Circuit board assembly and electronic equipment

Abstract

The utility model discloses a circuit board assembly and electronic equipment, and relates to the technical field of electronic products. The circuit board assembly comprises a circuit board, an electric appliance element, a shielding cover and a conductive cover body, wherein the electric appliance element is arranged on a first end face of the circuit board; the shielding cover is buckled on the first end face of the circuit board, the electrical component is contained in the shielding cover, and a first through hole is formed in the area, corresponding to the electrical component, of the shielding cover; the conductive cover body is buckled with the shielding case, and the conductive cover body blocks the first through hole; and the conductive cover body is positioned on one side, far away from the circuit board, of the conductive cover body.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] With the application of the fifth generation (5G) mobile communication technology, in order to improve the performance of electronic devices such as mobile phones, protect the devices from interference from external signals, and prevent electromagnetic waves inside the devices from interfering with the outside world, a shielding cover is usually designed on the motherboard inside the electronic device to reduce the impact of electromagnetic interference on the circuit inside the electronic device. When the height of the electrical components installed inside the shielding cover is higher than the height of the space inside the shielding cover, it is usually necessary to open a hole in the shielding cover to avoid the electrical components with higher height dimensions. The hole area of ​​the shielding cover usually needs to be covered with copper foil, and conductive foam needs to be filled between the copper foil and the middle frame to press the copper foil toward the side of the shielding cover.

[0003] In this shielding structure, since the shielding cover, copper foil and conductive foam are usually stacked in sequence along the thickness direction of the electronic device, it is easy to cause the shielding structure to occupy a large thickness space, which is not conducive to the lightweight and thinning of the electronic device. Utility Model Content

[0004] The present application provides a circuit board assembly and an electronic device, which are beneficial to reducing the thickness space of the electronic device required to be occupied by the shielding structure, so as to achieve lightweight and thin electronic equipment.

[0005] In a first aspect, the present application provides a circuit board assembly, comprising:

[0006] circuit boards;

[0007] an electrical component, the electrical component being disposed on the first end surface of the circuit board;

[0008] a shielding cover, the shielding cover being buckled onto the first end surface of the circuit board, the electrical component being accommodated in the shielding cover, and a first through hole being formed in an area of ​​the shielding cover corresponding to the electrical component;

[0009] a conductive cover, the conductive cover being engaged with the shielding cover and sealing the first through hole;

[0010] Wherein, the conductive cover is located on a side of the conductive cover away from the circuit board.

[0011] In a second aspect, the present application provides an electronic device comprising the circuit board assembly described in the first aspect.

[0012] In the embodiment of the present application, since the conductive cover is buckled with the shielding cover, there is no need to fill conductive foam on the side of the conductive cover facing away from the shielding cover, which is beneficial to reducing the thickness space of the electronic device required for the shielding structure to achieve lightweight and thin electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is one of the cross-sectional schematic diagrams of the circuit board assembly provided in the embodiment of the present application;

[0014] Figure 2 yes Figure 1 A cross-sectional view of the circuit board assembly in a direction perpendicular to the paper;

[0015] Figure 3 This is one of the top views of the circuit board assembly provided in the embodiment of the present application;

[0016] Figure 4 This is the second top view of the circuit board assembly provided in an embodiment of the present application;

[0017] Figure 5 This is the second cross-sectional schematic diagram of the circuit board assembly provided in an embodiment of the present application;

[0018] Figure 6 This is the third cross-sectional schematic diagram of the circuit board assembly provided in an embodiment of the present application;

[0019] Figure 7 This is the fourth cross-sectional schematic diagram of the circuit board assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0021] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0022] Below, in conjunction with the accompanying drawings, a circuit board assembly and an electronic device provided in an embodiment of the present application are described in detail through specific embodiments and their application scenarios.

