Constant-temperature cold compress cooling device

Abstract

The utility model discloses a constant-temperature cold compress cooling device, and relates to the technical field of nursing equipment. The device comprises a bandage, a heat preservation bag is installed on the top of the bandage, and a first heat conduction pipe and a second heat conduction pipe are fixedly connected to the interior of the heat preservation bag. And a heat exchange assembly is arranged on one side of the bandage and comprises a heat exchange shell, the heat exchange shell is fixedly connected to one side of the bandage, and a micro screw pump is installed in the heat exchange shell. Through the arrangement of the first heat conduction pipe and the second heat conduction pipe, cooling water can be circulated, water flow in the heat preservation bag is kept flowing, the cooling time is prolonged, through the arrangement of the heat exchange assembly, the cooling water can be pressurized and conveyed, meanwhile, the flow direction of the cooling water can be controlled, and the cooling efficiency is improved. And when the cooling water is conveyed along the second heat conduction pipe, the cooling water only flows through the second heat conduction pipe, so that the cooling range can be conveniently adjusted, the patient is protected from low-temperature discomfort, and the cold compress effect is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of nursing equipment, in particular to a constant temperature cold compress cooling device. Background Art

[0002] For elevated body temperature caused by colds, heatstroke, fever, etc., fever-reducing patches and cold compress headbands are usually used on the forehead for emergency treatment of high fever and physical fever reduction to protect the brain and relieve headaches caused by fever. A cold compress headband is a product that can relieve head discomfort through a cooling effect. It is usually made of soft material and filled with cold gel or ice packs. Cold compress can relieve headaches and migraines: reduce vasodilation and alleviate the symptoms of headaches and migraines.

[0003] However, in the use of the cold compress headband in the prior art, it is usually necessary to put a pre-frozen ice bag into it and then apply it to the patient's head or armpit for cold compress. However, cold compress is not suitable for temperatures that are too low, which can easily cause frostbite to the patient. When the temperature of the ice bag is higher than room temperature, it will melt, making it impossible to maintain a constant temperature, which is very inconvenient to use.

[0004] To this end, we provide a constant temperature cold compress cooling device to solve the above problems. Utility Model Content

[0005] The purpose of the present utility model is to provide a constant temperature cold compress cooling device. By setting a heat exchange component, it solves the problem that the cold compress headband in the prior art does not have the temperature control function, and the use of ice bags for cold compressing patients is prone to frostbite. When the temperature of the ice bag is higher than the room temperature, it will melt, making it impossible to maintain a constant temperature, which is very inconvenient to use.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] The utility model is a constant temperature cold compress cooling device, comprising a bandage, a heat preservation bag is installed on the top of the bandage, and a first heat conduction tube and a second heat conduction tube are fixedly connected to the inside of the heat preservation bag respectively;

[0008] A heat exchange component is provided on one side of the strap, and the heat exchange component includes a heat exchange shell. The heat exchange shell is fixedly connected to one side of the strap, a micro screw pump is installed inside the heat exchange shell, a semiconductor refrigerator is provided inside the heat exchange shell, and a one-way valve is provided on the surface of the first temperature conducting tube.

[0009] The present invention is further configured such that the left end of the first temperature conducting tube is connected to a water pipe, and the other end of the water pipe passes through the interior of the heat exchange shell and is connected to a micro screw pump.

[0010] The present invention is further configured such that the left end of the second temperature conducting pipe is connected to the water pipe, the other end of the second temperature conducting pipe is connected to the heat exchange shell, and the right end of the first temperature conducting pipe is connected to the second temperature conducting pipe.

[0011] The present invention is further configured such that a partition is fixedly connected to the surface of the semiconductor refrigerator, and both sides of the partition are fixedly connected to the inner wall of the heat exchange shell.

[0012] The present invention is further configured such that the top of the micro screw pump is connected to a support plate, and both sides of the support plate are fixedly connected to the inner wall of the heat exchange shell.

[0013] The present invention is further configured such that the front side of the heat exchange shell is connected to an exhaust pipe, and an exhaust fan is installed inside the exhaust pipe.

[0014] The present invention is further configured such that the rear side of the heat exchange shell is connected to an air inlet pipe, and a dust screen is fixedly connected to the inside of the air inlet pipe.

