

[0053] In some embodiments, the flow resistance device 14 includes a regulating valve with adjustable opening, and is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by adjusting the opening according to the control of the processor 20.

[0054] Specifically, when the flow resistance device 14 includes a regulating valve with adjustable opening, the opening of the regulating valve can be adjusted to change the passage area of ​​the liquid, thereby applying resistance to the liquid flowing in the liquid cooling circulation loop.

[0055] In other embodiments, the flow resistance device 14 includes a pipe segment switching device, which is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by selectively connecting part of the liquid cooling circulation loop to pipe segments with different pipe diameters or different curvatures according to the control of the processor 20.

[0056] Specifically, when the flow resistance device 14 includes a pipe section switching device, the flow of liquid can be blocked by adjusting the pipe diameter or curvature of the pipeline, thereby applying resistance to the liquid flowing in the liquid cooling circulation loop.

[0057] The above first introduces the implementation of the flow resistance device 14, which shows that the flow resistance device 14 can apply resistance to the liquid flowing in the liquid cooling circulation loop. Figure 3 This paper introduces how the resistance exerted by a flow resistance device on a liquid affects the flow rate of the liquid. Figure 3is a diagram illustrating characteristic curves of a liquid supply pump and pipelines in a liquid cooling circulation loop according to some embodiments of the present disclosure.

[0058] like Figure 3 As shown, curve 31 is the characteristic curve when a single liquid supply pump is working, curve 32 is the characteristic curve when two liquid supply pumps are working in parallel, curve 33 is the characteristic curve of the pipeline of the liquid cooling circulation loop when the flow resistance device does not apply resistance to the liquid flowing in the liquid cooling circulation loop, and curve 34 is the characteristic curve of the pipeline of the liquid cooling circulation loop when the flow resistance device applies resistance to the liquid flowing in the liquid cooling circulation loop.

[0059] The characteristic curve of the liquid supply pump depicts the relationship between the flow rate of liquid flowing through the pump and the pressure it provides to the liquid. For example, point A on curve 31 indicates that when the flow rate of liquid in the liquid cooling circuit is Q1, the pressure provided by the single liquid supply pump is P1. The characteristic curve of the liquid supply pump reflects the pump's head at different flow rates.

[0060] The aforementioned pipeline characteristic curve represents the relationship between the flow rate of liquid in the pipeline and the required pressure of the liquid. For example, point B on curve 33 indicates that when the flow resistance device does not apply resistance to the liquid flowing in the liquid cooling circuit, the liquid requires a pressure of P2 to achieve a flow rate of Q2 in the pipeline. The pipeline characteristic curve reflects the resistance within the pipeline, including internal resistance such as friction and / or resistance applied by the flow resistance device to the liquid.

[0061] The intersection of the above characteristic curves means that at a specific flow rate, the pressure provided by the liquid supply pump to the liquid is consistent with the pressure required for the liquid to flow in the pipeline. Taking point C as an example, the meaning of intersection C is that when the liquid flow rate is Q3, according to curve 34, the liquid requires a pressure of P3, while according to curve 32, the flow rate provided by a single liquid supply pump to the liquid is P3, which just meets the requirement. Therefore, when the flow resistance device does not apply resistance to the liquid flowing in the liquid cooling circulation loop and a single liquid supply pump is working, the liquid flow rate is Q3. Therefore, in actual operation, the intersection of the characteristic curves is the operating condition point of the liquid cooling circulation loop.

[0062] from Figure 3 It can be seen that the resistance exerted by the flow resistance device on the liquid will cause the characteristic curve of the pipeline to change from curve 33 to curve 34. As mentioned above, the operating point of the liquid cooling circulation loop is the intersection of the characteristic curve of the liquid supply pump and the characteristic curve of the pipeline. Therefore, as the flow resistance device exerts resistance on the liquid, the flow rate of the liquid in the liquid cooling circulation loop will also decrease.

