Testing device for heat and humidity test of plastic package device

Abstract

The utility model discloses a testing device for a damp-heat test of a plastic package device, which comprises a test board system and a high-acceleration test system, and the test board system is connected with the high-acceleration test system. The test board system comprises a PCB, a golden finger, a power supply jumper wire, a device welding area, a protective tube welding area and a support, the golden finger is connected with the PCB, and the golden finger, the power supply jumper wire, the protective tube welding area and the device welding area are electrically connected in sequence. According to the utility model, the test board is provided with the power supply jumper wire and the protective tube welding area, so that the electrical connection abnormity of a plug-in jumper wire structure and a plug-in protective tube caused by the oxidation of a connector lug in a humid and hot environment is avoided; the device welding area and the corresponding welding station are arranged, a to-be-tested device product is placed at the position of the welding pad during welding, welding is conducted through reflow soldering, and the situation that electric connection is abnormal due to the fact that a probe head is oxidized in a hot and humid environment in a testing seat connection mode is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic device testing, and in particular relates to a test device for wet heat testing of plastic-sealed devices. Background Art

[0002] A damp heat test involves applying harsh temperature, humidity, and bias conditions to accelerate moisture penetration through the external protective materials of electronic components or the interface between external materials and metal conductors, thereby testing the operating status of electronic components in this environment. Plastic-encapsulated electronic components are typically subjected to damp heat testing after production to ensure product reliability and durability. Traditional damp heat testing involves placing the device in a test socket on a burn-in board, which is then connected to a sealed pressure vessel that can continuously maintain a specified temperature and relative humidity. A specified bias voltage is applied to the device during the test. Because this test is conducted in a high-temperature, high-humidity environment, using a conventional burn-in board can cause oxidation of the metal on the test socket, device pins, and fuse pins. This can cause rust on the test socket, device pins, and fuse pins, affecting the electrical connection between the device under test and the damp equipment. This ultimately leads to unstable test results that fail to meet high-standard test requirements. Therefore, there is an urgent need for a test device that can provide a stable electrical connection.

[0003] For example, Chinese patent publication number CN117884198A discloses a high-low temperature and humidity test chamber, which relates to the field of laboratory equipment technology. The chamber includes a test chamber formed by an outer insulation material, in which a horizontal wind field is formed. Several test racks are installed in the test chamber, and the test racks are configured as follows: the windward side of the sample on the fixed rack rotates around a cylindrical cam under the force of the horizontal wind field. When it rotates to the other side, it rotates to the side wind side under the action of the crank, shaft, and cylindrical cam, so that the sample rotates in one direction around the cylindrical cam under the action of the horizontal wind field, thereby achieving testing under wind conditions at different angles. However, this patent only improves the humidity test chamber, and does not improve the test plate. When using traditional aging plates for humidity and heat tests, the aging plates will still rust, resulting in unstable test results. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a test device for wet heat test of plastic sealed components.

[0005] The utility model is achieved through the following technical solutions.

[0006] The utility model provides a test device for a wet heat test of a plastic packaged device, comprising a test board system and a highly accelerated test system, wherein the test board system is connected to the highly accelerated test system;

[0007] The test board system includes a PCB board, a gold finger, a power jumper, a device welding area, a fuse welding area and a bracket. The power jumper, the device welding area and the fuse welding area are arranged on the PCB board, the gold finger is connected to the PCB board, the gold finger, the power jumper, the fuse welding area and the device welding area are electrically connected in sequence, and the bracket is connected to the PCB board.

[0008] Preferably, a solder resist layer is provided on the outside of the PCB board, and an anti-corrosion layer is provided on the outside of the solder resist layer.

[0009] Preferably, the gold finger includes an upper gold finger and a lower gold finger, and the upper gold finger and the lower gold finger respectively have a plurality of pins.

[0010] Preferably, the power jumper includes a plurality of jumper areas, and a single jumper area includes a plurality of electrodes;

[0011] The device welding area includes a plurality of welding stations, each of which is provided with a welding pad;

[0012] The soldering pads are soldered by reflow soldering.

