Efficient heat dissipation computer case structure

Abstract

The utility model discloses a computer case structure with an efficient heat dissipation function, and belongs to the field of computers. The case structure comprises a shell, a ventilation opening formed in the bottom of the front end of the shell, a detachable dust removal net arranged in the ventilation opening, heat dissipation holes formed in the tops of the two sides of the shell and an auxiliary heat dissipation structure used for exhausting hot air in the shell in an accelerated mode. The auxiliary heat dissipation structure comprises a drainage plate fixedly connected to the top in the shell and inclined plates symmetrically arranged in the shell and corresponding to the bottoms of the heat dissipation holes. Gaps for hot air to pass through are formed between the inclined plates and the drainage plate. Wherein the two inclined plates are arranged in a splayed shape. By optimizing a heat dissipation path and adding an auxiliary heat dissipation structure, the heat dissipation efficiency of the computer is improved, hot air can be quickly discharged out of the case, and the temperature in the case is reduced. The arrangement of the drainage plate and the inclined plate enables the hot air to be guided in the rising process, reduces the residence time of the hot air in the case, and further improves the heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a computer chassis structure with high-efficiency heat dissipation. Background Art

[0002] With the rapid development of computer technology, high-performance processors, graphics cards, and other hardware are constantly being released. As a result, the heat generated by computers during operation is also increasing. To ensure stable computer operation, an efficient cooling system has become particularly important.

[0003] Currently, the most common computer cooling method is to circulate air through the vents at the rear of the case and the heat dissipation holes at the front. In this cooling design, the cooling fan on the motherboard draws cool air from the outside into the case through the vents at the rear, and then exhausts the hot air from the case through the heat dissipation holes at the front.

[0004] Although the above-mentioned heat dissipation method can reduce the operating temperature of the computer to a certain extent, due to the location of the cooling fan and the design limitations of the air circulation path, the hot air circulates slowly inside the chassis, resulting in low heat dissipation efficiency. Inside the chassis, especially around components that generate more heat, the hot air is easily trapped and cannot be quickly discharged, causing the internal temperature of the chassis to rise, affecting the stability and service life of the computer.

[0005] Therefore, the present application provides a computer chassis structure with high heat dissipation efficiency to solve the above problems. Utility Model Content

[0006] The present application provides a computer chassis structure with high heat dissipation efficiency, aiming to solve the problem raised in the background art that the existing computer chassis lacks internal heat drainage, which easily causes the hot air to be retained inside the chassis and cannot be quickly discharged, resulting in an increase in the internal temperature of the chassis.

[0007] To achieve the above-mentioned objectives, the present application provides the following technical solution: a computer case structure with high-efficiency heat dissipation, comprising a housing, a vent provided at the front bottom of the housing, a detachable dust removal net disposed within the vent, heat dissipation holes provided at the top of both sides of the housing, and an auxiliary heat dissipation structure for accelerating the discharge of hot air inside the housing;

[0008] To improve the computer's heat dissipation, the auxiliary heat dissipation structure includes a guide plate fixedly attached to the top of the housing to direct hot air, and a symmetrically positioned inclined plate within the housing, corresponding to the bottom of the heat dissipation holes. A gap is formed between the inclined plate and the guide plate for hot air to pass through. The two inclined plates are arranged in a figure-eight pattern. During heat dissipation, the cooling fan on the computer's motherboard activates, drawing cool air from outside into the computer through the dust filter and vents, cooling the components inside. Simultaneously, hot air generated by the components rises within the chassis, encounters the guide plate, and is directed to diffuse to the sides before entering the heat dissipation holes through the gap between the inclined plate and the guide plate. Because the inclined plates are arranged in a figure-eight pattern, the hot air is squeezed and guided by the inclined plates during its rise, making it easier to exit the chassis through the heat dissipation holes, achieving a bottom-in, top-out heat dissipation effect. By optimizing the heat dissipation path and adding the auxiliary heat dissipation structure, the computer's heat dissipation efficiency is significantly improved, hot air stagnation is reduced, noise levels are lowered, and maintenance is facilitated.

[0009] Preferably, to enhance the diversion effect of the drain plate, the drain plate is V-shaped. Its apex points toward the center of the chassis, while its two sides extend toward the sides of the chassis, forming a certain angle with the inclined plate. The coordinated design of the V-shaped drain plate and the figure-eight inclined plate allows for smoother flow of hot air within the chassis, improving the efficiency of hot air exhaust and thus significantly increasing the heat dissipation efficiency of the computer. By optimizing the shape of the drain plate and the configuration of the inclined plate, the residence time of hot air within the chassis is effectively reduced, further enhancing the heat dissipation effect and lowering the temperature within the chassis.

