LED packaging structure

Abstract

The utility model provides an LED packaging structure. The LED packaging structure comprises a substrate; the heightening block is arranged on the base plate; the chip is arranged on the block-up block; the reflection cup is arranged on the substrate and surrounds the periphery of the chip; the reflecting glue layer is at least filled between the outer side wall of the heightening block and the inner side wall of the reflecting cup; the chip is provided with a side light-emitting surface facing the inner side wall of the reflection cup, and the side light-emitting surface is exposed out of the side, away from the substrate, of the reflection glue layer. According to the LED packaging structure, the chip is heightened through the heightening block, so that the side light-emitting surface of the chip cannot be shielded by the reflecting glue layer, the light-emitting efficiency of the side light-emitting surface of the chip is improved, and the light-emitting efficiency of the whole LED packaging structure is improved.

Description

Technical Field

[0001] The present application belongs to the field of LED packaging technology, and more specifically, relates to an LED packaging structure. Background Art

[0002] An LED package structure integrates the LED chip with other necessary components (such as a substrate and optical elements) to form a complete LED product. The LED package not only protects the chip but also enhances heat dissipation, optical control, and power management. However, current LED package structures have low luminous efficiency for the LED chip, which in turn leads to low luminous efficiency for the entire LED package. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an LED packaging structure to solve the technical problem of low luminous efficiency of LED packaging structures existing in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is to provide an LED packaging structure, including:

[0005] substrate;

[0006] A padding block is provided on the base plate;

[0007] A chip is arranged on the raising block;

[0008] A reflective cup is provided on the substrate and surrounds the chip;

[0009] a reflective adhesive layer, the reflective adhesive layer being filled at least between the outer side wall of the raising block and the inner side wall of the reflective cup;

[0010] The chip has a side light-emitting surface facing the inner side wall of the reflective cup, and the side light-emitting surface is exposed on a side of the reflective adhesive layer facing away from the substrate.

[0011] In one embodiment, the spacer block is a conductor, and the spacer block is electrically connected between the substrate and the chip.

[0012] In one embodiment, the spacer block is an insulator, and the substrate is electrically connected to the chip via a wire.

[0013] In one embodiment, the height of the spacer blocks ranges from 50um to 200um.

[0014] In one embodiment, the reflective adhesive layer is also filled between adjacent raising blocks.

[0015] In one embodiment, the reflective adhesive layer comprises:

[0016] A lower reflective portion, the lower reflective portion being no higher than the lower surface of the chip; the lower reflective portion being filled between adjacent raised blocks and between the raised blocks and the reflective cup;

[0017] An upper reflective portion is higher than the lower surface of the chip, is in contact with the inner wall of the reflective cup, has a reflective surface facing away from the reflective cup, and is spaced apart from the side light emitting surface.

[0018] In one embodiment, the LED packaging structure further includes a fluorescent layer, the chip further has an upper light-emitting surface facing away from the substrate, the fluorescent layer is coated on the upper light-emitting surface and the side light-emitting surface of the chip, and the fluorescent layer covers the side of the reflective adhesive layer facing away from the substrate.

[0019] In one embodiment, the substrate has:

[0020] A first surface, wherein the first surface is provided with a first negative electrode pad and a first positive electrode pad corresponding to the chip;

[0021] The second surface is arranged opposite to the first surface; the second surface is provided with a second negative electrode pad, a second positive electrode pad and a heat dissipation pad at intervals; the first negative electrode pad is electrically connected to the second negative electrode pad, and the first positive electrode pad is electrically connected to the second positive electrode pad.

[0022] In one embodiment, the LED packaging structure includes at least two rows of chips, each row of chips includes at least two chips spaced apart along a first direction, the chips in the same row are connected in series in sequence, and a first negative lead-out pad and a first positive lead-out pad are led out from both ends respectively, the first negative lead-out pad is electrically connected to the second negative lead-out pad, and the first positive lead-out pad is electrically connected to the second positive lead-out pad; the rows of chips are spaced apart along the second direction, and the rows of chips are connected in parallel with each other.

[0023] In one embodiment, along the second direction, the second negative electrode pads are integrally connected, and the second positive electrode pads are integrally connected;

[0024] Along the first direction, the second negative electrode pad and the second positive electrode pad are respectively spaced apart and arranged on two opposite sides of the heat dissipation pad.

