Heat exchanger

Abstract

The heat exchanger comprises a core body, the core body comprises at least two sets of chip assemblies which are sequentially arranged in a stacked mode in the vertical direction, each chip assembly comprises an upper chip and a lower chip which are sequentially arranged in a stacked mode from top to bottom, and the upper chips and the lower chips are correspondingly provided with circulation openings which communicate with each other; a lower chip which is located above an upper chip and is adjacent to the upper chip in a core body is defined as a first chip, the peripheral edge of a circulation opening of the upper chip extends upwards to form a flange, the top edge of the flange is provided with a limiting piece, and at least part of the limiting piece is located in a circulation opening of the first chip; at least part of the outer wall face of the limiting piece makes contact with the corresponding position of the peripheral edge of the first chip circulation opening, a space ring is arranged between every two adjacent chip assemblies, and the space rings are arranged on the peripheries of the turned-over edges in a sleeving mode and connected with the adjacent upper chips and the lower chips. Therefore, the strength of the heat exchanger is better, and the service life of the heat exchanger is prolonged. The production complexity is reduced, and the production is convenient.

Description

Technical Field

[0001] The present application relates to the field of heat exchange technology, and in particular to a heat exchanger. Background Art

[0002] Heat exchangers are a type of cooling device commonly used in hydraulic and lubrication systems. They enable heat exchange between two fluids with a certain temperature difference, thereby reducing the temperature and ensuring the normal operation of the system.

[0003] Current heat exchangers are typically constructed from stacked chip assemblies, with spacers separating adjacent chip assemblies. Typically, the lower chip opening of the upper chip assembly is folded downward to form a lower flange, while the upper chip opening of the lower chip assembly is folded upward to form an upper flange. The upper and lower flanges are then inserted into each other to secure the relative positions of the two adjacent chip assemblies. However, this has the following drawbacks:

[0004] Due to the height and diameter limitations of the upper and lower flanges, interference between them can occur, resulting in excessively large welds between the spacer and the lower and upper chips, leading to leaks. Alternatively, excessive gaps can weaken the weld. Furthermore, because a flat spacer is placed at the bottom of the core, the flow port of the lower chip at the bottom of the core does not require flanges. This requires a separate design for the bottom chip, increasing production complexity. Utility Model Content

[0005] Based on this, it is necessary to provide a heat exchanger that is simple to produce and avoids interference between two adjacent groups of chip components.

[0006] The present application provides a heat exchanger, which includes a core body, the core body includes at least two groups of chip components stacked in sequence along the up and down directions, the chip components include an upper chip and a lower chip stacked in sequence from top to bottom, the upper chip and the lower chip are respectively provided with mutually connected flow openings, the up and down direction is defined as a first direction, and the direction basically perpendicular to the first direction is defined as a second direction, the lower chip in the core body located above the upper chip and arranged adjacent to the upper chip is defined as a first chip, the flow opening of the upper chip is defined as a first flow opening, and the flow opening of the lower chip is defined as a second flow opening, the periphery of the first flow opening extends upward to form a flange, the top edge of the flange is provided with a limit member for limiting the relative movement of the two adjacent groups of chip components in the second direction, at least a portion of the limit member is located in the second flow opening of the first chip, and at least a portion of the outer wall surface of the limit member contacts the corresponding position of the periphery of the second flow opening, and a spacer is provided between the two adjacent groups of chip components, the spacer is sleeved on the outer periphery of the flange and connects the adjacent upper chip and lower chip.

[0007] In one embodiment, the upper chip includes an upper chip body arranged along the second direction, the first flow port is located on the upper chip body, the lower chip includes a lower chip body arranged side by side with the upper chip body, the second flow port is located on the lower chip body, the bottom surface of the spacer is in contact with the top surface of the upper chip body on the corresponding side, and the top surface of the spacer is in contact with the bottom surface of the lower chip body on the corresponding side.

[0008] In one embodiment, the flange height of the upper chip is defined as h, the thickness of the spacer is defined as h1, and the thickness of the lower chip body is defined as h2. The height h, thickness h1, and thickness h2 satisfy h≤h1+h2.