[0010] Preferably, in order to change the flow rate of hot air out of the heat dissipation hole: the shell is provided with a triangular chamber connected to the heat dissipation hole and the gap between the guide plate and the inclined plate corresponding to the heat dissipation hole. The design of the triangular chamber makes the flow of hot air inside the chassis smoother, thereby improving the efficiency of heat dissipation. At the same time, since the hot air is compressed in the triangular chamber, the flow rate is accelerated, and the heat dissipation effect at the heat dissipation hole is significantly enhanced. As an efficient hot air channel, the triangular chamber not only accelerates the discharge of hot air, but also reduces the residence time of hot air inside the chassis. This helps to reduce the temperature inside the chassis and improve the stability of the computer.

[0011] To facilitate cleaning of the dust filter, the dust filter is preferably provided with a through-hole into which a screw threadedly connected to the housing is inserted. The through-hole and the threaded screw design make the dust filter easy to remove and install, greatly facilitating cleaning and maintenance. Regular cleaning of the dust filter effectively removes accumulated dust and debris, maintaining its filtering and heat dissipation performance, thereby ensuring smooth air circulation within the chassis and improving the computer's heat dissipation efficiency.

[0012] Preferably, to prevent the computer from sliding on the floor, support legs are fixedly connected to the four corners of the bottom end of the housing, and anti-slip pads are fixedly connected to the bottom ends of the support legs. The design of the support legs and anti-slip pads makes the chassis more stable when placed, preventing sliding or tipping due to uneven ground or external forces, and ensuring safe operation of the computer.

[0013] Preferably, to reduce the temperature of air entering through the dust screen, a cooling plate is positioned between the vent and the dust screen. The cooling plate is filled with coolant and has ventilation holes corresponding to the filter holes in the dust screen. The introduction of the cooling plate significantly reduces the temperature of air entering the chassis, thereby improving the chassis' heat dissipation efficiency. This design allows the computer to maintain a stable temperature even under prolonged, high-load operation, extending its lifespan.

[0014] This application improves the computer's heat dissipation efficiency by optimizing the heat dissipation path and adding auxiliary heat dissipation structures, allowing hot air to be discharged from the chassis more quickly and reducing the temperature inside the chassis. The provision of guide plates and inclined plates guides hot air as it rises, reducing its residence time inside the chassis and further improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The present invention is a structural diagram of a computer case structure with high efficiency in heat dissipation;

[0016] Figure 2 for Figure 1 Explosion display diagram of the structure inside the central vent;

[0017] Figure 3 for Figure 1 A cross-sectional plan view of the internal structure of the middle shell;

[0018] Figure 4 for Figure 1 Bottom view of the structure.

[0019] In the picture:

[0020] 1. Shell; 2. Ventilation port; 21. Dust removal net; 211. Through hole; 212. Screw; 3. Heat dissipation hole; 4. Auxiliary heat dissipation structure; 41. Drain plate; 42. Inclined plate; 43. Gap; 5. Triangular chamber; 6. Support leg; 61. Anti-slip pad; 7. Cooling plate; 71. Coolant; 72. Ventilation hole. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0022] This embodiment provides a computer chassis structure with high efficiency heat dissipation, such as Figure 1-4 As shown, the chassis structure includes a shell 1, a vent 2 opened at the front bottom of the shell 1, a detachable dust removal net 21 arranged in the vent 2, heat dissipation holes 3 opened at the top of both sides of the shell 1, and an auxiliary heat dissipation structure 4 for accelerating the discharge of hot air inside the shell 1; the dust removal net 21 is detachably arranged in the vent 2, which is convenient for users to clean and replace, effectively preventing dust from entering the interior of the chassis, and extending the service life of the computer.

