Online cleaning device for silk-screen printing silicon wafer
Through the cleaning device combining the brush head and the air collector pipe, the problem of incomplete removal of impurities on the surface of the silicon wafer and position offset is solved, improving the printing effect and safety.
Patent Information
- Application Number
- CN202422788143.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-11-15
AI Technical Summary
The prior art is difficult to effectively remove impurities on the surface of the silicon wafer, and the purge process can easily lead to the position of the silicon wafer, affecting the printing effect and safety.
A cleaning device is used to combine the brush head and the air collector pipe. The brush head removes large particles of impurities, and the air collector pipe forms a V-shaped airflow to blow away fine impurities to avoid position deviation.
It has achieved complete removal of impurities on the surface of the silicon wafer, improved printing effect, reduced the risk of screen damage, and ensured smooth transmission of the silicon wafer.
Smart Images
Figure CN223278743U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of solar cell production, and particularly relates to an online cleaning device for screen-printed silicon wafers. Background Art
[0002] The manufacturing process for crystalline silicon solar cells primarily includes cleaning, damage layer removal, texturing, diffusion, bonding, etching, anti-reflection coating deposition, printing, sintering, and cell testing. Printing is a crucial step in the production of crystalline silicon solar cells, and screen printers are the most widely used equipment in the solar industry for printing cell electrodes. Screen printing requires high surface cleanliness for the silicon wafers. However, when the silicon wafers are transported to the printing process, they are subject to high temperatures and are susceptible to dust and impurities adhering to their surfaces, affecting the printing process and, consequently, the electrical and mechanical properties of the solar cell.
[0003] In order to improve the printing performance of silicon wafers, the surface of the silicon wafers was mostly cleaned before the printing process. Currently, fans are used to blow air to remove dust and cool the silicon wafers. However, since the silicon wafers are placed on a conveyor belt, once the fan air volume is increased, the silicon wafers will fall from the conveyor belt and break. Therefore, in the actual production process, the fan air volume is relatively weak. Obviously, this method cannot blow away foreign matter on the surface of the silicon wafer, and the cooling effect is general. It is also easy to cause the position of the silicon wafer to shift during the transmission of the silicon wafer, affecting the introduction of the silicon wafer into the printer and also affecting the printing effect.
[0004] The current cleaning method uses air channel purging. The intersection of the airflow directions of the airflow channels is located on the center line of the silicon wafer on the transmission device. When the two groups of airflows meet and the airflow directions are opposite, the effects of the airflows cancel each other out and cannot effectively remove impurities on the surface of the silicon wafer. Excessive airflow can easily cause the position of the transmitted silicon wafer to move, and also cause the silicon wafer to be transferred off-center. Utility Model Content
[0005] The embodiment of the utility model provides an online cleaning device for screen-printed silicon wafers, which performs surface cleaning on the silicon wafers before they enter the screen printing machine, aiming to remove impurities on the surface of the silicon wafers and avoid positional offset of the silicon wafers, which affects the introduction of the silicon wafers into the printer and the printing effect.
[0006] To achieve the above-mentioned object, the technical solution adopted by the present invention is as follows: providing an online cleaning device for screen-printed silicon wafers, comprising: a silicon wafer cleaning mechanism and a silicon wafer cooling and purge mechanism sequentially arranged along the direction of silicon wafer transmission; the silicon wafer cleaning mechanism and the silicon wafer cooling and purge mechanism are both fixed to the printing machine table and are both located directly above the transmitted silicon wafer;
[0007] The silicon wafer cleaning mechanism includes a lifting rod fixed on the printing machine table and a brush head fixed to the lower end of the lifting rod; the length of the brush head can cover the width of the silicon wafer, the width direction of the silicon wafer is perpendicular to the silicon wafer transmission direction, and the length direction of the brush head is perpendicular to the silicon wafer transmission direction;
[0008] The silicon wafer cooling and purging mechanism includes an air collecting pipe fixed on the printing machine table and an air inlet pipe connected to the air collecting pipe. The air collecting pipe is parallel to the silicon wafer and is provided with air outlet holes opened in the direction of the silicon wafer. The length of the air collecting pipe can cover the width of the silicon wafer, and the air collecting pipe is evenly distributed with a number of air outlet holes along its length. The line connecting the two ends of the air collecting pipe is perpendicular to the transmission direction of the silicon wafer.
[0009] In one achievable manner, the gas collecting pipe is V-shaped to form a V-shaped airflow; the tip of the gas collecting pipe is directed toward the silicon wafer.