[0009] In one embodiment, the lower chip includes a lower chip body arranged along the second direction, the second flow port is located on the lower chip body, and in the core body, the top of the limiting member of the upper chip is located above the top surface of the lower chip body of the first chip, or the top of the limiting member of the upper chip is flush with the top surface of the chip body below the first chip.

[0010] In one embodiment, the limiting member includes a first part and a second part, both extending upward, which are arranged at intervals along the second direction, and at least parts of the outer wall surfaces of the first part and the second part are in contact with corresponding positions on the periphery of the second flow port on the corresponding side.

[0011] In one embodiment, a direction perpendicular to both the first direction and the second direction is defined as a third direction, the first flow opening in the chip assembly and the corresponding first flow openings are connected to form a channel, there are at least two channels and they are spaced apart, each flange corresponds to a limiting member, and the limiting member also includes a third part for limiting the relative movement of two adjacent groups of chip assemblies in the third direction, along the second direction, the third part is located between the first part and the second part, and at least a part of the outer wall of the third part is in contact with the peripheral wall of the second flow opening, at least two third parts on the upper chip are spaced apart along the third direction, and are both arranged at a position away from each other, or are both arranged at a position close to each other.

[0012] In one embodiment, the chip assembly further includes a fin located between the upper chip and the lower chip, the fin and the upper chip are stacked, the flow port of the fin is defined as the third flow port, and the channel is formed by corresponding connections among the first flow port, the third flow port and the second flow port.

[0013] In one embodiment, a direction that intersects the second direction and the third direction and is located in the same plane is defined as a fourth direction, and the channels are arranged at intervals along the fourth direction.

[0014] In one embodiment, the first portion, the second portion and the third portion of the limiting member are arranged at intervals along the circumference of the corresponding flange.

[0015] In one embodiment, the limiting member is a protrusion formed by sequentially connecting the first part, the third part, and the second part, and the protrusion extends along the circumference of the flange.

[0016] In one embodiment, the side walls of the first portion and the second portion away from the third portion are both inclined surfaces that gradually incline toward the third portion and upward along the circumference of the flange.

[0017] In one embodiment, one of the first circulation openings is an inlet for medium to flow in, and another is an outlet for medium to flow out. The area of ​​the upper chip between the inlet and the outlet is defined as the first area, and the first part, the second part and the third part are all located at a position of the flange away from the first area.

[0018] Compared with the prior art, in the heat exchanger provided by the present application, a flange is only provided at the first flow port of the upper chip. By providing a limiter on the flange, the positioning of the two adjacent groups of chip components is achieved, thereby preventing the two adjacent groups of chip components from offsetting during welding, transportation, etc., and avoiding the flange interference problem caused by the flange provided at the second flow port of the lower chip. This avoids the situation where the spacer ring and the first chip and the second chip cannot be fully fitted together during connection, resulting in a reduced connection strength or solder leakage. The strength of the heat exchanger is better and the service life of the heat exchanger is extended. In addition, there is no flange provided at the second flow port. At this time, the lower chip at the bottom of the core does not need to be provided separately, which reduces the complexity of production and facilitates production. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A three-dimensional diagram of a heat exchanger according to an embodiment of the present application;

[0021] Figure 2 for Figure 1 A partial cross-sectional view of a heat exchanger is shown;

[0022] Figure 3 for Figure 1 A schematic diagram of the exploded structure of the chip assembly in the heat exchanger is shown;

[0023] Figure 4 for Figure 1 A partial cross-sectional view of a heat exchanger is shown;

[0024] Figure 5 for Figure 4 A partial enlarged view of position I in the heat exchanger shown;

[0025] Figure 6 for Figure 4 A partial enlarged view of position II in the heat exchanger shown;

[0026] Figure 7 A partial cross-sectional view of a heat exchanger according to an embodiment of the present application;

[0027] Figure 8 for Figure 7 A schematic diagram of a three-dimensional exploded structure of a chip assembly of a heat exchanger is shown;

