Normalizing mechanism and conveying device

Abstract

The utility model discloses a normalizing mechanism and a conveying device.The normalizing mechanism is used for ascending from the position below a conveying belt and normalizing stacked silicon wafers conveyed on the conveying belt, the normalizing mechanism comprises a lifting driving assembly and a normalizing assembly, and the lifting driving assembly is configured to drive the normalizing assembly to ascend to the position above the conveying belt; driving the tidying assembly to descend and reset; the arranging assembly comprises two sets of first arranging pieces, two sets of second arranging pieces, a first driving piece and a second driving piece. The first arranging pieces are provided with receding openings used for receding the conveying belt during lifting. The first driving part is configured to drive the two groups of first arranging parts to be close to or far away from each other in the first direction; the second driving part drives the two groups of second arranging parts to be close to or far away from each other in the second direction; the first direction is parallel to the conveying direction of the conveying belt, and the second direction is perpendicular to the first direction; according to the arrangement device, the arrangement area is increased on the basis that the conveying belt is not interfered, and therefore the arrangement effect of stacked silicon wafers conveyed on the conveying belt is improved.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic cell manufacturing, and in particular to a regularization mechanism and a conveying device. Background Art

[0002] Silicon wafers are the starting point for photovoltaic cell manufacturing. Qualified wafers that have passed sorting by a sorting machine are collected and stacked. These collected and stacked wafers are then moved onto a conveyor belt and transported between subsequent process stations. During transportation, stacked wafers can shift in position due to stress. To ensure accurate positioning, the wafers must be aligned on the conveyor belt.

[0003] Currently, there are aligning mechanisms for aligning the position of silicon wafers. These mechanisms are located below the two conveyor belts. When silicon wafers on the conveyor belts reach the aligning station, the aligning mechanism rises from between the two conveyor belts to align the wafers. However, the space between the two conveyor belts is limited, and the aligning components of the aligning mechanism that come into contact with the silicon wafers are small. This limits the contact area between the aligning mechanism and the silicon wafers, making the aligning mechanism ineffective if the silicon wafers are significantly skewed. Utility Model Content

[0004] In order to solve the problems of the prior art, the present application provides a regularization mechanism and a conveying device, which can solve the problems that the regularization parts in the regularization mechanism that are in contact with the silicon wafer are small in size, the contact area between the regularization mechanism and the silicon wafer is limited, and the regularization effect of the regularization mechanism is poor.

[0005] Specifically, in a first aspect, the present application provides a tidying mechanism for rising from below a conveyor belt and tidying stacked silicon wafers conveyed on the conveyor belt, the tidying mechanism comprising a lifting drive assembly and a tidying assembly, wherein:

[0006] The lifting drive assembly is configured to drive the tidying assembly to rise above the conveyor belt, and to drive the tidying assembly to descend and reset;

[0007] The tidying assembly includes two sets of first tidying pieces, two sets of second tidying pieces, a first driving piece and a second driving piece. The first tidying piece is provided with an avoidance opening for avoiding the conveyor belt during lifting;

[0008] The first driving member is configured to drive the two groups of first aligning members to move closer to or away from each other in a first direction; the second driving member is configured to drive the two groups of second aligning members to move closer to or away from each other in a second direction;

[0009] The first direction is parallel to the conveying direction of the conveyor belt, and the second direction is perpendicular to the first direction.

[0010] The present application provides a tidying mechanism and a conveying device, in which two groups of first tidying pieces in the tidying mechanism approach or move away from each other in a first direction parallel to the running direction of the conveyor belt, and two groups of second tidying pieces approach or move away from each other in a second direction perpendicular to the running direction of the conveyor belt. The first tidying pieces are provided with avoidance openings for avoiding the conveyor belt during lifting and lowering, thereby increasing the tidying area without interfering with the conveyor belt, thereby improving the tidying effect on the stacked silicon wafers transported on the conveyor belt.

[0011] In some embodiments, the first regularizing piece includes a first main regularizing piece and a first auxiliary regularizing piece. A first auxiliary regularizing piece is detachably installed on at least one end of the first main regularizing piece. The first auxiliary regularizing piece is configured to be driven by the first main regularizing piece to regularize or move away from the edge of the silicon wafer on the conveyor belt. A avoidance opening for avoiding the conveyor belt is formed between the first main regularizing piece and the first auxiliary regularizing piece.