[0025] In one embodiment, along the second direction, the first negative electrode lead pads are connected as one piece, and the first positive electrode lead pads are connected as one piece;

[0026] The second negative electrode pad and the second positive electrode pad are spaced apart along the first direction, and the heat dissipation pad is spaced apart and disposed on the same side of the second negative electrode pad and the second positive electrode pad along the second direction.

[0027] In one embodiment, the inner diameter of the reflective cup gradually increases in a direction away from the substrate, and the angle between the inner side surface of the reflective cup and the substrate is in a range of 60°-80°.

[0028] In one embodiment, the reflective cup is made of glass.

[0029] In one embodiment, a connection pad is provided on the substrate at a position corresponding to the reflective cup, and the reflective cup is welded to the connection pad through a welding layer.

[0030] The beneficial effect of the LED packaging structure provided by the present application is that: by arranging a spacer block between the chip and the substrate, the chip is raised by the spacer block, so that the reflective adhesive layer can be filled between the spacer block and the reflective cup, so that the side light-emitting surface of the chip can be exposed on the side of the reflective adhesive layer facing away from the substrate, that is, the side light-emitting surface of the chip will not be blocked by the reflective adhesive layer, thereby improving the light-emitting efficiency of the side light-emitting surface of the chip, and further improving the light-emitting efficiency of the entire LED packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0032] Figure 1 A schematic cross-sectional view of an LED packaging structure provided in an embodiment of the present application;

[0033] Figure 2 for Figure 1 A schematic diagram of the structure of the substrate of the LED packaging structure;

[0034] Figure 3 A schematic diagram of the first surface structure of the substrate in the LED packaging structure provided in an embodiment of the present application;

[0035] Figure 4 A schematic diagram of the second surface structure of the substrate in the LED packaging structure provided in an embodiment of the present application;

[0036] Figure 5 A schematic top view of a reflective cup in an LED packaging structure provided in an embodiment of the present application;

[0037] Figure 6 A schematic cross-sectional view of an LED packaging structure provided by another embodiment of the present application;

[0038] Figure 7 for Figure 6A schematic diagram of the structure of the substrate of the LED packaging structure;

[0039] Figure 8 A schematic structural diagram of the first surface of a substrate in an LED packaging structure provided by another embodiment of the present application;

[0040] Figure 9 A schematic diagram of the second surface structure of the substrate in the LED packaging structure provided by another embodiment of the present application;

[0041] Figure 10 A schematic structural diagram of the second surface of a substrate provided in yet another embodiment of the present application;

[0042] Figure 11 This is a schematic diagram of the assembly structure of the substrate and chip in the LED packaging structure provided in another embodiment of the present application.

[0043] Among them, the reference numerals in the figures are:

[0044] 100, substrate; 110, first surface; 120, second surface; 130, first negative electrode pad; 131, first negative electrode lead pad; 140, first positive electrode pad; 141, first positive electrode lead pad; 150, second negative electrode pad; 160, second positive electrode pad; 170, heat dissipation pad; 171, first heat dissipation portion; 172, second heat dissipation portion; 180, via; 190, connection pad; 200, spacer; 300, chip; 310, side light emitting surface; 320, inner light emitting surface; 330, upper light emitting surface; 400, reflector cup; 500, reflective adhesive layer; 510, lower reflector; 520, upper reflector; 521, reflective surface; 600, phosphor layer; 700, wire; 800, welding layer; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0045] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0046] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0047] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0049] See also Figure 1 , the LED packaging structure provided in the embodiment of the present application is now described.

[0050] The LED package structure includes a substrate 100, a spacer block 200, a chip 300, a reflective cup 400 and a reflective adhesive layer 500; the spacer block 200 is arranged on the substrate 100; the chip 300 is arranged on the spacer block 200; the reflective cup 400 is arranged on the substrate 100 and surrounds the chip 300; the reflective adhesive layer 500 is at least filled between the outer wall of the spacer block 200 and the inner wall of the reflective cup 400; the chip 300 has a side light-emitting surface 310 facing the inner wall of the reflective cup 400, and the side light-emitting surface 310 is exposed on the side of the reflective adhesive layer 500 facing away from the substrate 100.