[0023] In order to improve the heat dissipation effect of the computer: the auxiliary heat dissipation structure 4 includes a guide plate 41 fixedly connected to the top of the shell 1 for guiding the hot air, and an inclined plate 42 symmetrically arranged inside the shell 1 and corresponding to the bottom of the heat dissipation hole 3. A gap 43 for the hot air to pass through is formed between the inclined plate 42 and the guide plate 41; wherein, the two inclined plates 42 are arranged in an eight-shaped shape. By optimizing the heat dissipation path and adding the auxiliary heat dissipation structure 4, the heat dissipation efficiency of the computer is improved, so that the hot air can be discharged from the outside of the chassis more quickly, and the temperature inside the chassis is reduced. The arrangement of the guide plate 41 and the inclined plate 42 guides the hot air during its rise, reduces the residence time of the hot air inside the chassis, and further improves the heat dissipation effect. During the heat dissipation process, the heat dissipation fan on the mainboard of the computer starts, and the external cold air is introduced into the computer through the dust removal net 21 and the vent 2 to cool the components inside the computer. At the same time, the heat generated by the components rises inside the chassis, encounters the guide plate 41, and is directed to diffuse to the sides. It then enters the heat dissipation holes 3 through the gap 43 between the inclined plate 42 and the guide plate 41. Because the inclined plate 42 is arranged in an "eight" shape, the heat is squeezed and guided by the inclined plate 42 during its rise, making it easier to discharge out of the chassis through the heat dissipation holes 3, achieving a bottom-in, top-out heat dissipation effect. By optimizing the heat dissipation path and adding the auxiliary heat dissipation structure 4, the computer's heat dissipation efficiency is significantly improved, heat retention is reduced, noise levels are lowered, and maintenance is facilitated.

[0024] Specifically, to enhance the diversion effect of the guide plate 41, the guide plate 41 is V-shaped. Its apex points toward the center of the chassis, while its two sides extend toward the sides of the chassis, forming a certain angle with the inclined plate 42. The coordinated design of the V-shaped guide plate 41 and the figure-eight inclined plate 42 allows for smoother flow of hot air within the chassis, improving the efficiency of hot air exhaust and thus significantly enhancing the heat dissipation efficiency of the computer. By optimizing the shape of the guide plate 41 and the arrangement of the inclined plate 42, the residence time of hot air within the chassis is effectively reduced, further enhancing the heat dissipation effect and lowering the temperature within the chassis. The V-shaped guide plate 41 not only guides the hot air to diffuse to the sides but also promotes the overall circulation of air within the chassis, allowing the cool air to be more evenly distributed within the chassis and improving the uniformity of heat dissipation. During the heat dissipation process, when the cooling fan on the computer's mainboard is activated, external cool air is drawn into the chassis through the dust removal net 21 and the vents 2, cooling the components within the computer. At the same time, the heat generated by the components rises inside the chassis, and after encountering the V-shaped guide plate 41, the heat is effectively guided to diffuse to both sides of the chassis. Since the inclined plate 42 is set in an eight-shaped shape and forms an angle with the guide plate 41, the hot air is squeezed and guided by the inclined plate 42, and is more easily discharged to the outside of the chassis through the heat dissipation holes 3. This design not only improves the exhaust efficiency of the hot air, but also reduces the retention time of the hot air inside the chassis, further improving the heat dissipation effect. By optimizing the shape of the guide plate 41 and the setting of the inclined plate 42, the heat dissipation efficiency of the computer is significantly improved, the heat retention is reduced, the air circulation inside the chassis is enhanced, and the user experience is improved.

[0025] Specifically, to change the flow rate of hot air out of the heat dissipation hole 3, a triangular chamber 5 is formed in the housing 1 between the guide plate 41 and the inclined plate 42, corresponding to the heat dissipation hole 3, communicating with the heat dissipation hole 3 and the gap 43. The design of the triangular chamber 5 facilitates smoother heat flow within the chassis, improving heat dissipation efficiency. Furthermore, because the hot air is compressed within the triangular chamber 5, its flow rate is accelerated, significantly enhancing the heat dissipation effect at the heat dissipation hole 3. As an efficient hot air channel, the triangular chamber 5 not only accelerates the discharge of hot air, but also reduces the time it remains inside the chassis. This helps lower the temperature inside the chassis and improve computer stability. By changing the flow rate of hot air at the heat dissipation hole 3, the triangular chamber 5 optimizes the heat dissipation performance of the heat dissipation hole 3. Hot air is discharged through the heat dissipation hole 3 at a higher velocity, improving heat dissipation efficiency and lowering the temperature inside the chassis. During the heat dissipation process, the hot air rises within the chassis, is guided by the guide plate 41, diffuses to the sides of the chassis, and enters the triangular chamber 5 through the gap 43 between the inclined plate 42 and the guide plate 41. Due to the special shape of the triangular chamber 5, the flow rate of the hot air therein has been changed. Specifically, when the hot air enters the triangular chamber 5 from the gap 43, the hot air is compressed due to the contraction of the chamber shape, and the flow rate is accelerated. Subsequently, the hot air is discharged to the outside of the chassis through the heat dissipation holes 3 at a higher speed. This design not only improves the discharge efficiency of the hot air, but also enhances the heat dissipation effect at the heat dissipation holes 3. In addition, the triangular chamber 5 also plays a role in buffering and stabilizing the flow of hot air. In the process of hot air entering the triangular chamber 5 from the gap 43, the air pressure inside the chamber changes, forming a dynamic balance. This balance helps to stabilize the flow of hot air, reduce the turbulence and retention of hot air inside the chassis, and further improve the heat dissipation effect.

