Energy-saving cooling cycle for semiconductor production
Through the compression refrigerator and water pump circulation system, combined with the water pump and water injection pipe design, the problem of water cooling devices in semiconductor production is solved, and rapid cooling and water source conservation and utilization are achieved.
Patent Information
- Application Number
- CN202421717107.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-19
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-07-19
AI Technical Summary
In the existing semiconductor production, common water cooling methods cannot cool down quickly and consume a lot of water, resulting in the inability to cool normally when there is insufficient water source.
The compressed refrigeration mechanism is used to circulate the water through a water pump, combined with the design of water pumping and water injection pipes to achieve automatic replenishment and recycling of water to avoid insufficient water sources.
It achieves rapid cooling and water conservation and utilization, ensuring the continuous cooling effect of the equipment.
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Figure CN223283303U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor production, in particular to an energy-saving cooling cycle for semiconductor production. Background Art
[0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. From a scientific and technological perspective, the importance of semiconductors is enormous. When producing semiconductors, it is often necessary to adjust the indoor temperature in order to achieve the optimal temperature for semiconductor production. Common cooling devices used in semiconductor production usually use circulating water cooling. However, common water cooling methods cannot quickly cool the equipment, and will continuously consume water during the water cooling process. Once the water supply is insufficient, it will not be able to cool the equipment normally. For this reason, this application proposes an energy-saving cooling cycle for semiconductor production. Summary of the Invention
[0003] In order to solve the problems raised in the above background technology, the present invention provides the following technical solutions: an energy-saving cooling cycle for semiconductor production, comprising a shell, a through hole connected to the inner cavity of the shell is opened at the middle position of the top of the shell, a partition is fixedly installed at the lower position of the inner cavity of the shell, the partition forms a sealed water storage cavity at the bottom of the inner cavity of the shell, a load device is fixedly installed in the through hole, the bottom of the load device extends into the shell and abuts against the top of the partition, a water pump is wrapped around the outer wall of the load device, and the top of the partition is opened on the left side of the load device. There is a first through hole, and a second through hole is opened on the top of the partition and on the right side of the load device. The end of the water pumping pipe with a higher horizontal height is the water inlet end, and the water inlet end of the water pumping pipe extends downward and passes through the first through hole on the partition and extends into the water storage cavity. The end of the water pumping pipe with a lower horizontal height is the water outlet end, and the water outlet end of the water pumping pipe extends downward and passes through the second through hole and extends into the water storage cavity. A compression refrigerator is fixedly installed at the bottom of the water storage cavity. The part of the water pumping pipe wrapped around the outer wall of the load device is set to a semicircular tube shape, and the plane of the semicircular tube part of the water pumping pipe fits with the outer wall of the load device.
[0004] Preferably, a water tank with an upward opening is fixedly mounted on one side of the outer wall of the shell, a third through hole is provided on the side wall of the shell and below the water tank, a fourth through hole is provided on the top of the partition and to the right of the second through hole, and a water injection pipe is fixedly connected to the bottom end of the water tank, and the end of the water injection pipe away from the water tank passes through the third through hole and the fourth through hole in sequence and extends into the water storage cavity.
[0005] Preferably, a water pump is fixedly installed on the top of the partition and on the left side of the load equipment, and the output end of the water pump is connected to the water pumping pipe.
[0006] Preferably, the bottom of the water storage chamber is arranged to be inclined.
[0007] Preferably, a drain outlet is provided at one end of the water storage chamber with a lower horizontal height, and the drain outlet extends to the side of the shell away from the opening at one end of the water storage chamber, and a sealing screw plug is threadedly inserted into the opening of the drain outlet on the side of the shell.
[0008] Preferably, the water inlet end of the water pumping pipe extends to the bottom of the water storage chamber, and the end of the water filling pipe away from the water tank is located at the middle horizontal height of the water storage chamber.