[0051] The LED package structure may include one chip 300 or multiple chips 300. When the LED package structure includes one chip 300, the four side surfaces of the chip 300 all face the reflective cup 400, that is, the chip 300 has four side light-emitting surfaces 310, and the four side light-emitting surfaces 310 of the chip 300 are all exposed on the side of the reflective adhesive layer 500 facing away from the substrate 100. When the LED package structure includes multiple chips 300, the chip 300 has a side light-emitting surface 310 facing the reflective cup 400 and an inner light-emitting surface 320 facing an adjacent chip 300. The side light-emitting surface 310 of the chip 300 is exposed on the side of the reflective adhesive layer 500 facing away from the substrate 100, and the inner light-emitting surface 320 of the chip 300 may contact the reflective adhesive layer 500 or isolate the reflective adhesive layer 500.

[0052] The reflective adhesive layer 500 is disposed on the substrate 100 , thereby increasing the luminous reflectivity of the chip 300 and thus increasing the brightness of the chip 300 .

[0053] In the LED packaging structure in the embodiment of the present application, a spacer block 200 is provided between the chip 300 and the substrate 100. The spacer block 200 is used to space the chip 300, so that the reflective adhesive layer 500 can be filled between the spacer block 200 and the reflective cup 400. This allows the side light-emitting surface 310 of the chip 300 to be exposed on the side of the reflective adhesive layer 500 facing away from the substrate 100. In other words, the side light-emitting surface 310 of the chip 300 will not be blocked by the reflective adhesive layer 500, thereby improving the light-emitting efficiency of the side light-emitting surface 310 of the chip 300, and further improving the light-emitting efficiency of the entire LED packaging structure.

[0054] In one embodiment, see Figure 1 The spacer 200 is a conductor and electrically connects the substrate 100 to the chip 300. In other words, the spacer 200 not only elevates the chip 300 but also provides electrical connection between the chip 300 and the substrate 100. Specifically, two spacers 200 are provided for each chip 300, and the substrate 100 has two pads for each chip 300. The two spacers 200 electrically connect the two pins of the chip 300 to the two pads, respectively.

[0055] Optionally, the material of the spacer block 200 may be a conductive metal such as copper, silver, aluminum or gold.

[0056] In one embodiment, the height of the spacer block 200 ranges from 50um to 200um. Specifically, the height of the spacer block 200 can be 50um, 60um, 70um, 80um, 90um, 100um, 110um, 120um, 130um, 140um, 150um, 160um, 170um, 180um, 190um, or 200um.

[0057] The height of the raising block 200 here refers to the height of the raising block 200 protruding relative to the substrate 100, that is, the distance between the two opposite side surfaces of the raising block 200 along the thickness direction of the substrate 100, and is also the distance between the chip 300 and the substrate 100.

[0058] If the height of the raising block 200 is too low, the thickness of the reflective adhesive layer 500 will be too small, resulting in insufficient adhesive dispensing and a poor reflective effect. If the height of the raising block 200 is too high, the thickness of the reflective adhesive layer 500 will be too thick, which will not only take up space but also waste material. In this embodiment, by appropriately limiting the height range of the raising block 200, the setting of the raising block 200 not only elevates the chip 300 to a certain height so that the side light-emitting surface 310 of the chip 300 can be exposed, but also ensures that the thickness of the reflective adhesive layer 500 is appropriate, so that the reflective adhesive layer 500 can effectively reflect light without wasting the material of the reflective adhesive layer 500.

[0059] In one embodiment, see Figure 1 The reflective adhesive layer 500 is also filled between adjacent raising blocks 200 to ensure the structural stability of the adjacent raising blocks 200 .

[0060] In one embodiment, see Figure 1 The reflective adhesive layer 500 includes a lower reflective portion 510 and an upper reflective portion 520; the lower reflective portion 510 is not higher than the lower surface of the chip 300, and the lower reflective portion 510 is filled between adjacent padding blocks 200, and is filled between the padding blocks 200 and the reflective cup 400; the upper reflective portion 520 is higher than the lower surface of the chip 300, and the upper reflective portion 520 is in contact with the inner side wall of the reflective cup 400. The upper reflective portion 520 has a reflective surface 521 facing away from the reflective cup 400, and the reflective surface 521 is spaced apart from the side light emitting surface 310.