[0028] Figure 9 A partial cross-sectional view of a heat exchanger according to another embodiment of the present application;

[0029] Figure 10 for Figure 9 A schematic diagram of a three-dimensional exploded structure of a chip assembly of a heat exchanger is shown;

[0030] Figure 11 A partial cross-sectional view of a heat exchanger according to another embodiment of the present application;

[0031] Figure 12 for Figure 11 A schematic diagram of a three-dimensional exploded structure of a chip assembly of a heat exchanger is shown;

[0032] Figure 13 for Figure 12 A local enlarged view of point III in the chip assembly is shown.

[0033] Figure markings: 1. core body; 2. chip assembly; 21. upper chip; 210. first flow port; 211. upper chip body; 212. flange; 213. first extended edge; 214. wide edge; 22. fin; 220. third flow port; 23. lower chip; 23a. first chip; 230. second flow port; 231. lower chip body; 232. second extended edge; 3. limiter; 31. first part; 32. second part; 33. third part; 331. inclined surface; 4. spacer; 5. channel; 6. flat gasket. DETAILED DESCRIPTION

[0034] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0035] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right", "side", "top", "bottom" and similar expressions used in the specification of this application are only used to describe the various example structural parts and elements of this application, but these terms are used here for the purpose of convenience of explanation and are determined based on the example orientations shown in the accompanying drawings, and do not represent the only implementation method. Since the embodiments disclosed in the application can be set in different directions, these terms indicating directions are only for illustration and should not be regarded as limitations. For example, "up" and "down" are not necessarily limited to directions opposite to or consistent with the direction of gravity.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0037] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0039] See Figures 1 to 13 The present application provides a heat exchanger comprising a core 1, which includes at least two groups of chip assemblies 2 stacked in a vertical direction. Each group of chip assemblies 2 has an identical structure. The vertical direction is defined as a first direction A. Since each group of chip assemblies 2 is stacked in the vertical direction, the first direction A is the stacking direction of the chip assemblies 2, which is also the height direction of the heat exchanger.

[0040] like Figures 1 to 3 As shown, the chip assembly 2 includes an upper chip 21, a fin 22, and a lower chip 23 stacked in sequence from top to bottom. The upper chip 21, the fin 22, and the lower chip 23 are correspondingly provided with mutually connected flow openings. In one embodiment, the flow opening is a non-circular hole. In this embodiment, the flow opening is a circular hole. The flow opening of the upper chip 21 is defined as the first flow opening 210, the flow opening of the lower chip 23 is defined as the second flow opening 230, and the flow opening of the fin 22 is defined as the third flow opening 220.

[0041] A direction substantially perpendicular to the first direction A is defined as the second direction B. It should be noted that "substantially perpendicular" includes but is not limited to perpendicular, such as slightly deviating from perpendicular.

[0042] like Figures 4 to 6 As shown, the lower chip 23 located above the upper chip 21 in the core 1 and arranged adjacent to the upper chip 21 is defined as a first chip 23 a , and the upper chip 21 is defined as a second chip.

[0043] like Figure 3 、 Figure 4 and Figure 6 As shown, the periphery of the first flow opening 210 extends upward to form a flange 212. The top edge of the flange 212 is provided with a stopper 3 for limiting the relative movement of two adjacent groups of chip assemblies 2 in the second direction B. At least a portion of the stopper 3 is located within the second flow opening 230 of the first chip 23a. In one embodiment, at least a portion of the outer wall of the stopper 3 contacts a corresponding position of the periphery of the second flow opening 230 of the first chip 23a. It is understood that the diameter of the second flow opening 230 is slightly larger than the outer diameter of the flange 212 of the upper chip 21.

[0044] A spacer 4 is provided between each of the two adjacent groups of chip assemblies 2. The spacer 4 is positioned around the flange 212 and connects the adjacent first chip 23a and the second chip. The spacer 4 primarily connects the adjacent first chip 23a and the second chip by welding, such as brazing, but other welding methods may also be used.