[0009] Compared with the prior art, the beneficial effects of the present invention are:
[0010] The water in the water storage chamber is cooled by a compression refrigerator, and then the cold water is pumped into the water pump through a water pump. The cold water can drive the heat on the load equipment during the flow in the water pump. Finally, the water flows back to the water storage chamber, and the water in the water tank can be automatically replenished into the water storage chamber through the water injection pipe, thereby avoiding insufficient water in the water storage chamber. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0013] Figure 2 It is a structural schematic diagram of a partial section of the utility model;
[0014] Figure 3 This is a schematic diagram of the cross-sectional structure of the housing and the partition of the utility model;
[0015] Figure 4 This is a schematic diagram of the cross-sectional structure of a part of the water pumping pipe of the present invention;
[0016] In the figure: 1. Shell; 2. Partition; 3. Water storage chamber; 4. Through port; 5. Load device; 6. Water pump; 7. First through hole; 8. Second through hole; 9. Water pump; 10. Water storage tank; 11. Water injection pipe; 12. Third through hole; 13. Fourth through hole; 14. Compression refrigerator; 15. Drain port; 16. Sealing plug. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0018] Depend on Figure 1-4 The utility model includes a shell 1, a through hole 4 communicating with the inner cavity thereof is opened at the middle position of the top of the shell 1, a partition 2 is fixedly installed at the lower position of the inner cavity of the shell 1, and the partition 2 forms a sealed water storage chamber 3 at the bottom of the inner cavity of the shell 1, a load device 5 is fixedly installed in the through hole 4, the bottom of the load device 5 extends into the shell 1 and rests on the top of the partition 2, a water pumping pipe 6 is wound around the outer wall of the load device 5, a first through hole 7 is opened at the top of the partition 2 and located on the left side of the load device 5, a second through hole 8 is opened at the top of the partition 2 and located on the right side of the load device 5, and the end of the water pumping pipe 6 with a higher horizontal height is the water inlet end , and the water inlet end of the water pumping pipe 6 extends downward and passes through the first through hole 7 on the partition 2 and extends into the water storage chamber 3. The end of the water pumping pipe 6 with a lower horizontal height is the water outlet end, and the water outlet end of the water pumping pipe 6 extends downward and passes through the second through hole 8 and extends into the water storage chamber 3. A compression refrigerator 14 is fixedly installed at the bottom of the water storage chamber 3. The part of the water pumping pipe 6 wrapped around the outer wall of the load device 5 is set to a semicircular tube shape, and the plane of the semicircular tube part of the water pumping pipe 6 is in contact with the outer wall of the load device 5. This can increase the contact area between the water pumping pipe 6 and the outer wall of the load device 5, so that when the cold water flows in the water pumping pipe 6, it can bring more heat to the load device 5.
[0019] like Figure 1 and Figure 2 As shown, a water tank 10 with an upward opening is fixedly mounted on one side of the outer wall of the shell 1, a third through hole 12 is provided on the side wall of the shell 1 and below the water tank 10, a fourth through hole 13 is provided on the top of the partition 2 and to the right of the second through hole 8, and a water injection pipe 11 is fixedly connected to the bottom end of the water tank 10, and the end of the water injection pipe 11 away from the water tank 10 passes through the third through hole 12 and the fourth through hole 13 in sequence and extends into the water storage chamber 3. The water in the water tank 10 can be injected into the water storage chamber 3 through the water injection pipe 11, thereby avoiding the situation of insufficient water in the water storage chamber 3.
[0020] like Figure 2 As shown, a water pump 9 is fixedly installed on the top of the partition 2 and on the left side of the load device 5. The output end of the water pump 9 is connected to the water pumping pipe 6. The water in the water storage chamber 3 can be circulated through the water pump 9. The water in the water storage chamber 3 enters from the water inlet end of the water pumping pipe 6 and is discharged from the water outlet end.
[0021] like Figure 2 and Figure 3 As shown, the bottom of the water storage chamber 3 is arranged to be inclined to facilitate complete discharge of water in the water storage chamber 3.