[0061] In this embodiment, the reflective adhesive layer 500 is divided into a lower reflective portion 510 and an upper reflective portion 520. The lower reflective portion 510 is formed on the substrate 100 and fills the space between adjacent raised blocks 200 and between the raised blocks 200 and the reflective cup 400. This enhances the efficiency of reflecting light upward, thereby increasing the luminous intensity of the chip 300. The upper reflective portion 520 is attached to the inner sidewall of the reflective cup 400, providing the inner side of the reflective cup 400 with a reflective function. Light emitted from the chip 300 onto the inner sidewall of the reflective cup 400 is reflected by the upper reflective portion 520, thereby improving the luminous efficiency of the chip 300. Furthermore, because the reflective surface 521 of the upper reflective portion 520 is spaced apart from the side light emitting surface 310, the upper reflective portion 520 does not block the side light emitting surface 310, thereby preventing the luminous efficiency of the chip 300 from being affected.

[0062] In one embodiment, see Figure 1 The inner diameter of the reflective surface 521 gradually increases in a direction away from the substrate 100. That is, the upper reflective portion 520 is disposed around the periphery of the chip 300 and is substantially cup-shaped, thereby achieving a reflection and focusing effect to improve luminous efficiency.

[0063] For details, please refer to Figure 1 The reflective surface 521 extends along a curve from the bottom edge of the chip 300 to the top side of the reflective cup 400. It is understood that in other embodiments, the reflective surface 521 may not be connected to the bottom edge of the chip 300, but may extend directly from the top side of the lower reflective portion 510 to the top side of the reflective cup 400; or, in other embodiments, the reflective surface 521 may extend along an arc or an oblique line, which is not intended to be the only limitation herein.

[0064] In one embodiment, the reflective adhesive layer 500 can be made of white glue, which is dispensed between the spacer block 200 and the reflective cup 400. Furthermore, when the spacing between adjacent chips 300 is small, the glue can rise to the space between the adjacent chips 300 due to a capillary effect during the dispensing process. Of course, in other embodiments, the reflective adhesive layer 500 can also be formed of other reflective materials, and the reflective adhesive layer 500 can also be applied or adhered to the substrate 100. If the space between adjacent chips 300 is not filled with white glue, phosphor powder can be added or a gap can be left between the adjacent chips 300.

[0065] In one embodiment, see Figure 1 The LED packaging structure also includes a fluorescent layer 600. The chip 300 also has an upper light-emitting surface 330 facing away from the substrate 100. The fluorescent layer 600 is coated on the upper light-emitting surface 330 and the side light-emitting surface 310 of the chip 300. The fluorescent layer 600 covers the side of the reflective adhesive layer 500 facing away from the substrate 100.

[0066] The upper light-emitting surface 330 of the chip 300 refers to the surface of the chip 300 facing away from the substrate 100, and the side light-emitting surface 310 of the chip 300 refers to the surface of the chip 300 facing the reflector cup 400. This arrangement allows the chip 300 to be encapsulated and covered by the fluorescent layer 600, allowing light emitted from both the upper light-emitting surface 330 and the side light-emitting surface 310 of the chip 300 to pass through the fluorescent layer 600, thereby adjusting the light color and improving the color rendering of the light. Furthermore, the fluorescent layer 600 covers the side of the reflective adhesive layer 500 facing away from the substrate 100, allowing the light reflected from the reflective adhesive layer 500 to be adjusted as well, thereby improving the luminous performance of the entire LED package structure.

[0067] In one embodiment, see Figure 1 The fluorescent layer 600 is formed by dispensing glue, which makes the thickness of the fluorescent layer 600 uniform throughout. This improves the luminous effect while saving the amount of material used and simplifies the formation process. It is understood that in other embodiments of the present application, the fluorescent layer 600 can also be formed by coating. In this case, the surface of the fluorescent layer 600 facing away from the substrate 100 can be made flush, making the entire LED package structure look neat and beautiful.

