Integrated car lamp panel structure

Abstract

The utility model discloses an integrated car lamp panel structure which comprises a ceramic circuit board and a plurality of light-emitting chips. The ceramic circuit board comprises a ceramic substrate, a master control circuit and a plurality of independent control circuits. The front surface of the ceramic substrate is provided with a heat dissipation area; the master control circuit and the plurality of independent control circuits are separated from each other and are arranged on the ceramic substrate; and the plurality of light-emitting chips are distributed on the heat dissipation area and are welded and fixed with the ceramic substrate. The ceramic circuit board is adopted, the light-emitting chips are matched and directly welded to the ceramic circuit board, the traditional mode that lamp beads are welded to a PCB is replaced, the size of the light-emitting chips is smaller than that of the lamp beads, the number of the light-emitting chips capable of being welded is larger, the integration degree of the lamp panel of the automobile lamp is higher, the brightness is improved, and the use requirement is met; meanwhile, the heat dissipation performance of the ceramic plate is far better than that of a PCB, when the power is high, the ceramic plate can meet the heat dissipation requirement of the light-emitting chip, and the phenomenon of lamp failure is completely eradicated.

Description

Technical Field

[0001] The utility model relates to the field of light panels, in particular to an integrated vehicle light panel structure. Background Art

[0002] Car lights are an essential component of a vehicle. They not only illuminate but also provide warnings and alerts, thereby enhancing driving safety. With technological advancements, car lights are becoming increasingly intelligent. For example, active headlight systems automatically adjust the direction and range of light illumination based on road conditions and vehicle presence, minimizing interference with the vision of drivers in front and oncoming vehicles. Furthermore, car lights are increasingly being developed to address energy conservation, environmental protection, and pollution reduction. New light sources such as LED and laser headlights offer advantages such as energy conservation, environmental friendliness, and durability, making them a key direction for future car lighting development. Furthermore, as consumers demand for personalized vehicles grows, car lighting design is increasingly prioritizing personalized elements. For example, pixel headlights utilize digital light technology to achieve digitization and intelligent computing to control headlight systems with megapixel-level precision, allowing them to project text, graphics, and even video images directly onto the ground.

[0003] Light boards are a crucial component of automotive lighting. Current light boards primarily consist of a printed circuit board (PCB) and multiple lamp beads, which are soldered to the PCB and electrically connected to the circuitry on the PCB. Because the lamp beads typically consist of an LED holder and a light-emitting chip encapsulated within the holder, their bulkiness limits the number of lamp beads that can be soldered onto the PCB, resulting in a relatively low integration level. Furthermore, when operating at high power, the PCB cannot meet the heat dissipation requirements of the lamp beads, resulting in lamp failure. Therefore, improvements to current light boards are necessary. Utility Model Content

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide an integrated vehicle light panel structure, which can effectively solve the problems of low integration and prone to dead lights in existing vehicle light panels.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] An integrated vehicle light panel structure includes a ceramic circuit board and multiple light-emitting chips; the ceramic circuit board includes a ceramic substrate, a master control circuit, and multiple independent control circuits; the front of the ceramic substrate has a heat dissipation area; the master control circuit and the multiple independent control circuits are separated from each other and are all arranged on the ceramic substrate; the multiple light-emitting chips are distributed on the heat dissipation area and welded to the ceramic substrate, with one pin of each light-emitting chip conductively connected to the master control circuit, and another pin of each light-emitting chip conductively connected to the corresponding independent control circuit.

[0007] As a preferred solution, the master control circuit and the multiple independent control circuits are exposed on the front surface of the ceramic substrate, and the master control circuit is located outside the multiple independent control circuits.

[0008] As a preferred solution, a heat dissipation pad is welded and fixed on the back side of the ceramic substrate to improve the heat dissipation effect and avoid power overload.

[0009] As a preferred solution, the heat dissipation pad is made of copper plate, which has a good heat dissipation effect.

[0010] As a preferred solution, the plurality of light-emitting chips are arranged in a right-angled trapezoidal shape to generate lights of different shapes.

[0011] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0012] By using a ceramic circuit board and directly soldering multiple light-emitting chips on the ceramic circuit board, the traditional method of soldering lamp beads on the PCB is replaced. The light-emitting chips are smaller than lamp beads, and more light-emitting chips can be soldered, making the integration of the headlight board higher, increasing the brightness and meeting the needs of use. At the same time, the heat dissipation performance of the ceramic board is much better than that of the PCB board. When the power is high, the ceramic board can meet the heat dissipation requirements of the light-emitting chip and prevent the occurrence of dead lights.

