Wafer grinding head assembly convenient to assemble and disassemble

Abstract

The wafer grinding head assembly convenient to assemble and disassemble comprises a water spraying component, the water spraying component comprises a base, a supporting frame is arranged on the outer wall of the top of the base, a conveying pump is arranged on the outer wall of one side of the supporting frame, a water storage tank is connected to the top of the conveying pump, a supplementing opening is connected to the top of the water storage tank, and a fixing frame is arranged on the outer wall of the top of the base. Multiple sets of grinding frames are sequentially arranged at the top of the fixing frame, multiple sets of speed adjusting motors are arranged at the bottom of the fixing frame, each set of grinding frame is connected with the corresponding speed adjusting motor, a spray head is arranged on the side, close to the fixing frame, of the supporting frame, one end of the spray head is connected to a conveying pump, and the spray head is matched with the grinding frames in position. An adjusting component used for adjusting the grinding angle and position is arranged on one side of the supporting frame and comprises an electric telescopic rod, the electric telescopic rod is fixed to the outer wall of one side of the supporting frame through a bolt, an open groove is formed in the top of the supporting frame, and a moving block is slidably installed at the open groove.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer grinding, in particular to a wafer grinding head assembly which is easy to assemble and disassemble. Background Art

[0002] During the semiconductor device manufacturing process, wafers must be polished and ground. Wafers are the silicon wafers used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. Silicon ingots are then sliced, ground, and polished to form silicon wafers, also known as wafers.

[0003] After searching, the Chinese patent application number 202320482270.5 discloses a high-efficiency quick-change wafer grinding head. Since the wafer needs to be sprayed with water during the grinding process for cooling and lubrication, the water spray can take away the heat generated during the grinding process to prevent the wafer from being damaged by excessive temperature during the grinding process. The device is not equipped with a water spray device during use, and cannot cool and lubricate the wafer during grinding, thereby failing to protect the surface quality and structural integrity of the wafer. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to provide a wafer grinding head assembly that is easy to assemble and disassemble.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A wafer grinding head assembly that is easy to load and unload, includes a water sprinkling component, the water sprinkling component includes a base, a support frame is provided on the top outer wall of the base, a delivery pump is provided on the outer wall of one side of the support frame, the top of the delivery pump is connected to a water tank, the top of the water tank is connected to a replenishing port, a fixed frame is provided on the top outer wall of the base, multiple groups of grinding frames are arranged in sequence on the top of the fixed frame, multiple groups of speed-regulating motors are provided at the bottom of the fixed frame, each group of grinding frames is respectively connected to the corresponding speed-regulating motor, a nozzle is provided on one side of the support frame close to the fixed frame, one end of the nozzle is connected to the delivery pump, the position of the nozzle is adapted to the grinding frame, and an adjustment component for adjusting the grinding angle and position is provided on one side of the support frame.

[0007] As a further solution of the present invention: the adjusting component includes an electric telescopic rod, which is fixed to the outer wall of one side of the support frame by bolts, and a slot is provided on the top of the support frame, and a moving block is slidably installed at the slot, and the telescopic end of one side of the electric telescopic rod is slidably connected to the slot of the support frame and is connected to the moving block, and a hydraulic telescopic rod is fixed to the outer wall of the top of the moving block by bolts, and the output end of the bottom of the hydraulic telescopic rod can slide through the moving block, and a rotating motor is installed at the bottom of the hydraulic telescopic rod, and a rotating shaft is connected to the bottom of the rotating motor, and a mounting frame is installed at the bottom of the rotating shaft, and an adjusting motor is fixed to the outer wall of one side of the mounting frame by bolts, and one side of the adjusting motor is connected to a fixed shaft, one end of the fixed shaft can rotatably pass through the mounting frame, and an adjusting frame is installed on one end of the fixed shaft, and a buffer component for protecting the wafer is provided on one side of the adjusting frame.

[0008] As a further solution of the present invention: the buffer component includes a sleeve, which is fixed to the outer wall of the bottom of the adjusting frame by bolts, a piston rod is slidably installed at one end of the sleeve, a spring is arranged in the sleeve, one end of the spring is fixed to the adjusting frame, and the other end is fixed to the piston rod, and a grinding component for grinding wafers is installed at one end of the piston rod.

[0009] As a further solution of the present invention: the grinding component includes a first connecting plate, the first connecting plate is fixed to the bottom of the piston rod, a second connecting plate is provided at the bottom of the first connecting plate, the first connecting plate and the second connecting plate are symmetrically provided with multiple groups of screw holes, a grinding motor is installed at the bottom of the second connecting plate, and the grinding motor is detachably installed with a grinding head.