[0010] In one achievable manner, the center line of the air outlet is inclined toward the direction of the silicon wafer, and the inclination angle is 30-60°.
[0011] In one achievable manner, the vertical distance between the gas collecting pipe and the silicon wafer is 50-60 mm.
[0012] In one practicable manner, the distance between two adjacent air outlet holes on the air collecting pipe is 10-15 mm.
[0013] In one feasible manner, the air inlet pipe is connected to the middle of the air collecting pipe in the length direction.
[0014] In one feasible manner, a pressure regulating valve is provided on the air intake pipe.
[0015] In one achievable manner, the length of the brush head is 1.2-1.5 times the width of the silicon wafer.
[0016] In one achievable manner, the width of the brush head is 2-3 mm, and the width direction of the brush head is consistent with the transmission direction of the silicon wafer.
[0017] The online cleaning device for screen-printed silicon wafers provided by the utility model has the following beneficial effects compared with the prior art: first, the cleaning mechanism can effectively clean out larger granular impurities such as silicon nitride particles on the upper surface of the silicon wafer, and then the cooling and blowing mechanism can effectively blow away fine impurities such as silicon nitride dust on the upper surface of the silicon wafer; the impurities on the upper surface of the silicon wafer are cleaned twice, and the cleaning effect is more obvious and more thorough, which not only reduces the probability of the screen being punctured, but also improves the printing effect; and the air outlet holes for blowing are evenly distributed along the width direction of the silicon wafer, so the blown air flow will be evenly distributed along the width direction of the silicon wafer, and will not be perpendicular to the transmission direction of the silicon wafer, so that the position of the silicon wafer will not be offset, thereby ensuring that the silicon wafer is smoothly transmitted to the printing process, which also avoids the problem of silicon wafer offset. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A schematic structural diagram of an online cleaning device for screen-printed silicon wafers provided in an embodiment of the present invention;
[0019] Figure 2 for Figure 1 A schematic diagram of the top view of the silicon wafer cooling and purge mechanism provided;
[0020] Description of reference numerals:
[0021] 1. Bolt; 2. Lifting rod; 3. Brush head; 4. Printing machine; 5. Silicon wafer; 6. Conveying mechanism; 7. Gas collecting pipe; 8. Air outlet; 9. Air inlet pipe; 10. Pressure regulating valve. DETAILED DESCRIPTION
[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0023] Please also refer to Figure 1 and Figure 2 The online cleaning device for screen-printed silicon wafers provided by the present invention is now described. The device comprises a wafer cleaning mechanism and a wafer cooling and purge mechanism, arranged sequentially along the transport direction of a silicon wafer 5. Both the wafer cleaning mechanism and the wafer cooling and purge mechanism are fixed to a printing platform 4 and positioned directly above the transported silicon wafer 5. The wafer cleaning mechanism comprises a lifting rod 2 fixed to the printing platform 4 and a brush head 3 fixed to the lower end of the lifting rod 2. The brush head 3 is long enough to cover the width of the silicon wafer 5, with the width of the silicon wafer 5 perpendicular to the transport direction, and the length of the brush head 3 is perpendicular to the transport direction.
[0024] The silicon wafer cooling and purging mechanism includes an air collecting pipe 7 fixed on the printing machine table 4 and an air inlet pipe 9 connected to the air collecting pipe 7. The air collecting pipe 7 is parallel to the silicon wafer 5 and is provided with air outlet holes 8 opened in the direction of the silicon wafer 5. The length of the air collecting pipe 7 can cover the width of the silicon wafer 5, and the air collecting pipe 7 is evenly distributed with a number of air outlet holes 8 along its length. The line connecting the two ends of the air collecting pipe 7 is perpendicular to the transmission direction of the silicon wafer.
[0025] The online cleaning device for screen-printed silicon wafer 5 provided by the utility model has the following beneficial effects compared with the prior art: first, the cleaning mechanism can effectively clean out larger granular impurities such as silicon nitride particles on the upper surface of the silicon wafer 5, and then the cooling and blowing mechanism can effectively blow away fine impurities such as silicon nitride dust on the upper surface of the silicon wafer 5; the impurities on the upper surface of the silicon wafer 5 are cleaned twice, and the cleaning effect is more obvious and more thorough, which not only reduces the probability of the screen being punctured, but also improves the printing effect; and the air outlet holes 8 for blowing are evenly distributed along the width direction of the silicon wafer 5, so the blown air flow will be evenly distributed along the width direction of the silicon wafer 5, and will not be perpendicular to the transmission direction of the silicon wafer 5, so it will not cause the position of the silicon wafer 5 to shift, thereby ensuring that the silicon wafer 5 is smoothly transmitted to the printing process, which also avoids the problem of silicon wafer 5 shifting; and the blowing of the silicon wafer 5 also serves the purpose of cooling the silicon wafer 5, thereby reducing the volatilization rate of the slurry organic matter in the screen, and can maintain good printing performance; the utility model has a simple structure, is easy to maintain, and is suitable for promotion.
