Semiconductor packaging metal bump welding device

Abstract

The utility model relates to the technical field of semiconductor packaging metal bump welding, and discloses a semiconductor packaging metal bump welding device which comprises a fixed base, a butt joint supporting rod is arranged on the outer surface of the fixed base, a mounting groove is formed in the upper surface of the fixed base, a rotary clamping disc is arranged on the upper surface of the fixed base, and a clamping groove is formed in the lower surface of the rotary clamping disc. A driven worm gear is installed on the bottom face of the rotating clamping disc, a driving worm is connected to the side face of the driven worm gear, and a driving shaft is arranged on the driving worm. According to the welding device, the rotary clamping disc is arranged on the fixed base, the angle of the rotary clamping disc can be adjusted at will under the combined action of the driving rod, the driving worm and the driven worm gear, and the rotary clamping disc cannot automatically rotate in the welding process due to the self-locking effect of the driving worm and the driven worm gear; therefore, the metal bump can be accurately welded at a specified position on the semiconductor, and the qualified rate of products is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor package metal bump welding, in particular to a semiconductor package metal bump welding device. Background Art

[0002] In the field of semiconductor packaging, metal bump welding devices are one of the key technologies for connecting chips with external circuits. Metal bumps are small protrusions made on the surface of the chip. They are very small, usually only tens to hundreds of microns in size. The main function of these bumps is to provide electrical connections between the chip and other electronic components, increase connection density, and reduce size.

[0003] In actual practical situations, the accuracy of the metal bump welding position directly affects whether the chip can be used normally in the future. However, when the existing welding device continuously performs the metal bump welding operation on the chip, it is inevitable that the structure fixing the chip will be displaced, thereby affecting the accuracy of the welding position. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor package metal bump welding device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a semiconductor package metal bump welding device, comprising a fixed base, the outer surface of the fixed base is provided with a docking support rod, the upper surface of the fixed base is provided with a mounting groove, the upper surface of the fixed base is provided with a rotating clamping disk, the bottom surface of the rotating clamping disk is provided with a driven worm gear, the side of the driven worm gear is connected to a driving worm, the driving worm is provided with a driving shaft, the upper surface of the rotating clamping disk is provided with a limiting slide groove, the interior of the limiting slide groove is provided with a threaded rod, and a movable clamp is installed on the threaded rod.

[0006] As a further description of the above technical solution: a fixed support plate is installed on the outer surface of the fixed base, a fixed track is provided on the upper surface of the fixed support plate, a positioning groove is provided on the fixed track, a movable positioning rod is provided inside the fixed track, a through groove is provided on the movable positioning rod, and a positioning block is connected between the movable positioning rod and the fixed track.

[0007] As a further description of the above technical solution: the docking support rod is fixedly connected to the fixed base, the mounting groove is opened in the middle position of the upper surface of the fixed base, the rotating clamping disk is circular in shape, and the rotating clamping disk is rotatably connected to the fixed base.

[0008] As a further description of the above technical solution: the driven worm gear is fixedly connected to the bottom of the rotating clamping disk, the driving worm is meshedly connected to the driven worm gear, the driving shaft is fixedly connected to the driving worm, and the driving shaft passes through and is rotatably connected to the fixed base.

[0009] As a further description of the above technical solution: the limiting slide is symmetrically opened on the rotating clamping disk, the threaded rod is rotatably connected to the inside of the limiting slide, the movable clamp is slidably connected to the inside of the limiting slide, and the movable clamp is threadedly connected to the threaded rod.

[0010] As a further description of the above technical solution: the fixed support plates are evenly distributed on the outer surface of the fixed base, the fixed support plates are fixedly connected to the fixed base, the fixed rails are fixedly connected to the upper surface of the fixed support plates, and the positioning grooves pass through and connect the fixed rails.

[0011] As a further description of the above technical solution: the movable positioning rod is slidably connected to the fixed rail, the through groove is opened in the middle position of the movable positioning rod, the outer surface of the positioning block is provided with a threaded structure, and the positioning block is threadedly connected to the movable positioning rod.

[0012] The utility model has the following beneficial effects:

[0013] 1. In the utility model, a rotating clamping disk is provided on the fixed base. The angle of the rotating clamping disk can be adjusted at will under the joint action of the driving rod, the driving worm and the driven worm gear. In addition, the rotating clamping disk will not rotate independently during the welding process due to the self-locking effect of the driving worm and the driven worm gear, thereby ensuring that the metal bump can be accurately welded to the specified position on the semiconductor and ensuring the qualified rate of the product.