[0023] See Figure 1-7 , Figure 1-7 A schematic structural diagram of a circuit board assembly provided in an embodiment of the present application, the circuit board assembly comprising:

[0024] Circuit board 100;

[0025] An electrical component 200 , the electrical component 200 being disposed on the first end surface 101 of the circuit board 100 ;

[0026] A shielding cover 300 is buckled onto the first end surface 101 of the circuit board 100, and the electrical component 200 is accommodated in the shielding cover 300. A first through hole 340 is formed in the area of ​​the shielding cover corresponding to the electrical component;

[0027] a conductive cover 400 , wherein the conductive cover 400 is engaged with the shielding cover 300 and blocks the first through hole 340 ;

[0028] The conductive cover 400 is located on a side of the conductive cover 400 away from the circuit board 100 .

[0029] See Figure 1 In some embodiments of the present application, the shielding cover 300 may include an open end, and the shielding cover 300 is buckled onto the first end surface 101 of the circuit board 100 through the open end, and the electrical component 200 is accommodated in the shielding cover 300. The first through hole 340 may be defined in the first wall panel 310 of the shielding cover 300, and the first wall panel 310 is the top wall or top panel of the shielding cover 300.

[0030] The circuit board assembly can be an assembly formed by a circuit board 100 and devices installed in the circuit board 100 in various electronic products, wherein the circuit board 100 can be a mainboard in an electronic device or a frame board stacked with the mainboard.

[0031] The above electrical component 200 can be various electrical components 200 that can generate electromagnetic interference. For example, it can be a Central Processing Unit (CPU) 500, a Double Data Rate Synchronous Dynamic Random Access Memory (DDR), various switching devices, diodes, and non-linear passive components, etc. In some embodiments of the present application, the electrical component 200 can be a DDR. In this way, the DDR interference to the components outside the shielding cover 300 can be reduced.

[0032] The above shielding cover 300 can be various shielding covers 300 with electromagnetic shielding functions. For example, it can be various metal shielding covers 300. In addition, with the improvement of material technology and process technology, a three-dimensional (3D) shielding film material can also be used to replace the shielding cover 300 in the embodiments of the present application to achieve a better shielding effect, so that the thickness of the electronic product can be made extremely thin.

[0033] The fastening method between the above conductive cover 400 and the shielding cover 300 can be by snap fastening, or it can also be by interference fit. Among them, the above conductive cover 400 can be fastened to the first wall plate 310 of the shielding cover 300, or the conductive cover 400 can also be fastened to the side wall of the shielding cover 300.

[0034] In this embodiment, since the conductive cover 400 is fastened to the shielding cover 300, there is no need to fill conductive foam on the side of the conductive cover 400 away from the shielding cover 300, which is beneficial to reducing the thickness space of the electronic device occupied by the shielding structure to achieve the lightness and thinness of the electronic device.

[0035] Optionally, the conductive cover 400 is in the shape of "冖".

[0036] Please refer to Figure 1, in some embodiments of the present application, the conductive cover 400 is in the shape of "冖", where the shape of "冖" can also be referred to as an arch shape. Compared with setting the outer shape of the conductive cover 400 to be the same as that of the shielding case 300, in some application scenarios, in order to adapt to the shape of the installation space of the scene, the shielding case 300 is designed to be an irregular shape, that is, it is designed to be a special shape. At this time, if the outer shape of the conductive cover 400 is set to be the same as that of the shielding case 300, it may cause problems such as difficulty in fastening the conductive cover 400 to the shielding case 300 or poor fastening effect. Among them, when the fastening effect between the conductive cover 400 and the shielding case 300 is poor, there may be a gap between the conductive cover 400 and the shielding case 300. At this time, the interference signal generated by the DDR inside the shielding case 300 is likely to propagate outside the shielding case 300 through the gap between the conductive cover 400 and the shielding case 300, thereby causing DDR interference. Based on this, in the embodiments of the present application, the conductive cover 400 is set to be in the shape of "冖", that is, the shape of the conductive cover 400 does not need to be the same as that of the shielding case 300. In this way, it is convenient to fasten the conductive cover 400 to the shielding case 300 and improve the fastening effect between the conductive cover 400 and the shielding case 300.

[0037] In this embodiment, since the conductive cover 400 is in the shape of "冖", that is, the shape of the conductive cover 400 does not need to be the same as that of the shielding case 300, when the shape of the shielding case 300 is an irregular shape, it is also convenient to fasten the conductive cover 400 to the shielding case 300.

