Inclined through hole machining system

Abstract

The utility model discloses an inclined through hole machining system. Comprising a laser used for outputting laser and further comprises a beam expander and a shaper used for shaping the laser beam into a Bessel beam, the beam expander is located on a laser emitting path of the laser, and the shaper is connected with an angle adjusting unit used for adjusting the installation inclination angle of the shaper. An optical path transmission mirror group is arranged between the beam expander and the shaper, an angle is formed between the optical axis of incident light of the optical path transmission mirror group and the optical axis of emergent light of the optical path transmission mirror group, the optical axis of the emergent light of the optical path transmission mirror group is perpendicular to the shaper, and an angle is formed between the optical axis of the emergent light of the shaper and the surface of the workbench. According to the utility model, the laser beam is shaped into the Bessel beam with a certain focal depth, and the Bessel beam is adopted to carry out inclined through hole processing on the material, so that cracks are not easy to generate in the material, the heat influence is small, the roundness of the obtained micropore is higher, the consistency is good, the production efficiency is high, and the device is suitable for mass production.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to an oblique through-hole processing system. Background Art

[0002] Through Glass Via (TGV) refers to vertical electrical interconnects that pass through a glass substrate. TGV technology creates tiny vertical through-holes in a glass substrate and fills them with conductive material to achieve electrical connections. It is a material alternative to silicon substrates. TGV is an advanced three-dimensional integrated circuit technology that enables device miniaturization, high-density packaging, and gigahertz-speed data processing in various markets, including data centers, 5G communication networks, and IoT devices. TGV has applications in optical communications, RF modules, optoelectronic system integration, MEMS packaging, consumer electronics, electronic gas amplifiers, and medical devices.

[0003] Traditional micro-hole machining equipment typically performs vertical micro-hole (TGV) processing, while research on oblique micro-hole (TGV) processing is limited. Existing oblique micro-hole processing methods involve tilting the sample and then using ablation to perform layered processing. This process is complex and suffers from poor precision. Therefore, an oblique through-hole processing system is urgently needed to address these issues. Utility Model Content

[0004] In order to solve the above problems, the utility model provides an oblique through-hole processing system, comprising a laser for outputting laser, a beam expander and a shaper for shaping the laser beam into a Bessel beam, wherein the beam expander is located on the laser emission path of the laser, and the shaper is connected to an angle adjustment unit for adjusting its installation tilt angle, and an optical path transmission mirror group is provided between the beam expander and the shaper, and there is an angle between the optical axis of the incident light of the optical path transmission mirror group and the optical axis of the output light of the optical path transmission mirror group, and the optical axis of the output light of the optical path transmission mirror group is perpendicular to the shaper, and there is an angle between the optical axis of the output light of the shaper and the workbench surface.

[0005] Furthermore, the focal depth of the Bessel beam defined by the shaper is greater than the thickness of the sample.

[0006] Furthermore, the shaper includes an axicon, a focusing lens and an objective lens, the distance between the focusing lens and the objective lens is adjustable, and the axicon, focusing lens and objective lens are arranged in sequence along the transmission direction of the laser.

[0007] Furthermore, the shaper further comprises a protective lens, which is arranged on a side of the objective lens away from the focusing lens.

[0008] Furthermore, the angle adjustment unit includes a rotating motor, and the shaper is arranged at an output end of the rotating motor.

[0009] Furthermore, the angle adjustment unit includes a mounting plate, on which two groups of mounting holes are provided in the longitudinal direction, each group of mounting holes includes a plurality of mounting holes, and the shaper is selectively connected to one of the mounting holes in the two groups of mounting holes.

[0010] Furthermore, the optical axis of the light emitted by the shaper is inclined at a certain angle relative to the vertical direction, and the inclination angle is not greater than 20°.

[0011] Furthermore, the optical path transmission mirror group includes a plurality of reflectors arranged in sequence along the transmission direction of the laser, and the pitch angle of at least one of the reflectors is adjustable.