[0014] 2. In the utility model, a movable positioning rod is provided at the top of the fixed track. The movable positioning rod can adjust its position along the fixed track. The movable positioning rod can fix its own position under the action of the friction between the positioning block and the fixed track. There are two groups of movable positioning rods. The two groups of movable positioning rods can be used together to help workers quickly locate the welding position, and can be used repeatedly, effectively improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of a semiconductor package metal bump welding device proposed by the present invention;

[0016] Figure 2 This is an exploded three-dimensional structural diagram of a semiconductor package metal bump welding device proposed by the present invention;

[0017] Figure 3The present invention provides a schematic diagram of a partially exploded three-dimensional structure of a semiconductor package metal bump welding device.

[0018] Legend:

[0019] 1. Fixed base; 2. Docking support rod; 3. Mounting slot; 4. Rotating clamping plate; 5. Driven worm gear; 6. Driving worm; 7. Driving shaft; 8. Limiting slide; 9. Threaded rod; 10. Movable clamping block; 11. Fixed support plate; 12. Fixed rail; 13. Positioning slide; 14. Movable positioning rod; 15. Through slot; 16. Positioning block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Reference Figure 1-Figure 3 The utility model provides an embodiment: a semiconductor package metal bump welding device, including a fixed base 1, the outer surface of the fixed base 1 is provided with a docking support rod 2, the upper surface of the fixed base 1 is provided with a mounting groove 3, the upper surface of the fixed base 1 is provided with a rotating clamping disk 4, the bottom surface of the rotating clamping disk 4 is installed with a driven worm gear 5, the side of the driven worm gear 5 is connected to a driving worm 6, the driving worm 6 is provided with a driving shaft 7, the upper surface of the rotating clamping disk 4 is provided with a limiting slide groove 8, the interior of the limiting slide groove 8 is provided with a threaded rod 9, and a movable clamping block 10 is installed on the threaded rod 9.

[0022] A fixed support plate 11 is installed on the outer surface of the fixed base 1, and a fixed rail 12 is provided on the upper surface of the fixed support plate 11. A positioning groove 13 is provided on the fixed rail 12. A movable positioning rod 14 is provided inside the fixed rail 12, and a through groove 15 is provided on the movable positioning rod 14. A positioning block 16 is connected between the movable positioning rod 14 and the fixed rail 12.

[0023] The docking support rod 2 is fixedly connected to the fixed base 1, and the mounting groove 3 is opened in the middle position of the upper surface of the fixed base 1. The rotating clamping disk 4 is circular in shape, and the rotating clamping disk 4 is rotatably connected to the fixed base 1. When in use, the staff can connect and fix the welding robot arm (not shown in the figure) to the docking support rod 2 by bolt fastening, so as to facilitate the welding operation of the metal bump.

[0024] The driven worm gear 5 is fixedly connected to the bottom of the rotating clamping disk 4, the driving worm 6 is meshed and connected to the driven worm gear 5, the driving shaft 7 is fixedly connected to the driving worm 6, and the driving shaft 7 passes through and is rotatably connected to the fixed base 1. The cooperation between the driving worm 6 and the driven worm gear 5 can ensure that the rotating clamping disk 4 will not rotate autonomously.

[0025] The limiting slide 8 is symmetrically opened on the rotating clamping disk 4 , the threaded rod 9 is rotatably connected to the inside of the limiting slide 8 , the movable clamping block 10 is slidably connected to the inside of the limiting slide 8 , and the movable clamping block 10 is threadedly connected to the threaded rod 9 .

[0026] The fixed support plates 11 are evenly distributed on the outer surface of the fixed base 1 . The fixed support plates 11 are fixedly connected to the fixed base 1 . The fixed rails 12 are fixedly connected to the upper surface of the fixed support plates 11 . The positioning slots 13 penetrate and connect the fixed rails 12 .

[0027] The movable positioning rod 14 is slidably connected to the fixed rail 12, and the through groove 15 is opened in the middle position of the movable positioning rod 14. The outer surface of the positioning block 16 is provided with a threaded structure, and the positioning block 16 is threadedly connected to the movable positioning rod 14. There are two groups of movable positioning rods 14, and the two groups of movable positioning rods 14 are vertically arranged. The two groups of movable positioning rods 14 are attached to each other up and down, and the two groups of movable positioning rods 14 can be displaced.