[0063] In some embodiments, the operating range of the liquid flow in the liquid cooling circulation loop is within a certain range of the rated flow of the heat exchanger, for example, 80% to 120% of the rated flow, thereby ensuring the normal operation of the heat exchanger, that is, the normal cooling operation of the cooling equipment.

[0064] According to the above principle, the flow resistance device 14 in the present disclosure ensures that the flow rate of the liquid in the liquid cooling circulation loop is within the working range when all the multiple liquid supply pumps 11 are working normally and when some of the liquid supply pumps fail. That is, the flow rate corresponding to the intersection of the characteristic curve when all the liquid supply pumps are working normally and the characteristic curve when some of the liquid supply pumps fail with the characteristic curve of the pipeline is within the working range.

[0065] For example, in Figure 3 In the corresponding embodiment, the rated flow is Q0, and the operating range is 80% to 120% of the rated flow, that is, Figure 3 The dashed line range in FIG. When all the liquid supply pumps are operating normally, the characteristic curve of the liquid supply pump is curve 32. Controlling the flow resistance device to apply resistance to the liquid can make the operating condition point be point C, which is within the operating range. When one of the liquid supply pumps fails, the characteristic curve of the liquid supply pump becomes curve 31. Controlling the flow resistance device to reduce the resistance applied to the liquid can make the operating condition point, for example, become point D, which is also within the operating range.

[0066] In some embodiments, the processor 20 controls the flow resistance device 14 according to the flow rate of the liquid in the liquid cooling circulation loop, including: when the flow rate of the liquid in the liquid cooling circulation loop is greater than the working range, controlling the flow resistance device to increase the flow resistance of the liquid in the liquid cooling circulation loop; when the flow rate of the liquid in the liquid cooling circulation loop is less than the working range, controlling the flow resistance device to reduce the flow resistance of the liquid in the liquid cooling circulation loop.

[0067] In the above embodiment, a method for the processor 20 to specifically control the flow resistance device 14 is provided based on the principle of the flow resistance device. By adjusting the resistance applied by the flow resistance device as described above according to the flow rate of the liquid in the liquid cooling circulation loop, the flow rate of the liquid in the liquid cooling circulation loop can be controlled, and the flow rate of the liquid can be controlled within the working range.

[0068] In some embodiments, the processor may control the flow resistance of the liquid in the liquid cooling circuit by a certain amount. For example, the resistance provided by the flow resistance device may be adjusted by 1%. Specifically, if the flow resistance device includes a regulating valve with an adjustable opening, the opening of the regulating valve may be adjusted by 1% to adjust the resistance provided by the flow resistance device.

[0069] By performing the adjustment at a certain amplitude as described above, the flow rate of the liquid in the liquid cooling circulation loop can be controlled more quickly or more accurately based on the preset amplitude, thereby improving the control efficiency of the processor.

[0070] After the above adjustment, when all the liquid supply pumps are operating normally, the flow resistance device applies a first resistance to the liquid in the liquid cooling circulation loop; when some of the liquid supply pumps fail, the flow resistance device applies a second resistance or no resistance to the liquid in the liquid cooling circulation loop, and the second resistance is smaller than the first resistance.

[0071] By applying the first resistance and the second resistance, or applying no resistance, in both cases, the liquid flow rate can be maintained within the operating range. Furthermore, when all liquid supply pumps are operating normally, the flow rate provided by the liquid supply pumps is reduced by the resistance provided. Because the power of the liquid supply pump is positively correlated with the flow rate through the liquid supply pump, the flow rate control in the disclosed embodiments can reduce the power of the liquid supply pumps when all liquid supply pumps are operating normally, thereby increasing the service life of the liquid supply pumps.

[0072] Based on the above processor control, further refinement can be performed. In some embodiments, the operating range includes a flow rate range from a first flow rate to a second flow rate, where the second flow rate is greater than the first flow rate. In other words, the first flow rate is the lower limit of the operating range, and the second flow rate is the upper limit of the operating range.