[0012] By assembling the first main regulating piece and the first auxiliary regulating piece to form the first regulating piece, the size of the first regulating piece can be increased, the contact area between the regulating mechanism and the silicon wafer can be increased, thereby improving the regulating effect of the regulating mechanism. A clearance opening for avoiding the conveyor belt is formed between the first main regulating piece and the first auxiliary regulating piece to avoid interference with the conveyor belt during the regulating process.

[0013] In some embodiments, the first main regulating member includes a first mounting member and a first pushing member connected to each other, the first mounting member is matched with the driving end of the first driving member, and the first pushing member is mounted on the first mounting member through a first elastic member;

[0014] The first elastic member is configured to provide buffering when the first pushing member abuts against the stacked silicon wafers on the conveyor belt.

[0015] A first elastic member is arranged between a first pushing member in contact with the silicon wafer and a first mounting member driven by a first driving member. The first elastic member provides buffering when the first pushing member abuts against the stacked silicon wafers on the conveyor belt, thereby reducing the stress generated by the first pushing member on the silicon wafer when aligning the silicon wafer, and preventing the first pushing member from damaging the edge of the silicon wafer.

[0016] In some embodiments, the first pushing member includes a plate body and a flexible pad. The plate body is mounted on the first mounting member through a first elastic member. The flexible pad is attached to the plate body. The flexible pad is a component used by the first pushing member to abut against the stacked silicon wafers on the conveyor belt.

[0017] The plate body of the first pushing member is connected to the first mounting member through the first elastic member, and a flexible pad is covered on the surface that directly contacts the silicon wafer, which can further reduce the stress applied to the silicon wafer by the first pushing member when regularizing the silicon wafer, thereby avoiding damage to the edge of the silicon wafer caused by the first pushing member.

[0018] In some embodiments, the first auxiliary organizing member includes a first connecting member, a first auxiliary pushing member and a second elastic member. The first connecting member is detachably connected to the first main organizing member, and the first auxiliary pushing member is connected to the first connecting member through the second elastic member.

[0019] A second elastic member is connected between the first connecting member and the first auxiliary pushing member in the first auxiliary regularizing member, which can reduce the stress applied by the first auxiliary regularizing member to the edge of the large-sized silicon wafer when the first auxiliary regularizing member contacts and regularizes the large-sized silicon wafer, thereby avoiding the first auxiliary regularizing member impacting the silicon wafer and causing damage to the silicon wafer.

[0020] In some embodiments, the tidying mechanism further includes a lifting seat, a first guide rail and a mounting seat;

[0021] The bottom end of the lifting seat is connected to the driving end of the lifting drive assembly;

[0022] The fixed end of the first driving member and the first guide rail are fixedly mounted on the top of the lifting seat, the mounting seat is slidably connected to the first guide rail, and the fixed end of the second driving member is mounted on the top of the mounting seat;

[0023] The first regulating member is driven by the first driving member to move closer to or farther away from the top of the mounting seat, and the second regulating member is driven by the second driving member to move closer to or farther away from the top of the mounting seat.

[0024] By arranging both the first regulated piece and the second regulated piece on the lifting seat, the synchronous lifting of the first regulated piece and the second regulated piece can be achieved; a first guide rail is arranged on the top of the lifting seat, the first guide rail is slidably connected to the mounting seat, the fixed end of the first driving member is installed on the top of the lifting seat, and the fixed seat of the second driving member is installed on the top of the mounting seat, which can avoid the first regulated piece and the second regulated piece from interfering with each other during the regulated process.

[0025] In some embodiments, the aligning mechanism further includes a second guide rail, the second guide rail being mounted on the top of the lifting seat, the second guide rail being parallel to the first guide rail, and the second guide rail being symmetrically arranged on both sides of the first guide rail with the first guide rail as the center;

[0026] The mounting seat is slidably connected to the second guide rail;

[0027] The first driving component is arranged between the mounting seat and the lifting seat.

[0028] Second guide rails parallel to the first guide rails are symmetrically arranged on both sides of the first guide rail, and the mounting seat is slidably connected to the first guide rail and the second guide rail at the same time. The mounting seat can be stably supported and maintain stable sliding during the regularization process.