[0028] Working principle: Place the semiconductor that needs to be welded with metal bumps on the upper surface of the rotating clamping disk 4, and the staff manually rotates the threaded rod 9. As the threaded rod 9 rotates, the movable clamping block 10 set on the threaded rod 9 begins to move along the limiting slide groove 8 until the movable clamping block 10 fixes the semiconductor on the rotating clamping disk 4. At this time, the staff manually rotates the positioning block 16. As the positioning block 16 rotates, the end position of the positioning block 16 is separated from the outer surface of the fixed rail 12. After the positioning block 16 is separated, the movable positioning rod 14 can be displaced at the top end of the fixed rail 12. As the position of the movable positioning rod 14 moves, the two sets of movable positioning rods 14 will accurately locate the welding position on the semiconductor.

[0029] After the movable positioning rod 14 positions the welding position, the robotic arm connected and fixed to the docking support rod 2 can be started to complete the welding of the metal bump through the welding position defined by the two sets of movable positioning rods 14. At the same time, the staff can drive the driving worm 6 to rotate through the driving shaft 7, and the rotation of the driving worm 6 drives the rotating clamping disk 4 to rotate on the upper surface of the fixed base 1, so that the device can fix the metal bump at any position on the semiconductor, and can avoid the situation where the robotic arm is inconvenient to perform welding. The coordinated use of the driven worm gear 5 and the driving worm 6 can ensure that the semiconductor will not be displaced or rotated during the welding process, thereby ensuring the accuracy of the welding position.

[0030] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor package metal bump welding device, comprising a fixed base (1), characterized in that: The outer surface of the fixed base (1) is provided with a docking support rod (2), the upper surface of the fixed base (1) is provided with a mounting groove (3), the upper surface of the fixed base (1) is provided with a rotating clamping disk (4), the bottom surface of the rotating clamping disk (4) is provided with a driven worm gear (5), the side of the driven worm gear (5) is connected to a driving worm (6), the driving worm (6) is provided with a driving shaft (7), the upper surface of the rotating clamping disk (4) is provided with a limiting slide groove (8), the interior of the limiting slide groove (8) is provided with a threaded rod (9), and the threaded rod (9) is provided with a movable clamping block (10).

2. The semiconductor package metal bump welding device according to claim 1, characterized in that: A fixed support plate (11) is installed on the outer surface of the fixed base (1), a fixed track (12) is provided on the upper surface of the fixed support plate (11), a positioning slot (13) is provided on the fixed track (12), a movable positioning rod (14) is provided inside the fixed track (12), a through slot (15) is provided on the movable positioning rod (14), and a positioning block (16) is connected between the movable positioning rod (14) and the fixed track (12).

3. The semiconductor package metal bump welding device according to claim 1, characterized in that: The docking support rod (2) is fixedly connected to the fixed base (1), the mounting groove (3) is provided in the middle position of the upper surface of the fixed base (1), the rotating clamping disc (4) is circular in shape, and the rotating clamping disc (4) is rotatably connected to the fixed base (1).

4. The semiconductor package metal bump welding device according to claim 1, characterized in that: The driven worm gear (5) is fixedly connected to the bottom of the rotating clamping disc (4), the driving worm (6) is meshedly connected to the driven worm gear (5), the driving shaft (7) is fixedly connected to the driving worm (6), and the driving shaft (7) passes through and is rotatably connected to the fixed base (1).

5. The semiconductor package metal bump welding device according to claim 2, characterized in that: The limiting slide groove (8) is symmetrically opened on the rotating clamping disk (4), the threaded rod (9) is rotatably connected to the inside of the limiting slide groove (8), the movable clamping block (10) is slidably connected to the inside of the limiting slide groove (8), and the movable clamping block (10) is threadedly connected to the threaded rod (9).

6. The semiconductor package metal bump welding device according to claim 2, characterized in that: The fixed support plate (11) is evenly distributed on the outer surface of the fixed base (1), the fixed support plate (11) is fixedly connected to the fixed base (1), the fixed rail (12) is fixedly connected to the upper surface of the fixed support plate (11), and the positioning slide groove (13) passes through and connects to the fixed rail (12).

7. The semiconductor package metal bump welding device according to claim 2, characterized in that: The movable positioning rod (14) is slidably connected to the fixed rail (12), the through slot (15) is opened at the middle position of the movable positioning rod (14), the outer surface of the positioning block (16) is provided with a threaded structure, and the positioning block (16) is threadedly connected to the movable positioning rod (14).

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