[0015] The utility model has the following beneficial effects:

[0016] The utility model can circulate cooling water through the arrangement of the first thermal conductive tube and the second thermal conductive tube, so that the water flow inside the thermal insulation bag can be kept flowing, thereby increasing the cooling time. Through the arrangement of the heat exchange component, the cooling water can be pressurized and transported while the flow direction of the cooling water can be controlled. When the cooling water is transported along the second thermal conductive tube, the cooling water only flows through the second thermal conductive tube, which is convenient for adjusting the cooling range, protecting the patient from feeling uncomfortable with low temperature, and improving the cold compress effect.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for describing the embodiments.

[0019] Figure 1 This is a structural stereogram of a constant temperature cold compress cooling device;

[0020] Figure 2 A partial cross-sectional view of a heat preservation bag in a constant temperature cold compress cooling device;

[0021] Figure 3 A schematic diagram of the connection between the second temperature conducting pipe, the heat exchange shell and the water pipe in a constant temperature cold compress cooling device;

[0022] Figure 4 A schematic diagram of the separation of a first temperature conducting tube and a second temperature conducting tube in a constant temperature cold compress cooling device;

[0023] Figure 5 It is a side cross-sectional view of a heat exchange shell in a constant temperature cold compress cooling device.

[0024] In the attached figure: 1. binding strap; 2. insulation bag; 3. first temperature conducting tube; 4. second temperature conducting tube; 5. heat exchange shell; 6. micro screw pump; 7. semiconductor refrigerator; 8. one-way valve; 9. water pipe; 10. partition; 11. support plate; 12. exhaust duct; 13. exhaust fan; 14. air inlet duct. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described below in conjunction with the drawings in the embodiments of the present invention. The described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Specific embodiment 1

[0027] See also Figure 1-5 The utility model is a constant temperature cold compress cooling device, comprising a bandage 1, a heat preservation bag 2 is installed on the top of the bandage 1, and a first heat conduction tube 3 and a second heat conduction tube 4 are fixedly connected to the inside of the heat preservation bag 2;

[0028] A heat exchange component is provided on one side of the strap 1, and the heat exchange component includes a heat exchange shell 5, which is fixedly connected to one side of the strap 1. A micro screw pump 6 is installed inside the heat exchange shell 5, and a semiconductor refrigerator 7 is provided inside the heat exchange shell 5. A one-way valve 8 is provided on the surface of the first temperature conducting tube 3.

[0029] Specifically: the bottom of the strap 1 is made of elastic band material, which can provide elastic contraction when the patient wears it on the head, thereby increasing the fit of the wearer. The first thermal conductive tube 3 and the second thermal conductive tube 4 are both made of corrugated hose material, which can transfer the temperature to the insulation bag 2 when the water flows through. The bottom layer of the insulation bag 1 is made of silicone material, which can increase the heat conduction effect, so that the temperature of the water flow can pass through the silicone to conduct to the human skin. The micro screw pump 6 pushes the fluid along the thread through the rotation of the screw to realize the water conveying effect. At the same time, the screw pump has good self-priming ability and two-way operation ability. The screw pump can realize forward and reverse delivery of liquid by changing the rotation direction of the screw. Specific embodiment 2

[0031] See also Figure 1-5On the basis of the specific embodiment 1, the left end of the first temperature conducting pipe 3 is connected with the water pipe 9, the other end of the water pipe 9 passes through the interior of the heat exchange shell 5 and is connected with the micro screw pump 6, the left end of the second temperature conducting pipe 4 is connected with the water pipe 9, the other end of the second temperature conducting pipe 4 is connected with the heat exchange shell 5, the right end of the first temperature conducting pipe 3 is connected with the second temperature conducting pipe 4, a partition 10 is fixedly connected to the surface of the semiconductor refrigerator 7, both sides of the partition 10 are fixedly connected to the inner wall of the heat exchange shell 5, the top of the micro screw pump 6 is connected with a support plate 11, both sides of the support plate 11 are fixedly connected to the inner wall of the heat exchange shell 5, the front side of the heat exchange shell 5 is connected with an exhaust pipe 12, an exhaust fan 13 is installed inside the exhaust pipe 12, the rear side of the heat exchange shell 5 is connected with an air inlet pipe 14, and a dust screen is fixedly connected to the air inlet pipe 14.