[0029] In some embodiments, the tidying mechanism further includes two first photoelectric sensors, two second photoelectric sensors, and two first sensing elements, wherein:

[0030] The two first photoelectric sensors are respectively installed on the outside of the positions of the two groups of first regular pieces when they are away from each other, the two second photoelectric sensors are respectively installed on the outside of the positions of the two groups of first regular pieces when they are close to each other, and the two first sensing members are respectively installed on the two groups of first regular pieces;

[0031] When the two groups of first regular members are at positions far away from each other, the first sensing member is in the sensing area of ​​the corresponding first photoelectric sensor and is sensed by the first photoelectric sensor;

[0032] When the two groups of first regular members are close to each other, the first sensing members are in the sensing area of ​​the corresponding second photoelectric sensor and are sensed by the second photoelectric sensor.

[0033] A first photoelectric sensor is arranged outside the position where the two groups of first regular pieces are far away from each other, and a second photoelectric sensor is arranged outside the position where the two groups of first regular pieces are close to each other. A first sensing piece that can be sensed by the first photoelectric sensor and the second photoelectric sensor is installed on the two groups of first regular pieces. It can trigger a feedback sensing signal when the first regular pieces are in a position close to the target or a position far away from the target, thereby accurately controlling the position of the first regular pieces.

[0034] In some embodiments, the tidying mechanism further includes two third photoelectric sensors, two fourth photoelectric sensors, and two second sensing elements, wherein:

[0035] The two third photoelectric sensors are respectively installed on the outside of the positions of the two groups of second regular pieces when they are away from each other, the two fourth photoelectric sensors are respectively installed on the outside of the positions of the two groups of second regular pieces when they are close to each other, and the two second sensing members are respectively installed on the two groups of second regular pieces;

[0036] When the two sets of second regular members are at positions far away from each other, the second sensing member is in the sensing area of ​​the corresponding third photoelectric sensor and is sensed by the third photoelectric sensor;

[0037] When the two groups of second regular members are close to each other, the second sensing members are in the sensing area of ​​the corresponding fourth photoelectric sensor and are sensed by the fourth photoelectric sensor.

[0038] A third photoelectric sensor is arranged outside the position where the two groups of second regular pieces are far away from each other, and a fourth photoelectric sensor is arranged outside the position where the two groups of second regular pieces are close to each other. Second sensing pieces that can be sensed by the third photoelectric sensor and the fourth photoelectric sensor are installed on the two groups of second regular pieces. Feedback sensing signals can be triggered when the second regular pieces are close to the target or far away from the target, thereby accurately controlling the position of the second regular pieces.

[0039] In a second aspect, the present application further provides a conveying device, comprising a conveyor belt mechanism and a regularizing mechanism as provided in any one of the first aspects, wherein the regularizing mechanism is disposed below the conveyor belt mechanism;

[0040] The conveyor mechanism is configured to convey the stacked silicon wafers to a tidying station above the tidying mechanism;

[0041] The conveyor belt mechanism includes two parallel conveyor belts. The first aligning member is configured to be driven by the lifting drive assembly to rise until the conveyor belts are located in the avoidance opening. Then, the first aligning member is driven by the first drive member to move closer to each other in a first direction parallel to the running direction of the conveyor belts to align the silicon wafers on the conveyor belts.

[0042] The second aligning member is configured to be driven by the lifting drive assembly to rise from the outside of the two conveyor belts, and then driven by the second drive member to approach each other in a second direction perpendicular to the running direction of the conveyor belts to align the silicon wafers on the conveyor belts.

[0043] The conveying device provided by the present application has a conveyor belt mechanism that conveys the stacked silicon wafers to the tidying station above the tidying mechanism, and then the lifting drive assembly drives the first tidying piece to rise to the conveyor belt and is located in the avoidance opening of the first tidying piece. The first drive member drives the first tidying piece to approach each other in a first direction parallel to the running direction of the conveyor belt to tidy the silicon wafers. The second tidying piece is driven by the second drive member to approach each other from the outside of the conveyor belt and tidy the silicon wafers in a second direction perpendicular to the running direction of the conveyor belt. The contact width of the first tidying piece with the silicon wafer is greater than the total width of the conveyor belt, and the contact area with the silicon wafer is large. The silicon wafer can be effectively tidyed even when the deflection angle of the silicon wafer is large. The first tidying piece and the second tidying piece tidy the silicon wafer from two directions perpendicular to each other, and the tidying effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The disclosure of this application will be more easily understood with reference to the accompanying drawings. Those skilled in the art will readily appreciate that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the figures represent similar components, where:

[0045] Figure 1 This is a three-dimensional diagram of a regular mechanism provided in one embodiment of the present application;

[0046] Figure 2 This is a schematic diagram of the coordination between the regularization mechanism and the conveyor belt provided in one embodiment of the present application;

[0047] Figure 3 This is a schematic structural diagram of a regularization component in a regularization mechanism provided in one embodiment of the present application;

[0048] Figure 4 yes Figure 3 Enlarged view of point A in the middle.