[0038] Optionally, both ends of the conductive cover 400 are fastened to two opposite side surfaces of the shielding case 300; or, both ends of the conductive cover 400 are fastened to the edge of the first through hole 340.

[0039] Specifically, when the conductive cover 400 is in the shape of "冖" and both ends of the conductive cover 400 need to be fastened to two opposite side surfaces of the shielding case 300, the conductive cover 400 can be transversely or vertically spanned across one end of the shielding case 300 away from the circuit board 100. Please refer to Figure 3 , which shows that the conductive cover 400 can be transversely spanned across one end of the shielding case 300 away from the circuit board 100. Please refer to Figure 4 , which shows that the conductive cover 400 can be vertically spanned across one end of the shielding case 300 away from the circuit board 100.

[0040] Please refer to Figure 1, in some embodiments of the present application, the conductive cover 400 is in the shape of "冖", and the conductive cover 400 straddling the end of the shielding cover 300 away from the circuit board 100 specifically means that: the end of the shielding cover 300 away from the circuit board 100 is embedded inside the conductive cover 400, and the end of the shielding cover 300 away from the circuit board 100 and its two opposite outer side walls are respectively in contact with the three inner walls of the conductive cover 400, so that the inner wall of the conductive cover 400 opposite to the first wall plate 310 closes the first through hole 340.

[0041] Please refer to Figure 5-7 , in some other embodiments of the present application, when the two ends of the conductive cover 400 are buckled to the edge of the first through hole 340, the conductive cover 400 can cover the end face of the first wall plate 310 facing away from the circuit board 100. At this time, the conductive cover 400 only contacts the end face of the first wall plate 310 facing away from the circuit board 100, that is, there is no cooperation relationship between the conductive cover 400 and other parts of the shielding cover 300 except the end face of the first wall plate 310 facing away from the circuit board 100. Therefore, the conductive cover 400 can be buckled with various regular-shaped or irregular-shaped shielding covers 300. Compared with setting the outer shape of the conductive cover 400 to be the same as that of the shielding cover 300, since the shape of the conductive cover 400 does not need to be consistent with that of the shielding cover 300, in this way, it is convenient to buckle the conductive cover 400 with the shielding cover 300 and improve the buckling effect between the conductive cover 400 and the shielding cover 300.

[0042] In this embodiment, since the conductive cover 400 is in the shape of "冖" and the two ends of the conductive cover 400 are buckled to the two opposite side faces of the shielding cover 300; or, the two ends of the conductive cover 400 are buckled to the edge of the first through hole 340, that is, the shape of the conductive cover 400 does not need to be consistent with that of the shielding cover 300. In this way, when the shape of the shielding cover 300 is irregular, it is also convenient to buckle the conductive cover 400 with the shielding cover 300.

[0043] Optionally, the conductive cover 400 includes a cover body 410 and a conductive thin film 420. The conductive thin film 420 covers the end face of the shielding cover 300 away from the circuit board 100, and the conductive thin film 420 is opposite to the first through hole 340. The conductive thin film 420 blocks the first through hole 340;

[0044] The cover body 410 is snapped onto the shielding cover 300, and the conductive film 420 is located between the cover body 410 and the shielding cover 300. The cover body 410 is provided with a second through hole 4113 opposite to the conductive film 420, and the projection of the first through hole 340 on the plane where the cover body 410 is located is located within the second through hole 4113.

[0045] Wherein, the shielding cover 300 further includes opposite first side walls 320 and second side walls 330. The first side walls 320 are connected to the second side walls 330 through the first wall plate 310. A first clamping position 321 is provided on the surface of the first side walls 320 on the side facing away from the second side walls 330, and a second clamping position 331 is provided on the surface of the second side walls 330 on the side facing away from the first side walls 320.

