Two-stage double-cylinder liquid cooling high-pressure air pump
Through the design of the secondary dual-cylinder liquid-cooled high-pressure air pump, the use of components such as the coolant tank and semiconductor refrigeration sheet, the problem of temperature increase of high-pressure air pump under high pressure is solved, effective cooling effect is achieved, and service life is improved.
Patent Information
- Application Number
- CN202422763390.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-11-13
AI Technical Summary
When existing high-pressure air pumps work at high pressure or ultra-high pressure, it is easy to cause the pump body temperature to rise and damage, and it is difficult for existing mechanisms to effectively cool down.
A second-stage twin-cylinder liquid-cooled high-pressure air pump is adopted to achieve liquid-cooling cooling of the high-pressure air pump through components such as cooling liquid tank, water pump, liquid-cooling pipe, circulation tube, thermal plate, heat dissipation fin, semiconductor refrigeration sheet.
It improves the service life of the high-pressure air pump, and the liquid cooling effect is significantly reduced, reducing the risk of pump body damage.
Smart Images
Figure CN223282190U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of high-pressure air pumps, in particular to a two-stage double-cylinder liquid-cooled high-pressure air pump. Background Art
[0002] The operating principle of a high-pressure air pump is as follows: the engine drives the pump crankshaft via two V-belts, which in turn drives the piston to pump air. The pumped air is then directed through an air pipe into an air reservoir. The air reservoir, in turn, directs the air from the air reservoir through another air pipe into a pressure-regulating valve mounted on the air pump, thereby controlling the air pressure within the air reservoir. When the air pressure within the air reservoir does not reach the set pressure of the pressure-regulating valve, the air entering the pressure-regulating valve from the air reservoir cannot push the valve open. When the air pressure within the air reservoir reaches the set pressure, the air entering the pressure-regulating valve pushes the valve open and enters the air passage connecting the pressure-regulating valve within the air pump. This air passage controls the air inlet of the air pump, allowing it to operate at no load, thereby reducing power loss and protecting the air pump. When the air pressure within the air reservoir drops below the set pressure of the pressure-regulating valve due to loss, the valve within the pressure-regulating valve is returned by a return spring, disconnecting the air supply to the air pump and allowing the pump to resume pumping. The above principle is the simplest air pump working mechanism. However, when working with some air pumps that require high pressure or ultra-high pressure, the above mechanism principle is not easy to achieve high-pressure load work, resulting in an increase in the temperature of the pump body and the pump body is more easily damaged. Utility Model Content
[0003] The purpose of the utility model is to provide a two-stage double-cylinder liquid-cooled high-pressure air pump, which can liquid-cool the two-stage double-cylinder high-pressure air pump body through a coolant tank, a water pump, a liquid cooling pipe, and a circulation pipe, thereby reducing the temperature of the two-stage double-cylinder high-pressure air pump and increasing its service life.
[0004] To achieve the above object, a two-stage double-cylinder liquid-cooled high-pressure air pump is provided, comprising a two-stage double-cylinder high-pressure air pump body and a coolant tank, one side of the coolant tank being fixedly connected to a water pump, one end of the water pump being fixedly connected to a liquid cooling pipe, the upper end of the coolant tank being fixedly connected to a circulation pipe, both sides of the coolant tank being fixedly connected to heat conducting plates, one side of one of the heat conducting plates being fixedly connected to a plurality of heat dissipating fins;
[0005] A semiconductor refrigeration plate is fixedly connected to one side of the heat conduction plate, a protective shell is fixedly connected to one side of the coolant tank, a plurality of air inlets are provided on the outer wall of the protective shell, a heat dissipation port is provided on one side of the protective shell, and a cooling fan is fixedly connected to the inside of the heat dissipation port.
[0006] According to the two-stage double-cylinder liquid-cooled high-pressure air pump, one end of the liquid-cooling pipe is connected to the two-stage double-cylinder high-pressure air pump body.
[0007] According to the two-stage double-cylinder liquid-cooled high-pressure air pump, one end of the circulation pipe is connected to the two-stage double-cylinder high-pressure air pump body.
[0008] According to the two-stage double-cylinder liquid-cooled high-pressure air pump, the upper end of the coolant tank is fixedly connected to a liquid inlet pipe.
[0009] According to the two-stage double-cylinder liquid-cooled high-pressure air pump, a first dustproof net is fixedly connected to the interior of the air inlet.
[0010] According to the two-stage double-cylinder liquid-cooled high-pressure air pump, a second dustproof net is fixedly connected to the interior of the heat dissipation port.
[0011] Compared with the prior art, the beneficial effects of the present invention are:
[0012] 1. This two-stage double-cylinder liquid-cooled high-pressure air pump is equipped with a coolant tank, a water pump, a liquid cooling pipe, and a circulation pipe to liquid-cool the two-stage double-cylinder high-pressure air pump body, thereby reducing the temperature by liquid cooling and improving the service life.
[0013] 2. This two-stage double-cylinder liquid-cooled high-pressure air pump cools the coolant inside the coolant tank by setting a heat conduction plate, heat dissipation fins, and semiconductor refrigeration sheets, so that it can be recycled and the cooling effect on the pump body is improved.
[0014] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;
[0016] Figure 1 This is a three-dimensional diagram of a two-stage double-cylinder liquid-cooled high-pressure air pump of the utility model;
[0017] Figure 2 This is a cross-sectional view of a coolant tank of a two-stage double-cylinder liquid-cooled high-pressure air pump of the present invention;
[0018] Figure 3 This is a structural schematic diagram of a coolant tank for a two-stage double-cylinder liquid-cooled high-pressure air pump of the utility model;
[0019] Figure 4 This is a schematic diagram of the installation of a protective shell of a two-stage double-cylinder liquid-cooled high-pressure air pump of the utility model.