[0013] Preferably, the fuse welding area is used for welding a fuse, and the fuse is a fuse with high humidity and heat resistance and explosion resistance.

[0014] Preferably, the highly accelerated test system comprises a power supply module and a humid box module, wherein the power supply module is connected to the humid box module and a test board system respectively, and the test board system is arranged in the humid box module.

[0015] Preferably, the power supply module includes: a device library, a batch setting subsystem, a test control subsystem, a data acquisition subsystem and a batch report subsystem, and the device library, batch setting subsystem, test control subsystem, data acquisition subsystem and batch report subsystem are respectively connected to the test board system.

[0016] Preferably, the humid box module includes a temperature control subsystem, a humidity control subsystem, a pressure control subsystem, a power interface and a test interface. The temperature control subsystem, humidity control subsystem and pressure control subsystem are respectively connected to the power interface, the power interface is connected to the power supply module, and the test interface is connected to the test board system.

[0017] The beneficial effects of the present invention are:

[0018] 1. A power jumper is set on the test board. When in use, just short-circuit the corresponding interface according to the electrical schematic diagram of the original component to be tested or the power supply direction. This avoids the abnormal electrical connection caused by oxidation of the terminal head in a hot and humid environment in the plug-in jumper structure;

[0019] 2. A fuse welding area is set up to avoid abnormal electrical connection caused by oxidation of the plug-in fuse in a hot and humid environment;

[0020] 3. The device welding area and corresponding welding stations are set up. When welding, the device to be tested is placed on the pad and soldered by reflow soldering, which avoids the abnormal electrical connection caused by oxidation of the probe head in a humid and hot environment when the test socket is connected;

[0021] 4. Made of corrosion-resistant materials, the test board can be made to extend its service life in harsh environments such as high temperature and high humidity. At the same time, a layer of anti-corrosion material is applied to the entire test board after the test board is manufactured to ensure its reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure provided by Example 1 of the present utility model;

[0023] Figure 2 This is a schematic diagram of the test board system structure provided in Example 1 of the present utility model;

[0024] Figure 3 This is a schematic diagram of the power jumper structure provided by Example 1 of the present utility model;

[0025] Figure 4 This is a schematic structural diagram of the welding area of ​​the fuse provided in Example 1 of the present utility model;

[0026] Figure 5 This is a schematic diagram of the device welding area structure provided in Example 1 of the present utility model;

[0027] Figure 6 This is a schematic diagram of the test board system structure provided by Example 2 of the present utility model;

[0028] Figure 7 This is a schematic diagram of the test board system structure provided in Example 3 of the present utility model. DETAILED DESCRIPTION

[0029] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the described solution.

[0030] Example 1:

[0031] like Figure 1 As shown, a test device for a wet heat test of a plastic packaged device includes a test board system and a highly accelerated test system, wherein the test board system is connected to the highly accelerated test system;

[0032] The test board system is used to connect the device under test and the highly accelerated test system; the highly accelerated test system is used to maintain a humid and hot environment and provide power supply.

[0033] like Figure 2 As shown, the test board system includes a PCB board, a gold finger, a power jumper, a device welding area, a fuse welding area and a bracket. The power jumper, the device welding area and the fuse welding area are arranged on the PCB board, the gold finger is connected to the PCB board, the gold finger, the power jumper, the fuse welding area and the device welding area are electrically connected in sequence, and the bracket is connected to the PCB board.

[0034] The PCB board is used to carry gold fingers, power jumpers, device welding areas and fuse welding areas; the PCB board is used to carry out overall circuit layout according to the shape, voltage, current and electrical connection method of the device to be tested.

[0035] In this embodiment, the model of the device under test is DFN5x6, so the corresponding power jumper, device welding area and fuse welding area are designed according to the external dimensions of the device under test.

[0036] The gold finger is used to connect the power supply module; it is matched according to the interface of the wet heat equipment, and the aging board interface is designed to be a gold finger shape, which is convenient for taking and placing the test board, and also ensures the normal electrical connection.

[0037] The power jumper is used to control the on and off of the power supply; a power jumper reserved port is designed according to the structure of the device under test product. When in use, the corresponding interface can be short-circuited according to the electrical schematic diagram of the device under test product or the power supply direction, avoiding the abnormal electrical connection caused by oxidation of the terminal head in a hot and humid environment in a plug-in jumper structure.