[0026] Conventional one-step cleaning methods, using a sweeping device alone, cannot completely remove fine impurities such as silicon nitride dust from the surface of the silicon wafer 5. When using a purge device alone, removing larger silicon nitride particles from the surface of the silicon wafer 5 requires adjusting the airflow pressure to a high level, but this can easily cause the position of the silicon wafer 5 to shift, causing the silicon wafer 5 to deviate. The present application uses a combination of brush sweeping and airflow purging, which can not only remove fine impurities but also avoid the problem of silicon wafer 5 shifting.
[0027] In some embodiments, see Figure 2 The gas manifold 7 is V-shaped to create a V-shaped airflow; the tip of the gas manifold 7 is directed toward the silicon wafer 5. The V-shaped structure of the gas manifold 7 offers significant advantages: the airflow forms a V-shaped wind knife, which blows impurities away from the conveyor mechanism 6, preventing them from contaminating the conveyor mechanism 6 and the subsequent silicon wafer 5. The airflow from the air outlet 8 forms a continuous V-shaped wind knife on the top surface of the silicon wafer 5, enhancing the purge effect.
[0028] During the transmission process, the silicon wafer 5 first passes under the brush head 3 and then passes under the gas collecting pipe 7. When passing under the brush head 3, the lower edge of the brush head 3 contacts the upper surface of the silicon wafer 5. During the transmission process, the bristles of the brush head 3 can remove particulate impurities such as silicon nitride on the upper surface of the silicon wafer 5; when the silicon wafer 5 passes under the gas collecting pipe 7 during the transmission process, the gas blown out from the air outlet 8 on the V-shaped gas collecting pipe 7 forms a V-shaped airflow, which will form a V-shaped wind knife on the upper surface of the silicon wafer 5, which can effectively blow away the fine silicon nitride dust and other impurities on the upper surface of the silicon wafer 5, and blow the impurities away from the transmission mechanism 6, thereby preventing impurities from contaminating the transmission mechanism 6.
[0029] In some embodiments, see Figure 1 The center line of the air outlet 8 is tilted toward the direction of the silicon wafer 5, and the tilt angle is 30-60 degrees, so that the air flow is directed toward the direction of the silicon wafer 5. For example, the tilt angle is 30 degrees, 35 degrees, 40 degrees, 45 degrees, 55 degrees, 60 degrees, etc., with 45 degrees being the best.
[0030] In some embodiments, see Figure 1 The vertical distance between the gas collecting pipe 7 and the silicon wafer 5 is 50-60 mm. The distance here is the vertical distance from the center line of the gas collecting pipe 7 to the upper surface of the silicon wafer 5. The vertical distance from the lowest point of the gas collecting pipe 7 to the silicon wafer 5 is 30-40 mm.
[0031] In some embodiments, see Figure 2 The spacing between two adjacent air outlet holes 8 on the gas collecting pipe 7 is 10-15 mm. For example, the spacing is 10 mm, 12 mm, 14 mm, 15 mm, etc. The straight-line distance between the two air outlet holes 8 with the largest spacing on the gas collecting pipe 7 is generally greater than or equal to the lateral width of the transported silicon wafer 5 to ensure that the outlet airflow covers the width of the silicon wafer 5 and effectively removes dust from the silicon wafer 5.
[0032] The shape of the air outlet holes 8 on the air collecting pipe 7 can be a circular hole, a square hole, an elliptical hole or a straight hole.
[0033] In some embodiments, see Figure 2 The air inlet pipe 9 is connected to the middle of the length direction of the air collecting pipe 7 so that the air outlet holes 8 on the air collecting pipe 7 at different distances from the air inlet pipe 9 have the same air flow time. For a V-shaped air collecting pipe 7, the air inlet pipe 9 is connected to the tip of the air collecting pipe 7.