[0068] In one embodiment, see Figures 1 to 4The substrate 100 has a first surface 110 and a second surface 120 arranged opposite to each other. The first surface 110 is provided with a first negative electrode pad 130 and a first positive electrode pad 140 corresponding to the chip 300, and the second surface 120 is provided with a second negative electrode pad 150, a second positive electrode pad 160 and a heat dissipation pad 170 at intervals. The first negative electrode pad 130 is electrically connected to the second negative electrode pad 150, and the first positive electrode pad 140 is electrically connected to the second positive electrode pad 160.

[0069] Among them, the raising block 200, the chip 300, the reflective adhesive layer 500, the reflective cup 400 and the fluorescent layer 600 are all arranged on the first surface 110 of the substrate 100, and the first negative electrode pad 130 and the first positive electrode pad 140 are respectively electrically connected to the positive and positive electrodes of the chip 300 through the two raising blocks 200. At the same time, since the first negative electrode pad 130 is electrically connected to the second negative electrode pad 150, and the first positive electrode pad 140 is electrically connected to the second positive electrode pad 160, the chip 300 is electrically connected to the second negative electrode pad 150 and the second positive electrode pad 160, and then the second negative electrode pad 150 and the second positive electrode pad 160 can be connected to the external circuit to realize circuit control of the chip 300 by the external circuit.

[0070] Specifically, the first negative electrode pad 130 and the second negative electrode pad 150 can be electrically connected, and the first positive electrode pad 140 and the second positive electrode pad 160 can be electrically connected by forming a via hole 180 on the substrate 100 and filling the via hole 180 with a conductive material.

[0071] In one embodiment, see Figures 2 to 4 The LED package structure includes at least two rows of chips 300, each row of chips 300 includes at least two chips 300 spaced apart along the first direction X, the chips 300 in the same row are connected in series, and the first cathode lead pad 131 and the first anode lead pad 141 are led out from both ends respectively, the first cathode lead pad 131 is electrically connected to the second cathode pad 150, and the first anode lead pad 141 is electrically connected to the second anode pad 160; the chips 300 in each row are spaced apart along the second direction Y, and the chips 300 in each row are connected in parallel.

[0072] Specifically, the first negative electrode pads 130 and the first positive electrode pads 140 that are close to each other in two adjacent chips 300 are connected as a whole, thereby realizing the series connection of the adjacent chips 300. Figure 3 In the figure, the first positive electrode pad 140 of the left chip 300 and the first negative electrode pad 130 of the right chip 300 are connected as a whole, so that the left chip 300 and the right chip 300 are connected in series. In this way, for the same row of chips, only one first negative electrode lead-out pad 131 and one first positive electrode lead-out pad 141 need to be led out.

[0073] In one embodiment, see Figures 2 to 4 , along the second direction Y, each second negative electrode pad 150 is integrally connected, and each second positive electrode pad 160 is integrally connected; along the first direction X, the second negative electrode pad 150 and the second positive electrode pad 160 are respectively arranged on opposite sides of the heat dissipation pad 170. The second negative electrode pad 150 is respectively electrically connected to the first negative electrode lead pad 131 of each row of chips 300, and the second positive electrode pad 160 is respectively electrically connected to the first positive electrode lead pad 141 of each row of chips 300. In this embodiment, please refer to Figure 3 The first negative electrode lead pads 131 distributed along the second direction Y do not need to be connected to each other, and the first positive electrode lead pads 141 distributed along the second direction Y do not need to be connected to each other, thereby simplifying the pad setting of the first surface 110 of the substrate 100.

[0074] In another embodiment of the present application, see Figures 6 to 9 Along the second direction Y, each first negative electrode lead pad 131 is integrally connected, and each first positive electrode lead pad 141 is integrally connected; the second negative electrode pad 150 and the second positive electrode pad 160 are spaced apart along the first direction X, and the heat dissipation pad 170 is disposed on the same side of the second negative electrode pad 150 and the second positive electrode pad 160 along the second direction Y. In this embodiment, by distributing the chips 300 distributed along the second direction Y in parallel on the first surface 110 of the substrate 100, without having to do so on the second surface 120 of the substrate 100, the areas of the second negative electrode pad 150 and the second positive electrode pad 160 can be reduced, thereby increasing the area of ​​the heat dissipation pad 170 and improving the heat dissipation effect.