[0010] As a further solution of the present invention: a sealing cover is installed at one end of the replenishing port, and the diameter of the top end of the sealing cover is slightly larger than the diameter of the replenishing port.

[0011] As a further solution of the present invention: an observation window is provided on one side of the water tank, and a scale sticker is pasted on one side of the observation window.

[0012] As a further solution of the present invention: a filter screen is detachably mounted on the inner wall of the replenishing port, and the inner diameter of the filter screen pores gradually expands in a funnel shape from top to bottom.

[0013] As a further solution of the present invention: a fixing bracket is fixed to the outer wall of the top of the base by bolts, and a control panel is installed on one side of the fixing bracket.

[0014] The beneficial effects of the utility model are:

[0015] 1. Water can be added to the water tank through the replenishment port. During the grinding process, the water in the water tank can be transported by the delivery pump, and the stored water is delivered to the nozzle for spraying. The spraying through the nozzle can cool the wafer and the grinding head, and can also play a role in cooling while lubricating, thereby protecting the surface quality and structural integrity of the wafer.

[0016] 2. The design of multiple grinding racks can simultaneously fix multiple groups of wafers for grinding, thereby effectively increasing the processing efficiency.

[0017] 3. Observe the remaining water volume through the transparent observation window, and the specific water volume through the scale sticker. You can find out the insufficient water volume in time and replenish it to avoid the situation where there is no water available. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram from a main perspective of a wafer grinding head assembly that is easy to assemble and disassemble, as proposed by the present invention;

[0019] Figure 2 This is a schematic structural diagram of a wafer grinding head assembly placement part that is easy to load and unload, as proposed by the present invention;

[0020] Figure 3 This is a schematic structural diagram of the water sprinkling portion of a wafer polishing head assembly that is easy to assemble and disassemble, as proposed by the present invention;

[0021] Figure 4 This is a structural schematic diagram of the grinding part of a wafer grinding head assembly that is easy to assemble and disassemble, as proposed by the present invention.

[0022] In the figure: 1-base, 2-piston rod, 3-speed regulating motor, 4-grinding frame, 5-fixed frame, 6-control panel, 7-sprinkler, 8-water tank, 9-electric telescopic rod, 10-support frame, 11-adjusting motor, 12-mounting frame, 13-rotating motor, 14-hydraulic telescopic rod, 15-rotating axis, 16-fixed axis, 17-sealing cover, 18-replenishing port, 19-observation window, 20-adjusting frame, 21-delivery pump, 22-casing, 23-first connecting plate, 24-second connecting plate, 25-grinding motor, 26-grinding head, 27-moving block, 28-spring, 29-filter. DETAILED DESCRIPTION

[0023] The technical solution of the present utility model will be further described in detail below in conjunction with specific implementation methods.

[0024] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0025] Example 1

[0026] A wafer grinding head assembly that is easy to load and unload, such as Figure 1-4 As shown, it includes a water sprinkling component, which includes a base 1, a support frame 10 is fixedly provided on the top outer wall of the base 1 by bolts, a delivery pump 21 is fixedly provided on the outer wall of one side of the support frame 10 by bolts, the top of the delivery pump 21 is connected to a water storage tank 8, and the top of the water storage tank 8 is connected to a replenishing port 18, a fixing frame 5 is fixedly provided on the top outer wall of the base 1 by bolts, a plurality of groups of grinding frames 4 are arranged in sequence on the top of the fixing frame 5, a plurality of groups of speed regulating motors 3 are fixedly provided on the bottom of the fixing frame 5 by bolts, each group of grinding frames 4 is respectively connected to the corresponding speed regulating motor 3, a nozzle 7 is provided on one side of the support frame 10 close to the fixing frame 5, one end of the nozzle 7 is connected to the delivery pump 21, the position of the nozzle 7 is adapted to the grinding frame 4, and an adjusting component for adjusting the grinding angle and position is provided on one side of the support frame 10;

[0027] During use, multiple groups of wafers can be placed on the grinding racks 4 at the same time for grinding. The wafers to be ground are placed on the grinding racks 4. The speed regulating motor 3 can control the rotation of the grinding racks 4 to cooperate with the grinding heads to grind the wafers. During the grinding process, the water in the water storage tank 8 can be transported by the delivery pump 21, and the stored water is transported to the nozzle 7 for spraying. The spraying of the nozzle 7 can cool the wafers and the grinding head 26, and can also play a role in cooling and lubricating, thereby protecting the surface quality and structural integrity of the wafers. Water can be replenished in the water storage tank 8 through the replenishment port 18.