[0026] Specifically, to facilitate cleaning of the dust net 21: a through hole 211 is provided on the dust net 21, into which a screw 212 threadedly connected to the housing 1 is inserted. By providing the through hole 211 and designing the threaded screw 212, the removal and installation of the dust net 21 becomes simple and easy, greatly facilitating the user's cleaning and maintenance work. Regularly cleaning the dust net 21 can effectively remove accumulated dust and debris, maintain its filtering effect and heat dissipation performance, thereby ensuring smooth air circulation inside the chassis and improving the computer's heat dissipation efficiency. During the use of the chassis, the dust net 21 will continue to accumulate dust and debris, affecting its filtering effect and heat dissipation performance. To clean the dust net 21, the user only needs to manually unscrew the screw 212 from the housing 1 to easily remove the dust net 21 from the vent 2. After cleaning, the user aligns the dust net 21 with the through hole 211 and re-secures it to the housing 1 using the screw 212.

[0027] Specifically, to prevent the computer from sliding on the floor, support legs 6 are fixedly connected to the four corners of the bottom end of the housing 1, and anti-slip pads 61 are fixedly connected to the bottom ends of the support legs 6. The design of the support legs 6 and anti-slip pads 61 makes the chassis more stable when placed, preventing sliding or tipping due to uneven ground or external forces, and ensuring the safe operation of the computer.

[0028] Furthermore, in order to lower the temperature of the gas entering the dust removal net 21, a cooling plate 7 is provided between the corresponding vent 2 and the dust removal net 21. The interior of the cooling plate 7 is loaded with coolant 71, and ventilation holes 72 corresponding to the filter holes on the dust removal net 21 are provided on the cooling plate 7. The introduction of the cooling plate 7 significantly reduces the temperature of the gas entering the chassis, thereby improving the heat dissipation efficiency of the chassis. This design enables the computer to maintain a stable temperature even under long-term high-load operation, extending the service life of the computer. When external air enters the chassis through the vent 2 and the dust removal net 21, it first passes through the cooling plate 7. At this time, the heat in the hot air will be absorbed by the coolant 71 inside the cooling plate 7, thereby lowering the temperature of the gas. Subsequently, the cooled gas passes through the ventilation holes 72 and continues to enter the interior of the chassis to cool the components inside the computer.

[0029] The above is only a preferred specific implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and concept of the present application within the technical scope disclosed in the present application, and they should be covered by the scope of protection of the present application.

Claims

1. A computer case structure with high heat dissipation efficiency, comprising a housing (1), a vent (2) provided at the bottom front end of the housing (1), a detachable dust removal net (21) disposed in the vent (2), heat dissipation holes (3) provided at the top of both sides of the housing (1), and an auxiliary heat dissipation structure (4) for accelerating the discharge of hot air inside the housing (1); Its characteristics are: The auxiliary heat dissipation structure (4) comprises a guide plate (41) fixedly connected to the top of the shell (1) for guiding the hot air, and an inclined plate (42) symmetrically arranged inside the shell (1) and corresponding to the bottom of the heat dissipation hole (3), wherein a gap (43) for the hot air to pass through is formed between the inclined plate (42) and the guide plate (41); wherein the two inclined plates (42) are arranged in an eight-shaped shape.

2. The computer case structure with high efficiency heat dissipation according to claim 1, characterized in that: The guide plate (41) is in a V shape.

3. The computer case structure with high efficiency heat dissipation according to claim 1, characterized in that: The housing (1) is provided with a triangular chamber (5) between the guide plate (41) and the inclined plate (42) corresponding to the heat dissipation hole (3) and communicating with the heat dissipation hole (3) and the gap (43).

4. The computer case structure with high efficiency heat dissipation according to claim 1, characterized in that: A through hole (211) is provided on the dust removal net (21), and a screw (212) threadedly connected to the housing (1) is inserted into the through hole (211).

5. The computer case structure with high efficiency heat dissipation according to claim 1, characterized in that: The four corners of the bottom end of the shell (1) are fixedly connected to support legs (6), and the bottom ends of the support legs (6) are fixedly connected to anti-slip pads (61).

6. The computer case structure with high efficiency heat dissipation according to claim 1, characterized in that: A cooling plate (7) is provided between the corresponding ventilation port (2) and the dust removal net (21), the interior of the cooling plate (7) is loaded with a coolant (71), and ventilation holes (72) corresponding to the filter holes on the dust removal net (21) are provided on the cooling plate (7).

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