[0045] It can be understood that the flange 212 is only provided at the first flow port 210, and the positioning of the two adjacent groups of chip components 2 is achieved by providing a limiter 3 on the flange 212, thereby preventing the two adjacent groups of chip components 2 from being offset during welding, transportation, etc., and avoiding the problem of flange interference caused by the flange provided at the second flow port 230, thereby avoiding the reduction in connection strength or solder leakage caused by the inability of the spacer ring 4 to fully fit with the first chip 23a and the second chip during connection.

[0046] In one embodiment, if Figure 1 、 Figure 5 and Figure 6 As shown, the upper chip 21 includes an upper chip body 211 arranged along the second direction B, and the first flow port 210 is located on the upper chip body 211. The upper chip 21 includes a lower chip body 231 arranged side by side with the upper chip body 211. Then, the lower chip body 231 is also arranged along the second direction B. The second flow port 230 is located on the lower chip body 231.

[0047] like Figure 6 As shown, the bottom surface of the spacer ring 4 is aligned with the top surface of the upper chip body 211 of the corresponding second chip, and the top surface of the spacer ring 4 is aligned with the bottom surface of the lower chip body 231 of the corresponding second chip. In addition, the outer peripheral wall of the upper chip body 211 extends downward to form a first extended edge 213, and the outer peripheral wall of the lower chip body 231 extends upward to form a second extended edge 232. The first extended edge 213 is located outside the adjacent second extended edge 232, and the inner peripheral surface of the first extended edge 213 is aligned with the outer peripheral surface of the second extended edge 232.

[0048] like Figure 5 As shown, the height of the flange 212 of the upper core 21 is defined as h, the thickness of the spacer 4 is defined as h1, and the thickness of the lower core body 231 is defined as h2. The height h, thickness h1, and thickness h2 satisfy the condition h ≤ h1 + h2. When h > h1 + h2, the flange 212 extends into the cavity between the upper core 21 and the lower core 23, which houses the fins 22. This reduces the vertical height of the cavity and thus increases the oil pressure drop.

[0049] In one embodiment, if Figure 5 and Figure 6As shown, in the core body 1, the top of the limiting member 3 of the upper chip 21 is located above the top surface of the lower chip body 231 of the first chip 23a. That is, the total height H of the flange 212 of the upper chip 21 below and the limiting member 3 is greater than the sum of the thickness h1 of the spacer 4 and the thickness h2 of the lower chip body 231. In another embodiment, the top of the limiting member 3 of the upper chip 21 is flush with the top surface of the lower chip body 231 of the first chip 23a. In other embodiments, the top of the limiting member 3 of the upper chip 21 is located between the top surface and the bottom surface of the lower chip body 231 of the first chip 23a.

[0050] like Figure 1 As shown, a direction perpendicular to both the first direction A and the second direction B is defined as a third direction C, and a direction intersecting the second direction B and the third direction C and lying in the same plane is defined as a fourth direction D. In one embodiment, the upper chip 21 is circular. In this case, the first direction A is the height direction of the core 1, and the second direction B, the third direction C, and the fourth direction D are all diameter directions of the chip. In another embodiment, the upper chip 21 is elliptical.

[0051] In this embodiment, if Figure 1 and Figure 2 As shown, the core 1 is in the shape of a rectangular parallelepiped, the first direction A is the thickness direction of the core 1, the second direction B is the width direction of the core 1, the third direction C is the length direction of the core 1, and the fourth direction D is the diagonal direction of the cross section of the core 1. In another embodiment, the second direction B is the length direction of the core 1, and the third direction C is the width direction of the core 1. In addition, the flow direction of the medium in the flow channel between the upper chip 21 and the lower chip 23 is generally consistent with the length direction of the core 1. Figure 2 As shown, the first flow port 210, the third flow port 220 and the second flow port 230 in the above-mentioned core body 1 are connected to form a channel 5, and there are at least two channels 5 and they are distributed at intervals. In one embodiment, the channel 5 is located in the central area of ​​the core body 1, and there are two of them. In one embodiment, the two channels 5 are spaced apart along the first direction A or the second direction B. In another embodiment, the two channels 5 are spaced apart along the fourth direction D. In one embodiment, there may be three or more channels 5. In this embodiment, there are two channels 5, and they are respectively close to the wide edges of the corresponding sides of the chip assembly. That is, there are two first flow ports 210 on the upper chip 21.