[0013] In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view of a preferred embodiment of the present utility model;

[0015] Figure 2 It is a cross-sectional view of a preferred embodiment of the present utility model.

[0016] Description of the accompanying drawings:

[0017] 10. Ceramic circuit board 11. Ceramic substrate

[0018] 12. Main control circuit 13. Independent control circuit

[0019] 14. Heat dissipation pad 101, heat dissipation area

[0020] 20. Luminescent chip. DETAILED DESCRIPTION

[0021] Please refer to Figure 1 and Figure 2As shown, it shows the specific structure of a preferred embodiment of the present invention, including a ceramic circuit board 10 and a plurality of light-emitting chips 20.

[0022] The ceramic circuit board 10 includes a ceramic substrate 11, a master control circuit 12, and multiple independent control circuits 13. The front of the ceramic substrate 11 has a heat dissipation area 101. The master control circuit 12 and the multiple independent control circuits 13 are separated from each other and are all disposed on the ceramic substrate 11. In this embodiment, the ceramic substrate 11 is rectangular in shape. The master control circuit 12 and the multiple independent control circuits 13 are exposed on the front of the ceramic substrate 11, and the master control circuit 12 is located outside the multiple independent control circuits 13. Furthermore, a heat dissipation pad 14 is soldered to the back of the ceramic substrate 11 to improve heat dissipation and prevent power overload. The heat dissipation pad 14 is made of copper plate, which has good heat dissipation.

[0023] The plurality of light-emitting chips 20 are distributed on the heat dissipation region 101 and soldered to the ceramic substrate 11. One pin of each light-emitting chip 20 is electrically connected to the overall control circuit 12, and another pin of each light-emitting chip 20 is electrically connected to the corresponding independent control circuit 13. In this embodiment, the plurality of light-emitting chips 20 are arranged in a right-angled trapezoidal shape to produce light of different shapes.

[0024] The method of using this embodiment is described in detail as follows:

[0025] When in use, this product is fixed in the lamp housing to form a lamp, and the main control circuit 12 and multiple independent control circuits 13 are respectively connected to the wiring harness. When the lamp is installed on the car, the wiring harness is connected to the car's control system, and each light-emitting chip 20 is independently controlled by the car's control system to generate light of corresponding shapes.

[0026] The design focus of this utility model is: by adopting a ceramic circuit board and directly soldering multiple light-emitting chips on the ceramic circuit board, it replaces the traditional method of using lamp beads soldered on the PCB board. The light-emitting chip is smaller than the lamp beads, and more light-emitting chips can be soldered, making the integration of the car light board higher, increasing the brightness and meeting the needs of use. At the same time, the heat dissipation performance of the ceramic board is much better than that of the PCB board. When the power is high, the ceramic board can meet the heat dissipation requirements of the light-emitting chip and prevent the occurrence of dead lights.

[0027] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. An integrated vehicle light panel structure, characterized by: The invention comprises a ceramic circuit board and a plurality of light-emitting chips; the ceramic circuit board comprises a ceramic substrate, a master control circuit and a plurality of independent control circuits; the front surface of the ceramic substrate has a heat dissipation area; the master control circuit and the plurality of independent control circuits are separated from each other and are all arranged on the ceramic substrate; the plurality of light-emitting chips are distributed on the heat dissipation area and welded to the ceramic substrate, one pin of each light-emitting chip is conductively connected to the master control circuit, and the other pin of each light-emitting chip is conductively connected to the corresponding independent control circuit.

2. The integrated vehicle light panel structure according to claim 1, characterized in that: The overall control circuit and the plurality of independent control circuits are exposed on the front surface of the ceramic substrate, and the overall control circuit is located outside the plurality of independent control circuits.

3. The integrated vehicle light panel structure according to claim 1, characterized in that: A heat dissipation pad is welded and fixed on the back side of the ceramic substrate.

4. The integrated vehicle light panel structure according to claim 3, characterized in that: The heat dissipation pad is made of copper plate.

5. The integrated vehicle light panel structure according to claim 1, characterized in that: The plurality of light-emitting chips are arranged in a right-angled trapezoidal shape.

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