[0046] The cover body 410 is in the shape of "冖", and the cover body 410 includes: a cover plate 411 covering the side of the conductive film 420 facing away from the first wall plate 310, a first extension plate 412 extending from the first side 4111 of the cover plate 411 towards the circuit board 100, and a second extension plate 413 extending from the second side 4112 of the cover plate 411 towards the circuit board 100. Among them, the first extension plate 412 is in contact with the first side wall 320, and the first extension plate 412 includes a third clamping position 4121 matching the first clamping position 321, and the third clamping position 4121 is clamped with the first clamping position 321. The second extension plate 413 is in contact with the second side wall 330, and the second extension plate 413 includes a fourth clamping position 4131 matching the second clamping position 331, and the fourth clamping position 4131 is clamped with the second clamping position 331. Among them, the first extension plate 412 and the second extension plate 413 form the two ends of the cover body 410. The outer surfaces of the first side walls 320 and the outer surfaces of the second side walls 330 form the above two opposite side surfaces of the shielding cover 300.

[0047] The above-mentioned conductive film 420 can be various plate bodies with conductive properties, specifically, various thin plates made of metal materials. In the embodiment of the present application, the conductive film 420 can be a copper foil in the shape of a plate. Among them, the cross-sectional dimension of the conductive film 420 is larger than the cross-sectional dimension of the first through hole 340, so that the conductive film 420 can be prevented from moving into the interior of the first through hole 340.

[0048] The above-mentioned cover body 410 can be made of metal material or non-metal material. In some embodiments of the present application, the cover body 410 is made of metal material, so that it is beneficial to further improve the electromagnetic shielding effect on the devices inside the shielding cover 300.

[0049] The thickness of the above-mentioned conductive film 420 can be less than or equal to 0.04 mm, and the thickness of the above-mentioned cover body 410 can be less than or equal to 0.08 mm. Since when a conductive cover body 400 with the same shape as the shielding cover 300 is used alone, the thickness of the conductive cover body 400 is usually 0.15 mm. Therefore, in the embodiment of the present application, by combining a conductive sheet with the cover body 410, it is beneficial to reduce the thickness of the conductive cover body 400, thereby reducing the overall thickness of the shielding structure, which is beneficial to the lightweight and thinning of electronic equipment.

[0050] Of the first engaging position 321 and the second engaging position 331, one is a slot and the other is a buckle; of the third engaging position 4121 and the fourth engaging position 4131, one is a slot and the other is a buckle. For example, see Figure 1 In some embodiments of the present application, the first engaging portion 321 is a groove-shaped engaging slot, and the second engaging portion 331 is a buckle protruding toward one side of the first engaging portion 321. The third engaging portion 4121 is a groove-shaped engaging slot, and the fourth engaging portion 4131 is a buckle protruding toward one side of the third engaging portion 4121. In this way, during the assembly of the conductive cover body 400 and the shielding cover 300, the conductive film 420 is first placed on the surface of the first wall panel 310, and the conductive film 420 covers the first through hole 340. Then, the open end of the cover body 410 is directed toward the end of the shielding cover 300 away from the circuit board 100, and pressure is applied to the cover body 410 toward the side of the shielding cover 300, so that the cover body 410 moves toward the side of the shielding cover 300 until the first locking position 321 is locked with the second locking position 331, and the third locking position 4121 is locked with the fourth locking position 4131. At this time, the cover plate 411 is fitted with the conductive film 420, thereby pressing the conductive film 420 against the first wall panel 310, thereby preventing the DDR interference signal from being transmitted to the outside of the shielding cover 300 through the first through hole 340.

[0051] In which, the cross-sectional size of the above-mentioned conductive film 420 can be larger than the cross-sectional size of the second through hole 4113, and the orthographic projection of the second through hole 4113 in the conductive film 420 is located inside the conductive film 420, and there is a gap between the orthographic projection of the second through hole 4113 in the conductive film 420 and the edge of the conductive film 420. In this way, it can be ensured that the cover body 410 can have an area facing the conductive film 420, thereby pressing the conductive film 420 against the first wall panel 310.

[0052] In some embodiments of the present application, the cross-sectional shape and size of the second through hole 4113 may be the same as the cross-sectional shape and size of the first through hole 340, and the first through hole 340 may be aligned with the second through hole 4113. In other embodiments of the present application, the cross-sectional size of the second through hole 4113 may be larger than the cross-sectional size of the first through hole 340, and the projection of the first through hole 340 on the plane of the cover plate 411 is located within the second through hole 4113.