[0028] The adjusting component includes an electric telescopic rod 9, which is fixed to the outer wall of one side of the support frame 10 by bolts. A slot is provided at the top of the support frame 10, and a moving block 27 is slidably installed at the slot. The telescopic end of one side of the electric telescopic rod 9 is slidably connected to the slot of the support frame 10 and is connected to the moving block 27. A hydraulic telescopic rod 14 is fixed to the outer wall of the top of the moving block 27 by bolts. The output end of the bottom of the hydraulic telescopic rod 14 can slide through the moving block 27. A rotating motor 13 is installed at the bottom of the hydraulic telescopic rod 14. A rotating shaft 15 is connected to the bottom of the rotating shaft 15. A mounting frame 12 is installed at the bottom of the rotating shaft 15. An adjusting motor 11 is fixed to the outer wall of one side of the mounting frame 12 by bolts. A fixed shaft 16 is connected to one side of the adjusting motor 11. One end of the fixed shaft 16 can rotatably penetrate the mounting frame 12. An adjusting frame 20 is installed at one end of the fixed shaft 16. A buffer member for protecting the wafer is provided on one side of the adjusting frame 20;

[0029] During use, the position of the grinding part can be adjusted by controlling the movement of the moving block 27 with the slot of the support frame 10 through the electric telescopic rod 9, the height of the grinding part can be adjusted by the hydraulic telescopic rod 14, and the angle of the grinding part can be adjusted by controlling the fixed shaft 16 and the adjustment frame 20 to rotate by the adjustment motor 11. When adjusting the angle, the direction can be adjusted by cooperating with the rotation motor 13 to control the rotation of the rotating shaft 15. By adjusting the height, position, angle and direction, it is convenient to grind the wafer;

[0030] The buffer member includes a sleeve 22, which is fixed to the outer wall of the bottom of the adjustment frame 20 by bolts. A piston rod 2 is slidably mounted on one end of the sleeve 22. A spring 28 is provided in the sleeve 22. One end of the spring 28 is fixed to the adjustment frame 20, and the other end is fixed to the piston rod 2. A grinding member for grinding wafers is mounted on one end of the piston rod 2.

[0031] During use, when the grinding member contacts the wafer for grinding, a high pressure may be applied during contact, causing damage to the wafer. The sliding of the piston rod 2 and the elastic force of the spring 28 in the sleeve 22 can act as a buffer to achieve soft pressure, thereby protecting the wafer without affecting the grinding process and preventing it from being damaged.

[0032] The grinding member includes a first connecting plate 23, which is fixed to the bottom of the piston rod 2. A second connecting plate 24 is provided at the bottom of the first connecting plate 23. The first connecting plate 23 and the second connecting plate 24 are symmetrically provided with multiple sets of screw holes. A grinding motor 25 is installed at the bottom of the second connecting plate 24. The grinding motor 25 is detachably mounted with a grinding head 26.

[0033] During use, the grinding head 26 can be controlled to rotate by the grinding motor 25, and the grinding cylinder 26 can be used to grind the wafer by contacting the wafer. During installation, the first connecting plate 23 and the second connecting plate 24 are aligned. After alignment, the fixing bolts are inserted through the aligned screw holes and the fixing nuts are tightened to quickly complete the fixed installation of the grinding component. When disassembly is required, the fixing nuts can be removed to conveniently remove it. The grinding head 26 can be removed and replaced as needed.

[0034] To prevent the entry of foreign matter, such as Figure 1 As shown, a sealing cover 17 is installed at one end of the replenishing port 18, and the diameter of the top end of the sealing cover 17 is slightly larger than the diameter of the replenishing port 18;

[0035] When in use, the sealing cover 17 is placed on the replenishing port 18 to seal it. After adding water, the replenishing port 18 can be closed to prevent foreign matter from entering the water storage tank 8 through the replenishing port 18 and causing blockage during water delivery.

[0036] To observe the remaining water volume, Figure 2 As shown, an observation window 19 is provided on one side of the water tank 8, and a scale sticker is pasted on one side of the observation window 19;

[0037] When in use, the observation window 19 is made of transparent material, and the remaining water level can be observed through the transparent observation window 19. The specific water level can be observed through the scale sticker, so that insufficient water can be replenished in time to avoid the situation where there is no water available;

[0038] In order to filter when adding water, such as Figure 3 As shown, a filter screen 29 is detachably mounted on the inner wall of the replenishment port 18, and the inner diameter of the filter screen 29 gradually expands in a funnel shape from top to bottom;

[0039] During use, the filter screen 29 can be used to filter water when adding water to prevent impurities from mixing in and effectively remove impurities. The filter holes that gradually expand downward along the inner diameter can increase the filtering accuracy and the flow rate at the same time.