[0022] like Figure 2 and Figure 3 As shown, a drain outlet 15 is provided at one end of the water storage chamber 3 at a lower level. The drain outlet 15 extends to the side of the shell 1 away from the opening at one end of the water storage chamber 3. A sealing screw plug 16 is threadedly inserted at the opening of the drain outlet 15 on the side of the shell 1. The water in the water storage chamber 3 can be discharged for replacement through the drain outlet 15.
[0023] like Figure 2 As shown, the water inlet end of the water pumping pipe 6 extends to the bottom of the water storage chamber 3, and the end of the water injection pipe 11 away from the water tank 10 is located at the middle horizontal height of the water storage chamber 3. When the water level in the water storage chamber 3 is lower than the bottom end of the water injection pipe 11, the water in the water tank 10 will flow into the water storage chamber 3 through the water injection pipe 11.
[0024] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.
[0025] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An energy-saving cooling cycle for semiconductor production, comprising a housing (1), characterized in that: A through-hole (4) communicating with the inner cavity of the shell (1) is provided at a middle position on the top of the shell (1), a partition (2) is fixedly installed at a lower position of the inner cavity of the shell (1), and the partition (2) forms a sealed water storage cavity (3) at the bottom of the inner cavity of the shell (1). A load device (5) is fixedly installed in the through-hole (4), and the bottom of the load device (5) extends into the shell (1) and abuts against the top of the partition (2). A water pumping pipe (6) is wound around the outer wall of the load device (5). A first through-hole (7) is provided on the top of the partition (2) and on the left side of the load device (5). A second through hole (8) is provided on the right side of the water pumping pipe (6), the end of the water pumping pipe (6) with a higher horizontal height is the water inlet end, and the water inlet end of the water pumping pipe (6) extends downward and passes through the first through hole (7) on the partition (2) and extends into the water storage chamber (3), the end of the water pumping pipe (6) with a lower horizontal height is the water outlet end, and the water outlet end of the water pumping pipe (6) extends downward and passes through the second through hole (8) and extends into the water storage chamber (3), a compression refrigeration machine (14) is fixedly installed at the bottom of the water storage chamber (3), the part of the water pumping pipe (6) wound around the outer wall of the load device (5) is set to a semicircular tube shape, and the plane of the semicircular tube part of the water pumping pipe (6) is in contact with the outer wall of the load device (5).
2. The energy-saving cooling cycle for semiconductor production according to claim 1, characterized in that: A water tank (10) with an upward opening is fixedly mounted on one side of the outer wall of the shell (1); a third through hole (12) is provided on the side wall of the shell (1) and below the water tank (10); a fourth through hole (13) is provided on the top of the partition (2) and to the right of the second through hole (8); a water injection pipe (11) is fixedly connected to the bottom end of the water tank (10); an end of the water injection pipe (11) away from the water tank (10) passes through the third through hole (12) and the fourth through hole (13) in sequence and extends into the water storage chamber (3).
3. The energy-saving cooling cycle for semiconductor production according to claim 1, characterized in that: A water pump (9) is fixedly installed on the top of the partition (2) and on the left side of the load device (5), and the output end of the water pump (9) is connected to the water pumping pipe (6).
4. The energy-saving cooling cycle for semiconductor production according to claim 1, characterized in that: The bottom of the water storage chamber (3) is arranged in an inclined shape.
5. The energy-saving cooling cycle for semiconductor production according to claim 4, characterized in that: A drain outlet (15) is provided at one end of the water storage chamber (3) at a lower level. The drain outlet (15) extends away from the opening at one end of the water storage chamber (3) to the side of the housing (1). A sealing screw plug (16) is threadedly inserted into the opening of the drain outlet (15) located on the side of the housing (1).
6. The energy-saving cooling cycle for semiconductor production according to claim 2, characterized in that: The water inlet end of the water pumping pipe (6) extends to the bottom of the water storage chamber (3), and the end of the water injection pipe (11) away from the water storage tank (10) is located at the middle horizontal height of the water storage chamber (3).