[0049] Among them: 1. Regulating mechanism; 10. Lifting drive assembly; 20. Regulating assembly; 21. First regulating member; 211. First main regulating member; 211A. Plate; 211B. Flexible pad; 2111. First mounting member; 2112. First pushing member; 2113. First elastic member; 212. First auxiliary regulating member; 2121. First connecting member; 2122. First auxiliary pushing member; 2123. Second elastic member; 22. Second regulating member; 221. Second mounting member; 222. Second pushing member; 223. Third elastic member; 23. First driving member; 24. Second driving member; 25. Avoidance; 30. Lifting seat; 40. First guide rail; 50. Mounting seat; 60. Second guide rail; 71. First photoelectric sensor; 72. First sensing member; 73. Third photoelectric sensor; 74. Fourth photoelectric sensor; 75. Second sensing member; 2. Conveyor belt. DETAILED DESCRIPTION

[0050] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application.

[0051] As described in the background technology, during the manufacturing process of photovoltaic cells, qualified silicon wafers are stacked on a conveyor belt and transported between process stations. During the transportation process, the stacked silicon wafers are subjected to force and their positions are shifted, requiring straightening. Currently, a straightening mechanism is provided below the conveyor belt. When the silicon wafers transported on the conveyor belt arrive at the straightening station, it rises from between the two conveyor belts to straighten the silicon wafers on the conveyor belt. However, the space between the two conveyor belts is limited, and the straightening parts in the straightening mechanism that come into contact with the silicon wafers are small in size. The contact area between the straightening mechanism and the silicon wafers is limited. If the deflection angle of the silicon wafers is large, the straightening effect of the straightening mechanism is poor.

[0052] In order to solve the above problems, the present application creatively proposes a regularizing mechanism and a conveying device, which adopts two groups of first regularizing pieces to approach or move away from each other in a first direction parallel to the running direction of the conveyor belt, and two groups of second regularizing pieces to approach or move away from each other in a second direction perpendicular to the running direction of the conveyor belt. The first regularizing pieces are provided with avoidance openings for avoiding the conveyor belt during lifting and lowering, which increases the regularizing area without interfering with the conveyor belt, thereby improving the regularizing effect of the stacked silicon wafers transported on the conveyor belt.

[0053] The present application will be described in detail below through specific embodiments.

[0054] The embodiment of the present application provides a tidying mechanism 1, which is used to rise from below a conveyor belt 2 and tidy up stacked silicon wafers conveyed on the conveyor belt 2. The tidying mechanism 1 includes a lifting drive assembly 10 and a tidying assembly 20, wherein:

[0055] The lifting drive assembly 10 is configured to drive the tidying assembly 20 to rise above the conveyor belt, and to drive the tidying assembly 20 to descend and reset;

[0056] The arranging assembly 20 includes two sets of first arranging members 21, two sets of second arranging members 22, a first driving member 23 and a second driving member 24. The first arranging member 21 is provided with an avoidance opening 25 for avoiding the conveyor belt 2 during lifting;

[0057] The first driving member 23 is configured to drive the two groups of first aligning members 21 to move closer to or away from each other in a first direction; the second driving member 24 is configured to drive the two groups of second aligning members 22 to move closer to or away from each other in a second direction;

[0058] The first direction is parallel to the conveying direction of the conveyor belt 2 , and the second direction is perpendicular to the first direction.

[0059] In the tidying mechanism 1 provided in the present application, two groups of first tidying pieces 21 approach or move away from each other in a first direction parallel to the running direction of the conveyor belt 2, and two groups of second tidying pieces 22 approach or move away from each other in a second direction perpendicular to the running direction of the conveyor belt 2. The first tidying pieces 21 are provided with avoidance openings 25 for avoiding the conveyor belt 2 during lifting and lowering, thereby increasing the tidying area without interfering with the conveyor belt 2, thereby improving the tidying effect on the stacked silicon wafers transported on the conveyor belt 2.

