Integrated module for air conditioner, electric control board and air conditioner
By setting up a partition layout area and conductive copper foil in the air conditioner integration module, combining the insulated heat conducting medium and heat dissipation structure, the problem of large thermal resistance between the chip wafer and the substrate is solved, efficient heat dissipation and cost reduction are achieved, and the air conditioner miniaturization design is supported.
Patent Information
- Application Number
- CN202422626154.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-10-29
AI Technical Summary
In the prior art, the thermal resistance between the chip wafer and the substrate of the integrated module is large, and the heat transfer effect is poor, and the need for an additional radiator leads to an increase in cost.
The partition layout area is set on the substrate, and the conductive copper foil is set corresponding to the electrical control function. It is connected through an insulated heat conducting medium. The heat dissipation structure is fixed on the substrate to reduce thermal resistance and improve heat dissipation efficiency.
It effectively reduces the overall thermal resistance of the integrated module, enhances the heat dissipation effect, reduces the heat dissipation cost, and meets the miniaturized design needs of the air conditioner.
Smart Images
Figure CN223283206U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of air conditioning, and in particular to an integrated module for an air conditioner, an electric control panel, and an air conditioner. Background Art
[0002] With technological advancements, air conditioners are becoming increasingly compact, requiring smaller electronic control components. To achieve further miniaturization, electronic control components are increasingly being implemented in integrated modules. Integrated modules integrate a portion of a circuit into a single package, functioning as a single device. Examples include commonly used bridge rectifiers, compressor Intelligent Power Modules (IPMs), and fan IPMs.
[0003] It should be noted that after the electronic control devices are integrated and miniaturized, heat accumulation occurs because multiple power devices are integrated into one package. Solving the heat dissipation problem of the integrated module is the key to further integration and miniaturization of the module.
[0004] In related technologies, multiple media are placed between the chip wafer and the substrate of an integrated module, resulting in low thermal conductivity. This results in high thermal resistance between the chip wafer and the substrate, leading to poor heat transfer. Furthermore, the substrate serves only as a load-bearing and heat-conducting medium, unable to directly transfer the majority of heat to the environment. An additional heat sink is required, which is tightly attached to the heat sink via the thermally conductive medium. This further increases thermal resistance and reduces heat transfer between the chip wafer and the outside world. Consequently, the electronic control requires a larger heat sink to achieve effective heat dissipation, increasing its cost. Utility Model Content
[0005] In view of this, the embodiments of the present application provide an integrated module, an electronic control board and an air conditioner for an air conditioner, aiming to improve the heat dissipation effect of the electronic control and reduce the cost of the electronic control on the basis of miniaturization of the electronic control components of the air conditioner.
[0006] The technical solution of the embodiment of the present application is implemented as follows:
[0007] In a first aspect, an embodiment of the present application provides an integrated module for an air conditioner, comprising:
[0008] A substrate, wherein a first surface of the substrate is provided with a layout area divided based on at least two electronic control functions of the air conditioner, and a second surface of the substrate is fixedly provided with a heat dissipation structure;
[0009] a plurality of conductive copper foils, each of the conductive copper foils being arranged in one-to-one correspondence with the layout area, and each of the conductive copper foils being welded with an electric control device having a corresponding electric control function;
[0010] An insulating heat-conducting medium, one side of which is connected to the first surface, and the other side of which is connected to the plurality of conductive copper foils.
[0011] In some embodiments, the at least two electronic control functions include at least two of the following: power rectification, power inversion, compressor power regulation, fan power regulation, and refrigerant pipeline pressure regulation.
[0012] In some embodiments, the electronically controlled device comprises a chip wafer.
[0013] In some implementation schemes, the layout areas are arranged in sequence based on power supply paths.
[0014] In some embodiments, the heat dissipation structure includes heat dissipation fins and / or heat dissipation columns.
[0015] In some embodiments, the heat dissipation structure is integrally formed with the substrate, or the heat dissipation structure is bonded or welded to the second surface of the substrate.
[0016] In some embodiments, the substrate further includes a plurality of conductive pins disposed on the first surface; the conductive copper foil and / or the electronically controlled components on the conductive copper foil are connected to the conductive pins via connecting wires.
[0017] In a second aspect, an embodiment of the present application provides an electric control board for an air conditioner, wherein the electric control board for an air conditioner includes the integrated module for an air conditioner described in the first aspect of the embodiment of the present application.
[0018] In a third aspect, an embodiment of the present application provides an air conditioner, which includes the electric control board for the air conditioner described in the second aspect of the embodiment of the present application.
[0019] In some embodiments, the air conditioner electric control board is installed in the cavity of the air conditioner.