[0012] Furthermore, the workbench is connected to a motion platform for adjusting its spatial position.

[0013] Furthermore, the workbench is provided with a cavity and a plurality of adsorption holes communicated with the cavity, and the cavity is connected to the negative pressure vacuum equipment through a gas pipeline.

[0014] Due to the adoption of the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0015] The inclined through-hole processing system provided by the utility model shapes the laser beam into a Bessel beam with a certain focal depth, and uses the Bessel beam to perform inclined through-hole processing on the material. Cracks are not easily generated inside the material, the thermal impact is small, the obtained micro-holes have higher roundness and good consistency, the production efficiency is high, and it is suitable for mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic structural diagram of the oblique through-hole machining system provided by the present invention;

[0018] Figure 2 This is a structural diagram of a shaper in the oblique through-hole processing system provided by the present invention;

[0019] Figure 3 This is a schematic diagram of a sample processed according to the present invention.

[0020] 1-Laser; 2-Beam expander; 3-Optical path transmission lens group; 4-Angle adjustment unit; 5-Shaper; 51-Axicon; 52-Focusing lens; 53-Objective lens; 54-Protective lens; 55-Focal depth; 6-Workbench; 7-Motion platform; 8-Sample; 9-Control unit. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention. In the drawings, the size and relative sizes of some parts may be exaggerated for clarity.

[0022] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connection" and "connected" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In the description of the present invention, the terms "up", "down", "left", "right", "front", "back", "center", "horizontal", "vertical", "top", "bottom", "inside", "outside" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0024] Furthermore, in the description of this utility model, the terms "first" and "second" are used solely to distinguish between the features in the description and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Furthermore, features designated as "first" or "second" may explicitly or implicitly include one or more of the features.

[0025] As the instruction manual Figure 1As shown, the utility model provides an oblique through-hole processing system, comprising a laser 1 for outputting laser light, a beam expander 2, and a shaper 5 for shaping the laser beam into a Bessel beam, wherein the beam expander 2 is located on the laser emission path of the laser 1, and the shaper 5 is connected to an angle adjustment unit 4 for adjusting its installation tilt angle, and an optical path transmission mirror group 3 is provided between the beam expander 2 and the shaper 5, wherein an angle is formed between the incident light axis of the optical path transmission mirror group 3 and the output light axis of the optical path transmission mirror group 3, and the output light axis of the optical path transmission mirror group 3 is perpendicular to the shaper 5, and the optical path transmission mirror group 3 is perpendicular to the shaper 5. There is an angle between the optical axis of the output light from the shaper 5 and the surface of the workbench 6. In this embodiment, the laser beam adjusts the optical path transmission path through the optical path transmission mirror group. The intersection angle between the optical axis of the incident light from the optical path transmission mirror group and the optical axis of the output light from the optical path transmission mirror group is an acute angle. The laser light after passing through the optical path transmission mirror group is vertically incident on the shaper and is shaped into a Bessel beam by the shaper. The intersection angle between the optical axis of the output light from the shaper and the surface of the workbench is an acute angle. The Bessel beam is incident on the sample on the workbench at a certain angle, wherein the inclination angle of the Bessel beam is adapted to the inclination angle of the oblique through hole to be processed in the sample.

[0026] Specifically, the processing system in this embodiment is suitable for processing oblique through-holes, and is particularly suitable for processing through-holes of transparent brittle materials. The sample can be transparent glass, quartz, etc. The processing of the oblique through-hole on sample 8 is achieved by adjusting the laser path. The optical transmission mirror group 3 can adjust the transmission path of the laser beam. In this embodiment, the optical axis of the incident light of the optical transmission mirror group 3 is horizontal. After passing through the optical transmission mirror group 3, there is a certain angle between the optical axis of the outgoing light of the optical transmission mirror group and the vertical direction. The shaper 5 is located above the sample. The shaper installation tilt angle is adjusted so that the laser beam is perpendicular to the shaper 5. After the beam is shaped into a Bessel beam by the shaper 5, it acts on the sample at a certain angle, which can complete the processing of the oblique through-hole on the sample 8. As shown in the attached manual Figure 3 shown.