[0053] In this embodiment, since the two sides of the cover body 410 are respectively engaged with the two opposing side walls of the shielding case 300, the cover body can ensure that the conductive film 420 is always pressed against the first wall 310. Since temperature fluctuations have little impact on the engaging connection, when the components in the circuit board assembly release heat during operation, causing the ambient temperature of the cover body 410 to rise, the connection between the cover body 410 and the shielding case 300 is minimally affected. Therefore, the conductive film 420 can be relatively stably attached to the first wall 310, thereby ensuring a stable shielding effect for the shielding structure. Furthermore, by providing a second through hole 4113 in the cover plate 411, the weight of the conductive cover body 400 is reduced, thereby lowering costs and further facilitating the thinning and lightweighting of the electronic device. Furthermore, during maintenance, maintenance personnel can check through the second through hole 4113 to ensure that the conductive film 420 is properly sealing the first through hole 340, thereby facilitating maintenance of the shielding structure.

[0054] Optionally, a groove 312 surrounding the first through hole 340 is formed on an end surface of the conductive cover 400 away from the circuit board 100 , and both ends of the conductive cover 400 are buckled into the groove 312 .

[0055] Specifically, the conductive cover 400 covers the end surface of the first wall panel 310 facing away from the circuit board 100, and the end surface of the first wall panel 310 facing away from the circuit board 100 is provided with a groove 312 surrounding the end surface, and the edge of the conductive cover 400 is provided with an extension portion 440 extending toward one side of the first wall panel 310, wherein the extension portion 440 includes two ends of the conductive cover 400, and the extension portion 440 is embedded in the groove 312, and the extension portion 440 is clamped with the groove wall of the groove 312.

[0056] See Figure 5, in some embodiments of the present application, the groove 312 is an annular groove surrounding the first through hole 340, and the extension 440 is an annular plate extending from the edge of the conductive cover 400 toward the first wall plate 310. The extension 440 and the side wall of the groove 312 can be connected by a snap connection. Alternatively, the extension 440 and the groove 312 can be connected by interference fit to snap the extension 440 into the groove 312.

[0057] In some other embodiments of the present application, the groove 312 may also include only two strip-shaped grooves. Among them, the two strip-shaped grooves are located on two opposite sides of the first through hole 340. At this time, the extension 440 also includes only two strip-shaped plates. That is, the conductive cover 400 is in the shape of "冖", and the two strip-shaped plates are strip-shaped plates extending from two opposite sides of the conductive cover 400 toward the first wall plate 310. The two strip-shaped plates correspond to the two strip-shaped grooves one by one, and the strip-shaped plates are snapped into the corresponding strip-shaped grooves. Among them, the snap connection method between the strip-shaped plate and the strip-shaped groove can be a snap connection or an interference fit connection.

[0058] In this embodiment, by opening an annular groove 312 surrounding the first through hole 340 on the end face of the first wall plate 310 far from the circuit board 100 and buckling the two ends of the conductive cover 400 into the groove 312, in this way, during the assembly process of the conductive cover 400 and the shielding cover 300, only by buckling the conductive cover 400 on the end face of the first wall plate 310 far from the circuit board 100, the assembly of the two can be realized, which is beneficial to facilitating the assembly between the conductive cover 400 and the shielding cover 300. At the same time, since the shape of the conductive cover 400 has nothing to do with the outer shape of the shielding cover 300, the conductive cover 400 can be adapted to shielding covers 300 of various outer shapes.

[0059] Optionally, the end face of the conductive cover 400 far from the circuit board 100 and the end face of the shielding cover 300 far from the circuit board 100 are located in the same plane.