[0040] Example 2

[0041] For ease of control, refer to Figure 2 、 3 A wafer grinding head assembly that is easy to assemble and disassemble. Compared with Example 1, this embodiment makes the following improvements: a fixing bracket is fixed to the top outer wall of the base 1 by bolts, and a control panel 6 is installed on one side of the fixing bracket;

[0042] When in use, the control panel 6 is electrically connected to various components of the device through lines. The device can be quickly and easily controlled through the control panel 6, making the control of the device more convenient.

[0043] The above is only a preferred specific implementation method of the present invention. Parts that do not require creative work such as circuit control and signal control transmission may refer to the existing technology, but the protection scope of the present invention is not limited to this. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer grinding head assembly that is easy to load and unload, characterized in that: The invention comprises a water sprinkling component, wherein the water sprinkling component comprises a base (1), a support frame (10) is provided on the top outer wall of the base (1), a delivery pump (21) is provided on one side outer wall of the support frame (10), the top of the delivery pump (21) is connected to a water storage tank (8), the top of the water storage tank (8) is connected to a replenishing port (18), a fixing frame (5) is provided on the top outer wall of the base (1), a plurality of groups of grinding frames (4) are arranged in sequence on the top of the fixing frame (5), a plurality of groups of speed regulating motors (3) are provided on the bottom of the fixing frame (5), each group of grinding frames (4) is respectively connected to a corresponding speed regulating motor (3), a nozzle (7) is provided on one side of the support frame (10) close to the fixing frame (5), one end of the nozzle (7) is connected to the delivery pump (21), the position of the nozzle (7) is adapted to the grinding frame (4), and an adjusting component for adjusting the grinding angle and position is provided on one side of the support frame (10).

2. The wafer polishing head assembly that is easy to assemble and disassemble according to claim 1, characterized in that: The adjusting member comprises an electric telescopic rod (9), which is fixed to the outer wall of one side of the support frame (10) by bolts. A slot is provided on the top of the support frame (10), and a moving block (27) is slidably installed at the slot. The telescopic end of one side of the electric telescopic rod (9) is slidably connected to the slot of the support frame (10) and connected to the moving block (27). A hydraulic telescopic rod (14) is fixed to the outer wall of the top of the moving block (27) by bolts. The output end at the bottom of the hydraulic telescopic rod (14) can slide through the moving block (27). A rotating motor (13) is installed at the bottom end of the compression and telescopic rod (14), a rotating shaft (15) is connected to the bottom of the rotating motor (13), a mounting frame (12) is installed at the bottom of the rotating shaft (15), an adjusting motor (11) is fixedly provided on the outer wall of one side of the mounting frame (12) by means of bolts, a fixed shaft (16) is connected to one side of the adjusting motor (11), one end of the fixed shaft (16) is rotatably passed through the mounting frame (12), an adjusting frame (20) is installed at one end of the fixed shaft (16), and a buffer component for protecting wafers is provided on one side of the adjusting frame (20).

3. The wafer polishing head assembly that is easy to assemble and disassemble according to claim 2, characterized in that: The buffer component includes a sleeve (22), which is fixed to the outer wall of the bottom of the adjustment frame (20) by bolts, and a piston rod (2) is slidably installed at one end of the sleeve (22). A spring (28) is arranged in the sleeve (22), and one end of the spring (28) is fixed to the adjustment frame (20) and the other end is fixed to the piston rod (2). A grinding component for grinding wafers is installed at one end of the piston rod (2).

4. The wafer polishing head assembly that is easy to assemble and disassemble according to claim 3, characterized in that: The grinding component includes a first connecting plate (23), which is fixed to the bottom of the piston rod (2). A second connecting plate (24) is provided at the bottom of the first connecting plate (23). The first connecting plate (23) and the second connecting plate (24) are symmetrically provided with multiple groups of screw holes. A grinding motor (25) is installed at the bottom of the second connecting plate (24), and the grinding motor (25) is detachably installed with a grinding head (26).

5. The wafer polishing head assembly that is easy to assemble and disassemble according to claim 1, characterized in that: A sealing cover (17) is installed at one end of the replenishing port (18), and the diameter of the top end of the sealing cover (17) is slightly larger than the diameter of the replenishing port (18).

6. The wafer polishing head assembly that is easy to assemble and disassemble according to claim 1, characterized in that: An observation window (19) is provided on one side of the water storage tank (8), and a scale sticker is pasted on one side of the observation window (19).

7. The wafer polishing head assembly that is easy to assemble and disassemble according to claim 1, characterized in that: A filter screen (29) is detachably mounted on the inner wall of the replenishing port (18), and the inner diameter of the filter holes of the filter screen (29) gradually expands in a funnel shape from top to bottom.

8. The wafer polishing head assembly that is easy to assemble and disassemble according to claim 1, characterized in that: A fixing bracket is fixed on the top outer wall of the base (1) by means of bolts, and a control panel (6) is installed on one side of the fixing bracket.

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