[0027] Preferably, the laser 1 is an ultrafast laser, which can be an infrared band laser or a green band laser, and the laser pulse width is 50fs-5ps. The laser beam emitted by the laser 1 passes through the shaper 5, and the shaper 5 can transform the Gaussian spot into a ring-shaped Bessel beam. The Bessel beam acts on the transparent sample, and cracks are not easily generated inside the sample, and the thermal impact is small. The micropores obtained after subsequent chemical etching have higher roundness, and the micropores processed by the Bessel beam have good consistency and high production efficiency, which is easy to achieve mass production.

[0028] In an optimized implementation method, the focal depth of the Bessel beam obtained by the shaper 5 is greater than the thickness of the sample 8. The Bessel beam has a certain focal depth, which is greater than the thickness of the sample. During the processing, the distance between the sample 8 and the shaper 5 is adjusted to ensure that the entire sample thickness is within the Bessel focal depth range. The Bessel beam can pass through the sample. The processing method is a pulse impact method, from top to bottom, and the processing of a single oblique through hole is completed instantly. There is no need for layered processing, and the micro-hole processing consistency is high.

[0029] Of course, this embodiment can also process samples whose thickness is greater than the focal depth of the Bessel beam, such as blind hole processing, or adjusting the distance between the sample and the shaper during processing. Multiple layered processing can complete through-hole processing of thicker samples.

[0030] In an optimized implementation method, the beam expander 2 is arranged at the laser output end of the laser 1, and can amplify the laser spot emitted by the laser. The beam expansion factor is determined according to the incident spot size required by the shaper 5, ensuring that the laser beam can enter the shaper 5 after being expanded by the beam expander 2.

[0031] Optimize the implementation method, as shown in the attached instructions Figure 2 As shown, the shaper 5 includes an axicon 51, a focusing lens 52 and an objective lens 53. The spacing between the focusing lens 52 and the objective lens 53 is adjustable. The axicon 51, the focusing lens 52 and the objective lens 53 are arranged in sequence along the transmission direction of the laser. The axicon 51, the focusing lens 52 and the objective lens 53 are integrated in the shell to form an integrated structure. The axicon 51, the focusing lens 52 and the objective lens 53 are coaxially arranged. During use, the tilt angle of the shell can be adjusted so that the laser beam after passing through the optical path transmission lens group 3 is vertically incident on the mirror surface of the axicon 51.

[0032] Preferably, one end of the axicon mirror 51 is conical, positioned toward the focusing lens 52. The axicon mirror 51 transforms the Gaussian spot into an annular Bessel beam. The focusing lens 52 and the objective lens 53 form a bi-telecentric structure, forming a Bessel beam with a specific depth of focus. The spacing between the focusing lens 52 and the objective lens 53 is adjustable, allowing fine-tuning of the Bessel beam's focal depth 55 to accommodate samples of varying thicknesses. In this embodiment, the Bessel beam has a focal depth of 0.5 mm to 3 mm. For samples up to 3 mm thick, the focal depth fully covers the sample thickness. The Bessel beam pulses the sample, creating a modified zone that completely penetrates the glass, completing the processing of the sample's oblique through-hole.

[0033] In an optimized implementation manner, the shaper 5 further includes a protective mirror 54, which is arranged on a side of the objective lens 53 away from the focusing lens 52. The protective mirror is arranged on the housing and is coaxially arranged with other lenses in the housing. The protective mirror 54 is preferably a quartz lens and is used to protect the objective lens 53.