[0032] Specifically: the cooling end of the semiconductor refrigerator 7 is located at the bottom of the partition 10, and the heat exchange end of the semiconductor refrigerator 7 is located at the top of the partition 10. The core of the semiconductor refrigerator 7 is the Peltier element. These elements are usually formed by alternating and connecting n-type and p-type semiconductor materials. When current passes through these materials, according to the Peltier effect, one side absorbs heat (becomes cold) and the other side releases heat (becomes hot). By controlling the direction and magnitude of the current, the working mode and strength of the refrigerator can be controlled. The one-way valve 8 is mounted on the surface of the first temperature conducting tube 3, which can control the water flow direction of the first temperature conducting tube 3. The first temperature conducting tube 3 and the second temperature conducting tube 4 are both connected to the water pipe 9, and are connected to the water outlet of the micro screw pump 6 through the water pipe 9. The exhaust fan 13 can drive the air flow inside the heat exchange shell 5 to increase the heat exchange effect of the semiconductor refrigerator 7. The top of the support plate 11 is used to store liquid water. A temperature sensor is installed on the top of the support plate 11. A battery is installed inside the heat exchange shell 5 to serve as a power supply.

[0033] The working principle of the present invention is as follows: the medical staff moves the bandage 1 so that the bottom of the thermal insulation bag 2 is attached to the patient's head. Then, the external controller starts the semiconductor refrigerator 7 and the micro screw pump 6. The semiconductor refrigerator cools the water at the bottom of the partition 10. The micro screw pump 6 pumps the cooled water into the water pipe 9. The water is respectively injected into the first thermal conduction pipe 3 and the second thermal conduction pipe 4 through the water pipe 9 for circulation. When the circulating water flows into the thermal insulation bag 2, the temperature of the water flow can be transferred to the patient's forehead, thereby achieving the effect of constant temperature cold compress.

[0034] When the cold compress temperature is low and the patient feels uncomfortable, the micro screw pump 6 can be controlled to deliver water in reverse, and water can be drawn in through the water pipe 9. The water flows into the water pipe 9 through the second temperature conducting pipe 4, and the one-way valve 8 limits the water flow into the first temperature conducting pipe 3, thereby reducing the range of water flow, achieving the effect of controlling the ice compress temperature and improving the cold compress effect.

[0035] The standard parts used in the present invention can all be purchased from the market, and can be customized according to the description in the specification and drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology. The control method is automatically controlled by a control unit. The control circuit of the control unit can be implemented by simple programming by technicians in this field, which is common knowledge in this field. Therefore, the control method and circuit connection are no longer explained in detail in the present invention.

[0036] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all details in detail, nor do they limit the present invention to only the specific implementation methods described. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that technicians in the relevant technical field can better understand and utilize the present invention.

Claims

1. A constant temperature cold compress cooling device, comprising a bandage (1), characterized in that: A heat preservation bag (2) is installed on the top of the binding belt (1), and a first heat conduction tube (3) and a second heat conduction tube (4) are fixedly connected inside the heat preservation bag (2); A heat exchange component is provided on one side of the binding band (1), and the heat exchange component includes a heat exchange shell (5). The heat exchange shell (5) is fixedly connected to one side of the binding band (1), a micro screw pump (6) is installed inside the heat exchange shell (5), a semiconductor refrigerator (7) is provided inside the heat exchange shell (5), and a one-way valve (8) is provided on the surface of the first temperature conducting tube (3); The left end of the first temperature conducting tube (3) is connected to a water supply pipe (9), and the other end of the water supply pipe (9) passes through the interior of the heat exchange shell (5) and is connected to a micro screw pump (6); The left end of the second temperature conducting pipe (4) is connected to the water pipe (9), the other end of the second temperature conducting pipe (4) is connected to the heat exchange shell (5), and the right end of the first temperature conducting pipe (3) is connected to the second temperature conducting pipe (4); A partition (10) is fixedly connected to the surface of the semiconductor refrigerator (7), and both sides of the partition (10) are fixedly connected to the inner wall of the heat exchange shell (5); The top of the micro screw pump (6) is connected to a support plate (11), and both sides of the support plate (11) are fixedly connected to the inner wall of the heat exchange shell (5); The front side of the heat exchange shell (5) is connected to an exhaust pipe (12), and an exhaust fan (13) is installed inside the exhaust pipe (12); The rear side of the heat exchange shell (5) is connected to an air inlet pipe (14), and a dust screen is fixedly connected to the interior of the air inlet pipe (14).

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