[0038] The device welding area is used to connect the device to be tested; according to the product dimensions of the device to be tested, the corresponding device welding area is designed on the test board. During welding, the device to be tested is placed on the welding pad and soldered by reflow soldering, thereby avoiding abnormal electrical connection caused by oxidation of the probe head in a humid and hot environment when the test socket connection method is used.

[0039] The fuse welding area is used for welding fuses to protect the safe operation of the circuit; the fuse welding area is designed on the test board based on the current that may flow through the product during the humidity test and the planned size of the fuse to be used, thereby avoiding abnormal electrical connection caused by oxidation of the terminal head of the plug-in fuse in a humid and hot environment.

[0040] The bracket is used to fix the PCB board, making it convenient for the test board system to be connected to the high-acceleration test system.

[0041] The material of the PCB board supports epoxy resin or polyimide resin, and the conductive layer supports copper foil;

[0042] A solder resist layer is provided outside the PCB board, and an anti-corrosion layer is provided outside the solder resist layer.

[0043] The gold finger comprises an upper gold finger and a lower gold finger, and each of the upper gold finger and the lower gold finger has a plurality of pins;

[0044] The material of the gold finger is a gold-plated material with electrical conductivity and corrosion resistance.

[0045] like Figure 3 As shown, the power jumper includes several jumper areas, and each jumper area includes several electrodes;

[0046] In this embodiment, there are two jumper areas, A and B. Three electrodes are provided in each jumper area, and electrical connection is performed according to the area where the device under test is soldered during the test.

[0047] like Figure 5 As shown, the device welding area includes several welding stations, each of which is provided with a welding pad;

[0048] In this embodiment, 40 welding stations are set according to the devices under test, and 40 devices under test can be tested at the same time.

[0049] The soldering pads are soldered by reflow soldering.

[0050] like Figure 4 As shown, the fuse welding area is used for welding the fuse, and the fuse is a fuse with high humidity and heat resistance and explosion resistance.

[0051] The material of the bracket is aluminum alloy.

[0052] The bracket is made of aluminum alloy, which ensures the sturdiness of the bracket and reduces the weight. At the same time, it ensures that the test board is more convenient to take and put when connected to the equipment, and it is also more convenient to directly stack and store the test boards.

[0053] The highly accelerated test system includes a power supply module and a wet box module, wherein the power supply module is connected to the wet box module and a test board system respectively, and the test board system is arranged in the wet box module;

[0054] The power supply module is used to provide power to the test board system and the wet box module and control the power supply voltage;

[0055] In this embodiment, the power supply module has five test areas and six power supply controls. Five test board systems can be tested simultaneously each time, and the maximum test power can reach 2000V.

[0056] The humid box module is used to maintain a humid and hot environment.

[0057] In this embodiment, the temperature of the wet box module can reach up to 200° C., the humidity can reach up to 100%, and the pressure can reach up to 0.4 MPa.

[0058] The power supply module includes: a device library, a batch setting subsystem, a test control subsystem, a data acquisition subsystem and a batch report subsystem, and the device library, batch setting subsystem, test control subsystem, data acquisition subsystem and batch report subsystem are respectively connected to the test board system;

[0059] The device library is used to archive the test procedures of the device under test;

[0060] The batch setting subsystem is used to set the archive batches during the test of the device under test;

[0061] The test control subsystem is used to control the power supply to the test board system;

[0062] The data acquisition subsystem is used to collect test data;

[0063] The batch report subsystem is used to query the test data of different archived batches.

[0064] The humid box module includes a temperature control subsystem, a humidity control subsystem, a pressure control subsystem, a power interface and a test interface. The temperature control subsystem, the humidity control subsystem and the pressure control subsystem are respectively connected to the power interface, the power interface is connected to the power supply module, and the test interface is connected to the test board system;

[0065] The temperature control subsystem is used to control the temperature of the test environment;

[0066] The humidity control subsystem is used to control the humidity of the test environment;

[0067] The pressure control subsystem is used to control the air pressure of the test environment;

[0068] The power interface is used to connect to the power supply module;

[0069] The test interface is used to connect to the test board system.