[0052] like Figure 3As shown, each flange 212 corresponds to a stopper 3. In one embodiment, the stopper 3 includes a first portion 31 and a second portion 32, both extending upward. The first portion 31 and the second portion 32 are spaced apart along the width of the core 1, and at least portions of the outer walls of the first portion 31 and the second portion 32 respectively contact corresponding locations along the periphery of the second flow opening 230 of the first chip 23a. It will be understood that the presence of the first portion 31 and the second portion 32 limits the relative displacement of two adjacent groups of chip assemblies 2 along the width of the core 1.

[0053] In one embodiment, if Figure 3 As shown, the above-mentioned limiting member 3 includes not only a first portion 31 and a second portion 32 both extending upward, but also a third portion 33 for limiting the relative movement of the two adjacent groups of chip assemblies 2 in the length direction of the core 1. Along the width direction, the third portion 33 is located between the first portion 31 and the second portion 32. It can be understood that the existence of the above-mentioned third portion 33 limits the relative displacement of the two adjacent groups of chip assemblies 2 in the length direction of the core 1, that is, the cooperation of the first portion 31 and the second portion 32 can realize the positioning of the two adjacent groups of chip assemblies 2 in two directions, improve the positioning effect between the two adjacent groups of chip assemblies 2, and better prevent the displacement of the two adjacent groups of chip assemblies during welding, transportation, etc.

[0054] The upper core 21 has at least two third portions 33 spaced apart along the length of the core 1. In one embodiment, each flange 212 of the upper core 21 corresponds to at least two third portions 33. In other words, each upper core 21 has three or more third portions 33. The third portions 33 of the two flanges 212 are spaced apart along the length of the core 1. In this embodiment, each flange 212 corresponds to one third portion 33.

[0055] like Figure 3 、 Figure 7 and Figure 8 As shown, the third portion 33 of each flange 212 is close to the wide edge 214 of the corresponding upper chip 21. In other words, the two third portions 33 are spaced apart along the length of the core 1 and are both located at a position away from each other. At least a portion of the outer wall of the two third portions 33 is in contact with the peripheral wall of the second flow opening 230 of the corresponding first chip 23a. In addition, in another embodiment, as Figure 9 As shown, the third portion 33 of each flange 212 is arranged close to the other flange 212, that is, the third portions 33 on the two flanges 212 are arranged at a position close to the other side.

[0056] In addition, in another embodiment, the above-mentioned first part 31 and the second part 32 are arranged at intervals along the length direction of the core 1, and the third parts 33 of the two flanges 212 are arranged at intervals along the width direction of the core 1, and are both close to the long edge of the chip 21 on the corresponding side, or, are both set at a position close to the other side.

[0057] In one embodiment, if Figure 3 As shown, the first part 31 , the second part 32 and the third part 33 of the above-mentioned limiting member 3 are arranged at intervals along the circumference of the corresponding flange 212 , that is, the first part 31 , the second part 32 and the third part 33 are all independent limiting parts.

[0058] In another embodiment, Figures 7 to 12 As shown, the limiting member 3 is a protrusion formed by sequentially connecting the first part 31 , the third part 33 and the second part 32 , and the protrusion extends along the circumference of the flange 212 .

[0059] In one embodiment, the sidewalls of the first portion 31 and the second portion 32 away from the third portion 33 are vertical surfaces. Figure 11 and Figure 12 As shown, the side walls of the first and second portions 31, 32 of the protrusion away from the third portion 33 are both inclined surfaces 331 that gradually slope upward toward the third portion 33 along the circumference of the flange 212. Furthermore, one of the side walls of the first and second portions 31, 32 away from the third portion 33 is a vertical surface, while the other side wall is an inclined surface 331 that gradually slopes upward toward the third portion 33 along the circumference of the flange 212.