[0020] The technical solution provided by the embodiment of the present application is an integrated module for an air conditioner, comprising: a substrate, a plurality of conductive copper foils, and an insulating heat-conducting medium. The first surface of the substrate is provided with a layout area divided based on at least two electronic control functions of the air conditioner, and the second surface of the substrate is fixedly provided with a heat dissipation structure. Each conductive copper foil is provided in a one-to-one correspondence with the layout area, and each conductive copper foil is welded with an electronic control device of the corresponding electronic control function. One side of the insulating heat-conducting medium is connected to the first surface, and the other side of the insulating heat-conducting medium is connected to the plurality of conductive copper foils. In this way, the integrated module for an air conditioner in the embodiment of the present application can integrate at least two electronic control functions of the air conditioner, and by welding the electronic control devices of each electronic control function to the corresponding conductive copper foil, each conductive copper foil is connected to the substrate through a common insulating heat-conducting medium, which can effectively reduce the number of transfer layers between the electronic control device and the substrate, thereby reducing thermal resistance. In addition, the heat dissipation structure is fixedly provided on the substrate, which can eliminate the thermal resistance between the substrate and the heat sink, thereby effectively reducing the overall thermal resistance of the integrated module, enhancing the heat dissipation effect, reducing the heat dissipation cost, and better meeting the design requirements of miniaturization of the air conditioner integrated module. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 Schematic diagram of a top view of an integrated module in related art;
[0022] Figure 2 It is a bottom-up schematic diagram of an integrated module in the related art;
[0023] Figure 3 It is a side view schematic diagram of an integrated module in the related art;
[0024] Figure 4 It is a side cross-sectional schematic diagram of an integrated module in the related art;
[0025] Figure 5 This is a side cross-sectional schematic diagram of an integrated module for an air conditioner according to an embodiment of the present application;
[0026] Figure 6 This is a schematic diagram of an integrated circuit of an integrated module in an application example of this application;
[0027] Figure 7 This is a top view of an integrated module in an application example of this application;
[0028] Figure 8 This is a bottom-up schematic diagram of an integrated module in an application example of this application;
[0029] Figure 9 This is a side view of an integrated module in an application example of the present application;
[0030] Figure 10 This is a bottom view schematic diagram of an integrated module after removing the potting medium in an application example of this application.
[0031] Description of reference numerals:
[0032] 100. Integrated module;
[0033] 101. Substrate;
[0034] 102. Heat dissipation structure;
[0035] 103. Conductive copper foil;
[0036] 104. Electronic control devices;
[0037] 105. Insulating thermal conductive medium;
[0038] 106. Conductive pin;
[0039] 107. Potting medium;
[0040] 108. Install fixing holes;
[0041] 109. Connecting line. DETAILED DESCRIPTION
[0042] The present application will be described in further detail below with reference to the accompanying drawings and embodiments.
[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.
[0044] In the description of this application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0045] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood broadly. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0046] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," "above," and "upper side" of a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," "below," and "lower side" of a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0047] In related technologies, such as Figures 1 to 3As shown, the integrated module 100' includes a substrate 101', on which are provided mounting holes 102', a potting medium 103' and conductive pins 104' for electrical connection. The mounting holes 102' are used to mount the integrated module 100' on the corresponding electronic control board; the potting medium 103' is used to encapsulate the integrated electronic control components on the substrate 101' to achieve dustproof, waterproof, and insulation protection for the electronic control components on the substrate 101'; and the conductive pins 104' serve as pins for connecting the integrated module to the outside. The stacked structure inside the integrated module 100' is shown in FIG. Figure 4 As shown, the chip wafer 105' is welded on the first copper foil 106', the first copper foil 106' is connected to the upper surface of the insulating medium 107' (for example, a ceramic substrate), the lower surface of the insulating medium 107' is connected to one side of the second copper foil 108', and the other side of the second copper foil 108' is welded to one side of the substrate 101'.
[0048] In practical applications, in order to improve heat dissipation, the other side of the substrate 101' is usually connected to an external heat sink ( Figure 4 The integrated module (not shown) is tightly attached together to transfer heat away from the integrated module. With this design, multiple dielectrics are placed between chip wafer 105' and substrate 101', resulting in high thermal resistance. There is also significant thermal resistance between substrate 101' and the heat sink, resulting in poor heat dissipation and the need for an additional heat sink, increasing cooling costs.
[0049] Based on this, the embodiment of the present application provides an integrated module for an air conditioner, such as Figure 5 As shown, the integrated module 100 of the embodiment of the present application includes: a substrate 101, a first surface of the substrate 101 is provided with a layout area divided based on at least two electronic control functions of the air conditioner, and a second surface of the substrate 101 is fixedly provided with a heat dissipation structure 102; the integrated module 100 also includes: a plurality of conductive copper foils 103 and an insulating heat-conducting medium 105, each conductive copper foil 103 is provided in a one-to-one correspondence with the layout area, and an electronic control device 104 of the corresponding electronic control function is welded on each conductive copper foil 103; one side of the insulating heat-conducting medium 105 is connected to the first surface of the substrate 101, and the other side of the insulating heat-conducting medium 105 is connected to the plurality of conductive copper foils 103.