[0073] The control of the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop further includes: when all of the multiple liquid supply pumps are operating normally and the flow rate of the liquid in the liquid cooling circulation loop is greater than the second flow rate, controlling the flow resistance device to increase the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of the liquid in the liquid cooling circulation loop is less than or equal to the second flow rate;

[0074] When some liquid supply pumps fail and the flow rate of liquid in the liquid cooling circulation loop is less than the first flow rate, the flow resistance device is controlled to reduce the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of liquid in the liquid cooling circulation loop is greater than or equal to the first flow rate.

[0075] Through the above control, it is possible to achieve the following: when all the liquid supply pumps are operating normally and the flow rate they provide is greater than the upper limit of the operating range, i.e., the second flow rate, the flow rate can be controlled to be at or below the second flow rate by controlling the flow resistance device; and when some of the liquid supply pumps fail and the flow rate provided by the remaining liquid supply pumps is less than the lower limit of the operating range, i.e., the first flow rate, the flow rate can be controlled to be at or above the first flow rate by controlling the flow resistance device. The above control can ensure the operation of the cooling unit and improve the reliability of the cooling unit.

[0076] For example, in Figure 3In the illustrated embodiment, the first flow rate is the lower limit of the working range, ie, 80% of the rated flow rate Q0, and the second flow rate is the upper limit of the working range, ie, 120% of the rated flow rate Q0.

[0077] If all liquid supply pumps operate normally, without the resistance imposed by the flow resistance device, the operating point of the liquid cooling circulation pipeline would be the intersection of curves 32 and 33. The flow rate provided by multiple liquid supply pumps would exceed the upper limit of the operating range, resulting in failure. Therefore, by increasing the flow resistance of the flow resistance device, the pipeline characteristic curve is changed, and the operating point is changed to the intersection C of curves 32 and 34. In other words, the flow rate of the liquid cooling circulation pipeline is controlled at Q3, which is less than 120% of Q0, ensuring the operation of the cooling unit.

[0078] Similarly, if some of the liquid supply pumps fail, without reducing the resistance applied by the flow resistance device, the operating point of the liquid cooling circulation pipeline will be the intersection of curves 31 and 34, and the flow rate provided by the remaining liquid supply pumps will be less than the lower limit of the operating range. Therefore, by reducing the resistance of the flow resistance device, the pipeline characteristic curve is changed, and the operating point is changed to the intersection D of curves 31 and 34. In other words, the flow rate of the liquid cooling circulation pipeline is controlled at Q4, which is greater than 80% of Q0, and the operation of the cooling unit can be guaranteed.

[0079] In some embodiments, the working range includes a third flow rate, which is greater than the first flow rate and less than the second flow rate. Controlling the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop also includes: when all the multiple liquid supply pumps are working normally, controlling the flow resistance device so that the difference between the flow rate of the liquid in the liquid cooling circulation loop and the third flow rate is less than a threshold value.

[0080] The above-mentioned third flow rate can be, for example, the rated flow rate Q0 of the heat exchanger, and the threshold value of the above-mentioned difference is, for example, 5% of Q0. By further setting the third flow rate and controlling the flow rate in the liquid cooling circulation loop to be near the third flow rate, that is, in the range of 95% to 105% of the rated flow rate, the heat exchanger can have a higher working efficiency while avoiding the waste of excess flow, thereby improving the working efficiency of the cooling unit under normal working conditions.

[0081] Based on the above Figure 1-3 Introducing some basic embodiments and operating principles of the present disclosure, the following will be based on Figure 4 Some further embodiments of the present disclosure are introduced. Figure 4 2 is a schematic structural diagram showing a cooling unit according to other embodiments of the present disclosure.