[0060] It can be understood that the above-mentioned single protrusion can limit the relative movement of two adjacent chip components 2 in the width direction and the length direction.

[0061] One of the first flow openings 210 is an inlet for medium to flow in, and the other first flow opening 210 is an outlet for medium to flow out. The area between the inlet and the outlet of the upper chip 21 is defined as the first area 21a. In one embodiment, Figure 7 、 Figure 8 、 Figure 11 and Figure 12 As shown, the first portion 31 , the second portion 32 and the third portion 33 are all located at a position of the flange 212 away from the first region 21 a .

[0062] It can be understood that the first part 31, the second part 32 and the third part 33 realize the positioning of two adjacent groups of chip components in two directions. When the medium flows into the flow channel of the core 1 through the inlet, the first part 31, the second part 32 and the third part 33 are located away from the first area 21a. Therefore, the first part 31, the second part 32 and the third part 33 will not hinder the flow of the medium, reduce the flow resistance, and improve the heat exchange efficiency.

[0063] like Figure 6 As shown, the heat exchanger further includes a flat washer 6 disposed at the bottom of the core 1. The top surface of the flat washer 6 is in contact with the bottom surface of the core 1. The presence of the flat washer 6 helps to strengthen the compressive strength of the core 1. Because the structures of the various chip assemblies 2 are identical, the bottommost lower chip 23 has the same structure as the other lower chips 23. This eliminates the need for a separate redesign of the bottommost lower chip 23 of the core 1, reducing costs and facilitating production management.

[0064] When the chip assemblies 2 are stacked, two spacers 4 are first placed around the outer edges of the two flanges 212 of the upper chip 21, and then another chip assembly 2 is placed on the spacers 4 in the same direction. Since the total height H of the flange 212 and the stopper 3 of the lower chip assembly 2 is greater than the sum of the thickness h1 of the spacers 4 and the thickness h2 of the chip, the second flow opening 230 of the lower chip 23 of the upper chip assembly 2 is placed on the stopper 3 of the upper chip 21 of the lower chip assembly 2. The presence of the stopper 3 allows the upper chip assembly 2 to move relative to the lower chip assembly 2 in the length and width directions. In this way, the chip assemblies 2 are continuously stacked to achieve the required number of core body 1 layers.

[0065] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A heat exchanger, characterized in that: The invention comprises a core body (1), wherein the core body (1) comprises at least two groups of chip components (2) stacked in sequence along the up-down direction, wherein the chip component (2) comprises an upper chip (21) and a lower chip (23) stacked in sequence from top to bottom, wherein the upper chip (21) and the lower chip (23) are provided with flow openings that are interconnected, wherein the up-down direction is defined as a first direction (A), and a direction substantially perpendicular to the first direction (A) is defined as a second direction (B), wherein the lower chip (23) located above the upper chip (21) and arranged adjacent to the upper chip (21) in the core body (1) is defined as a first chip (23a), wherein the flow opening of the upper chip (21) is defined as a first flow opening (210), and wherein the lower chip (23) is defined as The flow opening is a second flow opening (230), the periphery of the first flow opening (210) extends upward to form a flange (212), the top edge of the flange (212) is provided with a limiter (3) for limiting the relative movement of the two adjacent groups of chip components (2) in the second direction (B), at least a part of the limiter (3) is located in the second flow opening (230) of the first chip (23a), and at least a part of the outer wall surface of the limiter (3) contacts the corresponding position of the periphery of the second flow opening (230), and a spacer (4) is provided between the two adjacent groups of chip components (2), the spacer (4) is sleeved on the periphery of the flange (212), and connects the adjacent upper chip (21) and lower chip (23).