[0075] In another embodiment of the present application, please refer to Figure 10 The heat dissipation pad 170 includes a first heat dissipation portion 171 and a second heat dissipation portion 172. The second negative electrode pad 150, the first heat dissipation portion 171 and the second positive electrode pad 160 are arranged in sequence along the first direction X. The second heat dissipation portion 172 is connected to the first heat dissipation portion 171. The second heat dissipation portion 172 is arranged on the same side of the second negative electrode pad 150, the first heat dissipation portion 171 and the second positive electrode pad 160 along the second direction Y. In this way, the area of ​​the heat dissipation pad 170 can be further increased, thereby enhancing the heat dissipation effect.

[0076] In one embodiment, see Figure 1 The substrate 100 is provided with a connection pad 190 at a position corresponding to the reflector cup 400, and the reflector cup 400 is welded to the connection pad 190 via a welding layer 800. Specifically, the reflector cup 400 is electroplated on the side facing the substrate 100, and the reflector cup 400 is welded to the substrate 100 via welding material to form a welding layer 800.

[0077] Optionally, the reflector cup 400 is made of glass, which is easy to process, low in cost, and easy to dissipate heat. It is understandable that in other embodiments of the present application, the reflector cup 400 can also be made of metal materials, such as copper, which is not limited here.

[0078] In one embodiment, see Figure 1 and Figure 5 The reflector cup 400 is cup-shaped, and its inner diameter gradually increases as it moves away from the substrate 100. An angle A formed between the inner side surface of the reflector cup 400 and the first surface 110 of the substrate 100 is in the range of 60°-80°, for example, 60°, 62°, 64°, 66°, 68°, 70°, 72°, 74°, 76°, 78°, or 80°. The height of the reflector cup 400 is in the range of 0.5 mm-0.7 mm, for example, 0.50 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm, 0.60 mm, 0.62 mm, 0.64 mm, 0.66 mm, 0.68 mm, or 0.70 mm.

[0079] In one embodiment, the substrate 100 may be an aluminum nitride substrate or an aluminum substrate.

[0080] In one embodiment, the raising block 200 is welded to the substrate 100. In other embodiments, the raising block 200 can also be mounted on the substrate 100 by electroplating.

[0081] In another embodiment of the present application, see Figure 11 , the raising block 200 may not be a conductor. Specifically, the raising block 200 is an insulator, and the substrate 100 and the chip 300 are electrically connected through the wire 700. In this embodiment, the raising block 200 is used to raise the chip 300. Since the raising block 200 is an insulator, and the raising block 200 raises the chip 300, the chip 300 and the substrate 100 are spaced apart, so that the chip 300 and the substrate 100 cannot be directly welded and electrically connected. At this time, the electrical connection between the chip 300 and the substrate 100 can be formed by welding with the wire 700. Specifically, the first negative electrode pad 130 and the first positive electrode pad 140 are respectively electrically connected to the positive and negative electrodes of the chip 300 through the wire 700.

[0082] In another embodiment of the present application, the reflective adhesive layer 500 includes a lower reflective portion 510. The side of the lower reflective portion 510 facing away from the substrate 100 is flush and lower than the lower surface of the chip 300. The reflective adhesive layer 500 is primarily used to reflect light directed toward the substrate 100 to enhance light intensity. Furthermore, to achieve the reflective function of the reflective cup 400, a reflective material, such as a reflective film or reflective cloth, may be coated or adhered to the inner sidewall of the reflective cup 400.

[0083] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An LED packaging structure, characterized in that: include: substrate(100); A padding block (200) is provided on the substrate (100); A chip (300) is provided on the raising block (200); A reflective cup (400) is provided on the substrate (100) and surrounds the chip (300); a reflective adhesive layer (500), the reflective adhesive layer (500) being filled at least between the outer side wall of the raising block (200) and the inner side wall of the reflective cup (400); The chip (300) has a side light-emitting surface (310) facing the inner side wall of the reflective cup (400), and the side light-emitting surface (310) is exposed on a side of the reflective adhesive layer (500) facing away from the substrate (100).

2. The LED packaging structure according to claim 1, wherein: The padding block (200) is a conductor, and the padding block (200) is electrically connected between the substrate (100) and the chip (300).