[0082] like Figure 4As shown, in some embodiments of the present disclosure, the liquid cooling circulation loop 10 further includes: a flow sensor 15, which is communicatively connected to the processor 20 and configured to sense the flow of the liquid in the liquid cooling circulation loop; and / or at least one pressure sensor 16, which is communicatively connected to the processor 20 and configured to sense the pressure of the liquid in the liquid cooling circulation loop.

[0083] The flow sensor 15 and the pressure sensor 16 can accurately measure the flow and pressure of the liquid in the liquid cooling circulation loop 10, which facilitates the processor 20 to perform corresponding control, including the processor controlling the flow resistance device 14 according to the flow of the liquid in the liquid cooling circulation loop.

[0084] In some embodiments, the at least one pressure sensor 16 includes: a first pressure sensor 161 located at the inlet of the heat exchanger; and / or a second pressure sensor 162 located at the outlets of the plurality of liquid supply pumps.

[0085] The first pressure sensor 161 can monitor the pressure of the liquid at the heat exchanger inlet, ensuring that the liquid flowing through the heat exchanger inlet does not exceed the safety pressure of the heat exchanger inlet, thereby effectively protecting the more fragile interface.

[0086] By means of the second pressure sensor 162 , it is possible to monitor the pressure of the liquid at the outlets of the plurality of liquid supply pumps, thereby accurately determining the working status of the plurality of liquid supply pumps.

[0087] For example, the processor 20 can determine whether there is a fault in multiple liquid supply pumps based on the pressure sensed by the second pressure sensor 162. Specifically, when a liquid supply pump fails, it will cause insufficient pressure of the liquid at the outlet of the liquid supply pump. Through real-time sensing of the second pressure sensor 162, the processor can make timely and accurate judgments on the above situation.

[0088] like Figure 4 As shown, the liquid cooling circulation loop 10 may further include: a bypass branch 100 connected in parallel with the heat exchanger 12, configured to divert the liquid in the liquid cooling circulation loop when the pressure at the inlet of the heat exchanger 12 is greater than a threshold.

[0089] By means of the bypass branch 100 , the liquid in the liquid cooling circulation loop can be diverted when the pressure of the liquid at the heat exchanger inlet is close to the safety pressure of the heat exchanger inlet, thereby reducing the pressure of the liquid in the loop and protecting the heat exchanger inlet.

[0090] In some embodiments, the bypass branch 100 includes a bypass valve 101 . The processor 20 is in communication with the bypass valve 101 and controls the bypass valve according to the pressure sensed by the first pressure sensor.

[0091] The bypass valve controls the flow of liquid through the bypass branch. When the first pressure sensor detects that the pressure at the heat exchanger inlet is greater than a threshold, the processor controls the bypass valve to divert the liquid. This configuration enables accurate control of the bypass branch, thereby protecting the heat exchanger inlet.

[0092] like Figure 4 As shown, the liquid cooling circulation loop 10 may further include: a ball valve 17 connected to the inlet and outlet of the plurality of liquid supply pumps 11 ; and a flexible joint 18 connected between the plurality of liquid supply pumps 11 and the ball valve 17 .

[0093] By installing ball valves and flexible joints at both ends of the liquid supply pump, the connection between the liquid supply pump and other parts of the liquid cooling circulation loop can be effectively cut off when the liquid supply pump fails, so that the liquid supply pump can be repaired, which improves the convenience of the system.

[0094] like Figure 4 As shown, the liquid cooling circulation loop 10 may further include: a one-way valve 19 , which is respectively connected to the outlets of the plurality of liquid supply pumps 11 .

[0095] By installing a one-way valve at the outlet of the liquid supply pump, it is possible to ensure that the liquid in the liquid cooling circulation loop flows in one direction, thereby preventing the liquid from flowing back into the liquid supply pump due to unexpected circumstances and causing damage.