[0070] Example 2:

[0071] like Figure 6 As shown, this embodiment is modified based on Example 1. The difference between this embodiment and Example 1 is:

[0072] In this embodiment, the device under test is SOT-89, and the connection lines, device welding area, and fuse welding area of ​​the PCB board are reset accordingly. Since the pin settings of the device under test are different, the welding station settings of the device welding area are also different.

[0073] Example 3:

[0074] like Figure 7 As shown, this embodiment is modified based on Example 1. The difference between this embodiment and Example 1 is that:

[0075] The device under test in this embodiment is TO-220, and the connection lines, device welding area and fuse welding area of ​​the PCB board are reset accordingly. Among them, due to the different pin settings of the device under test, the welding station settings of the device welding area are also different.

[0076] The utility model has the characteristics of simple structure, convenient manufacturing, low cost, etc.

[0077] When the utility model is used to conduct strong accelerated steady-state damp heat and steady-state damp heat tests, the test board is convenient to take out. The power jumper and the fuse on the test board are connected by welding, avoiding the abnormal electrical connection caused by oxidation of the wiring head in a wet and hot environment in a plug-in connection method. The welding area of ​​appropriate size is designed, and welding can be directly performed through reflow soldering equipment, avoiding the abnormal electrical connection caused by oxidation of the probe head in a wet and hot environment in a test socket connection method.

[0078] Finally, the entire test board is made of corrosion-resistant materials to increase its service life in harsh environments such as high temperature and high humidity. At the same time, after the test board is completed, a layer of anti-corrosion material is coated on the entire test board to further ensure the test life and insulation.

Claims

1. A test device for wet heat test of plastic packaged components, characterized in that: It includes a test board system and a highly accelerated test system, wherein the test board system is connected to the highly accelerated test system; The test board system includes a PCB board, a gold finger, a power jumper, a device welding area, a fuse welding area and a bracket. The power jumper, the device welding area and the fuse welding area are arranged on the PCB board, the gold finger is connected to the PCB board, the gold finger, the power jumper, the fuse welding area and the device welding area are electrically connected in sequence, and the bracket is connected to the PCB board.

2. The test device for wet heat test of plastic packaged components according to claim 1, characterized in that: A solder resist layer is provided outside the PCB board, and an anti-corrosion layer is provided outside the solder resist layer.

3. The test device for wet heat test of plastic packaged components according to claim 1, characterized in that: The gold finger comprises an upper gold finger and a lower gold finger, and each of the upper gold finger and the lower gold finger has a plurality of pins.

4. The test device for wet heat test of plastic packaged components according to claim 1, characterized in that: The power jumper includes a plurality of jumper areas, and each jumper area includes a plurality of electrodes; The device welding area includes a plurality of welding stations, each of which is provided with a welding pad; The soldering pads are soldered by reflow soldering.

5. The test device for wet heat test of plastic packaged components according to claim 1, characterized in that: The fuse welding area is used for welding the fuse, and the fuse is a fuse with high humidity and heat resistance and explosion resistance.

6. The test device for wet heat test of plastic packaged components according to claim 1, characterized in that: The highly accelerated test system includes a power supply module and a wet box module. The power supply module is connected to the wet box module and a test board system respectively. The test board system is arranged in the wet box module.

7. The test device for wet heat test of plastic packaged components according to claim 6, characterized in that: The power supply module includes: a device library, a batch setting subsystem, a test control subsystem, a data acquisition subsystem and a batch report subsystem, and the device library, batch setting subsystem, test control subsystem, data acquisition subsystem and batch report subsystem are respectively connected to the test board system.

8. The test device for wet heat test of plastic packaged components according to claim 6, characterized in that: The humid box module includes a temperature control subsystem, a humidity control subsystem, a pressure control subsystem, a power interface and a test interface. The temperature control subsystem, humidity control subsystem and pressure control subsystem are respectively connected to the power interface, the power interface is connected to the power supply module, and the test interface is connected to the test board system.

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