[0060] Specifically, please refer to Figure 5The conductive cover 400 can separate the end surface of the first wall panel 310 away from the circuit board 100 into a first area and a second area. The first area is the area of ​​the first wall panel 310 located inside the conductive cover 400, and the second area is the area of ​​the first wall panel 310 located outside the conductive cover 400. The inner wall of the conductive cover 400 facing the circuit board 100 can be coplanar with the first area, and the end surface of the conductive cover 400 away from the circuit board 100 can be coplanar with the second area. The first area and the second area are not coplanar, and the distance between the first area and the circuit board 100 is smaller than the distance between the second area and the circuit board 100.

[0061] In this embodiment, by making the end surface of the conductive cover 400 away from the circuit board 100 and the end surface of the shielding cover 300 away from the circuit board 100 located in the same plane, arranging the conductive cover 400 on the side of the shielding cover 300 away from the circuit board 100 will not cause the overall thickness of the shielding structure to increase, thereby facilitating further reducing the thickness space required to be occupied by the shielding structure.

[0062] Alternatively, see Figure 6 In some embodiments of the present application, a fifth locking position 311 is provided on the end surface of the first wall panel 310 away from the circuit board 100, the conductive cover 400 is plate-shaped, and a sixth locking position 430 matching the fifth locking position 311 is provided on the end surface of the conductive cover 400 facing the first wall panel 310, and the fifth locking position 311 is locked with the sixth locking position 430.

[0063] Of the fifth engaging position 311 and the sixth engaging position 430, one is a slot and the other is a buckle. Figure 6 In some embodiments of the present application, the fifth engaging position 311 is a groove-shaped engaging slot, and the sixth engaging position 430 is a buckle protruding toward one side of the fifth engaging position 311. When the buckle is engaged with the engaging slot, the engaging slot can retain the buckle within the buckle. Specifically, the buckle and the engaging slot can be connected by an interference fit.

[0064] In this embodiment, by snapping the conductive cover 411 into the first wall 310, the conductive cover 400 and the shielding cover 300 can be assembled by simply snapping the conductive cover 400 onto the end surface of the first wall 310 away from the circuit board 100. This facilitates assembly of the conductive cover 400 and the shielding cover 300. Furthermore, since the shape of the conductive cover 400 is independent of the outer shape of the shielding cover 300, the conductive cover 400 can be adapted to shielding covers 300 of various shapes.

[0065] Optionally, the circuit board assembly also includes a support column 600, the first end of which is fixedly connected to the first end face 101 of the circuit board 100, and the second end of which contacts the inner wall of the shielding cover 300 facing the circuit board 100, and the support column 600 is adjacent to the first through hole 340.

[0066] The support column 600 may be an insulating support column 600 , specifically a support column 600 made of various plastic materials, and the support column 600 may be bonded to the circuit board 100 .

[0067] Specifically, since the first through hole 340 is opened in the first wall plate 310 , the strength of the area of ​​the first wall plate 310 near the first through hole 340 will be reduced, making this area easily deformed toward the circuit board 100 under the pressure of the conductive film 420 .

[0068] In this embodiment, a support column 600 is provided between the first wall panel 310 and the circuit board 100, and the support column 600 is provided adjacent to the first through hole 340. In this way, the support column 600 can effectively support the weak strength area in the first wall panel 310, that is, support the area in the first wall panel 310 located near the first through hole 340, thereby preventing the area in the first wall panel 310 located near the first through hole 340 from being deformed toward the side of the circuit board 100 under the extrusion of the conductive film 420.

[0069] Alternatively, see Figure 7 The first through hole 340 is a rectangular through hole, and the circuit board assembly includes four support columns 600. The four support columns 600 correspond to the four vertex corners of the first through hole 340 one by one, and the support columns 600 are adjacent to the corresponding vertex corners.

[0070] In this embodiment, four support columns 600 are provided, and the four support columns 600 support the areas adjacent to the four top corners of the first through hole 340 in the first wall panel 310. This is beneficial to improving the structural uniformity of the various areas adjacent to the first through hole 340 in the first wall panel 310, thereby preventing the areas adjacent to the first through hole 340 in the first wall panel 310 from being deformed toward the side of the circuit board 100 under the extrusion of the conductive film 420.

[0071] Optionally, one end of the electrical component 200 away from the circuit board 100 is accommodated in the first through hole 340 .