[0034] In an optimized embodiment, the optical path transmission mirror assembly 3 includes multiple reflectors arranged sequentially along the transmission direction of the laser light. At least one of the reflectors has an adjustable pitch angle. The transmission path of the laser beam is adjusted via the reflectors. The mounting angle of the shaper 5 is adjusted according to the tilt angle of the oblique through-hole, allowing the beam to pass through the shaper 5 and act on the sample 8. The reflectors are adjusted so that the laser light emitted by the beam expander 2 is perpendicularly incident on the center of the shaper 5. The laser beam acts on the sample at a specific tilt angle, completing the processing of the oblique through-hole. In this embodiment, there are three reflectors. The number and placement of the reflectors can be adjusted based on actual conditions to ensure that the laser beam achieves the desired tilt angle after being reflected by each reflector in sequence.

[0035] Of course, the processing system in this embodiment can also complete the processing of vertical microholes. The shaper 5 is set vertically, and the laser beam is vertically incident on the shaper after passing through the optical path transmission mirror group 3. The Bessel beam obtained after being shaped by the shaper 5 acts vertically on the sample 8 to complete the processing of the vertical through hole of the sample 8.

[0036] Preferably, the pitch angle of at least one reflector in the optical path transmission mirror group 3 is adjustable. By adjusting the mirror tilt angle of the reflector, the transmission path of the optical path can be adjusted, and the angle between the laser beam and the sample 8 can be adjusted to realize the processing of oblique through holes with different tilt angles.

[0037] The installation angle of the shaper 5 can be achieved in the following two ways:

[0038] As one of the specific implementations, the angle adjustment unit 4 includes a rotary motor, and the shaper 5 is arranged at the output end of the rotary motor. The rotary motor can rotate, thereby driving the shaper 5 to rotate in a vertical plane to adjust its installation tilt angle.

[0039] As one of the specific embodiments, the angle adjustment unit 4 includes a mounting plate, on which two groups of mounting hole groups are provided in the longitudinal direction, each group of the mounting hole groups includes a number of mounting holes, and the mounting holes of the two groups of mounting hole groups are arranged one by one relative to each other. By selecting the upper and lower mounting holes, different installation inclination angles can be met, and the shaper is fixed on the mounting hole according to the set installation inclination angle.

[0040] The installation inclination angle of the shaper 5 can be adjusted by the above two methods to meet the needs of through-hole processing with different inclination angles.

[0041] In an optimized embodiment, the optical axis of the light emitted by the shaper 5 is tilted at a certain angle relative to the vertical, and the tilt angle is not greater than 20°. The angle between the laser beam used for sample processing and the vertical is determined according to the actual oblique through hole to be processed in the sample.

[0042] The optimized embodiment further includes a workbench 6 for placing a sample 8, connected to a motion platform 7 for adjusting its spatial position. The motion platform 7 is preferably a three-dimensional motion platform, capable of adjusting the spatial position of the workbench along the X, Y, and Z axes, thereby adjusting the spatial position of the sample 8. The motion platform drives the sample up and down to position the sample at the center of the focal depth of the Bessel beam, enabling the processing of different patterns through X, Y, and Z axis motion. The motion platform 7 is an existing motion platform, and therefore will not be described in detail here.

[0043] In an optimized embodiment, the workbench 6 is preferably a suction-type workbench. A cavity is defined within the workbench 6 , and a plurality of suction holes are formed on the workbench 6 , communicating with the cavity. The cavity is connected to a negative pressure vacuum device via a gas pipeline. When the negative pressure vacuum device is activated, the sample 8 is suctioned onto the workbench 6 , preventing sample 8 from shifting during processing and ensuring accurate micro-hole processing.

[0044] The optimized implementation method also includes a control unit 9. The laser 1, rotating motor, motion platform 7 and negative pressure vacuum equipment are electrically connected to the control unit respectively. The control unit can send action instructions to turn the laser on and off and stabilize the pulse output. The rotating motor can be rotated to a set position according to the inclination angle of the inclined through hole of the sample, and the motion platform can also be moved according to the control instructions to complete the inclined through hole processing.