[0060] In some embodiments, reference Figure 3 As shown, the first regularizing piece 21 includes a first main regularizing piece 211 and a first auxiliary regularizing piece 212. A first auxiliary regularizing piece 212 is detachably installed on at least one end of the first main regularizing piece 211. The first auxiliary regularizing piece 212 is configured to be driven by the first main regularizing piece 211 to regularize or move away from the edge of the silicon wafer on the conveyor belt 2. An avoidance opening 25 for avoiding the conveyor belt 2 is formed between the first main regularizing piece 211 and the first auxiliary regularizing piece 212.

[0061] The conveyor belt 2 can have one conveyor belt, and one first auxiliary regulating member 212 cooperates with one first main regulating member 211 to form an escape 25 for avoiding the conveyor belt 2. The conveyor belt can also have two conveyor belts, and two first auxiliary regulating members 212 cooperate with the two ends of one first main regulating member 211 to form two escape 25 for avoiding the conveyor belt 2.

[0062] By assembling the first main regulating piece 211 and the first auxiliary regulating piece 212 to form the first regulating piece 21, the size of the first regulating piece 21 can be increased, and the contact area between the regulating mechanism 1 and the silicon wafer can be increased, thereby improving the regulating effect of the regulating mechanism 1. A bypass opening 25 for avoiding the conveyor belt 2 is formed between the first main regulating piece 211 and the first auxiliary regulating piece 212 to avoid interference with the conveyor belt 2 during the regulating process.

[0063] Optional, see Figure 3 As shown, the first main regulating member 211 includes a first mounting member 2111 and a first pushing member 2112 connected to each other. The first mounting member 2111 is matched with the driving end of the first driving member 23. The first pushing member 2112 is mounted on the first mounting member 2111 through a first elastic member 2113.

[0064] The first elastic member 2113 is configured to provide buffering when the first pushing member 2112 abuts against the stacked silicon wafers on the conveyor belt 2 .

[0065] A first elastic member 2113 is arranged between the first pushing member 2112 in contact with the silicon wafer and the first mounting member 2111 driven by the first driving member 23. The first elastic member 2113 provides buffering when the first pushing member 2112 abuts against the stacked silicon wafers on the conveyor belt 2, thereby reducing the stress generated by the first pushing member 2112 on the silicon wafer when tidying the silicon wafer, and preventing the first pushing member 2112 from damaging the edge of the silicon wafer.

[0066] Optional, see Figure 4 As shown, the first pushing member 2112 includes a plate body 211A and a flexible pad 211B. The plate body 211A is installed on the first mounting member 2111 through the first elastic member 2113. The flexible pad 211B is attached to the plate body 211A. The flexible pad 211B is a component used by the first pushing member 2112 to abut against the stacked silicon wafers on the conveyor belt 2.

[0067] The plate body of the first pushing member 2112 is connected to the first mounting member 2111 through the first elastic member 2113, and the surface directly contacting the silicon wafer is covered with a flexible pad 211B, which can further reduce the stress applied to the silicon wafer by the first pushing member 2112 when regularizing the silicon wafer, thereby avoiding the first pushing member 2112 from causing damage to the edge of the silicon wafer.

[0068] Optional, continue to refer to Figure 3 As shown, the first auxiliary regulating member 212 includes a first connecting member 2121, a first auxiliary pushing member 2122 and a second elastic member 2123. The first connecting member 2121 is detachably connected to the first main regulating member 211, and the first auxiliary pushing member 2122 is connected to the first connecting member 2121 through the second elastic member 2123.

[0069] A second elastic member 2123 is connected between the first connecting member 2121 and the first auxiliary pushing member 2122 in the first auxiliary regularizing member 212, which can reduce the stress applied by the first auxiliary regularizing member 212 to the edge of the large-sized silicon wafer when the first auxiliary regularizing member 212 contacts and regularizes the large-sized silicon wafer, thereby avoiding the first auxiliary regularizing member 212 from impacting the silicon wafer and causing damage to the silicon wafer.

[0070] The second regulating member 22 may only include a push plate that is matched with the driving end of the second driving member 24 and is driven by the second driving member 24 to move along the second direction, or it may be Figures 1 to 3 As shown, it includes a second mounting member 221 and a second pushing member 222 connected to each other, the second mounting member 221 is matched with the driving end of the second driving member 24, and the second pushing member 222 is mounted on the second mounting member 221 through a third elastic member 223;

[0071] The third elastic member 223 is configured to provide buffering when the second pushing member 222 abuts against the stacked silicon wafers on the conveyor belt 2 .