[0050] The integrated module 100 of the embodiment of the present application is capable of integrating at least two electronic control functions of an air conditioner, and by respectively soldering the electronic control devices 104 of each electronic control function on the corresponding conductive copper foil 103, each conductive copper foil 103 is connected to the substrate 101 through a common insulating heat-conducting medium 105, which can effectively reduce the number of transfer layers between the electronic control device 104 and the substrate 101, thereby helping to reduce thermal resistance; in addition, a heat dissipation structure 102 is fixedly arranged on the substrate 101, which can eliminate the thermal resistance between the substrate 101 and the radiator, thereby effectively reducing the overall thermal resistance of the integrated module 100, enhancing the heat dissipation effect, reducing the heat dissipation cost, and better meeting the design requirements of miniaturization of the air conditioner integrated module.
[0051] Exemplarily, the at least two electronic control functions integrated into the integrated module 100 include at least two of the following: power rectification, power inversion, compressor power regulation, fan power regulation, and refrigerant pipeline pressure regulation. For example, the air conditioner's power rectification function can utilize a rectifier circuit, the power inversion function can utilize an inverter circuit, the compressor power regulation function can utilize a compressor IPM module, the fan power regulation function can utilize a fan IPM module, and the refrigerant pipeline pressure regulation function can utilize a solenoid valve drive module. In this way, the electronic control components corresponding to at least two of the aforementioned functions can be integrated into the integrated module 100, thereby achieving a miniaturized design of the air conditioner's electronic control.
[0052] In an application example, Figure 6 As shown, the integrated module 100 includes at least two power semiconductor devices of a rectifier circuit, a power factor correction (PFC) circuit, and an inverter circuit, and is internally connected to each other.
[0053] For example, the electronic control device integrated in the integrated module 100 includes a chip wafer. The wafer structure can reduce the size of the power semiconductor device and improve the integration level of the integrated module 100.
[0054] Exemplarily, the layout areas are arranged in sequence based on the power supply path.
[0055] It should be noted that the electronic control devices on the integrated module 100 of the embodiment of the present application are divided into zones according to the integrated electronic control functions, and each layout area is arranged from one end to the other end of the integrated module 100 in the order of the power supply path, thereby optimizing the electrical connection relationship and facilitating the miniaturization design of the integrated module 100.
[0056] Exemplarily, the heat dissipation structure includes heat dissipation fins and / or heat dissipation columns.
[0057] It is understood that the heat dissipation structure can take the form of heat dissipation fins or heat dissipation columns, as long as the heat accumulated on the first surface of the substrate 101 can be quickly dissipated through the heat dissipation structure on the second surface. Since the heat dissipation structure is directly fixed to the substrate 101, it is conducive to improving heat dissipation efficiency and meeting the overall miniaturization design requirements of the integrated module.
[0058] In an application example, Figure 5 As shown, the heat dissipation structure 102 is a heat dissipation fin extending on the second surface of the substrate 101 in a direction away from the substrate 101 .
[0059] Exemplarily, the heat dissipation structure 102 and the substrate 101 are integrally formed, or the heat dissipation structure 102 is bonded or welded to the second surface of the substrate 101 .
[0060] It is understood that the heat dissipation structure 102 can be integrally formed with the substrate 101. For example, integrally formed heat dissipation fins or heat dissipation columns can be provided on the second surface of the substrate 101. In other examples, in addition to integrally forming the substrate 101 and the heat dissipation structure 102, the heat dissipation structure 102 can also be welded, bonded, or otherwise bonded to the substrate 101 to form an inseparable integral structure.
[0061] Exemplarily, the substrate 101 further includes a plurality of conductive pins 106 disposed on the first surface; the conductive copper foil 103 and / or the electronically controlled components 104 on the conductive copper foil 103 are connected to the conductive pins 106 via connecting wires. It is understood that the conductive pins 106 serve as pins for connecting the integrated module 100 to the outside.
[0062] It is understandable that if Figures 7 to 10 As shown, the integrated module 100 also includes a potting medium 107, which is used to encapsulate the integrated electronic control components on the substrate 101, thereby providing dustproof, waterproof, and insulating protection for the electronic control components on the substrate 101. The substrate 101 is also provided with mounting holes 108 for mounting the integrated module 100 on a corresponding electronic control board.