[0045] The operating principle of the oblique through-hole machining system of the present invention is to adjust the mounting tilt angle of the shaper 5 according to the oblique through-hole angle of the sample to be machined, ensuring that the Bessel beam is at the desired angle relative to the vertical direction. The reflector is adjusted so that the laser beam is incident perpendicularly into the shaper 5. The motion platform 7 is adjusted so that the sample 8 is within the focal depth of the Bessel beam, and the sample 8 is adsorbed on the workbench 6. Laser 1 is turned on, and the Gaussian light emitted by laser 1 is amplified by the center of the beam expander 2. The amplified Gaussian light is then deflected by the optical transmission mirror assembly 3 and incident perpendicularly into the shaper. The Gaussian light is shaped by the shaper into a Bessel beam with a fixed focal depth. The Bessel beam acts on the sample, completing the oblique through-hole machining of the sample.

[0046] In this application, a Bessel beam shaped with ultra-high peak power density is used for processing, which instantly acts on the inside of the transparent material to form a tiny laser-modified channel. Based on the anisotropic corrosion rate characteristics of the modified and non-modified areas, a higher aspect ratio and a controllable morphology through-hole can be obtained through chemical etching in the subsequent corrosion treatment after laser processing.

[0047] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0048] Those skilled in the art will appreciate that the present invention may be implemented in many other specific forms without departing from the spirit and scope of the present invention. Although embodiments of the present invention have been described, it should be understood that the present invention should not be limited to these embodiments, and those skilled in the art may make changes and modifications within the spirit and scope of the present invention as defined by the appended claims.

Claims

1. An oblique through-hole processing system, comprising a laser for outputting laser light, characterized in that: It also includes a beam expander and a shaper for shaping the laser beam into a Bessel beam, the beam expander is located on the laser output path of the laser, the shaper is connected to an angle adjustment unit for adjusting its installation tilt angle, an optical path transmission mirror group is provided between the beam expander and the shaper, an angle is formed between the optical axis of the incident light of the optical path transmission mirror group and the optical axis of the output light of the optical path transmission mirror group, the optical axis of the output light of the optical path transmission mirror group is perpendicular to the shaper, and an angle is formed between the optical axis of the output light of the shaper and the workbench surface.

2. The oblique through-hole machining system according to claim 1, characterized in that: The focal depth of the Bessel beam defined by the shaper is greater than the thickness of the sample.

3. The oblique through-hole machining system according to claim 1, wherein: The shaper includes an axicon, a focusing lens and an objective lens. The distance between the focusing lens and the objective lens is adjustable. The axicon, the focusing lens and the objective lens are arranged in sequence along the transmission direction of the laser.

4. The oblique through-hole machining system according to claim 3, characterized in that: The shaper further includes a protection lens, which is arranged on a side of the objective lens away from the focusing lens.

5. The oblique through-hole machining system according to claim 1, wherein: The angle adjustment unit includes a rotary motor, and the shaper is arranged at an output end of the rotary motor.

6. The oblique through-hole machining system according to claim 1, wherein: The angle adjustment unit includes a mounting plate, and two groups of mounting holes are provided on the mounting plate in the longitudinal direction. Each group of mounting holes includes a plurality of mounting holes, and the shaper is selectively connected to one of the mounting holes in the two groups of mounting holes.

7. The oblique through-hole machining system according to claim 1, wherein: The optical axis of the light emitted by the shaper is inclined at a certain angle relative to the vertical direction, and the inclination angle is not greater than 20°.

8. The oblique through-hole machining system according to claim 1, wherein: The optical path transmission mirror group includes a plurality of reflectors arranged in sequence along the transmission direction of the laser, and the pitch angle of at least one of the reflectors is adjustable.

9. The oblique through-hole machining system according to claim 1, wherein: The workbench is connected to a motion platform for adjusting its spatial position.

10. The oblique through-hole machining system according to claim 1, wherein: The workbench is provided with a cavity and a plurality of adsorption holes communicated with the cavity, and the cavity is connected to the negative pressure vacuum equipment through a gas pipeline.

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