[0072] In some embodiments, reference Figure 1 and Figure 2 As shown, the tidying mechanism 1 also includes a lifting seat 30, a first guide rail 40 and a mounting seat 50; the bottom end of the lifting seat 30 is matched with the driving end of the lifting drive assembly 10; the fixed end of the first driving member 23 and the first guide rail 40 are fixedly mounted on the top of the lifting seat 30, the mounting seat 50 is slidably connected to the first guide rail 40, and the fixed end of the second driving member 24 is mounted on the top of the mounting seat 50; the first tidying member 21 is moved closer to or farther away from the top of the mounting seat 50 by the first driving member 23, and the second tidying member 22 is moved closer to or farther away from the top of the mounting seat 50 by the second driving member 24.

[0073] By arranging both the first regulatable piece 21 and the second regulatable piece 22 on the lifting seat 30, the synchronous lifting and lowering of the first regulatable piece 21 and the second regulatable piece 22 can be achieved; a first guide rail 40 is arranged on the top of the lifting seat 30, and the mounting seat 50 is slidably connected to the first guide rail 40. The fixed end of the first driving member 23 is installed on the top of the lifting seat 30, and the fixed seat of the second driving member 24 is installed on the top of the mounting seat 50, which can avoid the first regulatable piece 21 and the second regulatable piece 22 from interfering with each other during the regulatable process.

[0074] Optionally, the tidying mechanism 1 also includes a second guide rail 60, which is installed on the top of the lifting seat 30, the second guide rail 60 is parallel to the first guide rail 40, and the second guide rail 60 is symmetrically arranged on both sides of the first guide rail 40 with the first guide rail 40 as the center; the mounting seat 50 is slidingly connected to the second guide rail 60; the first driving member 23 is arranged between the mounting seat 30 and the lifting seat 50.

[0075] A second guide rail 60 parallel to the first guide rail 40 is symmetrically arranged on both sides of the first guide rail 40, and the mounting seat 50 is slidably connected to the first guide rail 40 and the second guide rail 60 at the same time. The mounting seat 50 can be stably supported and maintain stable sliding during the regularization process.

[0076] In some embodiments, the tidying mechanism 1 further includes two first photoelectric sensors 71, two second photoelectric sensors (not shown) and two first sensing elements 72, wherein:

[0077] The two first photoelectric sensors 71 are respectively installed on the outside of the two groups of first regular members 21 when they are away from each other, the two second photoelectric sensors are respectively installed on the outside of the two groups of first regular members 21 when they are close to each other, and the two first sensing members 72 are respectively installed on the two groups of first regular members 21;

[0078] When the two groups of first regular members 21 are at positions away from each other, the first sensing members 72 are in the sensing area of ​​the corresponding first photoelectric sensors 71 and are sensed by the first photoelectric sensors 71;

[0079] When the two groups of first aligning members 21 are close to each other, the first sensing members 72 are located in the sensing area of ​​the corresponding second photoelectric sensor and are sensed by the second photoelectric sensor.

[0080] A first photoelectric sensor 71 is arranged outside the position where the two groups of first regular pieces 21 are far away from each other, and a second photoelectric sensor is arranged outside the position where the two groups of first regular pieces 21 are close to each other. A first sensing element 72 that can be sensed by the first photoelectric sensor 71 and the second photoelectric sensor is installed on the two groups of first regular pieces 21. It can trigger a feedback sensing signal when the first regular pieces 21 are in a target approaching position or a target far away position, thereby accurately controlling the position of the first regular pieces 21.

[0081] In some embodiments, reference Figure 3 As shown, the tidying mechanism 1 further includes two third photoelectric sensors 73, two fourth photoelectric sensors 74 and two second sensing elements 75, wherein:

[0082] The two third photoelectric sensors 73 are respectively installed on the outside of the two groups of second regular members 22 when they are away from each other, the two fourth photoelectric sensors 74 are respectively installed on the outside of the two groups of second regular members 22 when they are close to each other, and the two second sensing members 75 are respectively installed on the two groups of second regular members 22;

[0083] When the two sets of second regularization members 22 are at positions away from each other, the second sensing member 75 is in the sensing area of ​​the corresponding third photoelectric sensor 73 and is sensed by the third photoelectric sensor 73;

[0084] When the two groups of second aligning members 22 are close to each other, the second sensing members 75 are located in the sensing area of ​​the corresponding fourth photoelectric sensors 74 and are sensed by the fourth photoelectric sensors 74 .