3. The LED packaging structure according to claim 1, wherein: The padding block (200) is an insulator, and the substrate (100) and the chip (300) are electrically connected via a wire (700).

4. The LED packaging structure according to claim 1, wherein: The height of the padding block (200) ranges from 50um to 200um.

5. The LED packaging structure according to any one of claims 1 to 4, wherein: The reflective adhesive layer (500) is also filled between adjacent raising blocks (200).

6. The LED package structure according to any one of claims 1 to 4, wherein: The reflective adhesive layer (500) comprises: a lower reflective portion (510), the lower reflective portion (510) being no higher than the lower surface of the chip (300); the lower reflective portion (510) being filled between adjacent padding blocks (200) and between the padding blocks (200) and the reflective cup (400); An upper reflecting portion (520), the upper reflecting portion (520) being higher than the lower surface of the chip (300), the upper reflecting portion (520) being in contact with the inner side wall of the reflecting cup (400), the upper reflecting portion (520) having a reflecting surface (521) facing away from the reflecting cup (400), and the reflecting surface (521) being spaced apart from the side light emitting surface (310).

7. The LED package structure according to any one of claims 1 to 4, wherein: The LED packaging structure further comprises a fluorescent layer (600); the chip (300) further comprises an upper light-emitting surface (330) facing away from the substrate (100); the fluorescent layer (600) covers the upper light-emitting surface (330) and the side light-emitting surface (310) of the chip (300); and the fluorescent layer (600) covers the side of the reflective adhesive layer (500) facing away from the substrate (100).

8. The LED package structure according to any one of claims 1 to 4, wherein: The substrate (100) has: A first surface (110), wherein the first surface (110) is provided with a first negative electrode pad (130) and a first positive electrode pad (140) corresponding to the chip (300); The second surface (120) is arranged opposite to the first surface (110); a second negative electrode pad (150), a second positive electrode pad (160) and a heat dissipation pad (170) are arranged on the second surface (120) at intervals; the first negative electrode pad (130) is electrically connected to the second negative electrode pad (150), and the first positive electrode pad (140) is electrically connected to the second positive electrode pad (160).

9. The LED packaging structure according to claim 8, wherein: The LED packaging structure comprises at least two rows of chips (300), each row of chips (300) comprises at least two chips (300) spaced apart along a first direction (X), the chips (300) in the same row are sequentially connected in series, and a first negative electrode lead pad (131) and a first positive electrode lead pad (141) are respectively led out from both ends, the first negative electrode lead pad (131) is electrically connected to the second negative electrode pad (150), and the first positive electrode lead pad (141) is electrically connected to the second positive electrode pad (160); the chips (300) in each row are spaced apart along a second direction (Y), and the chips (300) in each row are mutually connected in parallel.

10. The LED packaging structure according to claim 9, wherein: Along the second direction (Y), each of the second negative electrode pads (150) is connected as a whole, and each of the second positive electrode pads (160) is connected as a whole; Along the first direction (X), the second negative electrode pad (150) and the second positive electrode pad (160) are respectively arranged at intervals on two opposite sides of the heat dissipation pad (170).

11. The LED packaging structure according to claim 9, wherein: Along the second direction (Y), each of the first negative electrode lead pads (131) is connected as a whole, and each of the first positive electrode lead pads is connected as a whole; The second negative electrode pad (150) and the second positive electrode pad (160) are spaced apart along the first direction (X), and the heat dissipation pad (170) is spaced apart and arranged on the same side of the second negative electrode pad (150) and the second positive electrode pad (160) along the second direction (Y).

12. The LED package structure according to any one of claims 1 to 4, wherein: The inner diameter of the reflective cup (400) gradually increases in a direction away from the substrate (100), and the angle between the inner side surface of the reflective cup (400) and the substrate (100) is in the range of 60°-80°.

13. The LED package structure according to any one of claims 1 to 4, wherein: The reflective cup (400) is made of glass.

14. The LED package structure according to any one of claims 1 to 4, wherein: A connection pad (190) is provided on the substrate (100) at a position corresponding to the reflective cup (400), and the reflective cup (400) is welded to the connection pad (190) via a welding layer (800).

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