Sensor chip
By setting through grooves or filling glue in the membrane layer structure of the MEMS sensor chip, the reliability problem caused by stress concentration is solved, and the stability and adhesion of the sensor chip are improved.
CN223280636UActive Publication Date: 2025-08-29SUZHOU YUANXIN MICROELECTRONICS TECH CO LTD
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Patent Information
- Application Number
- CN202422599010.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-10-28
AI Technical Summary
Technical Problem
The existing MEMS sensor chips have problems of reduced reliability due to stress concentration in the membrane structure.
Method used
A first trough through multiple layers is provided in the membrane structure of the sensor chip or a silicon substrate is filled with glue to improve stress, balance the stress by controlling the amount of glue filling, and increasing the adhesion between the chip and the PCB board.
Benefits of technology
It improves the reliability and stability of the sensor chip, prevents diaphragm from breaking, and enhances the adhesion between the chip and the PCB board.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN223280636U_ABST
Abstract
The utility model discloses a sensor chip, which is characterized in that the sensor chip comprises a multi-layer structure, and the multi-layer structure comprises a silicon substrate; the silicon substrate is provided with a first side and a second side which are oppositely arranged in the thickness direction of the silicon substrate, and the backboard, the sacrificial layer and the vibrating diaphragm are stacked on the first side; the sacrificial layer is arranged between the back plate and the vibrating diaphragm; the back plate is of a polygonal structure; the vibrating diaphragm is provided with at least one first digging groove arranged around the circumference of the back plate; a first groove penetrates through one or more layers of the multi-layer structure. According to the utility model, the dug grooves penetrating through the multilayer structure are arranged in the sensor chip, so that the stress existing in the polygonal film layer structure is released and balanced, the influence of the stress on multiple aspects such as the vibrating diaphragm structure and the integrity is reduced, and the reliability of the sensor chip is improved.
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