[0085] A third photoelectric sensor 73 is set outside the position where the two groups of second regular pieces 22 are far away from each other, and a fourth photoelectric sensor 74 is set outside the position where the two groups of second regular pieces 22 are close to each other. A second sensing element 75 that can be sensed by the third photoelectric sensor 73 and the fourth photoelectric sensor 74 is installed on the two groups of second regular pieces 22. It can trigger a feedback sensing signal when the second regular pieces 22 are in a target approaching position or a target far away position, thereby accurately controlling the position of the second regular pieces 22.

[0086] The embodiment of the present application further provides a conveying device, which includes a conveyor belt mechanism and a tidying mechanism 1 as provided in the above embodiment, wherein the tidying mechanism 1 is arranged below the conveyor belt mechanism;

[0087] The conveyor belt mechanism is configured to convey the stacked silicon wafers to the aligning station above the aligning mechanism 1;

[0088] The conveyor belt mechanism includes two parallel conveyor belts 2. The first aligning member 21 is configured to be driven by the lifting drive assembly 10 to rise until the conveyor belts 2 are located within the avoidance opening 25. Then, the first aligning member 21 is driven by the first driving member 23 to move the two aligning members closer to each other in a first direction parallel to the running direction of the conveyor belts 2 to align the silicon wafers on the conveyor belts 2.

[0089] The second aligning member 22 is configured to be driven by the lifting drive assembly 10 to rise from the outside of the two conveyor belts 2, and then driven by the second driving member 24 to approach each other in a second direction perpendicular to the running direction of the conveyor belts 2 to align the silicon wafers on the conveyor belts 2.

[0090] The conveying device provided by the present application is that after the conveyor belt mechanism conveys the stacked silicon wafers to the tidying station above the tidying mechanism 1, the lifting drive assembly 10 drives the first tidying piece 21 to rise to the conveyor belt 2 and is located in the avoidance opening 25 of the first tidying piece 21, and the first drive member 23 drives the first tidying piece 21 to approach each other in a first direction parallel to the running direction of the conveyor belt 2 to tidy the silicon wafers, and the second tidying piece 22 is driven by the second drive member 24 to approach each other from the outside of the conveyor belt 2 and tidy the silicon wafers in a second direction perpendicular to the running direction of the conveyor belt 2. The contact width of the first tidying piece 21 with the silicon wafer is greater than the total width of the conveyor belt 2, and the contact surface with the silicon wafer is large. The silicon wafer can be effectively tidyed even when the deflection angle of the silicon wafer is large. The first tidying piece 21 and the second tidying piece 22 tidy the silicon wafers from two directions perpendicular to each other, and the tidying effect is good.

[0091] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0092] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0093] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A tidying mechanism, which is used to rise from below a conveyor belt and tidy up stacked silicon wafers conveyed on the conveyor belt, characterized in that: The tidying mechanism includes a lifting drive component and a tidying component, wherein: The lifting drive assembly is configured to drive the tidying assembly to rise above the conveyor belt, and to drive the tidying assembly to descend and reset; The tidying assembly includes two groups of first tidying pieces, two groups of second tidying pieces, a first driving piece and a second driving piece. The first tidying piece is provided with an avoidance opening for avoiding the conveyor belt during lifting; The first driving member is configured to drive the two groups of the first aligning members to move closer to or away from each other in a first direction; the second driving member is configured to drive the two groups of the second aligning members to move closer to or away from each other in a second direction; The first direction is parallel to the conveying direction of the conveyor belt, and the second direction is perpendicular to the first direction.

2. The tidying mechanism according to claim 1, characterized in that: The first aligning piece includes a first main aligning piece and a first auxiliary aligning piece. The first auxiliary aligning piece is detachably mounted on at least one end of the first main aligning piece. The first auxiliary aligning piece is configured to be driven by the first main aligning piece to align or move away from the edge of the silicon wafer on the conveyor belt. An avoidance opening for avoiding the conveyor belt is formed between the first main aligning piece and the first auxiliary aligning piece.