[0096] The above describes the cooling unit and its operation process according to some embodiments of the present disclosure. The cooling unit proposed in the present disclosure can avoid the problem of excessive pump occupation area or reduced pump life under the premise of ensuring reliability. Figure 5 The flow control method proposed in the present disclosure and applied to the cooling unit described above is introduced.

[0097] Figure 5 FIG. 1 is a flow chart illustrating a flow control method according to some embodiments of the present disclosure. Figure 5 As shown, the flow control method includes steps S51 to S52.

[0098] In step S51, the flow rate of the liquid in the liquid cooling circulation loop is determined. Before controlling the flow resistance device, the processor determines the flow rate of the liquid in the liquid cooling circulation loop.

[0099] In step S52, the flow resistance device is controlled according to the flow rate of the liquid in the liquid cooling circulation loop to apply resistance to the liquid flowing in the liquid cooling circulation loop, so that the flow rate of the liquid in the liquid cooling circulation loop is within the working range when all multiple liquid supply pumps are operating normally and when some liquid supply pumps fail.

[0100] In the technical solution of the embodiments disclosed herein, by determining the liquid flow rate and then controlling the cooling unit as described above, the liquid flow rate in the liquid cooling circulation loop can be maintained within the operating range, thereby ensuring the reliability of the cooling unit. Furthermore, the cooling unit as described above does not utilize a backup pump, thereby improving space utilization and saving installation space for the cooling unit. Furthermore, when all multiple liquid supply pumps are operating normally, the multiple liquid supply pumps can operate at a lower load, thereby increasing the lifespan of the liquid supply pumps.

[0101] Figure 6 is a block diagram illustrating a computer system for implementing some embodiments of the present disclosure.

[0102] like Figure 6 As shown, the computer system 6 may be in the form of a general-purpose computing device. The computer system 6 includes a memory 61, a processor 62, and a bus 60 that connects the various system components.

[0103] The memory 61 can be various forms of computer-readable storage media, including, for example, system memory and non-volatile storage media. System memory, for example, stores an operating system, application programs, a boot loader, and other programs. System memory can include volatile storage media, such as random access memory (RAM) and / or cache memory. Non-volatile storage media, for example, stores instructions for executing corresponding embodiments of the flow control method. Non-volatile storage media include, but are not limited to, disk storage, optical storage, and flash memory.

[0104] The processor 62 may be implemented using a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, or discrete hardware components such as discrete gates or transistors. Accordingly, each module may be implemented by a central processing unit (CPU) executing instructions in memory that execute corresponding steps, or by dedicated circuits that execute corresponding steps.

[0105] The bus 60 may utilize any of a variety of bus architectures, including, but not limited to, an Industry Standard Architecture (ISA) bus, a Micro Channel Architecture (MCA) bus, and a Peripheral Component Interconnect (PCI) bus.

[0106] The computer system 6 may also include an input / output interface 63, a network interface 64, a storage interface 65, and the like. These interfaces 63, 64, and 65, as well as the memory 61 and the processor 62, may be connected via a bus 60. The input / output interface 63 provides a connection interface for input / output devices such as a display, mouse, and keyboard. The network interface 64 provides a connection interface for various networked devices. The storage interface 65 provides a connection interface for external storage devices such as floppy disks, USB flash drives, and SD cards.

[0107] According to embodiments of the present disclosure, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, some embodiments of the present disclosure include a computer program product that, when executed on a computer, causes the computer to implement the flow control method described in any of the aforementioned embodiments. The computer program product includes a computer program carried on a computer-readable medium, the computer program containing program code for executing the method shown in the flowchart.

[0108] An embodiment of the present disclosure further provides a vehicle, comprising a communication device; and the cooling unit as described above, configured to cool the communication device.

[0109] As previously mentioned, the cooling unit described above does not utilize a backup pump, thereby improving space utilization and saving installation space. Furthermore, it also allows the multiple liquid supply pumps to operate at a lower load, extending their lifespan, provided all are functioning properly. Furthermore, by controlling the flow resistance device, the liquid flow rate in the liquid cooling circuit is maintained within the operating range, ensuring the reliability of the cooling unit.