[0063] Figure 10 The bottom view of the integrated module 100 after removing the potting medium in an application example is shown. Figure 10The lower surface of the electronic control device (chip wafer) 104 is soldered to the conductive copper foil 103. The conductive copper foil 103 is arranged based on the integrated functional distribution, and multiple conductive copper foils 103 are connected to the substrate 101 via a common insulating thermal conductive medium 105. The upper surface of the electronic control device 104 is soldered with a connecting wire 109. The connecting wire 109 is used to achieve internal connections within the integrated module or to connect to the conductive pin 106. The devices within the integrated module can be connected to each other through the conductive copper foil 103 and the connecting wire 109. The types of the connecting wire 109 include but are not limited to aluminum wire, gold wire, and silver wire.
[0064] Exemplarily, one side of the insulating thermal conductive medium 105 is covered on one side of the substrate 101 by bonding or crimping, and the conductive copper foil 103 is connected to the other side of the insulating thermal conductive medium 105 by bonding or crimping. The distance between the edge of the conductive copper foil 103 and the edge of the insulating thermal conductive medium is greater than or equal to 0.2 mm to achieve electrical isolation between different layout areas.
[0065] It is understandable that the integrated module of the embodiment of the present application can weld the wafer of the semiconductor power device on multiple isolated conductive copper foils, and the conductive copper foils are connected to the substrate through an insulating heat-conducting medium. One side of the substrate carries the circuit, and the other side forms a heat dissipation fin, which can quickly transfer heat to the environment. In this way, the number of transfer layers between the chip wafer and the substrate is effectively reduced, and the thermal resistance is reduced. At the same time, the substrate acts as a heat sink, eliminating the thermal resistance between the substrate and the heat sink, which not only effectively improves the heat dissipation effect of the electronic control module, but also reduces the cost of the electronic control.
[0066] Illustratively, an embodiment of the present application provides an electric control board for an air conditioner, and the electric control board for the air conditioner includes the aforementioned integrated module for the air conditioner in the embodiment of the present application.
[0067] Illustratively, an embodiment of the present application further provides an air conditioner, which includes the aforementioned electric control board.
[0068] Here, the air conditioner is used to adjust the temperature, humidity, etc. of the environment. The air conditioner can be a dual-purpose air conditioner for cooling and heating, and can be a wall-mounted air conditioner, a cabinet air conditioner, a window air conditioner, or a ceiling-mounted air conditioner, etc., which is not specifically limited in the embodiments of the present application.
[0069] Exemplarily, the electric control board is installed in a cavity of the air conditioner, for example, it can be set in a fan cavity or a compressor cavity of the air conditioner.
[0070] It is understandable that the electric control board is installed in the fan cavity of the air conditioner. When the air conditioner is working, the electric control board can be effectively cooled, saving the need for an independent cooling air source set for the electric control board.
[0071] It should be noted that: "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.
[0072] In addition, the technical solutions described in the embodiments of the present application can be arbitrarily combined without conflict.
[0073] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.
Claims
1. An integrated module for an air conditioner, characterized in that: include: A substrate, wherein a first surface of the substrate is provided with a layout area divided based on at least two electronic control functions of the air conditioner, and a second surface of the substrate is fixedly provided with a heat dissipation structure; a plurality of conductive copper foils, each of the conductive copper foils being arranged in one-to-one correspondence with the layout area, and each of the conductive copper foils being welded with an electric control device having a corresponding electric control function; An insulating heat-conducting medium, one side of which is connected to the first surface, and the other side of which is connected to the plurality of conductive copper foils.
2. The integrated module for air conditioner according to claim 1, characterized in that: The at least two electronic control functions include at least two of the following: power supply rectification, power supply inversion, compressor power regulation, fan power regulation and refrigerant pipeline pressure regulation.
3. The integrated module for air conditioner according to claim 1, characterized in that: The electronic control device includes a chip wafer.
4. The integrated module for air conditioner according to claim 1, characterized in that: The layout areas are arranged in sequence based on power supply paths.
5. The integrated module for air conditioner according to claim 1, characterized in that: The heat dissipation structure includes heat dissipation fins and / or heat dissipation columns.
6. The integrated module for air conditioner according to claim 1, characterized in that: The heat dissipation structure is integrally formed with the substrate, or the heat dissipation structure is bonded or welded to the second surface of the substrate.
7. The integrated module for air conditioner according to claim 1, characterized in that: The substrate further comprises a plurality of conductive pins arranged on the first surface; the conductive copper foil and / or the electronically controlled components on the conductive copper foil are connected to the conductive pins via connecting wires.
8. An electric control panel for an air conditioner, characterized in that: The electric control board for an air conditioner comprises the integrated module for an air conditioner according to any one of claims 1 to 7.
9. An air conditioner, characterized in that: The air conditioner includes the electric control board for the air conditioner as described in 8.
10. The air conditioner according to claim 9, characterized in that The electric control board for the air conditioner is installed in the cavity of the air conditioner.