2. The heat exchanger according to claim 1, characterized in that The upper chip (21) includes an upper chip body (211) arranged along the second direction (B), the first flow port (210) is located on the upper chip body (211), the lower chip (23) includes a lower chip body (231) arranged side by side with the upper chip body (211), the second flow port (230) is located on the lower chip body (231), the bottom surface of the spacer (4) is in contact with the top surface of the upper chip body (211) on the corresponding side, and the top surface of the spacer (4) is in contact with the bottom surface of the lower chip body (231) on the corresponding side.

3. The heat exchanger according to claim 2, characterized in that The height of the flange (212) of the upper chip (21) is defined as h, the thickness of the spacer (4) is defined as h1, and the thickness of the lower chip body (231) is defined as h2. The height h, thickness h1, and thickness h2 satisfy the following: h≤h1+h2.

4. The heat exchanger according to claim 1, characterized in that The lower chip (23) includes a lower chip body (231) arranged along the second direction (B), the second flow port (230) is located on the lower chip body (231), and in the core body (1), the top end of the limiting member (3) of the upper chip (21) is located above the top surface of the lower chip body (231) of the first chip (23a), or the top end of the limiting member (3) of the upper chip (21) is flush with the top surface of the lower chip body (231) of the first chip (23a).

5. The heat exchanger according to any one of claims 1 to 4, characterized in that: The limiting member (3) comprises a first portion (31) and a second portion (32) both extending upward, the first portion (31) and the second portion (32) being arranged at intervals along the second direction (B), and at least parts of the outer wall surfaces of the first portion (31) and the second portion (32) respectively contact corresponding positions on the periphery of the second flow opening (230) on the corresponding side.

6. The heat exchanger according to claim 5, characterized in that A direction perpendicular to both the first direction (A) and the second direction (B) is defined as a third direction (C); the first flow opening (210) and the second flow opening (230) in the chip assembly (2) are connected to form a channel (5); there are at least two channels (5) and they are spaced apart; each flange (212) corresponds to a limiting member (3); the limiting member (3) further comprises a third portion (33) for limiting relative movement of two adjacent groups of chip assemblies (2) in the third direction (C); along the second direction (B), the third portion (33) is located between the first portion (31) and the second portion (32), and at least a portion of the outer wall of the third portion (33) contacts the peripheral wall of the second flow opening (230); at least two third portions (33) on the upper chip (21) are spaced apart along the third direction (C), and are both arranged at a position away from each other, or are both arranged at a position close to each other.

7. The heat exchanger according to claim 6, characterized in that The chip assembly (2) further includes a fin (22) located between the upper chip (21) and the lower chip (23), wherein the fin (22) and the upper chip (21) are stacked and arranged, and the flow port of the fin (22) is defined as a third flow port (220), and the channel (5) is formed by correspondingly connecting the first flow port (210), the third flow port (220) and the second flow port (230).

8. The heat exchanger according to claim 7, characterized in that A direction intersecting the second direction (B) and the third direction (C) and located in the same plane is defined as a fourth direction (D), and the channels (5) are arranged at intervals along the second direction (B) or the third direction (C) or the fourth direction (D).

9. The heat exchanger according to claim 6, characterized in that The first part (31), the second part (32) and the third part (33) of the limiting member (3) are arranged at intervals along the circumference of the corresponding flange (212).

10. The heat exchanger according to claim 9, characterized in that The limiting member (3) is a protrusion formed by sequentially connecting the first part (31), the third part (33) and the second part (32), and the protrusion extends along the circumference of the flange (212).

11. The heat exchanger according to claim 10, characterized in that The side walls of the first portion (31) and the second portion (32) away from the third portion (33) are both inclined surfaces (331) that gradually incline toward the third portion (33) and upward along the circumference of the flange (212).

12. The heat exchanger according to claim 10, characterized in that Among the first circulation openings (210), one first circulation opening (210) is an inlet for medium to flow in, and another first circulation opening (210) is an outlet for medium to flow out. The area of ​​the upper chip (21) located between the inlet and the outlet is defined as the first area (21a), and the first part (31), the second part (32) and the third part (33) are all located at a position of the flange (212) away from the first area (21a).

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