[0072] In some embodiments of the present application, the shielding cover 300 is provided with a CPU 500 and a DDR, and the DDR is stacked on top of the CPU 500 to form a package on package (PoP) structure. Since the height dimension of the CPU 500 and the DDR after stacking is relatively high, for example, the height dimension of the CPU 500 and the DDR after stacking can be greater than the height dimension of the internal space of the shielding cover 300, the CPU 500 and the DDR can be stacked below the first through hole 340. In this case, the first through hole 340 forms an avoidance hole. See Figure 7 The central processing unit 500 can be connected to the circuit board 100, and the electrical component 200 is the DDR. Since the DDR is stacked above the central processing unit 500, the portion of the DDR that exceeds the internal space of the shielding cover 300 can be accommodated in the first through hole 340 to achieve the installation of the central processing unit 500 and the DDR.

[0073] In addition, the support column 600 can be located outside the central processing unit 500. Therefore, during the process of dispensing glue on the central processing unit 500, the support column 600 can also play a role in blocking glue and reducing the width of glue overflow around the central processing unit 500.

[0074] In this embodiment, since the end of the electrical component 200 away from the circuit board 100 is accommodated in the first through hole 340, when there is a part of the electrical component 200 whose height exceeds the height of the internal space of the shielding cover 300, the electrical component 200 can also be installed.

[0075] An embodiment of the present application further provides an electronic device, which includes the circuit board assembly described in the above embodiment.

[0076] In this embodiment, since the electronic device includes the circuit board assembly in the above embodiment, the electronic device can implement each process of the circuit board assembly in the above embodiment and has the same beneficial effects. To avoid repetition, they will not be described here.

[0077] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A circuit board assembly, characterized in that: include: circuit boards; an electrical component, the electrical component being disposed on the first end surface of the circuit board; a shielding cover, the shielding cover being buckled onto the first end surface of the circuit board, the electrical component being accommodated in the shielding cover, and a first through hole being formed in an area of ​​the shielding cover corresponding to the electrical component; a conductive cover, the conductive cover being engaged with the shielding cover and sealing the first through hole; Wherein, the conductive cover is located on a side of the conductive cover away from the circuit board.

2. The circuit board assembly according to claim 1, wherein: The conductive cover is 冖 "shape.

3. The circuit board assembly according to claim 2, wherein: The two ends of the conductive cover are buckled on two opposite side surfaces of the shielding cover; or, the two ends of the conductive cover are buckled on edges of the first through hole.

4. The circuit board assembly according to any one of claims 1 to 3, wherein: The conductive cover includes a cover body and a conductive film, wherein the conductive film covers an end surface of the shielding cover away from the circuit board, and the conductive film is opposite to the first through hole, and the conductive film blocks the first through hole; The cover body is buckled with the shielding cover, and the conductive film is located between the cover body and the shielding cover. The cover body is provided with a second through hole opposite to the conductive film, and the projection of the first through hole on the plane where the cover body is located is located in the second through hole.

5. The circuit board assembly according to claim 3, wherein: A groove surrounding the first through hole is formed on an end surface of the conductive cover away from one end of the circuit board, and two ends of the conductive cover are buckled in the groove.

6. The circuit board assembly according to claim 5, wherein: An end surface of the conductive cover away from one end of the circuit board and an end surface of the shielding cover away from one end of the circuit board are located in the same plane.

7. The circuit board assembly according to claim 1, wherein: The circuit board assembly also includes a support column, a first end of which is fixedly connected to the first end surface of the circuit board, and a second end of which contacts the inner wall of the shielding cover facing the circuit board, and the support column is adjacent to the first through hole.

8. The circuit board assembly according to claim 7, wherein: The first through hole is a rectangular through hole, and the circuit board assembly includes four support columns. The four support columns correspond to the four vertex corners of the first through hole one by one, and the support columns are adjacent to the corresponding vertex corners.

9. The circuit board assembly according to claim 1, wherein: One end of the electrical component away from the circuit board is accommodated in the first through hole.

10. An electronic device, characterized in that: A circuit board assembly comprising any one of claims 1 to 9.

Images