3. The tidying mechanism according to claim 2, characterized in that: The first main regulating member includes a first mounting member and a first pushing member connected to each other, the first mounting member is matched with the driving end of the first driving member, and the first pushing member is mounted on the first mounting member through a first elastic member; The first elastic member is configured to provide buffering when the first pushing member abuts against the stacked silicon wafers on the conveyor belt.

4. The tidying mechanism according to claim 3, characterized in that: The first pushing member includes a plate body and a flexible pad. The plate body is mounted on the first mounting member through the first elastic member. The flexible pad is attached to the plate body. The flexible pad is a component used by the first pushing member to abut against the stacked silicon wafers on the conveyor belt.

5. The tidying mechanism according to claim 2, characterized in that: The first auxiliary structuring member includes a first connecting member, a first auxiliary pushing member and a second elastic member. The first connecting member is detachably connected to the first main structuring member, and the first auxiliary pushing member is connected to the first connecting member through the second elastic member.

6. The tidying mechanism according to claim 1, characterized in that: The regularization mechanism also includes a lifting seat, a first guide rail and a mounting seat; The bottom end of the lifting seat is matched with the driving end of the lifting drive assembly; The fixed end of the first driving member and the first guide rail are fixedly mounted on the top of the lifting seat, the mounting seat is slidably connected to the first guide rail, and the fixed end of the second driving member is mounted on the top of the mounting seat; The first regulating member is moved closer to or farther away from the top of the mounting seat by the first driving member, and the second regulating member is moved closer to or farther away from the top of the mounting seat by the second driving member.

7. The tidying mechanism according to claim 6, characterized in that: The aligning mechanism further includes a second guide rail, which is mounted on the top of the lifting seat, is parallel to the first guide rail, and is symmetrically arranged on both sides of the first guide rail with the first guide rail as the center; The mounting seat is slidably connected to the second guide rail; The first driving component is arranged between the mounting seat and the lifting seat.

8. The tidying mechanism according to claim 1, characterized in that: The regularization mechanism further includes two first photoelectric sensors, two second photoelectric sensors and two first sensing elements, wherein: The two first photoelectric sensors are respectively installed on the outside of the two groups of first regular members when they are away from each other, the two second photoelectric sensors are respectively installed on the outside of the two groups of first regular members when they are close to each other, and the two first sensing members are respectively installed on the two groups of first regular members; When the two groups of the first regular members are at positions far away from each other, the first sensing member is within the sensing area of ​​the corresponding first photoelectric sensor and is sensed by the first photoelectric sensor; When the two groups of the first regular members are close to each other, the first sensing members are within the sensing area of ​​the corresponding second photoelectric sensor and are sensed by the second photoelectric sensor.

9. The tidying mechanism according to claim 1, characterized in that: The regularization mechanism further includes two third photoelectric sensors, two fourth photoelectric sensors and two second sensing elements, wherein: The two third photoelectric sensors are respectively installed on the outside of the two groups of second regular members when they are away from each other, the two fourth photoelectric sensors are respectively installed on the outside of the two groups of second regular members when they are close to each other, and the two second sensing members are respectively installed on the two groups of second regular members; When the two groups of the second regular members are at positions away from each other, the second sensing members are in the sensing area of ​​the corresponding third photoelectric sensor and are sensed by the third photoelectric sensor; When the two groups of the second regular members are close to each other, the second sensing members are in the sensing area of ​​the corresponding fourth photoelectric sensor and are sensed by the fourth photoelectric sensor.

10. A conveying device, characterized in that: The conveying device includes a conveyor belt mechanism and a tidying mechanism according to any one of claims 1 to 9, wherein the tidying mechanism is arranged below the conveyor belt mechanism; The conveyor belt mechanism is configured to convey the stacked silicon wafers to the aligning station above the aligning mechanism; The conveyor belt mechanism includes two parallel conveyor belts, and the first aligning member is configured to be driven by the lifting drive assembly to rise until the conveyor belt is located in the avoidance opening, and then driven by the first driving member to move closer to each other in a first direction parallel to the running direction of the conveyor belt to align the silicon wafers on the conveyor belt; The second aligning member is configured to be driven by the lifting drive assembly to rise from the outside of the two conveyor belts, and then driven by the second drive member to approach each other in a second direction perpendicular to the running direction of the conveyor belts to align the silicon wafers on the conveyor belts.

Images