[0110] The cooling unit as described above is used for cooling communication equipment in a vehicle, thereby saving space in the vehicle.

[0111] The specific type of the vehicle in the embodiments of the present disclosure is not limited, for example, it can be a sedan, an SUV, a van, a sports car or a special-purpose vehicle, etc.

[0112] Thus far, various embodiments of the present disclosure have been described in detail. To avoid obscuring the concept of the present disclosure, some details known in the art have not been described. Based on the above description, those skilled in the art can fully understand how to implement the technical solutions disclosed herein.

[0113] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art will understand that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. Those skilled in the art will understand that the above embodiments may be modified or some technical features may be replaced with equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A cooling unit, characterized in that: include: A liquid cooling circulation loop consisting of multiple liquid supply pumps, heat exchangers, cooling modules and flow resistance devices connected in series; a processor, in communication with the flow resistance device, configured to control the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop, wherein: The plurality of liquid supply pumps are connected in parallel and configured to drive the flow of liquid in the liquid cooling circulation loop; The heat exchanger is configured to exchange heat between the liquid in the liquid cooling circulation loop and the equipment to be cooled, and the inlet of the heat exchanger is in fluid communication with the outlets of the plurality of liquid supply pumps; The cooling module is configured to cool the liquid in the liquid cooling circulation loop, the inlet of the cooling module is in fluid communication with the outlet of the heat exchanger, and the outlet of the cooling module is in fluid communication with the inlets of the plurality of liquid supply pumps; The flow resistance device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor, so that the flow rate of the liquid in the liquid cooling circulation loop is within the working range when all the multiple liquid supply pumps are operating normally and when some of the liquid supply pumps fail.

2. The cooling unit according to claim 1, characterized in that: The flow resistance device comprises: a regulating valve with adjustable opening, configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by adjusting the opening according to the control of the processor; or The pipe section switching device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by selectively connecting part of the liquid cooling circulation loop to pipe sections with different pipe diameters or different curvatures according to the control of the processor.

3. The cooling unit according to claim 1, characterized in that: The liquid supply pump is a fixed frequency pump.

4. The cooling unit according to claim 1, characterized in that: The liquid cooling circulation loop also includes: a flow sensor, communicatively connected to the processor and configured to sense the flow of liquid in the liquid cooling circulation loop; and / or At least one pressure sensor is communicatively connected to the processor and configured to sense the pressure of the liquid in the liquid cooling circulation loop.

5. The cooling unit according to claim 4, characterized in that: The at least one pressure sensor comprises: a first pressure sensor located at the inlet of the heat exchanger; and / or A second pressure sensor is located at the outlet of the plurality of liquid supply pumps.

6. The cooling unit according to claim 5, characterized in that: The liquid cooling circulation loop also includes: The bypass branch is connected in parallel with the heat exchanger and is configured to divert the liquid in the liquid cooling circulation loop when the pressure at the inlet of the heat exchanger is greater than a threshold.

7. The cooling unit according to claim 6, characterized in that: The bypass branch includes a bypass valve. The processor is in communication with the bypass valve and controls the bypass valve according to the pressure sensed by the first pressure sensor.

8. The cooling unit according to claim 1, characterized in that: The liquid cooling circulation loop also includes: ball valves, respectively connected to the inlets and outlets of the plurality of liquid supply pumps; Flexible joints are respectively connected between the plurality of liquid supply pumps and the ball valves.

9. The cooling unit according to claim 1, wherein: The liquid cooling circulation loop also includes: The one-way valve is configured to allow the liquid in the liquid cooling circulation loop to flow in one direction.

10. A vehicle comprising: communications equipment; The cooling unit according to any one of claims 1 to 9, configured to cool the communication equipment.

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