[0034] In some embodiments, see Figure 2 A pressure regulating valve 10 is provided on the air inlet pipe 9. The inlet of the air inlet pipe 9 is connected to the air pipe of the compressed air outside the workshop. The gas pressure on the air inlet pipe 9 can be adjusted by the pressure regulating valve 10 according to the pressure demand, generally 1-2MPa.
[0035] In some embodiments, see Figure 1 The length of the brush head 3 is 1.2-1.5 times the width of the silicon wafer 5. The length of the brush head 3 is generally greater than the width of the transported silicon wafer 5 to facilitate cleaning the surface of the silicon wafer 5. The bristles of the brush head 3 are made of soft material and will not damage the silicon wafer 5 when removing impurities on the surface of the silicon wafer 5.
[0036] The lifting rod 2 is fixed to the printing machine table 4 by bolts 1. The lifting structure of the lifting rod 2 can be a plurality of connection holes evenly arranged along the height direction of the lifting rod 2. The bolts 1 pass through different connection holes to adjust the distance between the brush head 3 and the silicon wafer 5.
[0037] The lower edge of the brush head 3 contacts the upper surface of the transported silicon wafer 5. During the transport of the silicon wafer 5, the bristles can remove particulate impurities on the upper surface of the silicon wafer 5. After using it for a period of time, when the bristles are worn, the fixing bolt 1 can be loosened and the height of the lifting rod 2 can be adjusted so that the lower edge of the bristles contacts the upper surface of the silicon wafer 5 again.
[0038] In some embodiments, the width of the brush head 3 is 2-3 mm, and the width of the brush head 3 is consistent with the transport direction of the silicon wafer 5 .
[0039] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.
[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A screen printing silicon wafer online cleaning device, characterized in that: include: A silicon wafer cleaning mechanism and a silicon wafer cooling and blowing mechanism are sequentially arranged along the transmission direction of the silicon wafer (5); the silicon wafer cleaning mechanism and the silicon wafer cooling and blowing mechanism are both fixed on the printing machine table (4) and are both located directly above the transmission silicon wafer (5); The silicon wafer cleaning mechanism comprises a lifting rod (2) fixed on the printing machine table (4) and a brush head (3) fixed to the lower end of the lifting rod (2); the length of the brush head (3) can cover the width of the silicon wafer (5), the width direction of the silicon wafer (5) is perpendicular to the silicon wafer transmission direction, and the length direction of the brush head (3) is perpendicular to the silicon wafer transmission direction; The silicon wafer cooling and purging mechanism comprises an air collecting pipe (7) fixed on the printing machine table (4) and an air inlet pipe (9) connected to the air collecting pipe (7); the air collecting pipe (7) is parallel to the silicon wafer (5); the air collecting pipe (7) is provided with an air outlet (8) opened in the direction of the silicon wafer (5); the length of the air collecting pipe (7) can cover the width of the silicon wafer (5), and the air collecting pipe (7) is evenly distributed with a plurality of the air outlet holes (8) along its length direction; the line connecting the two ends of the air collecting pipe (7) is perpendicular to the transmission direction of the silicon wafer.
2. The screen printing silicon wafer online cleaning device according to claim 1, characterized in that: The gas collecting pipe (7) is V-shaped to form a V-shaped airflow; the tip of the gas collecting pipe (7) is directed toward the silicon wafer (5).
3. The online cleaning device for screen-printed silicon wafers according to claim 1, wherein: The center line of the air outlet (8) is inclined toward the direction of transmission of the silicon wafer (5), and the inclination angle is 30-60 degrees.
4. The screen printing silicon wafer online cleaning device according to claim 1, characterized in that: The vertical distance between the gas collecting pipe (7) and the silicon wafer (5) is 50-60 mm.
5. The screen printing silicon wafer online cleaning device according to claim 1, characterized in that: The distance between two adjacent air outlet holes (8) on the air collecting pipe (7) is 10-15 mm.
6. The screen printing silicon wafer online cleaning device according to claim 1, characterized in that: The air inlet pipe (9) is connected to the middle of the air collecting pipe (7) in the length direction.
7. The screen printing silicon wafer online cleaning device according to claim 1, characterized in that: A pressure regulating valve (10) is provided on the air inlet pipe (9).
8. The online cleaning device for screen-printed silicon wafers according to claim 1, wherein: The length of the brush head (3) is 1.2-1.5 times the width of the silicon wafer (5).
9. The online cleaning device for screen-printed silicon wafers according to claim 1, wherein: The width of the brush head (3) is 2-3 mm, and the width direction of the brush head (3) is consistent with the transmission direction of the silicon wafer (5).