[0020] In the figure: 1. Two-stage double-cylinder high-pressure air pump body; 2. Coolant tank; 3. Water pump; 4. Liquid cooling pipe; 5. Circulation pipe; 6. Liquid inlet pipe; 7. Heat conduction plate; 8. Heat dissipation fins; 9. Semiconductor refrigeration plate; 10. Protective shell; 11. Air inlet; 12. First dustproof net; 13. Heat dissipation outlet; 14. Cooling fan; 15. Second dustproof net. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the utility model.
[0022] See also Figure 1-4 The embodiment of the utility model provides a technical solution: a two-stage double-cylinder liquid-cooled high-pressure air pump, comprising a two-stage double-cylinder high-pressure air pump body 1, a coolant tank 2, a water pump 3 fixedly connected to one side of the coolant tank 2, a liquid cooling pipe 4 fixedly connected to one end of the water pump 3, and a circulation pipe 5 fixedly connected to the upper end of the coolant tank 2. By arranging the coolant tank 2, the water pump 3, the liquid cooling pipe 4, and the circulation pipe 5, the two-stage double-cylinder high-pressure air pump body 1 is liquid-cooled, and the liquid cooling is performed on the pump body to increase its service life. Both sides of the coolant tank 2 are fixedly connected to heat conducting plates 7, and one side of a heat conducting plate 7 is fixedly connected to a plurality of heat dissipation fins 8;
[0023] A semiconductor refrigeration plate 9 is fixedly connected to one side of a heat conducting plate 7. By arranging the heat conducting plate 7, the heat dissipating fins 8 and the semiconductor refrigeration plate 9, the coolant inside the coolant tank 2 is cooled so that it can be recycled, thereby improving the cooling effect of the two-stage double-cylinder high-pressure air pump body 1. A protective shell 10 is fixedly connected to one side of the coolant tank 2 to protect the semiconductor refrigeration plate 9. Several air inlets 11 are provided on the outer wall of the protective shell 10, and a heat dissipation port 13 is provided on one side of the protective shell 10. A heat dissipation port 13 is fixedly connected to the inside of the heat dissipation port 13. By arranging the heat dissipation port 13, the heat dissipation fan 14 and the air inlet 11, the temperature of the heating surface of the semiconductor refrigeration plate 9 can be conveniently dissipated.
[0024] One end of the liquid cooling pipe 4 is connected to the two-stage double-cylinder high-pressure air pump body 1, one end of the circulation pipe 5 is connected to the two-stage double-cylinder high-pressure air pump body 1, the upper end of the coolant tank 2 is fixedly connected to the liquid inlet pipe 6, the inside of the air inlet 11 is fixedly connected to the first dustproof net 12, and the inside of the heat dissipation port 13 is fixedly connected to the second dustproof net 15. By setting the first dustproof net 12 and the second dustproof net 15, dust is prevented from entering the inside of the protective shell 10.
[0025] Working principle: When in use, turn on the power supply. When the two-stage double-cylinder high-pressure air pump body 1 is in use, start the water pump 3. The water pump 3 draws the coolant inside the coolant tank 2 through the liquid cooling pipe 4 and enters the two-stage double-cylinder high-pressure air pump body 1 to cool it down. After the coolant is used up, it returns to the coolant tank 2 through the circulation pipe 5. The temperature of the coolant will rise after use. The heat will be conducted through the heat conduction plate 7 and dissipated through the heat dissipation fins 8, which has a certain cooling effect. Start the semiconductor refrigeration plate 9, cool it through the cooling surface of the semiconductor refrigeration plate 9, conduct the temperature through the heat conduction plate 7, and cool the coolant, which is convenient for the recycling of the coolant.
[0026] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.
Claims
1. A two-stage double-cylinder liquid-cooled high-pressure air pump, comprising a two-stage double-cylinder high-pressure air pump body (1) and a coolant tank (2), characterized in that: A water pump (3) is fixedly connected to one side of the coolant tank (2), a liquid cooling pipe (4) is fixedly connected to one end of the water pump (3), a circulation pipe (5) is fixedly connected to the upper end of the coolant tank (2), heat conduction plates (7) are fixedly connected to both sides of the coolant tank (2), and a plurality of heat dissipation fins (8) are fixedly connected to one side of one heat conduction plate (7); A semiconductor refrigeration plate (9) is fixedly connected to one side of the heat conducting plate (7), a protective shell (10) is fixedly connected to one side of the coolant tank (2), a plurality of air inlets (11) are provided on the outer wall of the protective shell (10), a heat dissipation port (13) is provided on one side of the protective shell (10), and a heat dissipation fan (14) is fixedly connected inside the heat dissipation port (13).
2. A two-stage, double-cylinder, liquid-cooled, high-pressure air pump according to claim 1, characterized in that: One end of the liquid cooling pipe (4) is connected to the two-stage double-cylinder high-pressure air pump body (1).
3. The two-stage double-cylinder liquid-cooled high-pressure air pump according to claim 1, characterized in that: One end of the circulation pipe (5) is connected to the two-stage double-cylinder high-pressure air pump body (1).
4. A two-stage, double-cylinder, liquid-cooled, high-pressure air pump according to claim 1, characterized in that: The upper end of the coolant tank (2) is fixedly connected with a liquid inlet pipe (6).
5. The two-stage double-cylinder liquid-cooled high-pressure air pump according to claim 1, characterized in that: A first dustproof net (12) is fixedly connected to the interior of the air inlet (11).
6. The two-stage double-cylinder liquid-cooled high-pressure air pump according to claim 1, characterized in that: A second dustproof net (15) is fixedly connected to the interior of the heat dissipation opening (13).